1R

Itanium® 2 Processor Package Development

Kevin Haley, Package Pathfinding Manager

Enterprise Platforms Group, Intel Corporation

kevin.haley@intel.com

2R

Agenda• Overview

• First level interconnect– BGA

• Power delivery– Power Pod

• Second level interconnect– Interposer

• Third level interconnect– Socket

• Summary

• Speaker’s patents

3R

Itanium® 2 Processor Package Development Overview

• Itanium® 2 started in 1998 as an evolution from Itanium®

• Package goal was increased bus and power supply performance– Bus performance driven by trace length

– Tighter power supply tolerance = higher frequency

• New technologies for high value add items– Socket

– Interposer

• Existing technologies for high risk items– Power connector

– First level package– Thermal

Agenda First level interconnect – BGA

Power delivery - Power Pod

Second level interconnect - Interposer

Third level interconnect - Socket

4R

First level interconnect

• ~8000 flip chip connections from Silicon to the first level package – ~750 x 850 mil die

– Need for On-Package decoupling– 130 W dictated use of the integrated heat spreader

– 50 mil ball pitch standard of the day

= 42.5mm BGA

Big die and big BGA, but within Intel technology envelope

Agenda First level interconnect – BGAPower delivery - Power Pod

Second level interconnect - Interposer

Third level interconnect - Socket

5R

Package without heat spreader

Vdd (core)Vtt (FSB)PLL filter

Powerdeliveryconnector

6R

Power delivery

• Power Pod Concept from Itanium®

– Isolates processor power supply from mother board• 100A through a MB was daunting in 1998

– Modularity allows for servicing and future upgrades

• Power pod connector re-used from Itanium®

– Contact pattern changed from Merced – Updated power conversion technology

Width of interposer is set by the connector

Agenda First level interconnect – BGA

Power delivery - Power PodSecond level interconnect - Interposer

Third level interconnect - Socket

7R

Itanium® 2 Power Pod

130 mm100 mm71 mm

19 mm

Input Connector(8 position- 12v; 4position-48v)

51 mmOutput Board to

pod Thermal Plate Width of space forelectronics boards

inside RM

Output Connector mechanically the same

as Itanium(tm) power pod

8R

Itanium® 2 Processor Package Details

Powerdeliveryconnector

ServerManagementComponents

Flip-Chip BGA package withIntegrated Heat Spreader

InterposerSubstrate

9R

Second level interconnect

• Interposer enables tight power regulation– 8-layers of 2oz Cu + outer 2 layers plated to 2.5oz

– Enables a lateral power path

• Interposer enables system management components– Flash

• Fuse options• Mfg data• More decoupling• PLL filter components• and real estate for miscellaneous circuits

Agenda First level interconnect – BGA

Power delivery - Power Pod

Second level interconnect - InterposerThird level interconnect - Socket

10R

Itanium® 2 Processor Package Details

Powerdeliveryconnector

ServerManagementComponents

Flip-Chip BGA package withIntegrated Heat Spreader

InterposerSubstrate

11R

Third level interconnect

• Interposer has 611 pins to socket – Signals are straight through for minimum stub length

• Pins de-populated “randomly” due to manufacturing limitations• Socket has all pins – PGA 700

– Closest processor to processor spacing drives rectangular shape

• Socket designed for signal performance• 4mm to shorten signals with elevated cam box• Hex wrench actuation to allow through-the-heatsink socket access

• Technology extension of an existing processor socket mitigates risk

Agenda First level interconnect – BGA

Power delivery - Power Pod

Second level interconnect - Interposer

Third level interconnect - Socket

12R

Socket

• SMT ZIF socket– Low profile - performance driven (~4 mm)

• Stand-off from processor board dependent on solder volume, land diameter, and board technology used

– 700 positions, ZIF - multiple insertion/extraction (target = 50 actuations)• Tools =3mm hex, manual • Clearance area for vacuum pick and place

– 50 mil pitch, 25 x 28 grid array• BGA interface to MB• Mass and symmetry supports dual sided SMT without tools

– Alignment: Processor notches to posts on socket

Package to Socketalignment features Cam Actuation

13R

Why the apparent random pin depopulation?

•De-populated pins are Vdd (core power) vias

•White circle is the BGA land, green is the pin and via, red is via only

•Vdd comes from the Power Pod, not through the socket

•If the Vdd pin was populated Power pod voltage would be delivered to the motherboard

Sig

Vdd VddGnd Gnd

Sig SigSig

Vdd VddGnd Gnd

pin

pin viavia

pin pin

pin

pin

pin

pin pin

pin viavia

pin pin pin

pin

pin pin

14R

Itanium® 2 package Summary

• Value adds– Reduced package width allowing tighter processor pitch– Interposer/power pod to deliver tight power regulation for Core MHz– Short bus trace, pin and socket minimize stub length for MT/s

• Risk mitigation– Extension of Intel BGA technology– Re-use of Itanium 1 power connector– Socket technology extension of existing Intel socket

15R

• Patents issued to Kevin Haley• U.S. 6,667,548 Diamond Heat Spreading and cooling technique for integrated circuits• U.S. 6,313,987 Thermal connector for joining mobile electronic devices to a docking

station• U.S. 6,181,555 Cooling system for integrated circuit chips in a portable computer• U.S. 6,168,976 Socketable BGA package• U.S. 6,043,560 Thermal interface thickness control for a microprocessor• U.S. 5,982,617 Cooling system for integrated circuit chips in a portable computer lid

assembly• U.S. 5,966,286 Cooling system for thin profile electronic and computer devices• U.S. 5,956,229 Injection molded thermal interface system• U.S. 5,718,282 Heat pipe exchanger system for cooling a hinged computing device• U.S. 5,646,822 Heat pipe exchanger system for cooling a hinged computing device• U.S. 5,621,613 Apparatus for dissipating heat in a hinged computing device• U.S. 5,531,021 Method of making solder shape array package• U.S. 5,506,765 Tape BGA package• U.S. 5,290,735 Thin, high lead count integrated circuit package• U.S. 5,359,225 Thin, high lead count integrated circuit package• U.S. 5,359,768 Method for mounting very small integrated circuit package on PCB• U.S. 5,006,962 Apparatus for surface mounting an Integrated circuit package