Irradiation test on the nSYNC ASIC using X-Ray and protons ... · nSYNC architecture 20/09/18 -...
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Irradiation test on the nSYNC ASIC using
X-Ray and protons beam
Antwerpen – TWEPP 201820 Sep 2018
Davide Brundu1, S. Cadeddu1, A. Cardini1, L. Casu1
1INFN Cagliari
Outline• Introduction
• LHCb upgrade
• The nSYNC chip architecture
• Protons irradiation test at Catana facility• Facility description
• Experimental setup• Results
• X-Ray irradiation test in Cagliari• Experimental setup and Calibration• Results
• Conclusions
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Introduction
LHCb upgrade
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BUT…• The current Level-0 trigger (1 MHz, 4 𝜇𝑠)
becomes a limitation (hadronic lines saturation)
• nSYNC is the new fundamental component of the upgradedmuon detector readout, developed in UMC 130 nm.
• TID expected : 130&'𝐺𝑦, (𝑚𝑎𝑥 < 200𝐺𝑦)• Hadrons with Energy > 20 MeV = 2 3 1044/𝑐𝑚7
• 1 MeV Neutrons equivalent = 2 3 1047/𝑐𝑚7 , (NIEL: 0.65 Gy)
• Expected dose for nSYNC chip (10 years of upgrade operations):
• LHCb need more data: statistical improvementwith increased luminosity to 𝓛 = 𝟐 3 𝟏𝟎𝟑𝟑𝒄𝒎@𝟐𝒔@𝟏
• Remove Level-0 hardware trigger.• Readout directly at 40 MHz (p-p collisions rate)
SOLUTION:
nSYNC architecture
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48 LVDS Input channels: • Fully digital TDC (with Giordano-DCO[1,2] + dithering correction)
with programmable resolution (8-32 slices; 3.125 – 0.78 ns) @ 40MHz, • Nominal resolution: 16 slices, • Programmable pipeline to synchronize different channels,• Histogram block for each channel.
Bunch-Crossing (BX) tagging: • 12 bits BX counter.
Frame builder and TDC Zero Suppression (ZS): • Frame fixed will be implemented, • Header will be 16 bits wide, • Full Hit-Map (not-ZS) + TDC data ZS.
Output GBTx interface via e-LINK (SLVS, LVDS-compatible) @ 320MHz,
Interface for synchronous signals from LHCbTiming and Fast Control (TFC) system,
I2C Interface for slow control signals.
nSYNC is the fundamental component of the upgraded muon detector readout, developed in UMC 130 nm.
nSYNC is the fundamental component of the upgraded muon detector readout, developed in UMC 130 nm
48 LVDS Input channels: • Fully digital TDC with programmable resolution
(8-32 slices; 3.125 – 0.78 ns) @ 40MHz. • Nominal resolution: 16 slices• Programmable pipeline to synchronize different channels. • Histogram block for each channel
Bunch-Crossing (BX) tagging: • 12 bits BX counter
Frame builder and TDC Zero Suppression (ZS): • Frame fixed will be implemented• Header will be 16 bits wide • Full Hit-Map (not-ZS) + TDC data ZS
Output GBTx interface via e-LINK,
Interface for synchronous signals from LHCbTiming and Fast Control system,
I2C Interface for slow control signals.
nSYNC architecture
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Not protectedTDC status and histograms (90 B + 2.3 kB)
Protected with TMRConfiguration registers and TFC (~65 B)
Protected with Hamming code + EDACInternal counters, prog. output buffer
and TDC FSM states
nSYNC architecture
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• Size: about 4.4 x 3.8 mm2
• Technology: UMC 130 nm • Voltage Supply:
• I/O ring: 3.3 V • Core: 1.2 V
• Pin count: 125 • Package: QFP 160
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Protons Irradiation Test
Protons irradiation at Catana facility
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Test room
Injection and acceleration
CatanaControl room
• Catana facility (LNS - CT)*,• TID collected : 1.2 kGy[Si] (120 kRad[Si]),• Fluence collected : 1.1・1012 prot./cm2,
NIEL equivalent: 0.72 Gy (2.2・1012 1MeV neutr. eq./cm2),• 3 chips tested.
