MARTIN-Rework eco

Operating Instructions

®

HA 04 – Firmware Précis

58

Rework eco May/2002

Manual Soldering

Cursor position Change value

Dispensing Start Vacuum Start Soldering

(or foot switch)

Fluid Actual temperature [°C]Function Airflow [l/min]

Volume [mm³] IR-power [W]

Stop

Start Dispensing Start Vacuum

(or foot switch) (or foot switch)

Display thermo sensors

© MARTIN GmbH 2002

Matthias Fichtner

Selection of Soldering Mode

Program Soldering Edit Programs

Soldering/Desoldering PCBComponent

Solder Pen down

Vac Pen placed

Select phase

Vac Pen lifted

Copy Delete

program program

SMD placed

BGA/CSP placing

Quit

Extending solder phase

(teach program)

Stop solder phase (3x)

(teach program)

320° 10.0l 200W

DIS VAC <AIR>

soldpa point 0,20cmm

<DIS> VAC AIR

320° 10.0l 200W

Sens VAC <AIR>

select soldermode

MANU PROG EDIT

Placing solder tool

cancel VAC <P+P>

pCB smd

nEw DATa OK

preh160° 25l 031s 150W

stop Leng cancel

preh160° 25l 100s 150W

PHASE cancel OK

pCB smd

copy delete OK

on pCB smd

DIS VAC <START>

placing smd/tool

ok-qfp VAC <p+p>

insert bga/csp

cancel vac <p+p>

ir in position?

cancel ok

Contents

HA 04 – Firmware Précis 58

1. Introduction 61

General Comments 61Service 62Warranty 62Copyright and Liability Disclaimer 63Safety 64Definitions 65Environmental Effects 65Emissions 66

2. Technical Data 67

Hot Air 04 67Optional Extras 67DIS Module 68VAC Module 68AIR Module 68MESS Module 68Double Head Placer (DHP) 69Smart Fix 06 69Area Under Heating – IRF (Smart Fix IRF 06) 69

3. Description of Function 71

Technology 71

4. Function 77

Overview 77Installation 79Operators Control 80Establishing a Soldering Program 85Strategy for Parameters 87Reballing BGA / CSP 89Special Menu 91Maintenance 92Solder Separator – Vacuum Pen 93O-ring - Dispensing Pen 94Fine Filter – Vacuum Pen 95Fine Filter – Compressed Air Inlet 96Hints 97

Contents

59

5. Solder Star 99

MARTIN Software 99Process Description 101Program Mask 102Overview Mask 103Installation Mask 104Monitor Mask 105Save – Backup System 107

A. Appendix 109

Interfaces 109Electrical Schematic Diagram 111Declarations of Confirmity (actual: please see web site part “about us”) 112Test Certificate

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1. Introduction

General Comments

Dear Customer,

Could you please carefully read through these operating instructions, taking note of the re-

commendations, to ensure trouble-free operation of your MARTIN SMD Units. These opera-

ting instructions provide extensive descriptions, which should answer most of the questions

you may have. Unfortunately, no amount of instruction can hope to cover all eventualities.

We wish to point out that the contents of these operating instructions do not form part of

any agreement, promise or legal arrangement. All duties of MARTIN GmbH are defined in

the relevant contract of sale.

Should you require any further information please contact your MARTIN representative or

contact us direct.

Please also note our web site. Under Service there are Hints (FAQs) and the provision for

downloading the newest software. Your Partner will be able to give you the password, valid

for that day and for this purpose.

Yours Martin GmbH Fon ++49-(0)8153-932 9-30

Customer Service Fax ++49-(0)8153-932 9-39

Argelsrieder Feld 5 Web martin-smt.de

D-82234 Wessling Mail info@martin-smt.de

Germany

1. Introduction

61

Service

For the MARTIN SMD Units we offer a 3-day works turn-round. Should a repair or service

become necessary we would ask you to return the unit to the representative or direct to us.

During the warranty period please include the relevant proof of purchase.

Please do not forget to enclose a description of the fault(s).

Warranty

We warrant that, in accordance with legal requirements, your MARTIN equipment is supp-

lied without defect.This warranty applies for 12 months, provided that §438, sect 3 and

§479, sect 1 of the German regulations (BGB) do not stipulate longer periods.

Should there be a defect we will remove it or, at our discretion, replace the faulty item. If

this should fail, our other warranty obligations will not be affected. The costs of remedial

action on our part and the provision of materials will be borne by ourselves, not, however,

transport or travel costs.

We are not responsible for defects caused by improper use, maintenance or repairs and or

interference by persons not authorised by us for this purpose.

Proper use of your MARTIN equipment is defined as normal use, as described in the opera-

ting instructions for no longer than 40 hours per week.

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Copyright and Liability Disclaimer

The software packages Solder Star, Easy Solder, Easy Dispense and CamDesigner, inclu-

ding any documentation, are copyright protected.

The purchase of the programs confers the right to make back up copies only.

To the maximum extent permitted by applicable law, in no event shall manufacturer be li-

able for any damages whatsoever (including without limitation, special, incidental, conse-

quential, or indirect damages for personal injury, loss of business profits, business interrup-

tion, loss of business information, or any other preciunary loss) arising out of the use of or

inability to use this product, even if manufacturer has been advised of the possibility of such

damages. In any case, manufacturer’s entire liability under nay provision of this agreemnet

shall be limited to the amount actually paid by you for the SOFTWARE and/or HARDWARE.

Because some states/jurisdictions do not allow the exclusion or limitation of liability for con-

sequential or incidental damages, the above limitation may not apply to you.

