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No Process Catergory Items Need Prepare Qty

1 MI Tool/jig IC leg bending Jig for U1 IC * check setting 2

2 MI Tool/jig Component storage bin 8

3 MI Tool/jig Solder Iron 3

4 MI Tool/jig Touch up block need lamp 3

5 MI Tool/jig After dipping cooling fan 6

6 MI Tool/jig Touch up Jig 3

7 MI Tool/jig Prevent PCB warpping jig 150

8 MI Tool/jig IC dispencer jig 29 MI Tool/jig AC contact insertion jig 3

10 MI Tool/jig Set-up ICT 2

11 MI Tool/jig Need brush to clean solder ball 2

12 MI Tool/jig air gun for ICT cleaning process 2

13 MI Tool/jig D20 prework jig need review ( process & Qty ) 150

14 Assy Tool/jig PCB breaking jig 3

15 Assy Tool/jig Dummy Battery 14

16 Assy Tool/jig Knock test jig 3

17 Assy Tool/jig Set dismental Jig 1

18 Assy Tool/jig set up Call lamp 4

19 Assy Tool/jig nejico with secondary tray 3

20 Assy Tool/jig Grease dispencer 3

21 Assy Tool/jig IC writer cycle time high = 19 ~ 22s need 3 units 2

22 Assy Tool/jig Case screwing process need top cover jig 3

23 Assy Tool/jig Need battery discharge jig 3

24 Assy Tool/jig Screwing process request sensor to prevent screw missing 3

25 Assy Tool/jig Battery A check cycle time high 35 ~ 39S need 4 units 12

26 MI Set-up MI conveyer & Dipping machine test run

27 MI Set-up Material top up list28 MI Set-up Line set up & relocate Tuner ICT * air supply 2

29 MI Set-up Line ESD confirmation

30 MI Set-up Need to know full MI conveyer PCB Qty ?

31 MI Set-up need to buy off WI D20 , C8 , C37 , C2 sub work process

32 MI Set-up ICT pass stamp date code

33 MI Set-up Need review component insertion sequence

34 MI Set-up ICT coverage vs visual check matrix

35 MI Set-up Check flux vs Dipping joint conveyer condition

36 MI Set-up Test MI conveyer speed Slow -OK ?

37 Assy Set-up Extend packing block

38 Assy Set-up Battery A PC hanging block

39 Assy Set-up ESD, power plug point

TCJ3400 Line Set-up Preparation

12/7 18/7 24/7 1/83 day 8 day 13 day

1st Line 2nd Line 3rd Line

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52 Assy Quality Check screw torque

53 Assy Quality Counter to prevent battery A skip process

54 Assy Quality Appearance check template

55 Assy Quality Serial No control method ( lot by lot basic )

56 Assy Quality Material issueing lot by lot basic

57 Assy Quality AC blade carton label attention by colour

58 Assy Quality Equipment setting & spec indication

59 Assy Quality WI need Quality matrix table ( AC blade )

60 Assy Tool/jig Use micro sound scope to check foreign material + dummy set 3

61 Assy Quality Casing rubbing sound

62 Assy Quality Need to prepare difference table AC blade / manual .

63 Assy Quality carton information prefer label type

64 Assy Quality manual prefer change colour possible mix with TAS9700 , template65 Auto Quality Add glue to reduce Dipping solder short