• Protons energy: 60 MeV,• Flux: 5.69・108 prot./cm2 sec,• Beam collimated (not squeezed),
used collimator of 15 mm diameter,• Omogeneus lateral profile.*
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*G.Cuttone et al., CATANA protontherapy facility - DOI: 10.1140/epjp/i2011-11065-19
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Catana room and collimator
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Protons irradiation at Catana facility
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I2C
Power 3.3V
Power 1.2V
Alignementand cabling
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Protons irradiation at Catana facility
PLLandone LVDSdriver
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We have developed a complete custom DAQ system, to automatize I2C communication, control and monitoring operationsduring the irradiation test:
• Send I2C commands, set/read configuration;• Monitor internal error counters, current consumptions,
PLL jitter;• Calibrate TDCs, read TDCs status;
PCCustom
DAQSoftwarenSYNC
Supply1.2V
Supply3.3V
Oscilloscope Switch
I2C-tools
RemotePC
~20m
Testroom Controlroom
beam BeamControl
Tomaincontrolroom
I2C USB
GPIBEth.
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Protons irradiation – DAQ system
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Protons irradiation - Runs
Run details: Integrated Dose Overall fluence values• 5 runs of 80 Gy/run @ ~0.08 Gy/sec 400 Gy 3.6531011 prot./cm2
• 6th run of 400 Gy @ ~0.08 Gy/sec 800 Gy 7.2931011 prot./cm2
• 7th run of 400 Gy @ ~0.8 Gy/sec 1200 Gy 1.0931012 prot./cm2
We will show results separately for the different chip blocks:• Current consumption and PLL jitter• TDC performance• SEU cross sections for TDC, histograms and protected blocks• Final summary
Three chips tested: - one for dose rate calibration / SW debugging, - two for analysis and results (named chip 13 and chip 14).
13
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Chipcore(1.2V)
Current consumption
I/O(3.3V)
14
• Monitored the current consumption for the chip core (@ 1.2 V) and I/O (@ 3.3 V)• Expected increase due to change of the frame pattern in output interface (LVDS
driver) [from CCCC to AAAA] • Current stable at low dose rate, increase at higher dose rate, no failure behavior or
SEL seen.
change of the frame pattern to output LVDS drivers
change of the frame pattern to output LVDS drivers
Higher doserate:0.8Gy/sec
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Current consumptionComparison in I/O current consumption , at low and high dose rate.
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Run 1 @ 0.08 Gy/sec Run 7 @ 0.8 Gy/sec
Current increase @ 0.08 Gy/sec:~1.2% with 400 Gy (~3 LHCb upgrades)~0.8% with 130 Gy (~1 LHCb upgrade)
130 Gy à TID in 10 years of LHCb upgrade operation (named “1 upgrade”)
Current increase @ 0.8 Gy/sec:~4% with 400 Gy (~3 LHCb upgrades)~1.3% with 130 Gy (~1 LHCb upgrade)
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PLL and LVDS driver
• Monitored the jitter of PLL (@ 40 MHz) and of one LVDS driver Controlling the oscilloscope remotely (measuring the period in statistics mode).
• Seen no unexpected instability during the full runs. • PLL jitter increase with beam ≲ 5%.• LVDS jitter fluctuations of the order of ∼ 4%.
0 50 100 150 200
Time (min)
136
138
140
142
144
146
LVD
S jit
ter (
ps) @
80M
Hz
0 50 100 150 200 250Time (min)
38
39
40
41
42
43
44
45
46
PLL
jitte
r (ps
)
Begin RunBegin Run
EndRun– 1.2kGyEndRun– 1.2kGy
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TDC performance
• Check for unexpected trend in TDC performance w.r.t. TID, reading TDC-DCO ctrl word immediately after the DCO calibration.
• No trend found: calibration curves superimposable, TDC very stable.
10 15 20 25 30TDC resolution
0
2
4
6
8
10
12
TDC
Sta
tus
num
ber (
for c
h. 0
)
0 Gy80 Gy160 Gy240 Gy320 Gy400 Gy800 Gy1200 Gy
0 10 20 30 40Channel number
3.4
3.5
3.6
3.7
3.8
3.9
4
4.1
TDC
Sta
tus
num
ber @
res.