The SOFTWARE product and documentation are provided with RESTRICTED RIGHTS. Use,

duplucation, or disclosure by the United States Government is subject to restrictions as set

forth in subparagraph (c)(1)(ii) of the Rights in Technical Data and Computer Software clau-

se at DFARS 252.227-7013 or subparagraphs (c)(1) and (2) of the Commercial Computer

Software – Restricted Rights at 48 CFR 52.227-19, as applicable.

If you acquired the SOFTWARE in the United States of America, this Software License Agree-

ment and Warranty are governed by the laws of the State of Washington, U.S.A.

If you acquired the SOFTWARE outside the United States of America, local law may apply.

1. Introduction

63

Safety

WARNING � �• To maintain a reasonable level of safety the following should be noted:

• This unit runs on electricity. Of necessity some components within the device have

dangerous voltages applied to them.

• Non observance of the operating instructions can cause death, serious injuries

and/or extensive damage to property!

• Never open the housing or one of the IR Underheaters when the mains plug is

connected.

• Do not use the units for any purpose other than that for which they are intended.

Use it according to the operating instructions.

• This equipment must not be switched on or used without supervision.

• When the hot air pen is in use high temperatures are reached within. Therefore, do

not touch the heating element; there is the danger of being burnt. Do not direct any

hot air/gases unto any part of the body.

• Do not place any flammable material in the vicinity of the IR Underheater or the hot

air/gas nozzle.

• Please use the IR Underheater and Hot Pen only on a level and non flammable

surface.

• Touch the just deposited nozzles or soldering tools first after they have cooled

down. Place the soldering pen, the nozzles and soldering tools only unto the

support provided specifically for the purpose.

• When the IR Underheater is in use its housing and the areas exposed to the infra

red rays can reach high temperatures. Please do not touch the housing until it has

cooled - Burn Hazard.

• Avoid skin contact with adhesives or solder pastes. Contact with the skin can lead to

damaged health.

• Any maintenance of the units is only allowed to a service technician engaged by

MARTIN GmbH.

• Please also pay attention to the safety regulations applicable in your area.

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Definitions

•Qualified and/or sufficiently trained personnel

for the purpose of these operating instructions, such persons as are familiar with the in-

stallation, setting-up, use and maintenance of the equipment and hold suitable qualifica-

tions, such as eg:

• The training and/or authorisation to switch, isolate, earth or to identify electrical circuits

according to the prevailing safety standards.

• The training to maintain safety equipment according to the prevailing safety standards.

• Training in First Aid.

•WARNING � �When the relevant safety rules are not heeded the result could be: substantial damage to

property, serious injuries or even death.

•TAKE CARE �When the relevant safety rules are not heeded the result could be: damage to property or

personal injuries.

•NOTE

Important information regarding the equipment or a particular part of the operating in-

structions.

Environmental Effects

The ambient temperature during operation of the unit should be between 15 and 35 deg C.

Large temperature fluctuations should be avoided. Relative humidity should be between 30

and 90 %. Condensation would not be allowed to form on the unit.

1. Introduction

65

Emissions

When using this equipment with compressed air no noticeable emissions are released. Pos-

sible emissions caused by adhesives or solder pastes will be identified by the relevant ma-

nufacturers.

TAKE CARE �Avoid all skin contact with adhesives or Solder pastes. Contact with the skin can lead to

damaged health.

The maximal noise level, measured at a distance of one metre, will be below 70 dB(A).

During normal use the IR Under Heater does not emit any rays injurious to health.

MARTIN IR Filter Glass

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2. Technical Data

Hot Air 04

Dimensions 490 x 320 x 70 mm

Max. PCB Width approx. 370 mm

Max. PCB Length approx. 500 mm

Weight approx. 19 kg

Mains Supply AC 230/115 V, 50/60 Hz (adjustable at mains filter)

Fuse Overload protection (6.3 A slow blowing for 230 V,

10 A slow blowing for 115 V)

Power Consumption 800 VA

Working Pressure 5.5 to 8 bar (not lubricated, filtered 40 �m)

Air Delivery 1.0 to 25 l/min

Temperature Range 150° C to 400° C ± 1 %

Hot Air Pen 24 V; 5 to 200 W

Optional Extras

Dispensing Volume 0.01 to 10.0 mm³ (dot dispensing)

Dispensing Media 0.1 to 3.0 bar (line dispensing)

Dispensing Compensation 10° C to 40° C

IRK Underheater Dimensions 193 x 140 x 39 mm

IRK Underheater Area 75 resp. 130 x 105 mm (switchable)

IRK Underheater Power 50 to 500 Watt

IR Underheater Dimensions 93 x 40 x 30 mm

IR Underheater Area 33 x 40 mm

IR Underheater Power 20 to 120 W

2. Technical Data

67

DIS Module

Application dispensing of solder pastes, flux creme, adhesives or other media

Volume 0.01 to 10.0 mm³ (dot dispensing)

0.1 to 3.0 (bead dispensing)

Viscosity 0.1 to 10 (factor)

Dispensing Pen for 5 cm³ syringes with temperature sensor

Compensation 10 to 40°C

VAC Module

Application • placement of SMDs,

• removal of molten solder

Vacuum Pen quick-change mechanism for vacuum nozzles and button.