66 Assy Quality carton packing slot too tight , difficult to take out from slot hange

Assy Quality Bar code scanning system

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Status When Dept PIC Remark

Eng Design limitation

OK 11-Jul PRD Watie

16-Jul PRD JH Tan

Eng

PRD Razak

Eng

ok Eng

ok 12-Jul PRD JH TanOK Eng Vincent

Eng

ok 16-Jul PRD Watie

OK 16-Jul PRD Watie

study 10-Jul Eng Takanishi

ok Eng

Eng

ok 16-Jul PRD Azri

Eng

18-Jul PRD JH Tan

ok 16-Jul PRD Azri

ok 12-Jul PRD Azri

10-Jul Eng Takanishi

study 10-Jul Eng Vincent

OK 10-Jul Eng Zazli

in progress 10-Jul Eng Zazli

OK 10-Jul Eng Zazli

in progress 16-Jul PRD/Eng Razak

OK 12-Jul PRD/Eng WatieOK 16-Jul Eng/PRD Watie

ok 12-Jul PRD Ibrahim

ok 16-Jul PRD Watie

ok 16-Jul PRD Watie

ok 12-Jul PRD Watie

ok 16-Jul PRD Watie

ok 16-Jul PRD Watie

in progress 17-Jul PRD Razak

in progress 17-Jul PRD Razak

in progress 12-Jul PRD Azriin progress 16-Jul PRD / Eng Azri

OK 16-Jul PRD Azri

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ok 18-Jul PRD Azri

ok 18-Jul PRD Azri

ok 16-Jul PRD Azri

ok 16-Jul PC PS Khoo

ok 16-Jul MATC HH Lee

in progress IQC CC Lim

ok 16-Jul PRD Azri

ok Eng

PRD

ok 2-Jul IQC Vincent adjust molding parameter

ok 10-Jul Eng Teo

ok 10-Jul Eng Zazli

Ng 10-Jul Eng Takanishitest run 10-Jul Auto Govin 30% PCB will test run add glue process

oreitation up 10-Jul Eng Vincent

PRD/QC

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No Process Skill process PIC Status1 MI Touch up

Hand insert block check before dipping

Visual check inspector

2 Assy IC programming

Battery A

Attach label

Packing

Critical to Quality Skill Process

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Remark

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Model :TCJ3400 2Q Status

Panel Qty Cav/panel Total Qty

1 Auto TCJ3400 29 6 174

2 MI TCJ3400 29 6 174

3 Assy TCJ3400 150

No Location Defect Qty

1 No Solder 18

2 solder short 483 Pin hole 0

Total 66

No OCATIO DEFFECT QTY

1 LED High up 1

2 LED Reverse 2

3 C37 Solder Short 1

4 R25 Shifted 1

5 U4 Solder Short 66 C8 High up 1

7 C8 One leg No insert 1

8 JP1 Missing 1

14

8%

No OCATIO DEFFECT QTY

1 Case Rubbing Noise 145

2

RemarkProcess

Dipping PPM

Model / VersionTCJ3400

No

MI ICT Defect Data

Total

LDR

Assy Defect Data

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3

4

5

6

7

8

145

85%

Total

LDR

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No LOCATION DEFFECT QTY No LOCATION DEFFECT QTY

1 LED High up 1 1 C37 Slanting 12

2 LED Reverse 2 2 D3 High up 4

3 C37 Solder Short 1 3 D20 High up 5

4 R25 Shifted 1 4 LED High up 5

5 U4 Solder Short 6 5 D20 Slanting 4

6 C8 High up 1 6 SA1 High up 1

7 C8 One leg No insert 1 7 C8 Long lead 7

8 JP1 Missing 1

14 388% 22%

No LOCATION DEFFECT QTY

1 LED High up 1 High up 17

6 C8 High up 1 Slanting 16

2 D3 High up 4 Solder Shor 73 D20 High up 5 Long lead 7

4 LED High up 5 Reverse 2

6 SA1 High up 1 Shifted 1

7 C8 Long lead 7 7 Missing 1

8 JP1 Missing 1 1 One leg No 1

7 C8 One leg No insert 1 1

2 LED Reverse 2 2

4 R25 Shifted 1 1

1 C37 Slanting 12

5 D20 Slanting 4

3 C37 Solder Short 1

5 U4 Solder Short 6

MI Block Check Defect Data

TotalLDR

Total MI Defect Data

17

16

7

MI ICT Defect Data

TotalLDR

High up33%

Slanting31%

SolderShort13%

Long lead13%

Reverse4%

Shifted2% Missing

2%

One legNo insert

2%

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LOCATION DEFFECT QTY

C37 Slanting 12

C8 Long lead 7

U4 Solder Short 6

D20 High up 5LED High up 5

D3 High up 4

D20 Slanting 4

LED Reverse 2

LED High up 1

C8 High up 1

SA1 High up 1

JP1 Missing 1

C8 One leg No insert 1

R25 Shifted 1

C37 Solder Short 1

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No LOCATION DEFFECT QTY No LOCATION DEFFECT QTY Repair

