Manufacturing Process Innovation

1-phase AC 200, 220, 230, 240 V　1.5 kVA *2

0.5 MPa, 60 L /min（A.N.R.）W 964 mm × D 2 380 mm *3 × H 1 444 mm *3

1 390 kg（Only for main body:This differs depending on the option configuration.）

± 12.5 µm

Model No.

PCB dimensions

Repeatability

Cycle time

Electric source

Pneumatic source

Dimensions

Mass

Model ID NPM- DSP

Screen frame dimensions

NM-EJP4A

L 50 mm × W 50 mm to L 250 mm × W 216 mm

L 450 mm × W 450 mmL 432 mm × W 432 mm（optional）

6.5 s/board *1

3-phase AC 200, 220, 380, 400, 420, 480 V 2.5 kVA

0.5 MPa, 100 L /min（A.N.R.）W 835 mm × D 2 448 mm *3 × H 1 444 mm *4

1 450 kg（Only for main body:This differs depending on the option configuration.）

57 000 cph（0.063 s/chip ）

（01005’’）0402 chip*1 to L 12 mm × W 12 mm × T 6.5 mm

8 500 cph（0.423 s/QFP）

（0201’’）0603 chip to L 100 mm × W 90 mm × T 28 mm

34 000 cph（0.106 s/chip ）± 40 µm/chip± 30 µm/QFP □12mm to □32mm ± 50 µm/QFP □12mm Under

（01005’’）0402 chip*1 to L 32 mm × W 32 mm × T 12 mm

1.2 s（Board size：L 160 mm × W 320 mm Under ）, 2.4 s（Board size：L 160 mm × W 320 mm to L 350 mm × W 480 mm ）

8 mm tape：Max. 68 （double feeder, small real）Tape：8 / 12 / 16 / 24 / 32 / 44 / 56 mm Tape : 8 to 56 / 72 / 88 / 104 mm

Model No.

PCBdimensions

Component dimensions

Max. speed

Placement head

PCBexchangetime

Componentsupply

Electric source

Pneumatic source *2

Dimensions *2

Mass

・GHG Factor ・Resource Factor （Ref.Product:SP28P－DH）

8.76 6.73

Model ID NPM

・GHG Factor ・Resource Factor （Ref.Product:CM202－DH）

3.01 5.62

*It may not conform to Machinery Directive and EMC Directive in case of optional configuration and custom-made specification.

*It may not conform to Machinery Directive and EMC Directive in case of optional configuration and custom-made specification.

± 40 µm/chip ± 30 µm/QFPPlacement accuracy（Cpk≧1）

Stick,Tray

Single conveyor

Dual conveyor0s* *No 0s when cycle time is 4.5 s or less

4.5 s

Single conveyor

Dual conveyor

Taping

NM-EJM9B

L 50 mm × W 50 mm to L 510 mm × W 480 mm

L 50 mm × W 50 mm to L 350 mm × W 216 mmDual-lane mode

Single-lane mode L 50 mm × W 50 mm to L 350 mm × W 460 mm

12-nozzle head 2-nozzle head8-nozzle head

Stick：Max. 8 , Tray：Max. 20 （per tray feeder）

Dual-lane mode

Dual-lane mode

2D inspection head（A） 2D inspection head（B）

Square chip (0603 / 0201" or more), SOP, QFP (a pitch of 0.4mm or more), CSP, Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector,

Network resistor, Transistor, Diode, Inductor, Tantalum capacitor, Melf

Square chip (0402 / 01005" or more), SOP, QFP (a pitch of 0.3mm or more), CSP, Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector,

Network resistor, Transistor, Diode, Inductor, Tantalum capacitor, Melf

Max. 10 000 Max. 10 000

Missing components, Position shift, Rotation error, Polarity check, Foreign object *5 Missing components, Position shift, Rotation error, Polarity check, Foreign object *5

44.4 mm × 37.2 mm 21.1 mm × 17.6 mm

0.5 s / View size 0.5 s / View size

18μm 9μm

Inspection head

Applicable components

Inspection number

Inspection items

View size

Resolution

Inspection time

PRODUCTION MODULAR SCREEN PRINTER

2009

Electronics Assembly System catalog

* 1 dual screen printer + 3 production modulars in-line type

Model No.NM-EJP4A Model No.NM-EJM9B

All data as of February.1,2009.