AIR Module

Application • provision of heat for the solder joint(s) by hot air

• Control of soldering process following a programmed profile

Temperature 150 to 400°C ± 1% (recurrence accuracy PT500)

Air Flow 1.0 to 25 l/min

Hot Air Pen with 40 V heating element, power 24 V; 5 - 200 W, withs

temperature sensor and a quick-change mechanism for nozzles

MESS Module

Application Temperature measurement at soldering point, PCB etc

Measurement Range 20°C to 400°C ± 4% (can be calibrated)

Resolution 1 K

Sensor NiCrNi – thermo couple

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Double Head Placer (DHP)

Application Manual positioning and automatic de-soldering of SMDs

Axes Backlash free

Smart Fix 06

Application • Static protected location of pcb

• accurate positioning of the Hot Air Pen in 4 axes

• illumination of working area

• cooling of PCBs after soldering

Dimensions - Table 700 x 320 x 130 mm

Dimensions - PCBs maximum width 370 mm

maximum length approx. 500 mm

Power Supply from Hot Air 04

Fuse overload protection (2.0 A medium fast acting)

Area Under Heating – IRF (Smart Fix IRF 06)

Application uniform and evenly distributed energy supply by means of infra red

radiation to the underside and to prevent distortions of PCBs

Voltages 230/115 V AC 50/60 Hz (adjustable at mains filter)

Fuse Overload protection (10 A slow acting for 230 V,

no fuse for 115 V and for IRF 04)

Size of heated area 280 x 250 mm

Power IRF 03 0 to 1500 W

Power IRF 04 0 to 2400 W

2. Technical Data

69

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3. Description of Function

Technology

The supply unit for dispensing, vacuum and soldering pens as well as for underheating is

the Hot Air 04 which forms the basis of Line Rework eco. It is a precise, practicable and

portable combination unit for proto-typing, repair, service, small scale production and

especially for rework in branch of quantity production.

It fulfils all your requirements for dealing with SMDs:

• Desoldering of SMDs

• Removal of used solder

• Cooling of solder joints

• Application of solder paste or adhesive

• Picking and placing

• Soldering of SMDs

• Reballing of BGAs and µCSPs.

The Hot Air 04 enables you to deal with almost with all SMD types from 0402, SOs, PLCCs,

QFPs, BGAs, CSPs, µCSPs to plugs and non standard components. You only need the re-

quired pick & place and solder tools. Even Reballing of BGA and µCSP can be realized with

the required mini oven.

Your Hot Air 04, as component of our Line Rework eco, can be augmented with the optio-

nal extras in a modular manner to build up high value and comprehensive MARTIN rework

station.

3. Description of Function

71

Acquiring a Hot Air 04 unit has provided you with a piece of technologically mature reflow

soldering equipment for individual SMD treatment. The unit can be used for the smallest

components, such as 0402, SO up to PLCC, QFP, BGA as well as µCSP. You only need the

required pick & place and solder tools. Even Reballing of BGA and µCSP can be realized

with the required mini oven. Your Hot Air, as component of our Line Rework eco, can be

augmented with the optional extras in a modular manner to build up high value and com-

prehensive station for SMD rework and repair.

During its development and that of the soldering tools particular care has been taken to

take into account the needs of PCBs and components. This has been achieved by precise

temperature measurement and regulation and the least possible amount of heat being used

and applied by the heating element and soldering tools. Solder joints with excellent reliabili-

ty are achieved by using the program soldering function (replicating production reflow sol-

dering processes). Precise amounts of energy are carefully delivered by means of hot air di-

rectly from the top to the solder joints and from below by infra red radiation to the circuit

board.

The DIS Module provides you with an intelligent and very precise dispenser. Using the

equipment could not be simpler. The extensive computations and interrelationships the dis-

penser takes account of are of concern to the user only insofar as your dispenser unit does

what you want it to do: precise dispensing independent of temperature of the medium to be

dispensed (10 to 40°C) and pressure of available compressed air (4 to 8 bar).

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3. Description of Function

73

Reflow Soldering – IR Underheater + Hot Air

Large Surface IR Bottom Heating

(rough)

• Support of the soldering process

• Gentle IR area underheater brings the

entire PCB to 120°C (MARTIN occurs

successfully with IR underheater since

more than 9 years)

• No re-heating (defined start)

Topside Convection

(delicate)

• Patented, precision topside heater to re-

ach the reflow temperature, perfectly

controlled heating conditions at minimal

overrun temperature

• Allows all balls to reflow temperature at

virtually the same time

• Specially adapted air outlet openings in

the convection top side heater prevent

overheating of the SMD centre

(�T � ± 4 K at the component)

� Zero Risk Heating Technology

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Reflow Soldering – Hot Air

• Energy transfer by gas (air) :

Qw = mL x cP x �T

Qw = Energy flow

mL = Air flow

cP = Heat capacity

(cP Air = 1.01 KJ/KgK)

�T = Temperature overrun

MARTIN Precise Hot Air

• Minimal thermal mass

Exactly controllable temperature profile –

at CSP and µCSP as well

• Good heat transfer, good insulation,

hot air focussed on the solder pads, component

stress less than in line processing

• Hot air must not be calibrated

(platin temperature sensor = long-term stable) Under Heater

TemperatureSensor

Insulation

Heater Coil

Tool Carrier

The Hot Air 04 provides you with an intelligent and very precise dispenser.

The ‘clever’ part means that using the equipment could not be simpler. The extensive com-

putations and interrelationships the dispenser takes account of are of concern to the user

only insofar as your dispensing device does what you want it to do – precision dispensing

independent of:

• Temperature of the medium to be dispensed (10 - 40 °C)

• Pressure of available compressed air (4 - 8 bar)

3. Description of Function

75

Dispensing

Temperature Compensation

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4. Function

Overview

The enclosed booklet Rework ABC with many illustrations, explain the use of your MARTIN

Rework Station.

Please also note the HA 04 Firmware Précis, located just behind the title page for easy refe-

rence.