1 Case Rubbing Noise 145 1 LED slanting 35 10

2 2 C8 long lead 9

3 3 C8 high up 1

4 4 C1 high up 4 3

5 5 C37 slanting 2

6 6 LED high up 1

7 7 N pin hole 1

8 8 C2 high up 2

145 5585% 32%

No LOCATION DEFFECT QTY

1 LED slanting 35 Slanting 37

6 C37 slanting 2 Long lead 9

2 N pin hole 1 1 High up 83 C8 long lead 9 9 pin hole 1

4 C8 high up 1

6 C1 high up 4

7 LED high up 1

8 C2 high up 2

7

2

4

1

5

3

5

Assy Visual Check Defect Data

TotalLDR

Total MI Defect Data

Assy Defect Data

TotalLDR

37

8

Slanting67%

Longlead16%

High up15%

pin hole2%

0%0%

0%

0%

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LOCATION DEFFECT QTY

LED slanting 35

C8 long lead 9

C1 high up 4

C37 slanting 2C2 high up 2

N pin hole 1

C8 high up 1

LED high up 1

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Model :TCJ3400 Dipping PPM

No Indicator Defect Qty

1 No Solder 182 solder short 48

3 Pin hole 0

propose to add gluepropose to add gas hole

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x % = %

x

SEC

Daily Ouput (9.00hrs): pcs. *if 95% yield: pcs

Hourly Output: pcs Hourly Output: pcs

NO.

1 2 3 4 5 7 8 9 1011121314151617181920212223242526

REV : 0

13

6

11

Appearancecheck

VisualInspectionPCBA

Milan

Fatin

Vijaya

Mimi

Borj

Arsi

Atikah

ThinThin

Suriani

JOB

DESCRIPTION

Breaking

EMP.

NAME

Yahya PREPAREDAPPROVED

92.3

CHECKED

MAX TIME x NO. OF OPRS

CYCLE TIME AVERAGE

52.3

17

10

13

27.06.2013

100BALANCING EFFICIENCY = 204

39 10ASSY 10170 190.59

9 21

TCJ3400

TACT

TIME

CYCLE

TIME

(SEC)

ENGINEERING PROCESS VS TIME STUDYLINE BALANCING/PROCESS STANDARD TIME/DAILY OUTPUT

LINE O/P TARGET CYCLE TIME DATEMODEL TOTAL PROCESS TIMEHEADCOUNT

Labelatta

ch

ICProgram

&Powerware(Tester:13.12

Combinecases&Screwing.

19

Knocktest&Hipot(Tester:5.41s)

BatteryA(

Tester:26.00s)

BatteryB(

Tester:7.38s)

C'binePCB

toL/case&Applygrease

Packing

17

35

39

87.7

767

productivity / pass yield

808

max tact time calculation

Remark

204 ACTION TAKEN

PROCESS:INSERTION ~ PACKING

20.4

0

5

10

15

20

25

30

35

40

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26

target = 7 sec

output= 1200

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KAGA COMPONENTS (M) SDN BHD Model :TCJ3400 Event :PP

Engineering / QA Comment Sheet Customer :Kaga Date :14.5.13

Problem Statement Root Cause Proposal Action PIC / Date

study

Prefer widen U1 location hole follow U1

dimension

propose to add glue in between C37 lead

D20 slanting

productivity loss prework IC ( bend IC lead )

