KEY BENEFITS OF THE CARBON FIBERKEY BENEFITS OF THE CARBON FIBER COMPOSITE … · 2011-02-04 ·...

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KEY BENEFITS OF THE CARBON FIBERKEY BENEFITS OF THE CARBON FIBERCOMPOSITE IN A PRINTED CIRCUITCOMPOSITE IN A PRINTED CIRCUIT

BOARD AND A SUBSTRATEBOARD AND A SUBSTRATE

PRESENTED BY:

KRIS VASOYA, VP Engineering (THERMALWORKS)

ON BEHAF OF HUNTER TECHNOLOGY

NASA/JPL Science Forum, August-06

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Outline

Electronics Challenges

What is Carbon Fiber Composite Material

Test data of the Carbon Fiber Composite

How to use Carbon Fiber Composite in PCBs

Benefits of the Carbon Fiber Composite in PCBs

Conclusion


3

Challenges of the Electronics

The electronics Industry is facing challenges such asHOT SPOT

CTE mismatch,solder joint stress,

thermal fatigue failureshock and vibration issues,

“SMALLER, FASTER, LIGHTER”


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Thermal & Thermo-mechanical material

Carbon Fiber Composite is used today in PrintedCircuit Boards and Substrate to address these issues.

Carbon Fiber Composite is also known asSTABLCOR® Laminates


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What is Carbon Fiber Composite?

Made of Continuous Carbon Fiber reinforced with resin matrix

It is a thermally & Electrically Conductive Composite Material

It has very good In-plane Thermal Conductivity

It has low In-plane CTE (1-5 ppm/C)

It can be used as a plane layer, Preferably GND plane

Carbon Composite core

Copper

Copper

CCL


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CTE – Carbon Composite

In-Plane CTE

CTE vs TemperatureMaterial: ST325-EP450 Unclad

-4-202468

1012141618

-60 -40 -20 0 20 40 60 80 100 120 140

Temperature (C)

CT

E(p

pm/C

)

X1 Direction X2 Direction Linear (X2 Direction) Linear (X1 Direction)

Composite CTE (0-3 ppm) overTemp. range of -50C to +130C

12 to 16Non-PTFE Ceramic(RO4000)

17.00PTFE Ceramic (RO3000)

9 to 12Non Woven Aramid/Epoxy

15 to 19Polyimide/E-glass

16 to 20FR-4 / E-glass

In Plane CTE(ppm/C)DIELECTRIC MATERIAL


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CTE – Carbon Composite

209.57°C145.35°C

Alpha=42.1µm/(m·°C)

254.48°CAlpha=102µm/(m·°C)

Tg

-0.002

0.000

0.002

0.004

0.006

0.008

0.010

Dim

ens

ion

Ch

ange

(mm

)

0 50 100 150 200 250 300

Temperature (°C)

Sample: Tg and CTE test for CCLSize: 0.7159 mmMethod: Ramp TMA

File: C:\TA\Data\TMA\Stablcor substrate.008Operator: BPRun Date: 12-Sep-2005 17:38Instrument: TMA Q400 V7.1 Build 89

Universal V4.2E TA Instruments

P/N: ST325-EP450

Through Plane CTE

201.8734.82

209.5742.11

Tg (°C)Z-CTE before Tg(ppm/oC)

Runnumber

Z-axis CTE measurement by TMA method50 to 55

Non-PTFE Ceramic(RO4000)

25 to 40PTFE Ceramic (RO3000)

110 to 120Non Woven Aramid/Epoxy

50 to 55Polyimide/E-glass

55 to 60FR-4/E-glass

ThroughPlane CTE

(ppm/C)DIELECTRIC MATERIAL


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Thermal Management, CTE, Stiffener Material Comparisons

2.73.7525150Aluminum 6061 T6

1.65 to1.711 to 401 to 5

X,Y:75 to 250,Z:3/5

Copper Clad CarbonComposite (STABLCOR®)

8.906.4017.00385 to 400Copper C11000 full hard

2.703.7625150Aluminum 5052

1.7 to 1.830 to 35-0.418 to 12Low Modulus Carbon Fiber*

2.1 to 2.2100 to 130-1.5300-620High Modulus Carbon Fiber*

1.25 to 1.32 to 2.19 to 120.2 to 0.3Non Woven Aramidcomposite

9.8 to 10N/A6 to 8180 to 220Copper-Molybdenum-Copper (CMC)

9.9018 to 195 to 620 to 30Copper-Invar-Copper (CIC)

8.9012 to 1617 to 19385 to 400Heavy Copper

Density(g/cc)

TensileModulus (Msi)

IN-PLANE CTE(ppm/C)