16
0 Gy80 Gy160 Gy240 Gy320 Gy400 Gy800 Gy1200 Gy
(plots only for chip 14, similar for chip 13 in backup slides)
Calibration curves for ch. 0 Calibration curves for resolution 16.
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Very smalltrend,but completelyinsidethedithering correction
DCO
ctr
lwor
d (f
or c
h. 0
)
DCO
ctr
lwor
d
Nominalresolution =16
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SEU cross section – TDC
2 4 6 8 10)2 protons/cm11Fluence (x 10
0
10
20
30
40
50n.SE
U
1 2 3 4 5 6 7)2 protons/cm11Fluence (x 10
5
10
15
20
25
30
35
40
45
n.SE
U
• Counted the number of SEU w.r.t. fluence, periodically reading TDC status for all channels.
• SEU widespread over all channels.• Cross section [𝜎 = 𝑛. 𝑆𝐸𝑈/𝑓𝑙𝑢𝑒𝑛𝑐𝑒] quite stable at
different fluence values. (Note: linear fit constraint at the origin)
Chip 14: 6.7 ± 0.3 ⋅ 10@44𝑐𝑚7Chip 13: 4.9 ± 0.2 ⋅ 10@44𝑐𝑚7
Seu exampleReading
continuosly
TDCstatusfori-th channel
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TDC status: 2 bytes per channel(DCO control word, TDC enable etc)
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SEU cross section – time histograms
• Counted the number of SEU w.r.t. fluence, periodically downloading 2.3 kB of histograms for all channels, in order to compare each bits.
• Cross section stable at different fluence values.
1 2 3 4 5 6 7)2 protons/cm11Fluence (x 10
100
200
300
400
500
600
700
n.SE
U
2 4 6 8 10)2 protons/cm11Fluence (x 10
100
200
300
400
500
600
700
800
900
n.SE
U
Chip 14: 10.4 ± 0.3 ⋅ 10@4X𝑐𝑚7Chip 13: 8.7 ± 0.1 ⋅ 10@4X𝑐𝑚7
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Error Detection in Conf.Regs. and Internal Logic• Counted the number of:
• TMR activaction in configuration registers (using the internal counter),• Error detection for Hamming and EDAC (using internal counters).
• SEU in conf.regs. are always corrected by TMR Upper limit to cross section: <8310-13 @95%CL
• SEU in internal logic not corrected only if double errors (<3% of errors detected, dose rate dependent).
(plots only for chip 14, similar for chip 13 in backup slides)
1 2 3 4 5 6 7)2 protons/cm11Fluence (x 10
5
10
15
20
25
30
35
40
45
n.SE
U
2 4 6 8 10)2 protons/cm11Fluence (x 10
10
20
30
40
50
60
70
80
90
n.SE
U
TMRHamm.+EDAC
n.SEU
detected
n.SEU
detected
Cross section:13⋅ 10@44𝑐𝑚7 Cross section:8⋅ 10@44𝑐𝑚7
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Protons Irradiation SummarySEUestimationsfordifferentblocks
MethodofSEUcounting
Cross Section𝜎:events/(part3cm-2)
Cross Section𝝈 persinglebit:cm2/n.bits
Internallogic(allerrorsdetected)
Internal counters 13⋅ 10@44 -
Internallogic (doubleerrorsnotcorrected)
Internalcounters 4 310-12 -
TDC Readperiodically(~1s) 5.8310-11 0.8 310-13
Histograms Readperiodically(~2min) 0.9310-9 0.5310-13
Conf.Regs.+TFC(TMRcorrected)
Internalcounters 8310-11 0.6310-13
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• Stable SEU cross section at different fluence values (LET: 0.0086 MeV cm2 /mg), single bit cross section ≃ (0.5 − 0.8) ⋅ 10@4`cm7 ,
• No Single Event Latch-up seen (maybe too low LET to induce it),• No TMR failure,• Stability of current consumption, increase < 5% in 1 eq.LHCb upgrade (0.8 Gy/sec),• Stability of PLL and LVDS jitter and TDC performance.
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X-Ray Irradiation Test
X-Ray facility
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X-Ray irradiation system in Cagliari, used in the past to check uniformity on triple-GEM detectors. • X-ray tube with Fe anode, 20kV, max. current 40mA,
water cooled, 250 μm Be exit window;• Smallest X-ray spot: 7 mm diameter;• XY moving system with 50 μm accuracy available,
alignement with radiochromic film; • Same DAQ used at protons facility;• nSYNC with silicon exposed (bare die).