U2 solder short

U1 need to do prework IC lead bending by jig

propose to add gas hole

propose to add glue in between U2 lead

U3 solder short

C37 solder short

1 A B C

2 A B C

3 A B C

A B C

A B C

4 A B C

A B C5 A B C

A B CA B C5 A B C

A B CA B C6 A B C

Widen the U1 PCBinsertion position hole

A B C4 A B CA B CA B C5 A B C

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Model Sec PRD Event Qty 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29

TCJ3400 TAS MI N 69000 1.2 1.8 2.4 2.4 3.6 4.8 6 6 7.2 9 9 9

TCJ3400 TAS ASSY N 69000 1.2 1.8 1.8 3.6 4.2 4.8 5.4 6.6 7.8 7.8 9

Output W/H ( S ) Cycle time 10% loss

1200 32400 27 24.3

1800 32400 18 16.2

2400 32400 13.5 12.15

3000 32400 10.8 9.72

3600 32400 9 8.1

4000 32400 8.1 7.29

New & Critical Model event on Line

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30 31

6.6

9 6

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x % = %

x

SEC

Daily Ouput (9.00hrs): pcs. *if 95% yield: pcs

Hourly Output: pcs Hourly Output: pcs

NO.

1 2 3 4 5 6 7 8 9 101112131415161718192021222324252626

REV : 0

124

Visualinspection

26.41

CHECKED

6.65

CYCLE TIME AVERAGE

ACTION TAKEN

PROCESS:INSERTION ~ PACKING

Syikin

113.11

3

Maria

3

InsertT1

ICT(Tester=2.42s)

Rabiul

4 5.7

298

InsertSA

1

InsertU1

3

InsertC1

4

ENGINEERING PROCESS VS TIME STUDY

LINE BALANCING/PROCESS STANDARD TIME/DAILY OUTPUTLINE O/P TARGET CYCLE TIMEMODEL TOTAL PROCESS TIMEHEADCOUNT

InsertL1

InsertU2

4 4 3

InsertC2

433 3

TCJ3400

TACT

TIME

CYCLE

TIME

(SEC)

PCBA

DATE

17170

100BALANCING EFFICIENCY = 113.11

29 17190.59

PREPARED

productivity / pass yieldmax tact time calculation

1086 1032

TouchUp

MAX TIME x NO. OF OPRS

22.9

Remark

26.06.2013

InsertC8

APPROVED

Norlina

Surtina

InsertD2

0

Shima

Lina

Vijaya

118

JOB

DESCR

IPTION

InsertAC

Contact

EMP.