●Changes in specifications and appearance may be made without notice for product improvement. ●Homepage http://panasonic.net/pfsc/

●Recycled paper is used this Catalog.

Inquiries…

Panasonic Group builds Environmental Management System in the factories of the world and acquires the International Environmental Standard ISO 14001:2004.

ISO 14001

Panasonic Group products are built with the environment in mind. http://panasonic.net/eco/

Marketing & Solution Division

441-13 Nagahasu, Tateishi-cho, Tosu-city, Saga 841-8585, Japan TEL +81-942-84-2644 to 2646 FAX +81-942-84-2636

Ver.February.1,2009

●To ensu re sa fe ty when us ing th i s equ ipment a l l work shou ld be 　per fo rmed accord ing to tha t as s ta ted i n the supp l i ed Opera t i ng 　Ins t ruc t ions . Read you r ope ra t i ng i ns t ruc t ion manua l t ho rogh ly .

●Please read the User's Manual careful ly to 　famil iar ize yourself with safe and effective 　usage procedures.

Safety Cautions

*with Panasonic calculation formula*with Panasonic calculation formula

* Placement tact time, inspection time and accuracy values may differ slightly depending on conditions* Please refer to the specification booklet for details.

*1:The 0402 chip requires a specific nozzle/feeder. *2:Only for main body*3:Dimension D including tray feeder : 2 479 mm Dimension D including feeder cart : 2 524 mm

*4:Excluding monitor and signal tower*5:Foreign body inspection is available to chip components (Under development)

*Values such as cycle time and accuracy may vary depending on operating conditions. *Please refer to the specification booklet for details.

*1:With Panasonic optimal conditions (when printing on a 250mm x 150mm board) *2:Including blower and vacuum pump

*3:Excluding monitor and signal tower

Placem

ent height co

ntrol system

Operation navigation

system

APC sys

tem*

Component

Verifica

ton opti

on

Automat

ic changeover

option

Host com

municati

on option

Mixed product ion with di f ferent type substrates onthe same line is also provided with the dual conveyor.

12

2 8

SPI AOI

DT

NPM-DSPDUAL SCREEN PRINTER

NPMPRODUCTION MODULAR

PCB distribution conveyor *1 NPM－DSP NPM

PCB distribution conveyor *1

*1:Please the PCB distribution conveyor from other companies

* Under development

DSP

System evolution according to mounting changes NEW CONCEPT MACHINE

High area productivity with total mounting linesHigher productivity and quality with printing, placement and inspection process integration*

Configurable modules allow flexible line setupHead location flexibility with plug-and-play functions

2

Comprehensive control of lines, floor and factory with system softwareProduction plan support through line operation monitoring

3

1

Placement heads

Dual Screen Printing

12-nozzle head

8-nozzle head

2-nozzle head

Supply units

Feeder cart（17 inputs）

Tray feeder（20 Component types）

System software

Process units

3D inspection head*

Adhesive dispensing head*

2D inspection head

●NPM－DGS Data Creation System

Total line solution

Smaller-footprint modular lines byinstalling inspection heads*

Provides high-quality manufacturing with in-line inspection

12

8

12-nozzle head

8-nozzle head

…

…

ADH …Adhesive dispensing head S P I *…Print inspection AO I …Placement inspection

2 … 2-nozzle head

ＡＤＨＡＤＨ

Multi-Production Line

PCB distribution conveyor *1 NPM－DSP NPM

ChipChip

High productivity

Industry-leading area productivity *1 Dual conveyor(Optional)

Employs dual mounting method

2 505 mm

●Max. speed

　171 000 cph●Area productivity

　27 800 cph/m2

*1:as of February.1, 2009. NPM three-machine in-line setup

The dual-lane conveyor realizes zero changeover time through placingcomponents with one lane and replacing PCBs on the other lanesimultaneously. Improves productivity.Produces PCBs of the same and/or different types with each lane.