Thermal Conductivity(W/m.K)MATERIAL

Thermal Management, CTE Control, Stiffener Materials Comparison


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Carbon Composite Material Availability

RAWMATERIAL

THERMALCO NDUCTIVITY

(W/m*K)

CTE(ppm/C)

DENSITY(g/cm3)

TENSILEMO DULUS

(msi)

Standard CoreThicknesses

(Inch)

ST 600* 620.0 -1.15 2.20 130.0 .010"

ST 325* 325.0 -1.15 2.17 114.0 .008", .010"

ST 10* 8.0 -1.10 1.76 34.0 .0045 .006 .009"

FR4 0.3 16-20 1.80 3.5 to 4.5

PO LYIMIDE 0.3 15-19 1.70 3.5 to 4.5

CO PPER 385.0 17.00 8.92 12 to 16

ALUMINUM 240.0 24-25 2.70 10.2

CIC 108.0 5 to 6 9.90 18-19* values represents data of raw fibers

Carbon Fiber Property Comparisons


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How is carbon composite used in PCB stack-up?

FR-4

FR-4

CCL

FR-4

FR-4

L2/3

Prepreg

Prepreg

Prepreg

Prepreg

Prepreg

Prepreg

L4/5

GND

L6/7

L8/9

L1

L10

FR-4

FR-4

FR-4

L2*

Prepreg

Prepreg

Prepreg

Prepreg

L3/4

L5/6

L7/8

L9*

L1

L10

FR-4

FR-4

FR-4

Prepreg

Prepreg

L4/5

NF

L6/7

L9/10

Prepreg

Prepreg

L8*

Prepreg

Prepreg

1-CORE 2-CORE 3-CORE

(<0.035”) PCB/Substrate (<0.093”) PCB (>0.093”) PCB

L3*

FR-4 L1/2Prepreg

Prepreg

CCL

CCL

CCL

CCL

CCL


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CROSS SECTIONS

1-CORE 2-CORE 4-CORE

6-layer PCB 12-layer PCB3-layer PCB


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Thermal

CTE (Co-efficient of Thermal Expansion)

Rigidity / Stiffness

Density / Weight

The Benefits Of Carbon in a PCB / Substrate


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Thermal / HEAT

CARBON IN A PCB


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PCB Thermal Path

Heat source

ThermalVia

GroundVia

Isolated via onGround layer

Chassis

PCBMountingScrew

PCBMountingScrew

CarbonComposite


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ThermalVia

GroundVia

Isolated via onGround layer

Wedge Lock

Wedge Lock

Ground Pin

ThermalVia

EdgePlating

Hea

tsourc

e

MILLING STEP

HIGH LAYER VME CARD

VMEVME -- Wedge LockWedge Lock


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THERMAL PATH


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PCB acts as HEAT SPREADER

FR4 PCBComposite PCBComposite PCB FR4 PCB


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THERMAL – PRODUCT LEVEL

*>124.9°F

*<68.0°F

70.0

80.0

90.0

100.0

110.0

120.0

Composite PCB – 1G module

FR4 PCB – 1G module


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Co-efficient of Thermal Expansion

CARBON IN A PCB


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CTE Associated with Package Type

IC PACKAGE TYPE

Organic Packages (CTE: 16-19ppm/C)

Ceramic Packages (CTE: 6-8ppm/C)

Flip Chip, DDA, WLP (2-4ppm/C)


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CTE – Flip Chip Substrate

0.9990.993Correlation

1.852.29CTE Overall

1.622032.05218144.7

1.851652.06170121.3

1.871192.3011996.5

1.82752.376573

1.29320.36949.4

2.5204.33024.5

1.88-602.59-1030.7

1.95-1052.68-165-23.2

-153-231-47.8

CTEStrain YCTEStrain XTemp( C ) - J1.0

FC 400

CTE Test


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CTE – Flip Chip Substrate

CTE vs Temperature

02468

101214161820

-60 -40 -20 0 20 40 60 80 100 120 140 160

Temperature (C)

CTE

(pp

m/C

)

STABLCOR X1 STABLCOR X2 FR4 X1 FR4 X2

> 80%ReductionusingSTABLCOR®

BoardTemp(C) CTEX1 CTEX2

BoardTemp(C) CTEX1 CTEX2

-57.79 2.05 2.27 -40.84 16.6 16.66-44.12 2.2 2.45 -29.21 16.9 17.01-28.97 2.29 2.63 -16.95 17.55 17.68-14.24 2.61 3.11 18.68 16.54 16.8415.73 2.38 2.22 30.56 16.94 17.2830.66 2.68 2.65 42.41 17.21 17.5745.61 2.87 2.97 54.26 17.43 17.960.46 2.96 3.18 66.08 17.61 18.1375.37 2.98 3.33 77.95 17.79 18.3190.39 2.92 3.36 89.77 17.95 18.49120.2 2.87 3.53 101.49 18.08 18.62

