Module 3 CX Hardware

8/13/2019 Module 3 CX Hardware

1/55

EMC Induction

Module 3

CX Hardware


2/55

What is an Array?

DPE? DAE? SPE? SPs?

LCCs? SPSs? Loops ? Cache?

CRUs NDUs

Backend? Frontend? Enclosure ID?

Disks? LUNs? Tresspass? Lun masking?

Flare? Release code? Layered apps?

Hosts? Failover? Avg cost?


3/55


4/55

Link Controller Card

Act like FC hubs with the chassis backplanelinking FC_AL devices together

Links DAEs to DPEs allowing disk/loopexpansion

The LCC passes the input signal to the diskdrives in the enclosure; it then sends the

output signal, via cables, to the next DAE inthe loop.

Independently monitors the environmentalstatus of the entire enclosure.

controls the LCC port bypass circuits and thedisk-module status lights.

LCCs do not communicate with, or controleach other.


5/55

Inside an array

CX600


6/55


7/55

Cabling the Back end

CX400/CX500

Enclosure IDs mustbe different

Enclosure IDs mustbe different


8/55


Online interactive diagram
http://train.us.dell.com/training/server/dell_emc/storage_arrays/cx600/cabling_02.asphttp://train.us.dell.com/training/server/dell_emc/storage_arrays/cx600/cabling_02.asp


9/55



10/55

Spot quiz

What would be the disk convention for the 10th

disk in the 2nd

shelf ofdisks including DPE as 1 st shelf [CX700 is not a DPE]

In a CX300? In a CX500? In a CX700? ANS = 0_1_9 ANS = 1_0_9 ANS = 1_0_9

What would be the disk convention for the 5 th disk in the 5 th shelf

In a CX300? In a CX500? In a CX700?

ANS = 0_2_4 ANS = 0_1_4 ANS = Trick Qs

Only 3 additional DAEs max.


11/55


12/55


13/55

Overview

Look at and compare the Hardware Components of the; CX200 / CX300 CX400 / CX500 CX600 / CX700

Review the CX arrays Theory of Operations Review the CX arrays initial Configuration.


14/55

CX200 /CX300 Comparisons


15/55

CX200 / CX300 Comparisons

The CX200 and CX300 are both,

Disk Processor Enclosures (DPE) 2Gb DAS or SAN Solution

3U Rack mountable enclosure Physically look the same !

Dual SPs 15 disksDual Power Supplies (VSCs) Dual SPSs


16/55


CX200 specifics Comes in several Flavours CX200LC single SP,PSU version CX200 EMC 30 drive option CX200 DELL 15 drive option

Option to Support up to 30 disks Need 30 disk NDU installed

Runs NT 4 as embedded OS No layered applications supported 1 Backend Port per SP

1 Frontend Port with 2 connections per SP 512MB memory per SP used for OS and Caching
http://images.google.ie/imgres?imgurl=http://www.activewin.com/reviews/hardware/processors/intel/p3logo.gif&imgrefurl=http://www.activewin.com/reviews/hardware/processors/intel/tualatin/index.shtml&h=225&w=200&sz=8&tbnid=At2QHbWGCrsJ:&tbnh=101&tbnw=90&start=1&prev=/images%3Fq%3Dpentium%2B3%2Blogo%26hl%3Den%26lr%3D%26ie%3DUTF-8http://www.yestops.com/logo/lg_ms_ntembedded.gif


17/55


CX300 (Snapper) specifics No Dell Manufacture straight through product Option to Support up to 60 disks

Extra 3 DAE2s Need 60 disk NDU installed

Runs XP as embedded OS SnapView and SnapClones supported 1 Backend Port per SP 2 Frontend Ports with per SP 1GB memory per SP used for OS and Caching


18/55

SP Connections CX200

Front end loops A and BBack end loop 0 SPS Connection

Serial management Port


19/55


Front end loops 0 and 1Back end loop 0 SPS Connection



20/55



21/55


The CX400 and CX500 are both,

Disk Processor Enclosures (DPE)

2Gb DAS or SAN Solution

3U Rack mountable enclosure

Uses same chassis and supports;Dual SPs 15 disksDual Power Supplies (VSCs) Dual SPSs


22/55


CX400 specifics

Support up to 60 disks ( 1 DPE and 3 DAE2) Runs NT 4 as embedded OS Supports SANCopy,SnapView and MirrorView applications