NAME

InsertF1

Firna

Suhaida

Tina

Zaida

Bhakta

NweHtay

Siti

Suri

3

InsertCN

1

Pre-inspe

ctionbeforedipping

InsertC3

7

Zaiton

0

5

10

15

20

25

30

35

40

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26

target = 7 sec

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MODEL: TCJ3400 JUMP LIST

STEP PARTS NAME LO ACT UN STD UN MEAS UN RO,CO UN MD -R H-LIM UN L-LIM UN HPIN LPIN JFHPA COMMENTS

6 U1 5-6 C2 10 o 10 o 14 0 10 % -10 % 50 0 10000 NO TEST POINT

7 U1 6-7 C2 10 o 10 o 14 0 10 % -10 % 0 51 10000 NO TEST POINT

8 U1 7-8 C2 10 o 10 o 14 0 10 % -10 % 51 51 10000 SAME POINT75 C5*/ C2 22 pF 22 pF 7 0 20 % -20 % 51 50 10000 //C2

88 C28*/ C1 100 nF 100 nF 7 0 20 % -20 % 42 43 10000 //C37

89 C29*/ C1 100 nF 100 nF 7 0 20 % -20 % 9 42 10000 //C40/C41/U3/U4

100 C40*/ C1 100 nF 100 nF 7 0 20 % -20 % 42 10 10000 /C29/C41/U3/U4

101 C41*/ C1 100 nF 100 nF 7 0 20 % -20 % 42 10 10000 /C29/C40/U3/U4

138 U1 G-6 C2 1 V 0.75 V 10 -4 20 % -20 % 51 0 10000 NO TEST POINT

139 U1 G-7 C2 1 V 0.75 V 10 -4 20 % -20 % 51 51 10000 SAME POINT

140 U1 G-8 C2 1 V 0.75 V 10 -4 20 % -20 % 51 51 10000 SAME POINT

144 U3* G-2 C1 1 V 0.75 V 10 -4 20 % -20 % 42 42 10000 SAME POINT

154 U4* G-9 C1 1 V 0.75 V 10 -4 20 % -20 % 42 42 10000 SAME POINT

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Model No : TCJ3400

QTY QTY QTY TEST

No. COMPONENT AT PCB TESTED JUMPED %

1 RESISTOR 33 33 0 100

2 CAPACITOR 29 24 5 83

3 INDUCTOR /TRANSFORMER 2 2 0 100

4 DIODE /ZD/LED 7 7 0 100

5 TRANSISTOR 3 3 0 100

6 IC 3 3 0 100

7 JUMPER 5 5 0 100

8 FUSE 1 1 0 100

9 PHOTO COUPLER 1 1 0 100

10 VARISTOR 1 1 0 100

11

OVERALL 85 80 5 94%

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No Process Items Need Prepare When PIC

1 MI U1 Ic need bending process

2 MI ICT L1 need to check value 10-Jul Badri

3 MI Power transformer packing prefer over turn , easy pick up 10-Jul CC Lim

4 MI auto punch LED request extend lead length

5 MI C8 request purchase standard part Teo

6 MI D20 prework jig need review ( process & Qty ) 10-Jul Takanishi

7 Assy IC writer cycle time high = 19 ~ 22s need 3 units 10-Jul Takanishi

8 Assy Case screwing process need top cover jig 10-Jul Vincent

9 Assy carton packing slot too tight , difficult to take out from slot 10-Jul Vincent

10 Assy Need battery discharge jig 10-Jul Zazli

11 Assy Screwing process request sensor to prevent screw missing 10-Jul Zazli

12 Assy Hot melt jig & cycle time ?? 8s after 3 week Zazli

13 Assy Casing rubbing sound 2-Jul Vincent

14 Assy Need to prepare difference table AC blade / manual . 10-Jul Teo

15 Assy Battery A check cycle time high 35 ~ 39S need 4 units 10-Jul Zazli

16 Assy Battery B check cycle time high 13 ~ 17S 10-Jul Zazli

17 Assy Appearance check cycle time high 39s 10-Jul Azri

18 Assy carton information prefer label type 10-Jul Zazli

19 Assy manual prefer change colour possible mix with TAS9700 10-Jul Takanishi

TCJ3400 PP3 problem facing review

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Status Remark

NC Design limitation

Ok

in progress

NC machine limitation

NC Need prework jig & update WI

study

2 unit

study

in progress

OK

in progress

OK support by nation gate

change adjust molding parameter

In progress

OK

study

In progress

study

study

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No Location Wrong value Reverse High up Missing One leg Not insert Need prework Cut lead ICT Assy

1 CN1 x x o o o x x

2 C37 o o o o o o o3 C8 o x o o o o o

4 U2 x o o o o x x

5 U1 x x o o o o x

6 C7 o o o o o o o

7 C2 o o o o o o o

8 L1 x x o o o x x

9 C1 o o o o o o o

10 T1 x x o o o x x

11 D20 o o o o o x o

12 F1 o x o o o o o

13 C23 o o o o o o o14 SA1 o x o o o o o

15 L / N plate x x o o o x x

Remark

o

x

* Need clincing jig to prevent high up

* Need prevent PCB warping jig to reduce dipping PPM

possible happen

not possible happen

TCJ3400

C8D20

CN1U2

U1C2L1

C1F1

N

L

C37

T1

Old PCBNew PCB

Old PCB

F1SA1

C7

C23SA1