The MARTIN-Rework+Dispense CD-ROM contains a PowerPoint presentation, split into sec-

tions: 1 - Basics, 2 - Technologies and 3 - Practicals, offering very useful information.

Should you not be able to use PowerPoint the viewer included on the CD will allow these fi-

les to be accessed.

Changes can be found in the Readme-Hot-Air.txt file of your installation CD.

DANGER � � �• This equipment must not be left in ist continuous running mode without supervision

since there is a danger of starting a fire caused by the IR Underheater or the

Hot Air.

• Do not touch the heating element or the nozzles of the Hot Air Pen: danger of

burns!

TAKE CARE �Do not squeeze the hose of the Hot Air Pen. The interruption of the air flow can cause

overheating of the heating barrel.

4. Function

77

NOTES:

• For safety reasons manual soldering is switched off automatically after 4 minutes.

• In order not to stress the components unnecessarily the temperature should be kept

to a minimum (eg 300°C - 350°C when using solder nozzles).

• Temperature settings, which might damage the Hor Air Pen (eg because of max

temperature and min airflow), can not be activated. Such settings are indicated by

an audible signal and are selfcorrecting.

• As soon as the Air Module has been selected the Hor Air Pen will beheated to a

stand-by temperature, while maintaining a small gas flow rate. This stand-by

temperature corresponds to the set tmeperature up to 190°C. The Hot Air Pen can

therefore be used immediately, thus reducing soldering times.

• This stand by function will be autimatically cancelled after 30 minutes.

• Please see chapter Introduction part Safety.

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Desoldering

Soldering

Placing

Apply solder paste

Remove old solder

Teflon nozzle

Rework Dispenser

Double Head Placer

BGA, CSP (not CBGA)

only at class 1

Flux Pen / CremeChip, QFP, PLCC

at IPC-A-610C class 1 and 2

Zero Risk Rework – Process Plan

Installation

1.Check mains voltage

TAKE CARE �Before plugging the unit into the mains ensure at the mains connection (rear panel

of the unit) that the indicated voltage is set correctly. Non compliance with these

instructions can lead damaging the unit.

2.Positioning of the Unit

The unit should be placed on a flat surface and nothing upon the unit, so that there is

free access of air to and out of the unit.

3.Connection of Unit to Mains Supply

TAKE CARE �Before your unit is connected to the mains, check that the mains cable and plugs are

undamaged. Non-compliance with these instructions can lead to personal injury

and/or damage to the unit.

4.Connection of Foot Switch

Connect the Foot switch (optional extra) to the plug (foot switch) at the rear of the unit.

5.Connection of Pen/Heater and Switching on

Plug in the pens, the arm and the Heater (partly optional extras) into the corresponding

sockets and hand tighten the screw retention sleeves.

You can now switch on your unit by the mains switch.

NOTES:

• Please take note of the cautions outlined in the section Safety.

• You can switch the display between German and English – Your sales partner

can tell you how.

4. Function

79

Operators Control

•Pen Sockets

Please connect the pens to their corresponding sockets and hand tighten the plugs.

• IR Underheater Socket

One of a number of various convection underheaters can be connected here: the small IR

version, the large IRF one or the IRK variant. The latter also needs a mains supply at the

IRK main connection.

•Foot Switch Socket

The footswitch connected here starts the vacuum when <AIR> shows. Dispensing com-

mences when <DIS> is pre selected.

•Serial Interface

For the saving and editing of your soldering programs a connection to your PC is estab-

lished and operated with the optional Solder Star software.

•Mains Connection

You can also select the mains voltage here (please see Appendix).

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AIR Module (Manual Soldering)

•Temperature (400°)

The temperature of the air can be set here between 20� C (cooling) and 400� C.

During this function the actual temperature is displayed (� character and <AIR> flash).

•Air Flow (25 l)

The air flow between 1l and 25l is set here.

• IR Power (500 W)

The power of the IRK underheater can be set between 0 and 500 Watt.

– IR Heater: 500 W corresponds to 120 W (actual)

– IRF Heater: 500 W corresponds to 1 500 W (actual)

•Start Function Button (<AIR>)

By pressing this button or the footswitch the Air Pen and possibly the IR Underheater will

be started; a second depressing will switch them off again.

NOTES:

• As a safety precaution it will switch off automatically after 4 minutes.

• Error messages are displayed in straight text.

AIR Module (Program Soldering)

•Menu Button

When the AIR Module is selected (possibly pressing 1x AIR), the menu button takes you to

the Solder Mode Selection. A selection can be made between Program Soldering and

Editing, or you can return to Manual Soldering.

•Program Type (EIN/AUS)

The soldering and de-soldering programs are identical. The only difference is in that the

cooling phase is omitted for de-soldering.

•Printed Circuit Board (PCB)

Here your PCB can be selected.

•Component (SMD)

Under the heading PCB programs for individual PCBs are stored.

4. Function

81

•Start Function Button (<START>)

After correctly positioning the SMD or pen the solder program can here be started.

•Teach Program (pRoL)

Normally the pre heat phase remains unchanged. As soon as the soldering phase be-

gins the PROL function button should be pressed. This action resets the time to 240 se-

conds (the display now counts down). When you notice that the solder has molten, please

wait another 12 seconds (in the case of reballing 20 seconds) and press the stop function

button. The cooling phase then starts. The new times are stored on their being confirmed.

NOTE:

The end of the program is notified by an acoustic signal.

AIR Module (Edit Programs)

•New Program (NEw)

In this menu the selected program can be deleted, copied or renamed.

•Change Data (DATa)

This allows you to edit the values of all stages ( preheat, soldering, cooling) of the selec-

ted program.

