MECHANICAL DEVICES Advanced Thermal Solution

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MaxTC - Temperature Forcing System -65°C to +175°C

System Overview Features

• Temperature range: -65°C to 175°C

• Time to temperature (@T case): 25⁰C to -40⁰C in < 2 min; 25⁰C to 125⁰C in < 1 min

• Temperature accuracy: ±0.5°C

• Temperature stability: ±0.2°C

• Condensation FREE at cold test

• Maintenance FREE system

• Fully programmable with Lab VIEW, C++, MATLAB, VB, TICKLE, Perl, Lynux, Python.

• Cost effective due to low cost and high performance

• Vibration FREE contact

• Magnetic field FREE contact

• PID overshooting control

• Stand-alone plug and play system

• No external chiller or compressed air required

• Software controlled transition rates up to 100°C/min

• Suitable for testing socketed and soldered devices

• Environmentally friendly operation

• ESD safe product

• Min and Max temperature safety lock

• Can be seamlessly integrated with handlers and ATE testers

MaxTC thermal system stimulates DUT to the desired temperature from -65⁰C to

175⁰C (>200 ⁰C optional) by direct contact between a thermal head’s plunger and the

DUT.

Consists of a powerful temperature source that feeds a thermal head with an

interchangeable plunger designed to interface and connects directly to any of your IC

Devices.

Excellent cooling power 60W@-48⁰C; 250W@0⁰C;

Very low temp @ T junction even with high power devices

Fast time to temperature

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COC , CE Qualified, ISO 9001

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Why Max TC?

MaxTC Vs. Forced air solution

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Price – ~1/2 price then of thermostream Temp. Stability – Much better temp stability @ case/junction (within 0.2C)

compare to thermostream 2-3C Soak Time - Shorter soak time (only 30sec ) due to direct contact technology Size – much less space is required Noise – Much lower noise level compare to thermostream Stand-alone unit – Real Plug & Play unit ideal for IC design center at building

offices where e infrastructure is not available Maintenance FREE, no need to remove the ice from the bench or maintain the

chiller and compressed air. Substantial saving on compressed dry air consumption (compressors)

and infrastructure. Condensation – True condensation FREE during very long DUT tests over very

low temp. Small footprint <80mm compare to thermostream >200mm

o No overstress of peripheral components, o Temperature is conducted right where you need o Forced air systems need to “overdrive” the high speed air temperature to

compensate the thermal resistance losses and inefficiency.

Source: http://www.intestthermal.com/products/thermostream-eco-air-forcing-systems

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MaxTC Vs. Temperature Chambers

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Better cooling capacity at Tc or Tj Better productivity due to >10 times faster soak time Vs. oven Maintenance FREE (cost saving) Small footprint Energy efficient Cables and other support circuitry Free from thermal environment Enable short cable lengths for RF/microwave Saving on consumable cables due to thermal exposure with temp

chambers

Why Max TC?

Source: http://www.intestthermal.com/products/chambers/overview