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Kokomo Operations of GM Components Holdings, LLC
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Transcript of Kokomo Operations of GM Components Holdings, LLC
1GM Components Holdings, LLC Kokomo Operations
Kokomo Operations Overview www.kokomogmch.com
Brian King Business Development Manager, Kokomo Operations (765) 451-9904, [email protected]
Tim Guse Business Development Manager, Electronic Assembly, Thick Film Printing (765) 451-9188, [email protected]
Greg Bozarth Business Development Manager, Semiconductors (765) 451-7142, [email protected]
2GM Components Holdings, LLC Kokomo Operations
Bypass Campus
3GM Components Holdings, LLC Kokomo Operations
4GM Components Holdings, LLC Kokomo Operations
History
1930’s– Haynes – Home Avenue Building 1930’s– Crosley – home radios– Delco Radio – 1936
1940’s– Military production supporting war effort– Speaker, household radios
1950’s– Administration Building added– All-transistor radio introduced
1960’s– Plant 8 opens in 1962– Plants 7 & 9 open in 1965– AM/FM radio, AM/FMST/Tape player– automatic HVAC control
1970’s– Electronic ignition– Delco Electronics Division of GM - 1970– Seat belt interlock– ETR – Electronically Tuned Radio– ESC – Electronic Spark Control– ECM – Engine Control Modules
1980’s– Semiconductors– Fab III opens in 1983– Speaker production ceases– PASS-Key anti-theft device– Delco Electronics Corporation, Subsidiary of
Hughes Electronics – 1986– AM/FMST/Compact Disc– BCM – Body Computer Modules
1990’s– 50-millionth ECM produced– Monsoon high-end audio brand– QS-9000 registration– ISO 14001 Environmental certification– Delphi Delco Electronics Systems – 1999– Consolidation to Bypass site– SDM – Sensing & Diagnostic Modules
2000’s– PODS – Passive Occupant Detection System– Delphi Electronics & Safety – 2004– Audio production ceases– Power Electronics products– Consolidated Milwaukee ECMs, BCMs– GM Components Holdings, LLC - 2009
5GM Components Holdings, LLC Kokomo Operations
Formation of GM Components Holdings, LLC
Delphi Reorganization – October 7, 2009.
General Motors purchased four U.S. Manufacturing sites from Delphi to create GM Components Holdings, LLC (GMCH).
GM Components Holdings, LLC includes:– Kokomo, IN – automotive electronics, integrated circuits products– Grand Rapids, MI – powertrain products– Lockport, NY – heating, ventilation & air conditioning products– Rochester, NY – powertrain products
GMCH owns the facilities and manufacturing support in Kokomo formerly owned by Delphi Electronics and Safety.
6GM Components Holdings, LLC Kokomo Operations
Kokomo Operations
Plant population– Hourly – 726 employees – Salaried – 328 employees
» 127 Engineering
3 Manufacturing Areas– Electronic Assembly Operations– Thick Film Printing– Semiconductors
7GM Components Holdings, LLC Kokomo Operations
Facility Key Facts
Facility – 3M + Square feet
» EA 2.5M Sq ft (temp/humid control)» Thick Film Print 42K sq ft (Cleanrooms)» Semiconductors 500K sq ft (Cleanrooms)
– 5 Cleanrooms» 8” Semiconductor - Class 1» 5” Semiconductor - Class 10» Wafer Bumping - Class 100» Wafer Testing - Class 1000» Thick Film Printing - Class 10K
8GM Components Holdings, LLC Kokomo Operations
Electronic Assembly Processes Surface Mount
– 18 SMT Lines (16 laminate, 2 hybrid)– Single or double sided capability– Standard reflow Pb or Pb free– Wave soldering– Selective soldering
Highly Reconfigurable Assembly Cells– Adhesive dispense– Conformal coat– Auto/semi-auto/manual assembly– “Smart” screw-driving– Wire bonding: Au and Al
Test– In circuit– Functional– Programming– Conditioning
9GM Components Holdings, LLC Kokomo Operations
Current Electronic Assembly Products
Body Control Module - BCM