NOTES:

• There is a capacity for storing up to 100 soldering profiles.

• The optional Solder Star program allows the storing of profiles, which

are administered, edited and saved on a PC.

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DIS Module (Dispensing)

Pressing the DIS function button just once selects the dispensing mode.

•Fluid (soldPA)

Material

(typical examples)

Viscosity Range

(mPas)

Dispensing Tip

to be used (mm)

Code

Number

(T/V)

Soldpaste

Epoxy Glue

SMD Glue

Mask Fluid

Thick Oil

Thin Oil

Thick Cyan

Thin Cyan

Water

• SMD solder pastes

• epoxy resin adhesives

• SMD adhesives

• thin epoxy adhesives

• coatings

• potting compounds

• custor oil

• lubricant oil

• watchmakers oil

• heating oil

• cyanoacrylate adhesives

(gap > 0,1 mm)

• cyanoacrylate adhesives

(gap > 0,1 mm)

• petroleum

• watery solutions

• alcohols

>100,000 � +Flow Limit

>100,000 � +Flow Limit

50,000 � 100,000 +

FL.

10,000 � 50,000

1,000 � 10,000

500 � 1,000

100 � 500

10 � 100

1 � 10

Metal nozzle 0.3

Nozzle 0.58 pink

Nozzle 0.41 blue

Needle 0.84 green

Needle 0.51 lilac

Needle 0.41 blue

Needle 0.33 orange

Needle 0.25 red

Needle 0.15 lavender

1,8 / 5,0

3,4 / 2,4

2,9 / 5,0

2,5 / 10

2,1 / 15

1,8 / 20

2,0 / 25

1,6 / 35

1,25 / 70

•Function (Point)

A selection between dot and line dispensing is made here.

•Volume (0,01 mm³)

Here the dispense volume is set accurately between 0.01 and 10.0 mm³. For Bead Dis-

pensing the pressure is set between 0.10 and 3.00 bar.

The scale is intended for the material to be dispensed in conjunction with the indicated

dispensing nozzles.

NOTE:

Our Adhesive Volume Measuring Device allows simple and accurate measurement

of any dispensed material (Adhesive Volume Measuring Device part no.

HT00.0002).

4. Function

83

•Start Function Button (<DIS>)

The footswitch or this button initiated a dispensing cycle.

Prolonged pressing of this button results in interval dispensing of dots.

•Menu Button

When the DIS Module is chosen this menu button will display the temperature measured

at the dispensing pen.

VAC Module (Placement)

Vacuum for the placement pen can be switched on or off with the VAC function button, whi-

le the AIR Module is selected, with the footswitch or with the button incorporated in the pen.

MESS Module (Temperature Measurement)

During program soldering the current temperature is shown at the bottom of the display.

During manual soldering please operate the SENS function button.

DANGER � ���The switched on unit must not be left unattended. There is the danger of starting a fire

with the IR heater and/or the hot air.

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Establishing a Soldering Program

Please familiarise yourself with the task:

Reliable solder joints to be made in the shortest possible time without thermally overloading

either components or the PCB.

As far as possible conditions in the production line should be reproduced when reworking.

The following five almost universal Soldering Rules should be observed:

4. Function

85

Maximum

Component

Temperature

240°C

Solder Joint

Temperature

205� 210°C Time over 183°C

30� 90 secs

PCB

Temperature

100� 130°C

(w/o topheat)

Maximum Speed

Temperature Rise

3� 4 K/sec

Reflow Soldering – 5 Rules

Here is a CSP soldering profile, produced in under 10 minutes:

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perfect

10

20

65

30

X-ray

minTime for first profiling

secCooling time

secSoldering time

secPre-heating time

perfect

10

20

65

30

X-ray

minTime for first profiling

secCooling time

secSoldering time

secPre-heating time

115

30

2.7

210

230

°CPCB temperature (w/o top heat)

secTime over 183°C

K/secSpeed of temperature raise

°CSolder joint

°CMaximum component

115

30

2.7

210

230

°CPCB temperature (w/o top heat)

secTime over 183°C

K/secSpeed of temperature raise

°CSolder joint

°CMaximum component

Example – Soldering Profile

Strategy for Parameters

The correct adjustments of these solder parameters to suit the thermal characteristics of a

new PCB is an important step for reaching the reliability that is expected from your solder

joints by your client. This is why we offer simple methods which are easy to use and close to

established practice.

NOTE:

The Install Mask allows you to choose between Standard and Expert modes. The process

parameters can only be changed in mode Expert.

Our strategy for the establishing of parameters can be easily deduced from the supplied

read only files.

A few further guidelines will be of use.

• IRF Under-Heater

The temperature of the underside of any PCB, when only using underheating, should rea-

ched between100°C and 130°C. Please check these values, first of all, without using hot

air.

•Pre-Heat Temperature

The PCB should have a temperature of between 100 and 130°C (approximately between

150 and 220°C).

•Pre-Heat Time

This depends on the solder paste and the SMD type in use (QFP: 15 sec / eg BGA:

30 sec).

•Soldering Temperature

This depends on the soldering tool and PCB (approx. between 250 and 380°C). All sol-

der joints should reach temperatures between 205 and 210°C.

•Time for Soldering and Cooling

As soon as the solder paste has melted and/or solidified always add a few seconds bey-

ond the bare minimum.

• QFP / BGA: 15 sec

• Reballing: 24 sec

4. Function

87

Teach Parameters

New soldering tasks are normally best catered for by copying an appropriate printed circuit

board file and adjusting the soldering times according to a thermally similar SMD. No valu-

es need to be entered:

The solder program is started as normal and as soon as the heating and cooling phases

start, press the fields Lengthen or Stop. For each phase the set time is thus set to the maxi-

mum: 240 seconds (please observe the process data on the display or on the Solder Star

screen).