●PCB dimensions　Dual-lane mode　L 50mm × W 50mm to L 350mm × W 216mm　Single-lane mode　L 50mm × W 50mm to L 350mm × W 460mm●Dual / Single-lane mode change　Manual change system

High functionality & High reliability Inherited from Panasonic's mounting systems

Placement After reflow process

3D POP Jisso (Tape feeders) APC system* Tape feeder（8 to 56 ㎜） Nozzles

Bal l lacking CSP（image）

3D sensor Vertical line camera Tape feeder（72 to 104 ㎜） Stick feeder* Under development ：Provides compat ib i l i ty wi th the CM ser ies

User-friendly operation Navigation system

Operation navigation Changeover navigation system

Equipment that has the longestcycle time lights up

Production status check screen Operation navigation screen

Feeder cart changeover time can bereduced significantly

Changeover time per feeder cart

NPM

Conventional （CM602）

Operation count：4(75% reduction)

Operation count：16

3 minutes

0.5 minutesTime reduced by2.5 minutes

Changeover navigation system

Uni-floating printing method

Local decrease in solder viscosity

PlasticUrethane Metal

Transcription rate [%]

100

80

60

40

20

0

Plastic squeegee Metal squeegee

●Realization of user-friendly, easy-to-operate functions that enables the almost　automatic print condition adjustment on the basis　of our rich printing experiment database.

Advanced squeegee Solder transcription quantity

High-speed multiple snap-off Light cleaning

60。

θ θ

60。

P1 P2

System evolution according to mounting changes NPM－DSP

High quality printing Inherited from Panasonic proprietary printing technology　

●Our original uni-floating printing method　ensures the excellent filling performance　regardless of the board asperity.

●Realization of the high-quality　printing by combination with　the favored high-speed multi　snap-off of the SP80/60 series.

●Light cleaning prevents the flux from drying　up and realizes the stable solder transcription　quantity by adopting the solder-friendly suction　force.

Stable form and quantity of soldertranscription on the entire board

CSP 0.5 mm pitch

Negative clearance

Squeegee angle: Fixed (θ)Printing pressure: Adjusted automatically (feedback control)

●After cleaning

●Before cleaning

Because the flux does not dry up, the soldertranscription quantity becomes stable.

Solder leak out state

●Advanced squeegee prevents the solder from leaking out of the printing　area. It also reduces the waste solder and prevents the mask from being　clogged with deteriorated solder.

Adjust the block according to the board size.

●Realization of the stable operation and higher-quality printing by　combination with the plastic squeegee that ensures the solder　transcription quantity without damaging the mask.

Mask surfacecondition after30 000 printings

User-friendly operation “Easy-to-Operate Functions” with User-Friendly Design

Board type selection key

Standard conditions are set

Condition adjustment key

●Automatic batch teaching of the board and mask recognition marks.

Batch teaching Recognition mark search functions

Automatic correction

System evolution according to mounting changes NPM

Area productivity increases by up to 47% (compared to conventional SP18P-L)

High productivity Employs dual printing method

Changeover performance during operation

With front and rear printing stages and fully independent operation, changeovercan be performed at the rear stage while the front stage is running.

Board type B production Board type C preparation

Board type A productionNPM－DSP NPM

Continuing board type A productionNPM－DSP NPM

PCB distribution conveyor *1 PCB distribution conveyor *1

*1:Please the PCB distribution conveyor from other companies

● Conventional machine (SP18P -L )

1 64 boards/ h ・ m 2 ●NPM ー DSP

2 4 1 boards/ h ・ m 2

1 100 mm

m

m

6 3 5 1

m

m

0 8 3 2

964 mm Cycle time : 13 s/board Cycle time: 6.5 s/board

2D inspection head

<Example of printing position correction>

BGA mounting surface Sealed case mounting surface

Data Creation SystemSoftware packages include multi-CAD import, component library registration, assignment simulation functions

LNBLine Network BoxData is intensively managed by combining multiple machines in line.

NPM LineCM Line

NPM－DGS

PC*1PC*1PT200

NPM-DGS（Model No.NM-EJS9A）

①Multi-CAD import ③Simulation

②Component library ④Mix Job Setter(MJS)

⑤PPD/LWS Editor

⑥Off-line component data creationoption

Almost a l l CAD data can be retrieved by macro definit ion registration. Properties, such as polarity, also can be confirmed on screen in advance.