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X-Ray irradiation – Calibration
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• Used an Amptek XR-100 CR (300 𝜇𝑚 tick) to study X-Ray spectrum (corrected by det. efficiency and air absorption);
• Added Al filter to harden the spectrum and get more uniform absorption in the silicon (100÷300 𝜇𝑚 Al filter)
• Used a Si PIN (300 𝜇𝑚 tick) to estimate dose rate → Estimate of ~200av Gy/min (100 𝜇𝑚 Al filter).
• A posteriori correction for the dose reduction due to distance from the source.
RelativeDo
se[S
i] Dose VS SI depth weighted with spectrum
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0 5 10 15 20 25 30 35 40X-ray tube current (mA)
0
50
100
150
200
250
300
Aver
age
dose
rate
(Gy[
Si] /
min
)
No filter100um Al filter200um Al filter300um Al filter
PIN detector response
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X-Ray irradiation – Consumption
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0 2 4 6 8 10Time (min)
120
130
140
150
160
170
180
Cur
rent
(mA)
Current Consumption (chip decap. @ 3.3V)
0 2 4 6 8 10Time (min)
30
35
40
45
50
55
60
Cur
rent
(mA)
Current Consumption (chip decap. @ 1.2V)
I/O(3.3V) Chipcore(1.2V)
• Not failure behaviour found after several (~12) upgrades,• Current increase in ~1LHCb upgrade compatible with protons beam test:
• ~1-2 % @ low TID, first minutes after irradition start;• ~10% @ higher TID.
Tubecurrent:40mA~100𝜇𝑚 Alfilterd~25mm
Tubecurrent:40mA~100𝜇𝑚 Alfilterd~25mm
nSYNC irradiation test - TWEPP 2018
First test with one chip decapped, TID collected (16 mins at ~1.7Gy/sec): 1.6 kGy
1upgrade=130Gy 1upgrade=130Gy
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• Compatible results for the other chips.• Monitored annealing (~1 week). Possibility to continue to irradiate the same chip.
X-Ray irradiation – Consumption
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I/O(3.3V) Chipcore(1.2V)
Current increase in 1 LHCb upgrade:• 4% (3.3V) ÷ 7% (1.2V)
Tubecurrent:2mA~300𝜇𝑚 Alfilterd~14mm
Tubecurrent:2mA~300𝜇𝑚 Alfilterd~14mm
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- Second test with a previously irradiated chip, after annealing, with different conditions(distance reduced, added Al filters up to 300 𝜇𝑚).- Lower dose rate: ~0.03Gy/sec. Total: 220 Gy (120 minutes)
1upgrade=130Gy 1upgrade=130Gy
• Not failure behaviour after continuing to irradiate the same chip (>3 kGy total),• Even after the annealing and lower dose rate, the consumption increasing is higher,
cumulative (permanent?) effect.26
Conclusions
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nSYNC continue to work after several equivalent LHCb upgrades, tested with a TID of 1.2 kGy using protons beam, and up to 3 kGy using X-Ray.
nSYNC irradiation test - TWEPP 2018
• SEU cross section per single bit ≃ (0.5 − 0.8) ⋅ 10@4`cm7
• Fully digital TDC very stable, small trends within the DCO-dithering correction. • No unexptected effects seen (asymmetries or more vulnerable registers than others);• PLL and LVDS jitter increase ≲ 4%;• Current increase due to TID ~5% in one equivalent LHCb upgrade (130 Gy), with
evidence of cumulative effects (less evident with protons test);• No SEL or micro-SEL found.
Test done to validate the radiation hardening for LHCb upgrade operations, but it isinteresting to further test UMC 130 nm with different LET for cross section and SEL studies.