As soon as the solder paste has melted completely please wait between 15 to 24 seconds

and confirm by pressing Stop.

Ending the soldering process will save the new parameters.

Input Ranges

• Air Flow: 1 to 25 l/min

• Temperature: 150 to 400°C

• Heating Time: 0 to 240 secs

• IR 0 to 120 Watt

• IRK 0 to 500 Watt

• IRF 03 Power Range: 0 to 1500 Watt

• IRF 04 Power Range: 0 to 2400 Watt

• Dispensing Volume: 0.01 to 10.0 mm³

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88

Reballing BGA / CSP

All solder residues should be removed from

the component and flux applied with a flux

pen prior to reballing.

The component is placed into the Mini Oven

(CSPs with frame) and the template put on

top.

Appropriate balls are distributed across the

template, carefully using the SMD Hook, until

each opening contains one ball.

4. Function

89

Any excess ball should be poured carefully

back into the container.

NOTE:

Excellent results can only be achieved

when all reballing utensils are kept scru-

pulously clean!

The Hot Air Pencil should be inverted and pla-

ced on top of the magnetic catch with the

oven on top of the Hot Air Pen.

Please close the oven carefully and start the

program.

After the reballing cycle the component and

the template can be removed.

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90

Special Menu

This Menu is purposely somewhat hidden and can be accessed by simultaneously pressing

the Menu and VAC function buttons. The Menu button can then be used for scrolling

through the individual sub menus.

•Language

Chose between German or English language display.

•Mode – Normal / Expert / Fritsch

Should you wish to work without PC and protect your soldering programs data in the Hot

Air 04 from being altered, please select Normal.

In the Fritsch mode the z stroke of the positioning arm is de-activated, amongst others.

• IR Type

Please select a suitable output table for your Underheater.

•X and Y Arm Automation

In manual mode the DHP Positioning Arm can be moved by operating the 4 yellow arrow

keys (on the left of the display). Starting a desoldering program with the P+P button acti-

vates it.

•Hot Air Pen Calibration

This procedure takes several hours. The temperature controller automatically selects the

optimum value of every temperature / airflow combination (precisely matching your Hot

Air Pen / Solder Pen / Power Supply).

This optimisation is also carried out during normal operation.

Thou, this function should not be started.

•AutoStart and High Standby

This property is reserved for the Auto Start Pen Stand (Expert 04J).

•Sensor

NiCrNi-Thermocouples should be calibrated to provide acceptable accuracy. This is

done at the factory, using this function.

For example a value of 105 corresponds to a multiplication factor of 1.05 (in this exam-

ple the indication is increased by 5%).

4. Function

91

Maintenance

Overview

Your MARTIN SMD Units need only low maintenance, apart from keeping the outside clean.

Please handle these valuable units with care.

Care should also be taken in providing properly filtered compressed air (please see Techni-

cal Data).

Point of Maintenance Activity Interval Article No.

Solder Sucker - Suction Pen

O-ring - Dispensing Pen

Micro Strainer - Suction Pen

Micro Strainer - Compr. Air Inlet

Fan - DBL 04

Fan - IR Heater

Fan - IRK Heater

Fan - IRF Heater

Easy Cal - Hot Air 04

Clean / change

Clean / change

Clean / change

Check / change

Clean / change

Clean / change

Clean / change

Clean / change

Examine to ISO 9000

Daily / as required

Monthly / as required

Monthly / as required

Yearly / as required

Yearly / as required

Yearly / as required

Yearly / as required

Yearly / as required

Yearly / as required

DV15.0012

PD00.0202

DB15.0021

EB02.0001

HA00.0100

IR21.0004

IR21.0004

SF00.0021

DB00.2013

NOTE:

When replacing bulbs please do not touch them with bare fingers; should any contact

occur the glass surfaces should carefully cleaned with a lint free cloth, soaked in alco-

hol.

WARNING � �• These units run on electricity. Of necessity some components within the device have

dangerous voltages applied to them. Carry out any maintenance work with the

mains supply disconnected.

• Non observance of the operating instructions can cause death, serious injuries

and/or extensive damage to property!

• Keep to the stated maintenance intervals and the stated procedures.

• Repairs and maintenance of electrical apparatus must only be carried out by

qualified personnel. When such work is attempted by non qualified personnel

considerable dangers exist for the user.

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92

Solder Separator – Vacuum Pen

The used solder sucker should be cleaned with our cleaning tool daily or when the suction

becomes insufficient:

1.Remove the used solder sucker nozzle from the Vacuum Pen and lever out the Teflon-tip

from the used sucker nozzle.

2.Push the cleaning tool into the Teflon-tip and remove any solder and/or flux by rotating

it.

3.When necessary replace the Solder Separator too (three Solder Separators are originally

included with the station). The cleaning tool can also be used for cleaning out the glass

pistons.

TAKE CARE �When the solder separator is full flux can get into the pen or even into the main unit,

where it can cause damage.

4. Function

93

O-ring - Dispensing Pen

The O-ring of the syringe adaptor should be cleaned whenever changing syringes and a

occasionally light coating of grease applied to the O-ring is recommended (grease and re-

placement O-rings are supplied with the unit).

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94

Fine Filter – Vacuum Pen

When the Vacuum Pen is in daily use, the Micro Strainer should be cleaned at monthly in-

tervals or replaced (one strainer is originally included with the station).