135.11 2.86 3.66 113.35 18.2 18.77150.01 2.75 3.65 125.03 18.3 18.85

Average= 2.65 3.00 17.47 17.85

STABLCOR/FR4 FR406

CTE over Temperature Range


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CTE – 8-layer 50mil Thick PCB

150.3112.32

155.6912.01

Tg (°C)CTE before Tg (ppm)Run Number

81.73°CAlpha=12.0µm/(m·°C)

155.69°C 197.24°C

-0.001

0.000

0.001

0.002

0.003

0.004

0.005

Dim

en

sio

nC

han

ge

(mm

)0 50 100 150 200 250

Temperature (°C)

Sample: 3C Memory X-axisSize: 3.3008 mmMethod: RampComment: Tg and CTE test

TMAFile: C:\TA\Data\TMA\3C Memory X-axis.004Operator: BPRun Date: 10-Aug-2005 16:25Instrument: TMA Q400 V7.1 Build 89

Universal V4.2E TA Instruments

In-Plane CTE

X-TMA Setup


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Solder Joint Reliability – Flip Chip

For no underfill test, theFor no underfill test, thechips on Carbon Compositechips on Carbon Compositesubstrate remain attached atsubstrate remain attached at353 cycles. Most of the chips353 cycles. Most of the chipsdetached from the other testdetached from the other testboards at 353 cyclesboards at 353 cycles

With no underfill, theWith no underfill, thecharacteristic (63.2%) life ofcharacteristic (63.2%) life ofthe FRthe FR--4/NELCO is about 204/NELCO is about 20cycles . The carboncycles . The carboncomposite board is aboutcomposite board is about173 cycles173 cycles

Carbon Core

Liquid to Liquid Thermal Shock Reliability


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RIGIDITY / STIFFNESS

CARBON IN A PCB


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Rigidity at Room Temp

Printed Wiring Board Bend Data

0.0

2.0

4.0

6.0

8.010.0

12.014.0

16.0

18.0

20.0

22.0

24.0

26.0

28.0

30.0

32.0

0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 16.0

Displacement (mm)

Ap

plie

dfo

rce

(N)

Sample 1 (FR4)

Sample 2 (FR4)

Sample 3 (FR4 +STABLCOR)





Maximum Force at 15mm Deflection

14.00

16.00

18.00

20.00

22.00

24.00

26.00

28.00

30.00

Sample 1 (FR4) Sample 2 (FR4) Sample 3 (FR4 +STABLCOR)





Sample Identification

Max

imu

mA

ppl

ied

Forc

e(N

)This result shows the Carbon Composite samples is ~ 66.6% stronger than the FR4 test samples


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Rigidity of thick PCB (0.093” – 0.125”)

Bend Data

0.0

20.0

40.0

60.0

80.0

100.0

120.0

140.0

160.0

180.0

200.0

220.0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5

Displacement (mm)

Ap

plie

dF

orc

e(N

)

ST10 board 1

ST10 board 2

ST325 board 1

ST325 board 2

Polyimide board

Bend Data

0.0

20.0

40.0

60.0

80.0

100.0

120.0

140.0

160.0

180.0

200.0

220.0

240.0

ST10 board 1 ST10 board 2 ST325 board 1 ST325 board 2 Polyimideboard

Sample Identification

Ma

xim

um

Fo

rce

@6

mm

De

flec

tion

-47.2Polyimideboard

5

452.1%213.4ST325 board 24

423.5%199.9ST325 board 13

265.7%125.4ST10 board 22

277.3%130.9ST10 board 11

StrengthImproveme

nt overSample 5

Maximumforce at

6mm (N)

SampleIdentification

Sample

Number

ST10 -Composite samples are ~ 275% stiffer than the Polyimide test samples

ST325-Composite samples are ~ 450% stiffer than the Polyimide test samples


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WEIGHT

9.9CIC

8.92Copper

2.7Aluminum

1.65Carbon Composite

1.70Polyimide

1.80FR4

Densitygm/cm3

Material(Laminate)


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CONCLUSION

Operates CoolerReduces Hot SpotPCB acts as a Heat SinkReduces Thermal Stress on Components

Matches CTEAttach Ceramic packages more reliablyAttach Flip Chip more reliably

All above benefits at almost no weight premium

StiffnessPrevents Warpage Increased Yields for Component Placement


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For more infowww.hunterpcb.com

orwww.thermalworks.com


KEY BENEFITS OF THE CARBON FIBERKEY BENEFITS OF THE CARBON FIBER COMPOSITE … · 2011-02-04 ·...

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