Keynote (Mark Papermaster) - Powering the Next Generation Surround Computing Experience, by Mark...

LET’S BRING SURROUND COMPUTING TO LIFE MARK PAPERMASTER NOVEMBER 13, 2013

2 | AMD DEVELOPER SUMMIT | NOVEMBER 2013

APU13 – A WEEK OF HEADLINES

NEWS AMD Drives CPU/GPU Combo Into the Data Center With New Allies -VentureBeat

AMD Charts a Path to Java On the GPU -SemiAccurate

AMD Kaveri APU – Impressive Graphics Power Detailed -My Gaming

AMD Kaveri APU Showcased, Has Double The Performance Of Intel 4770K With A GeForce GT630 -DSO Gaming

Advanced Micro Devices is announcing new support from hardware and software companies today for a new kind of data center computing, dubbed heterogeneous system architecture (HSA).

The architecture makes it easy for a program to use the available computing power in a system, whether it comes in the form of a traditional central processing unit, or CPU, or a graphics processing unit (GPU), which can be programmed to handle non-graphics tasks. The idea is to help servers in data centers to keep up with demands on the cloud from mobile devices.

AMD’s Developer Summit is currently underway and yesterday the company showcased its new APU, the Kaveri. AMD’s Kaveri – the A10-7850K – was put against an Intel i7-4770K paired with an Nvidia GeForce GT630. Without a discrete GPU – and without taking advantage of the Mantle API – the A10-7850K has double the performance of the aforementioned combo in Battlefield 4.

Unified Heterogeneous Computing Arrives -Electronic Design

AMD has been ramping up their tools effort of late to support GPU compute on the server-side and today it is Java’s turn again. As SemiAccurate mentioned a while ago, AMD is not just making slides about servers, they are really making tools. Two years ago, AMD announced that the Aparapi API could target OpenCL so that one could explicitly compile Java to a parallel environment that was GPU aware. Essentially Java in, OpenCL bytecode out.

AMD has revealed some detailed specifications of Kaveri. It’s AMD’s next APU on socket FM2+ and is the culmination of the work AMD has put into HSA (Heterogeneous System Architecture). AMD announced that it is on track to ship Kaveri to its channel partners before the end of 2013. More details on the APU will be available at CES 2014, with general availability to the public in February 2014. Pricing and exact availability dates were not announced by the company.

AMD’s 2013 Developer Summit is off to a bang with chips, SDKs and architectures. The Kaveri (Fig. 1) Accelerated Processing Unit (APU) implements AMD’s Heterogeneous System Architecture (HSA). HSA delivers heterogeneous unified memory access (hUMA)so CPUs and GPUs share the same virtual address space. It means that data does not have to be copied between CPU and GPU accessible memory as is required with most CPU/GPU environments. The new APUs provide hQ (heterogeneous queuing) support (Fig. 2). The hQ allows CPU and GPU applications to schedule new GPU jobs directly. Combined with hUMA, hQ delivers significant efficiencies compared to isolated CPU/GPU architectures.


SURROUND COMPUTING – PROGRESS IN 2013 AUDIO, DISPLAY, IMMERSION, INTERACTION

Next-generation game consoles feature voice, vision, and motion technology Virtual Reality Headset

AMD optimizes gesture control and facial recognition for PC/tablet APUs

UltraHD home theater and gaming

AMD Surround House: 3x UltraHD surround resolution with 32.4 positional audio A Fully Programmable Audio Engine


TOO OFTEN WE VIEW COMPUTING THROUGH TINY WINDOWS.



LET’S CREATE DOORS TO

ACHIEVE SURROUND

COMPUTING EXPERIENCES.



HOW DO WE CREATE THE DOORS TO SURROUND COMPUTING?

EYE-DEFINITION VISUAL REALISM REAL-WORLD AUDIO NATURAL AND SECURE

INTERACTION


DRIVE MORE PIXELS DISPLAY MORE PIXELS ENABLE DEVELOPERS TO POWER MORE PIXELS

GCN

Mantle Driver

Mantle API

Graphics Applications

MORE WITH MORE

GCN Architecture HSA, OpenCL™, C++AMP, DirectX™ 11.2 and Mantle

PURSUING EYE-DEFINITION VISUAL REALISM


AMD Radeon™ HD 7970 GHz Edition

AMD Radeon™ R9 290X Increase

Geometry Processing 2.1 billion primitives/sec 4 billion primitives/sec 1.9x

Compute 4.3 TFLOPS 5.6 TFLOPS 1.3x

Texture fill rate 134.4 Gtexels/sec 176 Gtexels/sec 1.3x

Pixel fill rate 33.6 Gpixels/sec 64 Gpixels/sec 1.9x

Peak Bandwidth 264 GB/sec 320 GB/sec 1.2x

THE POWER TO CREATE DIGITAL VISUAL REALMS AS REAL AS THE HUMAN PERCEPTUAL SYSTEM IS WITHIN REACH

THE TREND TO PUSH MORE PIXELS IS ACCELERATING

WHAT CAN YOU DO WITH 64 GPIXELS/SEC RENDER POWER IN A SINGLE GPU?