2 Backend Ports per SP

2 Frontend Ports per SP Intel 800Mhz PIII CPU 1GB memory per SP used for OS and Caching
http://images.google.ie/imgres?imgurl=http://www.activewin.com/reviews/hardware/processors/intel/p3logo.gif&imgrefurl=http://www.activewin.com/reviews/hardware/processors/intel/tualatin/index.shtml&h=225&w=200&sz=8&tbnid=At2QHbWGCrsJ:&tbnh=101&tbnw=90&start=1&prev=/images%3Fq%3Dpentium%2B3%2Blogo%26hl%3Den%26lr%3D%26ie%3DUTF-8http://www.yestops.com/logo/lg_ms_ntembedded.gif


23/55

CX400 SP Connections

Front end loops 0 and 1Back end loops 0 and 1 SPS Connection



24/55


CX500 (Tarpon) specifics Supports up to 120 disks Runs XP as embedded OS Supports SANCopy,SnapView and MirrorView applications 2 Backend Ports per SP

2 Frontend Ports with per SP Dual 1.6Ghz Xeon CPUs per SP 2GB memory per SP used for OS and Caching

Higher rated power supply (VSC)Cannot use other CX array power supplies in a CX500

RJ45 connectors for network,console and SPS!

Port 80 error output LEDs


25/55

CX500 SP Connections

Front end loops 0 and 1Back end loops 0 and 1 SPS Connection



26/55


CX500 Port 80 output LEDS

1101 First Binary Number 0010 Second Binary Number

1101 in binary = D in Hex

0010 in binary = 2 in Hex

Look up D2 code;

failed to initialise video


27/55

Comparing the CX400, CX500 and CX600

Feature CX400 CX500 CX600

CPUs 1 x 800Mhz P3 2 x 1.6G Xn 2 x 2 G Xn

FE/BE Ports 2/2 x 2Gb 2/2 x 2 Gb 4/2 x 2Gb

DAE2 Support 3 7 15 + 1 x OS

Max Drives 60 120 240

Max RAID Group 60 120 240

MAX LUNs 512 1024 1024MAX LUN Size 2Tb 2Tb 2Tb


28/55

Chassis

Parts common to all CX DPE arrays


29/55

Power Supply Units

Hot Swappable, (One at a time) and only when new part is onsite[see fans]

Standard DAE2 Power Supply

CX500 has a higher rated power supply

Voltage Auto Sensing

2 fans integrated into each PSU.If PSU fails fans continue to run

Array can loose 50% of blowersfor 2mins before shutdown initiated

DPE / DAE2 Power Supply Unit


30/55

Mid-plane

Intelligent system board which connects all modules

Distributes power to system components

Designed as two discreet circuits [alternate power to disk]

Design common to all DPEs and DAE2s

To replace the midplane is to replace the chassis

Mid-plane front view


31/55

Disks

1 inch, 2Gbps, dual ported , FC hard drives [CRUs]

Use a 12v only power feed

Not compatible with older enclosures

Disk locations should not be changed

Clariion formatted

520 bytes per sector

CRUs come with carriers


32/55

Enclosure ID

The Enclosure ID must be unique on each loop

DPE ID must be set to 0

For multiple DAEs ,ID must be in correct sequence [see cabling]

Allows the new disks 0-14 to be seen as different AL_PA numbersfrom the DPE if another DAE is used


33/55

Hot Swappable Parts

15 Fibre Hard Disks

2 Storage Processors (SP)

2 Power Supply Units (PSU)


34/55


35/55


The CX600/CX700 are both , Storage Processor Enclosures SPE [often shown as xPEas other personalities are available]

Flagship 2Gb product for DAS or SAN Solutions Can be used in DAS and SAN Environments

Physically look the same ! Dual SP No disks Dual Power Supplies

3 Dual Fan packs

Use Port 80 output LEDs on each SP

Requires a DAE2/OS to boot


36/55

SPE + DAE-OS

Both the CX600 and CX700 have no built-in disks are called anSPE [Storage Processor Enclosure]

They employ a modifed DAE called a DAE-OS

Identifing a DAE-OS

BE 0

BE 0


37/55


CX600 specifics Comes in 2 flavours ; 2GB memory per SP or 4GB memory per SP

Dual 2.2Ghz Xeon CPUs per SP

Supports up to 240 disks Runs NT 4 as embedded OS Supports all Layered applications 2 Backend ports per SP 4 Frontend Ports per SP
http://www.yestops.com/logo/lg_ms_ntembedded.gif