Tact simulation can be confirmed on sc reen i n advance so tha t l i ne t o t a l ope ra t i on r a t i o can increase.

With quickly and easily compiling placement and inspection head data on the PC display during operation, time loss can be minimized

A component library of all placement machines including the CM series on floor can be registered to unify data management.

Production data optimization allows the NPM to commonly arrange feeders. Feeder replacement time reduction for changeover can improve productivity

With creating off-line component data using a store-bought scanner, productivity and quality can be improved.

0

Production time (hour)

Setup

Production volume (number)

20

40

60

80

100

with MJS

without MJS

1 3 5 7

Production 1 Production 3

Changeover 1

Changeover 2

*1 :A computer must be purchased separa te ly .

●Component setup error prevention　Prevents setup errors through verifying the NPM downloaded　production data and component barcode data●Array data activesync function　There's no need to select array data; data is verified with the NPM●Interlock function　Equipment stops when it has an incorrect and/or incomplete verification●Navigation function　Clearly provide a verification task with data display and Intelligent　feeder performance in sync●Scanner selection　Users can choose either a wired or wireless scanner (PDA)

Prevents setup errors duringchangeover Provides an increaseof production efficiencythrough easy operation

High-quality mounting Component Verification option

Scanner

High productivity Automatic changeover option

●PCB ID read-in type　PCB ID read-in function is selectable from among 3 types of external scanner, head camera or planning form

Supporting changeover (production data and rail width adjustment) can minimize time loss

NPM－DGS

NPM LineExternal scanner Head Camera Planning form

Off-line setup support station

●Station type　Users can choose either power supply or component verification 1. Power supply type: Supplies power to feeder carts and feeders

Material preparation area Production area

2. Component verification type: Supplies power to feeder　　carts and feeders as well as can verify components.　 It allows a scanner to read Component 1D / 2D code.

Additional feeder carts and feeders can be prepared externallyduring operation

Scanner

1. Power supply type 2. Component verification type

1. Power supply type 2. Component verification type

●Events　Outputs a real-time event of equipment●Other company's component verification　Communicates with your component verification systems ●Component management data　・Component remaining quantity data: Outputs component remaining quantity data　・Trace data: Outputs data linked with component information (*1) and PCB information (*2)

(*1) Requires input of component information with a component verification　　　option or an other company's component verification system I/F (*2) Requires input of PCB information with automatic changeover option

Able to standardize the interfacing with yoursystems currently used. Provides data communicationwith our standard interfaces

NPM Line

Open interface Host communication option

Host system (Users)

Panasonic proprietary high-quality production system

Post-mounting inspection (AOI)

Feedback to Screen printers Feedforward to mounting heads

APC System

After reflow

Feedforward to AOI

Mounted component inspection Pre-mounting foreign object*1 inspection* Feedback to mounting processes*

DSP

AOI

DSP

DSP

AOI

8

12

2

・Printing position correction・Cleaning direction・Stop direction due to sudden defect

・Solder position data (APC)　Chip components(0402C/R ～)　Package components (QFP, BGA)

・Block, Discrepancy mark data　communications

・APC component placement position data

* Under development

* Under development*1:Foreign body inspection is available to chip components

・Mounting position check

Shift

Flipping

Polarity　

・Pre-mounting foreign object inspection of BGAs・Pre-mounting inspection of 　sealed cases

・Display mounting misalignment 　warning to applicable modules・Immediate halt to applicable 　modules for missing　componentsOK

OK

OK

NG

NG

NG

In-line inspection achieves high-quality mounting*

INSPECTION HEAD

SPI

ADH

SPI

ADH

Placement heads

Post-printing inspection* Post-placement inspection

Dual Screen Printer Repair data display

Printing positioncorrection*

Inspectiondefect data*

Solder position data*Foreign body*1 inspectioncommunication* Feedback

data*

F/B

* Under development

:Data communica t ion

* 1：Fore ign body inspec t ion is ava i lab le to ch ip components

Post-printing inspection(SPI)* 3D inspection head

Post-printinginspection　　

Standard soldermounting

Standard mountinginspection

Measures and inspects misalignment placement position data ofmounting and landstandards

Corrected

Misalignment tolerance

Misalignment range

Corrects all printing positions outside of tolerance levels

Corrected values