MASTER’S THESIS PROPOSAL - INO - National Optics ... · Please send your resume to...
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Please send your resume to [email protected] with the subject ’Silicon photonics packaging master application’’ MASTER’S THESIS PROPOSAL THE OBJECTIVES OF THIS PROJECT ARE: We are calling for applications from highly motivated individuals enrolled in a master’s program to conduct research in silicon photonics packaging. The candidate will work with a multidisciplinary research team as part of the leading optics and photonics R&D center in Canada. In silicon photonics packaging, several devices require high frequency electrical signals. In standard CMOS packaging, ball grid arrays and the flip chip bonding technologies are used for RF packaging. However, these technologies require high temperature processes that may not be compatible with optoelectronic packages. The goal of this research is to develop an optoelectronic package for photonic chips with RF electrical I/Os. 1) Identify the appropriate technologies to package Si photonics chips with RF electrical signals requirements. 2) Perform simulations to predict the performances of the selected technologies 3) Develop these technologies on INO packaging capabilities 4) Design a package using these technologies 5) Assemble a package or selected components to verify predicted performances 6) Compare the performances with the prediction WHAT: Master thesis WHERE: INO, Québec city, Québec Canada WHEN: From September 2014 to April 2016 Identification of the technologies to develop Simulation of the performances of the identified technologies Selection of the technologies to test experimentally Assembly of an RF package Preliminary tests on individual components Design of an RF package Characterization of the performances of an RF package Final Report (Master Thesis) INO 2740 Einstein Street, Québec City, Québec G1P 4S4 Canada 418.657.7006 / 1.866.657.7406 www.ino.ca / [email protected]
Transcript of MASTER’S THESIS PROPOSAL - INO - National Optics ... · Please send your resume to...
Please send your resume to [email protected] with the subject ’Silicon photonics packaging master application’’
MASTER’S THESIS PROPOSAL
THE OBJECTIVES OF THIS PROJECT ARE:
We are calling for applications from highly motivated individuals enrolled in a master’s program to conduct research in silicon photonics packaging. The candidate will work with a multidisciplinary research team as part of the leading optics and photonics R&D center in Canada.
In silicon photonics packaging, several devices require high frequency electrical signals. In standard CMOS packaging, ball grid arrays and the flip chip bonding technologies are used for RF packaging. However, these technologies require high temperature processes that may not be compatible with optoelectronic packages.
The goal of this research is to develop an optoelectronic package for photonic chips with RF electrical I/Os.
1) Identify the appropriate technologies to package Si photonics chips with RF electrical signals requirements.
2) Perform simulations to predict the performances of the selected technologies
3) Develop these technologies on INO packaging capabilities
4) Design a package using these technologies
5) Assemble a package or selected components to verify predicted performances
6) Compare the performances with the prediction
WHAT: Master thesis
WHERE: INO, Québec city, Québec Canada
WHEN: From September 2014 to April 2016
Identification of the technologies
to develop
Simulation ofthe performancesof the identified
technologies
Selection of thetechnologies to test
experimentally
Assembly of an RFpackage
Preliminary tests onindividual components
Design of an RFpackage
Characterization of theperformances of an RF
package
Final Report(Master Thesis)
INO2740 Einstein Street, Québec City, Québec G1P 4S4 Canada
418.657.7006 / 1.866.657.7406www.ino.ca / [email protected]