ACHIEVING REAL WORLD AUDIO

WITH HSA AND AN INHERENTLY OPEN COMPUTING PLATFORM, AUDIO EVOLUTION WILL BE DISRUPTIVE

REAL-TIME ACCELERATED SOUND PROCESSING: APPLYING PHYSICS TO AUDIO

SPATIALIZATION / 3D AUDIO PHYSICS OF SOUND ENVIRONMENTS AND ACOUSTICS AUDIO/VOICE STREAMS


TRUEAUDIO: AUDIO DONE RIGHT

HSA WITH TRUEAUDIO MEANS ABUNDANT PROCESSING POWER FOR YOUR ALGORITHM

DEVELOPING FOR AMD TRUEAUDIO

Developers of Audio Engines & Effects can access AMD TrueAudio processing resources to deliver a unique audio user experience

Functionality exposed through AMD TrueAudio API

AMD TRUEAUDIO User-mode Services Library

AMD TrueAudio API

Game Engine

Middleware API

Audio Middleware/Engine

Middleware effects & plugins

3rd Party Plugins (ie. McDSP, GenAudio, etc.. )

Audio DSP


THE FOUR TENETS OF NATURAL AND SECURE INTERACTION

3. KNOW ME

2. SEE ME

4. SHOW ME

1. HEAR ME

AMD APU DESIGNS BLEND LOW-LATENCY PARALLEL AND FIXED FUNCTION PROCESSING TO BEST POWER THESE WORKLOADS


AMD IP: THE BEST BUILDING BLOCKS FOR SURROUND COMPUTING

CPU CORES GRAPHICS SOFTWARE

CPU and graphics cores, fixed function cores and DSPs are raised to the next level of performance…THROUGH HSA

MULTIMEDIA VIDEO CODECS AUDIO ALGORITHMS AND MORE


2013 2014

PUTTING IT ALL TOGETHER: THE BEST SoCs IN 2014

Mainstream

Low-Power Essential

Ultra-Low Power

Performance

AMD roadmaps are subject to change without notice or obligations to notify of changes. Placement of boxes intended to represent first year of production shipments.

“Kabini” APU 2-4 “Jaguar” CPU Cores

GCN Graphics Compute Units 15W-25W

“Temash” APU 2-4 “Jaguar” CPU Cores

GCN Graphics Compute Units 3W-4W SDP

“Beema ” APU 2-4 “Puma” CPU Cores

GCN Graphics Compute Units AMD Security Processor

10W-25W

“Kaveri” APU 2-4 “Steamroller” CPU Cores

GCN Graphics Compute Units HSA Features

AMD TrueAudio 15W-35W

“Mullins ” APU 2-4 “Puma” CPU Cores

GCN Graphics Compute Units AMD Security Processor

~2W SDP

“Richland” APU 2-4 “Piledriver” CPU Cores

2nd Generation DX®11 GPU Cores 17W-35W

32nm

28nm SoC

28nm SoC

28nm

28nm SoC

28nm SoC


THE WORLD’S BEST NEW CLIENT APU: “MULLINS” ULTRA-LOW POWER SOC FOR TABLET AND 2-IN-1 FORM FACTORS

More Performance, Lower Power ‒ 2X the performance-per-watt of the

previous AMD generation1,2

‒ Quad-Core x86 APU for fanless designs

‒ GCN Graphics: PC gaming in a tablet

New Features, Real Benefits ‒ Microsoft InstantGo

‒ AMD Security Processor with support for ARM TrustZone

15 | AMD DEVELOPER SUMMIT | NOVEMBER 2013 15 | AMD DEVELOPER SUMMIT | NOVEMBER 2013

LET’S CREATE SOME DOORS!


FORWARD LOOKING STATEMENTS

Today’s presentations contain forward-looking statements concerning Advanced Micro Devices, Inc. (“AMD” or the “Company”) including, among other things, AMD’s strategic initiatives and growth opportunities; AMD product roadmaps and future products, including the features, architecture and performance of these new products; the benefits of Heterogeneous System Architecture; and industry trends, which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act. Forward-looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," "projects," and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this presentation are based on current beliefs, assumptions and expectations, speak only as of the date of this presentation and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Risks include the possibility that that Intel Corporation’s pricing, marketing and rebating programs, product bundling, standard setting, new product introductions or other activities may negatively impact the Company’s plans; that the Company will require additional funding and may be unable to raise sufficient capital on favorable terms, or at all; that customers stop buying the Company’s products or materially reduce their operations or demand for its products; that the Company may be unable to develop, launch and ramp new products and technologies in the volumes that are required by the market at mature yields on a timely basis; that the company’s third-party foundry suppliers will be unable to transition the Company’s products to advanced manufacturing process technologies in a timely and effective way or to manufacture the Company’s products on a timely basis in sufficient quantities and using competitive process technologies; that the Company will be unable to obtain sufficient manufacturing capacity or components to meet demand for its products or will not fully utilize the Company’s projected manufacturing capacity needs at GLOBALFOUNDRIES Inc. (GF) microprocessor manufacturing facilities; that the Company’s requirements for wafers will be less than the fixed number of wafers that we agreed to purchase from GF or GF encounters problems that significantly reduce the number of functional die the Company receives from each wafer; that the Company is unable to successfully implement its long-term business strategy; that the Company inaccurately estimates the quantity or type of products that its customers will want in the future or will ultimately end up purchasing, resulting in excess or obsolete inventory; that the Company is unable to manage the risks related to the use of its third-party distributors and add-in-board (AIB) partners or offer the appropriate incentives to focus them on the sale of the Company’s products; that the Company may be unable to maintain the level of investment in research and development that is required to remain competitive; that there may be unexpected variations in market growth and demand for the Company’s products and technologies in light of the product mix that it may have available at any particular time; that global business and economic conditions, including consumer PC market conditions, will not improve or will worsen; and the effect of political or economic instability, domestically or internationally, on our sales or supply chain. Investors are urged to review in detail the risks and uncertainties in the Company's Securities and Exchange Commission filings, including but not limited to the Quarterly Report on Form 10-Q for the quarter ended September 28, 2013.

Keynote (Mark Papermaster) - Powering the Next Generation Surround Computing Experience, by Mark...

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Transcript of Keynote (Mark Papermaster) - Powering the Next Generation Surround Computing Experience, by Mark...