Using Copper Water Loop Heat Pipes to Efficiently Cool CPUs and GPUs
Miniature Loop Heat Pipes for Electronics Cooling
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Transcript of Miniature Loop Heat Pipes for Electronics Cooling
Miniature Loop Heat Pipes for Electronics Cooling Research Review
Essential VocabularyTwo-phaseLatent heat Surface tension CapillarityViscosityHeat flux
What is Loop heat pipes Two-phase heat transfer device that
operates on the basis of a capillary driven loop
Background Challenges of cooling computer components
Small heating area Space limitationMaintaining temperature below 100°C
AchievementsCylindrical evaporator with ammonia as coolant (25-30W)Flat evaporators
Ammonia and stainless steel (87W)Ethanol and nickel wick (120W) Research based of water-copper configuration ( 130-160W)
Research Goal Study further the development and capability of Miniature LHP (mLHP)
Meet computer development
Consideration of miniaturizing LHP Overcome space limitation
Testing water-copper configurationReach cooling below 100°C
Study ConditionsFlat evaporator- 30 mmTransport 70 WLoop length of 150 mmWater as coolant
Method DescriptionNon-uniform heating area (3/5)Thermocouple readings- every 10 secondsForced convention- fan Testing was done in the horizontal configurationmLHP thermal performance measured:
Max heat capacity Evaporator temperature Total thermal resistance
Assembly Description
Experiment Method
Results DiscussionReliable startup and steady state at low and high power
Results DiscussionsCapability to transfer 70W at around 100CmLHP auto-regulate the evaporator temperature
Results Discussions Decrease of HP thermal resistance (merit number, liquid distribution)
Observation Capability of handling non-uniform heat distribution
Consideration of other positions than symmetricalAssumption of capability of uniform distribution
Measurement of heat load was not indicated Consideration of angled configurationConducting the test in an enclosure/confinement
References