To remove the Micro Strainer, unscrew the three hollow screws from the rotating nozzle hol-

der. Remove the Micro Strainer together with the spring.

The O ring as well as the balls for the solder sucker tips are available as spares (Part No.

DB15.0023).

4. Function

95

Fine Filter – Compressed Air Inlet

When the Compressed Air Inlet is properly filtered there should be no accumulation of con-

tamination in the Micro Strainer.

For examining and possibly changing the filter the Hot Air 04 can be opened.

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96

Hints

Soldering

•Temperatures [°C]

• 250 � 260 very sensitive components (PLCC-Socket)

• 260 � 290 BGA, µCSP, Reballing

• 330 � 350 sucking used solder, ‘Vogelfutter’

• 320 � 340 SO, TSOP

• 340 � 390 PLCC, QFP (depending on size)

•Air Flow [l/min]

• 2 � 4 MELF (great 4 mm-hot air nozzle)

• 7 � 10 sucking used solder, ‘Vogelfutter’

• 7 � 10 µCSP

• 8 � 15 SO, TSOP

• 15 � 25 PLCC, QFP, BGA

•IR-Power with IRF-Underheater [W]

• 750 � 900 Standard

• 900 � 1200 Multilayer

• 1200 � 1500 Short heating

•IR-Power with IRK-Underheater [W]

• 600 � 750 Standard (appropriates in fact 200 - 250)

• 750 � 1150 Multilayer (appropriates in fact 250 - 350)

• 1200 � 1500 Short heating (appropriates in fact 350 - 500)

• at higher power the temperature overload switch of the IRK will switch off after a few

minutes.

• Please use the combs to support your PCB on the IRK convection underheater.

•IR-Power with IR-Underheater [W]

• 450 � 600 Standard (appropriates in fact 30 - 40)

• 600 � 900 Multilayer (appropriates in fact 40 - 70)

• 900 � 1500 Short heating (appropriates in fact 70 - 120)

4. Function

97

Programs – Teach Mode

1.Please copy a program that refers to a board closest to your current type in terms of PCB

and components (NORMAL => standard PCB; MLAYER => multi layer board).

2.Check the settings for the underheater by not using the hot air pen and measuring the

temperature of the underside of the PCB, which should not exceed 120 to 130�C.

3.Using the hot air pen, too, (PCB has been allowed to cool) The LENG button is pressed as

soon as the soldering phase begins. When all solder joints have molten, please wait

another 12 seconds and then press the Stop function button.

Dispensing

•Changing the nozzles:

•We recommend that any metal nozzle be left attached to the syringe when finished with

it. Metal nozzles do not have to be cleaned after prolonged pauses (days) in their use sin-

ce the solvents do not diffuse through the metall. Normally it is sufficient to dispense a

few trial dots.

Before a new syringe tip or nozzle is used for real, please dispense a short burst of (possi-

bly thickened) adhesive or solder paste from the syringe (eg by line dispensing).

•When applying solder paste or adhesive to a substrate hold the dispensing pen at an an-

gle of approx. 45° and press the Start button or foot switch. Only after dispensing is com-

pleted move the pen vertically away.

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98

5. Solder Star

MARTIN Software

NOTES:

• Please note that for the installation administrator access is required (not for

WIN98).

• Please save any already existing soldering profiles and uninstall older MARTIN

software versions.

• Please remove any existing MARTIN directories.

1. Setup for Win 98 se, Win 2000, Win NT.

Please insert your MARTIN-Rework+Dis-

pense-CD into your CD drive.

The CD should autorun.

Please select the language for the installa-

tion.

2. The Setup-Assistant guides you through the

installation and lets you know the version

number and how to proceed.

3. Here you can choose the preferred instal-

lation directory; however, we recommend

not to change the default values.

5. Solder Star

99

4.Please tick the relevant boxes for the instal-

led programs.

In the Rework+Dispense Technique Presen-

tation you’ll find useful information and illu-

strations, including the required memory.

5.Please confirm here the program field MAR-

TIN to add it to existing program groups.

6.The settings are now complete are shown

again for you to check.

The installation process starts. Please confirm with OK after Setup is successfully completed.

Please open the Readme.TXT of the installed software, print it out and read it carefully, as

up to date information and trouble shooting tips are contained there, which are have arisen

since the manual was printed.

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100

Process Description

1.Please double click on the Solder-Star Icon.

The Program window appears. Please

press the Hot Air�PC button to transfer all

programs from your Hot Air 04 or DBL 04

into the program.

2.Please select the program to be modified

from the file list by double click.

3. In the program window the soldering profi-

le data can now be modified as required

and saved. The function PC�Hot Air

transfers the programs back to your

Hot Air 04.

5. Solder Star

101

Program Mask

This program window appears after starting the program.

The soldering profiles, likewise, can be modified and stored.

For the correct parameter selection, please see under parameter strategy in your Rework

ABC.

You can name your printed circuit board and component individually here.

The program navigator allows the selection from the whole of the program range, as well

as moving one program up or down by using the + or - keys.

The Copy button adds the selected program and contains the same PCB and component

name, to differentiate between the programs a hyphen is added to the end.

The Delete button removes the selected profile.

The Screen button PC�Hot Air and Hot Air�PC copies all profiles from your PC to your

DBL 04 (Hot Air 04) and vice versa.

WARNING � �All data in the target file will be overridden and cannot be retrieved. Please back up

your data by using of the Solder-Star Save program.

By clicking the Monitor Field you are returned to the Temperature Monitor and to Analysis

(please see Monitor window).

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102

Overview Mask

From the Overview window the profile to be used can be selected by double click with the

left mouse button.

The End button will exit the Solder Star program.