38/55


Front end loops 0, 1, 2 and 3Back end loops 0 and 1 SPS Connection



39/55


40/55


Front end loops 0, 1, 2 and 3Back end loops 0, 1, 2 and 3 SPS Connection



41/55


42/55

CX700 Block Diagram

240 dr ives max p er s torage sy stem

Fan FanFan

Power Supply

CMI x 2

SP Fibre x 4

Mirrored Cache

CPU CPU

FC FC FC FCPower supplySPS SPS

15 Drives per DAE2

LCC

LCCLCCLCC

LCCLCC

LCC LCC

SP Fibre x 4

Mirrored Cache

CPU CPU

FC FC FC FC

LCC

LCC

LCCLCCLCC LCC

LCC

LCC


43/55


44/55

Fan Packs

Front Fan Packs in the SPE cool the Storage Processors

PSU Fan Packs in the DAE2 cool the Power Supplies & Disks

A 2 blower fault for 2 minutes will prevent boot or shutdownenclosure

Fan 1 Fan2


45/55

Power Supply Units

Hot Swappable, (One at a time)

Voltage Auto Sensing

SPE PSU is different to its DAE2 cousin

xPE Power Supply Unit


46/55

Mid-plane

Intelligent system board which connects all modules

Distributes power to system components

Designed as two discreet circuits


47/55

DAE2/OS

Must be connected to a Storage Processor Enclosure (SPE)a CX600 or CX700

Provides disks access to allow SPs to boot The Enclosure must be connected to BE0 with ID of 0 Functionally the exact same as a standard DAE2 just has

slightly different role.

S db S l


48/55

Standby Power Supply

Two ouput per SPS One for each power supply on SPE One for each power supply on DAE2/OS

Provides enough power to clear cache and shut down thearray

Serial port is used for monitoring battery state SPS Power switch sends a shutdown request to the SP

Only used for DAE-OS[CX600/700]

AC in

AC Out toDPE/SPE

Monitoringcable

2 l f


49/55

DELL EMC 2 Enclosure Performance

I/O per second Throughput

FC4500 30,000 cached 180MB/s

FC4700 50,000 cached 360MB/s

CX400 60,000 cached 540MB/s

CX600 150,000 cached 1,100MB/s

CX700 200,000 cached 1,520MB/s

DPE/DAE OS S i T


50/55

DPE/DAE-OS Service Tag

CX600/700 SPE S i


51/55

CX600/700 SPE Service tag

St db P S l


52/55

Standby Power Supply

Two output per SPS One for each power supply on SPE One for each power supply on DAE2/OS [CX600/700 only]

Provides enough power to clear cache and shut down the array Serial port is used for monitoring battery state SPS Power switch sends a shutdown request to the SP

Self testing/chargingOnly used for DAE-OS[CX600/700]

AC in

AC Out toDPE/SPE

Monitoringcable

P i


53/55

Powering on

Safely powering on the Array

Power on DAEs first [allow 1 min] Power on DPE/SPE from SPS

Safely powering off the Array

Power down the DPE/SPE from the SPS ONLY![this allows cache to flush cleanly, usually takes 2 mins ]

Power down DAEs


54/55

DAE2-ATA

Codename

Klondike

Supported from Release 11++

Refer to DAE2-ATA.doc

R i
http://localhost/var/www/apps/conversion/tmp/Instructors%20guide/Additional%20notes/ATA-DAE2.dochttp://localhost/var/www/apps/conversion/tmp/Instructors%20guide/Additional%20notes/ATA-DAE2.dochttp://localhost/var/www/apps/conversion/tmp/Instructors%20guide/Additional%20notes/ATA-DAE2.dochttp://localhost/var/www/apps/conversion/tmp/Instructors%20guide/Additional%20notes/ATA-DAE2.doc


55/55

Review

CX200 v CX300 Back end / front end loops Applications supported

CX400 v CX500 Power Supplies

No. Disks Supported Back end / Front end loops CX600 v CX700

Back end / Front end loops No. Disks supported

Module 3 CX Hardware

Documents

Transcript of Module 3 CX Hardware