Laser slotting of silicon for inkjet printer heads

Chin-Ting Lin

Institute of Mechanical EngineeringDate 2011/05/30﹕

Paper Survey

Tuan Anh Maia, Delphine Perrottet*a, Max Wikia and Bernold RicherzhagenaaSynova SA, Ch. de la Dent-d’Oche, CH-1024 Ecublens, Switzerland

2

Outline

Introduction

Conventional manufacturing procsses

Water-jet-guided laser

Damage-free laser slotting

Conclusion

Introduction

Figure 1: Basic principle of a inkjet-printer head.

Thermal Bubble Jet Technology

Conventional Manufacturing Procsses

Sandblasting Narrow slots below 150 microns.

Etching Slow and expensive Require masks.

Water-jet-guided Laser

Figure 2: Basic principle of the water-jet-guided laser technology

Damage-free Laser Slotting

Figure 3: Slot end (broken after cutting)

Nd:YAG laserWavelength 532 nmCutting speed: 1.2 mm/sNozzle:100um

675u

m

Figure 5: Chip backside, free of chipping

Damage-free Laser Slotting

Nd:YAG laserWavelength 532 nmCutting speed: 1.2 mm/sNozzle:30um

Damage-free Laser Slotting

Figure 4: Race track

Nd:YAG laserWavelength 532 nmCutting speed: 1.2 mm/sNozzle:30um

Figure 6: Slot exit side

Damage-free Laser Slotting

Nd:YAG laserWavelength 532 nmCutting speed: 5 mm/sNozzle:30um

Conclusion

The water-jet-guided laser technology has proved its capabilities of matching the requirements of silicon slotting for inkjet-printer heads. After a short phase of parameter optimization, the required quality and speed were not only reached but also surpassed. The produced slots are free of any length or depth limitations and the quality remains constant over time.

Thanks For Your Attention!!!