Engine Control Module – ECMTransmission Control Module – TCM
Sensors
Sensing Diagnostic Module– SDMBelt Alternator Starter (BAS+)
10GM Components Holdings, LLC Kokomo Operations
Precision Fabrication CenterFabrication from tooling and fixtures to entire machines. Precision Sheet Metal Fabrication 3D Modeling (Unigraphics) CNC and General Machining Wire Electrical Discharge Machining (EDM) Laser Cutting Fabrication Precision Welding Stereolithography (SLA) Urethane Rubber Molding Plastic Injection Molding Stamping Press Capability Quartz Glass Fabrication and Repair Custom Designed Cabling
11GM Components Holdings, LLC Kokomo Operations
Thick Film Printing Processes
Typical Base Materials– Alumina (typical ceramic material) – AlN (high-power applications)– Stainless Steel (specialty)
Low to High-Volume Production– Standard substrate sizes 3.25”x5.5” or 6”x8”– Multi-layer printing including multiple metal levels– Through hole printing– Double sided printing– Resistor printing and trimming– Thermistor printing and trimming– Fixed probe or Flying probe testing
In-house capability to develop and produce custom inks for specific applications.
– Including sense resistor technology down to 8 milliohm.
12GM Components Holdings, LLC Kokomo Operations
Why Thick Film?
Hybrid thick film is typically chosen for high reliability applications, harsh environment or high power dissipation applications.
– Used extensively in Automotive, Military and Aerospace applications as well as high-power applications.
Hybrids typically run single digit ppm.
Significant cost advantage over LTCC– Can provide a significant savings over comparable
LTCC technology up to 30 print layers. Ceramic Substrates
13GM Components Holdings, LLC Kokomo Operations
Kokomo Operations Thick Film Advantage
Largest volume thick-film production facility in the world has created significant price advantages with material suppliers
– Ceramic and Ink make up the largest portion of overall costs.– Kokomo printer cycle times 4 sec/print. – Industry average 12-15 sec/print.
Direct Screen Imaging– Capable of 3mil lines and 5mil spaces. Well beyond industry average. – Small via openings (6mil) allow true multi-level metal capability.– Provides lead time advantage over competitors.
Our LAS technology allows us the capability of printing on the largest ceramic in the industry
– Advantage of higher circuit count for the same labor content.
Ultra Thick Thick Film Capability– Ultra Thick Thick Film (UTTF > 50 microns thick in one print) is technology that was
developed here that could provide significant cost and thermal advantage in power electronics (vs. thick plated or clad technology).
14GM Components Holdings, LLC Kokomo Operations
Semiconductor Products/Processes
Application Specific Integrated Circuits (ASIC)– Complimentary Metal-Oxide Semiconductor (CMOS)– Bipolar– BiCMOS– SmartPower (BCDMOS)– MEMS
Discrete– Discrete Metal-Oxide Semiconductor (DMOS)– Insulated Gate Bipolar Transistor (IGBT)– Diodes
15GM Components Holdings, LLC Kokomo Operations
Quality Certifications
– TS16949/ISO9001– ISO 14001
Awards:– JD Powers– Shingo
On site certified metrology and calibration Six Sigma and Shainin master problem solvers on site Failure Analysis Capability
– Multiple electrical analysis labs– Scanning Electron Microscope (SEM)– Elemental analysis– Cross sectioning– Sono-scan– X-ray– FTIR
16GM Components Holdings, LLC Kokomo Operations
Summary
Very robust manufacturing capabilities designed for high reliability products.
Strong technical team.
Expertise in building high quality automotive-grade electronics suitable for demanding operating environments.
Vertical Integration opportunities.– Wafer Fabrication– Thick Film Printing– Electronics Assembly
www.kokomogmch.com