27
1
2
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Backup Slides
Dose expected
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• TID expected : 130&' 𝐺𝑦, (𝑚𝑎𝑥 < 200𝐺𝑦)• Hadrons with energy > 20 MeV = 2 3 1044/𝑐𝑚7
• 1 MeV Neutrons equivalent = 2 3 1047/𝑐𝑚7, NIEL dose: 0.65 Gy
FLUKA simulation of Radiation Levels
Considerations:• Muon towers structure not represented in the
simulation geometry;• In general, simulation values for dose tend to
be lower than measurements. The missingtower structures partially compensate for that;
• Measurements took during Run1 suggest thatthe simulation was rather accurate in thesepositions;
• Reccomandation anyway of a safety factor 2.
X=5-1<Y<+1Z=15.2meters
Hotregions
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Radiation not so critical in ODE positions (~20÷ 40 times smaller than very FE).Values in hottest regions (M2 – ODE-IB racks) for 10 years of LHCb upgrade:
All values with safety factor 2
Y,cm
[Rate:~6 3 10@f𝐺𝑦/𝑠𝑒𝑐]
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Dose expected in other regions
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Station IB-ODE position (x,y,z in meters)
Dose (Gy) Hadrons fluence(cm-2) (>20MeV)
1 MeV neutr. eq. fluence (cm-2)
M3 (5.5, ±1, 16.4) av. 60 Gymax. 73 Gy
av. 6.631010
max. 8.631010av. 1.731011
max. 231011
M4 (6, ±1, 17.6) av. 53 Gymax. 62 Gy
av. 6.331010
max. 7.531010av. 1.431011
max. 1.631011
M5 (6.5, ±1, 18.8) av. 48 Gymax. 61 Gy
av. 7.431010
max. 7.931010av. 231011
max. 2.131011
All values with safety factor 2.
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Dose expected in other regions
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Fluence little bit bigger in M5 wrt M4
X=500
X=650
X=550
X=600
1 MeV neutrons eq. fluence
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Experimental setup at Catana
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Experimental setup at Catana
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DAQ system used at Catana - FSM
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The DAQ software is based on a FSM with 5 states in order to:• Switch easier from/to different functionalities,• Perform a smart error handling, since different kinds of errors are present: Hw from
oscilloscope or I2C dongle, soft radiation-induced errors from the chip, I2C communication errors, such as address not ack. etc.
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DAQ system used at Catana
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Communication between the two domains is possibile sending notifiers (LabVIEW tool for tasks synchronization), wihout interfere with the parallelism.
The DAQ software architecture is based on: • a first fast-loop that expects user actions from the front panel in real time,• a second (above) asynchronous loop that performs measurements and r/w operations
on the nSYNC.
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Current consumption• Monitored the current consumption for the chip core (@ 1.2 V) and I/O (@ 3.3 V)
Note: complete power cycle after every run → small fluctuactions exptected.• Current very stable at low dose rate, small instability/increase at higher dose rate;
→ Instability of the beam current and changing of the frame pattern in output interface(from CCCC to AAAA) → no failure behavior seen.
(plots only for chip 14, similar for chip 13 in backup slides)
Chipcore(1.2V)I/O(3.3V)
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Current consumption for chip 13Small increase in the current in the 3.3V supply also in the first runs. Not observedin chip 14.
Only run 1 and 2 (@ 0.08 Gy/sec)
Current increase:~1.2% with 400 Gy (~3 upgrades)~1.6% with 800 Gy (~6 upgrades)
0 200 400 600 800 1000Time (sec)
128.8
129
129.2
129.4
129.6
129.8
Curren
t (mA)
Current Consumption (chip 13 @ 3.3V)
0 200 400 600 800 1000 1200Time (sec)
126.5
127
127.5
128
128.5
129
129.5
Cur
rent
(mA)
Current Consumption (chip 13 @ 3.3V)
400 Gy
Run1
Run2
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Channels vulnerability – TDC
• Check for channels vulnerability: histogram of SEU per channel number;
• Low statistics to perform deeper studies, but no particular trend seen.SEU widespread over all channels.
0 5 10 15 20 25 30 35 40 45Channels
0
1
2
3
4
5
6
Flip
s / c
hann
el
TDC SEU (chip 14)
0 5 10 15 20 25 30 35 40 45Channels
0
1
2
3
4
5
6
Flip
s / c
hann
el
TDC SEU (chip 13)
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Channels vulnerability – Histograms
• Check for channels vulnerability: counted number of SEU wrt channel number, grouping together the corresponding 16 counters (3 byte/counter).