All program data remains stored in your PC.

5. Solder Star

103

Installation Mask

In the Installation window some program specific changes can be carried out.

The default interface port setting is COM 2, this can be adjusted to suit the hardware confi-

guration at any time.

There is a choice between German and English.

Depending on your Expert equipment options the IR unit (Underheater) should be set to IR

(Single Radiator 120W) / IRK (Compact radiator 500W) or IRF (Large Area Heater 1500W).

The Database Operations allow the possibility of over writing all soldering programs with

standard values, where your individual soldering programs will be deleted and replaced by

those set at the factory as default, or to delete the whole database, leaving it free to accept

a completely new set of your data.

The path specification is intended for network users and can of course be modified to suit

particular circumstances.

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104

Monitor Mask

The progress of your soldering profile is shown graphically.

The precise temperatures of the Hot Air Pen and sensors 1 and 2 can be indicated digitally.

The function Stop + Print terminates the Monitor function and prints the current profile and

the Soldering program.

The button Stop + Analysis takes you to the Temperate Analysis program.

5. Solder Star

105

Analysis Mask

The OK key takes you back to the Monitor function.

With the End key in the Monitor window one returns to the Program window.

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106

Save – Backup System

The Save Backup System serves the purpose of

saving all soldering programs from your Sol-

der Star Program on the hard disk in an own

directory (Save) from where it can also be re-

trieved.

By changing the path other storage media (eg

FDDs...) can be made available.

We recommend that before finishing work at

your MARTIN Work Station you should save

the data.

5. Solder Star

107

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108

A. Appendix

Interfaces

Solder Pen

Thermocouple PT500 3 pin round plug

between pins 1 and 3: R � 540 �

at a room temperature of 20° C

Pen potential

connected to housing earth

by high resistance black hose pin side

Suction Pen

Button

between pins 3 and 4: 4 pin round plug

button pressed => 0 �

button relaxed => � �

Pen potential

connected to housing earth

by high resistance black hose pin side

Solder Pen

Thermocouple PT500 7 pin round plug

between pins 3 and 5: R � 540 �

at a room temperature of 20° C

Heating element

between pins 1 and 7: R � 5.5 �

Insulation pin side

between pins 4 and 5: R = � �

Pen potential

connected to housing earth

by high resistance black hose

A. Appendix

109

IR/IRK/IRF Underheater

IR Lamp 7 pin round plug

between pins 1 and 6: R � 5.5 �

IR/IRK Fans

Set voltage pin 7: + 24 V

Set voltage pin 3: � 24 V

IRF Cooling Fans pin side

Set voltage pin 7: + 24 V

Set voltage pin 4: � 24 V

IRF Power Supply

(for lightning and fans in the Smart Fix)

Set voltage pin 6/5: � 25 V~

Foot Switch Socket

Foot switch

between pin 5 and 9

Mains Voltage Selection

230 V

Fuse: 6.3 A slow blowing

115 V

Fuse: 10 A slow blowing

Rework eco May/2002

110

Electrical Schematic Diagram

A. Appendix

111

X1:Prozessor LPprocessor pcb

Si1:8,0A MT Sicherung für Lötgriffel

8.0A MS fuse for solder pen

U3:

TIC 263Treiber fürLötgriffel

driver forsolder pen

U3:TIC 263

Treiber für IRdriver for IR

Si2:

8,0A MT Sicherung für IR8.0A MS fuse for IR

U1:Optokoppler für Lötgriffel

coupler for solder pen

U2:Optokoppler

coupler for IR

X1:Buchsen LPsockets for pcb

Pin 1:rot / red

X8:Display

X3:Tastenfeld

buttons

X7:Ventile für DIS und VACvalves for DIS and VAC

X9:Ventile für AIR

valves for AIR

X12:Lüfterfan

Pin 1: braun

brown

Si1:Sicherung 2,5A MTfür Analog- und

Digitalteilfuse 2.5A MS

for analog anddigital

SI2:

Sicherung 2,5A MTfür Ventilefuse 2.5A MS

for valves

U11:

Regler 24Vcontroller 24V

U12:

Regler 5Vcontroller 5V

X11:2 xThermosensoren2 x sensors for temperature

X5:

Fußtasterfoot switch

X4:Serielle Schnittstelleserial interface

Eprom

HA4.xx

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Declaration of Confirmity for Quality Assurance

(DIN 66066)

Martin GmbH, Argelsrieder Feld 5, D-82234 Wessling

Declares under own responsibility:

all products having an own article number

Fulfill the requirement of the standard:

DIN ISO 9003

This declaration is given on the basis of a Management Review and is guilty without signa-

ture.

Declaration of Confirmity

(EN 45014)

Martin GmbH, Argelsrieder Feld 5, D-82234 Wessling

Declares under own responsibility:

Name of product: DBL IRF AVP HA HB SD RD DL MB850 MT2000...

CD MB4000 MT7000

Serial number: 04... 03... 04... 04... 02... 02... 05... 06... 04... 04...

04... 07...

Options: all all all all all all all all all all

Fulfill the requirement of the standard:

Protection: IP20 IEC 529 / EN 60529

ESD protection: CECC 000151/l

Tested: 89/336/EWG

Wessling, 01.01.2002 Bernhard Martin / Robert Eberl

This declaration is given on the basis of a Management Review and is guilty without signa-

ture.

Rework eco May/2002

112

Rework + Dispense Technic

Argelsrieder Feld 5

D-82234 Wessling

Fon +49 (0) 8153-9329-30

Fax +49 (0) 8153-9329-39

Mail info@martin-smt.de

www.martin-smt.de

®