• No particular trend seen, SEU widespread over all channels.
0 100 200 300 400 500 600 700Sequential bins
8
10
12
14
16
18
20
22
24
Flips
/ cha
nnel
Histograms SEU (chip 14)
0 100 200 300 400 500 600 700Sequential bins
12
14
16
18
20
22
24
26
28
Flip
s / c
hann
el
Histograms SEU (chip 13)
0 ChannelNumber 47 0 ChannelNumber 47
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TDC performance for chip 13
• Check for unexpected trend in TDC performance wrt TID, reading TDC status immediately after a calibration, in order to not include SEU.
• No trend found: calibration curves superimposable, TDC very stable.
10 15 20 25 30TDC resolution
0
2
4
6
8
10
12
TDC
Sta
tus
num
ber (
for c
h. 0
)
0 Gy80 Gy160 Gy240 Gy320 Gy400 Gy800 Gy1200 Gy
0 10 20 30 40Channel number
3.4
3.6
3.8
4
4.2
4.4
4.6
TDC
Sta
tus
num
ber @
res.
16
0 Gy100 Gy200 Gy300 Gy400 Gy500 Gy1000 Gy1500 Gy
Calibration curves for ch. 0 Calibration curves for resolution 16.
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TDC performance for chip 14 – ch.31
A very tiny trendfrom 0 Gy to higherdoses, but within the dithering correction(trend not significant)
6 8 10 12 14 16 18 20 22Resolution
2
3
4
5
6
7
8
9
10
TDC
sta
tus
num
ber (
ch.3
1) 0 Gy80 Gy160 Gy240 Gy320 Gy400 Gy800 Gy1200 Gy
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EDAC and TMR in chip 13• Counting the number of TMR activaction in configuration registers (using internal counter) and error
detection for hamming and EDAC (using internal counters).
• Important points:• SEU in conf.regs. are always corrected by TMR (get an upper limit to cross section)• SEU in internal logic not corrected only if double errors (~3% of errors detected)
1 2 3 4 5 6 7)2 protons/cm11Fluence (x 10
10
20
30
40
50
60
70
n.SE
U
2 4 6 8 10)2 protons/cm11Fluence (x 10
10
20
30
40
50
60
70
n.SE
U
Conf.Regs.Hamm.+EDAC
n.SEU
detected
n.SEU
detected
Cross section:13⋅ 10@44𝑐𝑚7 Cross section:8⋅ 10@44𝑐𝑚7
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All cross sections measured
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TDCChip 14: 6.7 ± 0.3 ⋅ 10@44𝑐𝑚7
Chip 13: 4.9 ± 0.2 ⋅ 10@44𝑐𝑚7
HistogramsChip 14: 10.4 ± 0.3 ⋅ 10@4X𝑐𝑚7
Chip 13: 8.7 ± 0.1 ⋅ 10@4X𝑐𝑚7
Config. Regs. Chip 14: 8.5 ± 0.1 ⋅ 10@44𝑐𝑚7
Chip 13: 6.9 ± 0.2 ⋅ 10@44𝑐𝑚7
Part of Internal logic(hamming + EDAC)
Chip 14: 16.5 ± 0.2 ⋅ 10@44𝑐𝑚7
Chip 13: 10.3 ± 0.3 ⋅ 10@44𝑐𝑚7
Errors in Config. Regs. without TMR correction (upper limit) < 8 ⋅ 10@4`𝑐𝑚7 @ 95%CL
Part of Internal logic(Hamming + EDAC) double errors
not corrected
Chip 14: 4 ⋅ 10@47𝑐𝑚7
Chip 13: <3 ⋅ 10@47𝑐𝑚7 @ 95%CL
20/09/18- DavideBrundu nSYNC irradiation test - TWEPP 2018
Beam Current @ Catana(InWater)
Chip13(05/07/2017)
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20/09/18- DavideBrundu nSYNC irradiation test - TWEPP 2018
Beam Current @ Catana(InWater)
Chip14(04/07/2017)
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X-Ray irradiation – Calibration
20/09/18- DavideBrundu
• Important: X-Ray spot has an angular semi-aperture of ~3.6° (estimated measuring spot diameter at different distances with radiochromic film),
• Changing the distance from the tube will change the dose:𝐷 𝑧 = 𝐷(0) 3 𝑅jklm7 (0)/𝑅jklm7 (𝑧)
• We have taken into account this dose reduction, based on the nSYNC – X-Ray tube distance.
nSYNC irradiation test - TWEPP 2018
0 50 100 150 200 250 300distance from beam (mm)
0
20
40
60
80
100
120
140
160
180
200
Aver
age
dose
rate
(Gy[
Si /
min
])
100um Al filter200um Al filter300um Al filter
fz1
Average dose (in 300 𝜇𝑚Si) wrt distance from the X-Ray tube
Distance fromtube(mm)
At 25 mm → Reduction by a factor 2.100av Gy/min using 100 𝜇𝑚 Al.
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20/09/18- DavideBrundu nSYNC irradiation test - TWEPP 2018
X-Ray irradiation in Cagliari - spectrum
Kα1 eKα2:~6396eV(2mergedlines)Kβ:7058eV(1line)
Kα Siescapepeak:~4656eV
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20/09/18- DavideBrundu nSYNC irradiation test - TWEPP 2018
X-Ray irradiation in Cagliari - spectrum
Fittox-raymassattenuationcoefficientμ/ρ (allinteractions)andthemassabsorptioncoefficientμ/ρen(photoelectric)intherange2-30keVusingdatafromhttp://physics.nist.gov/PhysRefData/XrayMassCoef/ElemTab/z14.html
𝜀 𝐸 = 1 − 𝑒@o p q
Correctedspectra →𝑁ks(𝐸t) =uvwxyz{y||(p})
~(p})
d=detectorthickness
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20/09/18- DavideBrundu nSYNC irradiation test - TWEPP 2018
X-Ray irradiation in Cagliari - spectrum
• Use of aluminum filters of various thickness could be used to reduce the low-energy component
• Effect of approximately 100μm Al filter on the X-Ray spectrum
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20/09/18- DavideBrundu nSYNC irradiation test - TWEPP 2018
Dose estimation with Si-PIN diode
Used a Si-PIN detector to perform an absolute estimate of the dose rate for the X-Rayradiation.
Supposing 1 W power deposition:
1𝑊 =1𝐽𝑠𝑒𝑐 = 6.242 3 104�𝑒𝑉/𝑠𝑒𝑐
1.734 3 104�𝑒ℎ𝑝𝑎𝑖𝑟/𝑠𝑒𝑐 = 0.2778𝐴
Sensitivity: 0.2778A/W
3.6eV forcreate1ehpair
𝐷𝑜𝑠𝑒𝑅𝑎𝑡𝑒 =𝑃𝑜𝑤𝑒𝑟𝑀𝑎𝑠𝑠 =
𝐶𝑢𝑟𝑟𝑒𝑛𝑡𝑆𝑒𝑛𝑠𝑖𝑡𝑖𝑣𝑖𝑡𝑦 ∗ 𝑀𝑎𝑠𝑠
Where with the mass term we consider the mass corresponding to the volume, in the PIN detector, irradiated by the full spot:
𝑀 = 𝐴���� 3 𝑑��u 3 𝜌�t
• To estimate the max. dose rate, the full spot must be inside the active area of the PIN diode. • This metod provides a lower limit to the dose, because we are neglecting inefficiencies (we are
considering a maximum/ideal sensitivity) and an average dose in the full thickness.• Suppose to have a detector with the same area of the spot and unitary mass: moving it far away
from the X-Ray tube leads to a smaller dose rate, if the beam has a non-vanishing angularaperture (neglecting air attenuation). The dose rate scale with the square of spot radius:𝐷 𝑧 = 𝐷(0) 3 𝑅jklm7 (0)/𝑅jklm7 (𝑧)
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20/09/18- DavideBrundu nSYNC irradiation test - TWEPP 2018
X-Ray spot aperture
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• Used radiochromic film to measure spot diameter at different distance. Spot shape elliptical with small eccentricity.
• Estimation of angular semiaperture (3.77° horizontal, 3.63° vertical)
mm mm
mm mm
20/09/18- DavideBrundu nSYNC irradiation test - TWEPP 2018
X-Ray radiation test – different distances
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Distance~14𝑚𝑚Distance~25𝑚𝑚