IPC Fall Standards Development Committee Meetings

IPC Fall STANDARDS DEVELOPMENTCommittee MeetingsSunday–Thursday October 13–17, 2013Fort Worth, TexasCo-located with

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General Information

IPC Fall STANDARDS DEVELOPMENT Committee Meetings || 1

2–4

Schedule-At-A-Glance

5–6

General InformationConvention Center Floor Plan Luncheon Information Official IPC Hotel Registration

7–12

Standards Development Meetings

13

List of Awards Recipients

IPC is a nonprofit, international trade association for electronics manufacturers and companies around the world that make, use, specify and design printed boards and assemblies, including those in advanced microelectronics, aerospace and military, automotive, computer, industrial equipment, medical equipment and devices, and telecommunications industries. As the industry’s leading source for standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.17 trillion global electronics industry. IPC maintains offices in Bannockburn, Ill. (headquarters); Taos, N.M.; Washington DC; Stockholm, Sweden; Moscow, Russia; Bangalore, India; Bangkok, Thailand; and Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.

Table of ContentsMessage from IPC President & CEO John Mitchell

Dear Colleague:

Welcome to the IPC Fall Standards Development Committee Meetings!

The coming days present a tremendous opportunity to gather with fellow committee members at nearly 80 meetings to discuss, develop and fine-tune the documents that quite literally “set the standards” for the electronic interconnect industry.

IPC is fortunate to have so many volunteers dedicated to meeting our industry’s needs for benchmarks of excellence in all areas of electronics manufacturing. The generous contributions of your time and expertise play a major role in helping advance the electronics industry in the U.S. and around the world.

Although you are here to roll up your sleeves and get some important work done, it is equally important to take time to celebrate your accomplishments. To that end, I hope you will join us for the IPC awards luncheons on Monday and Thursday, honoring more than 130 committee members for their work.

Thank you for your contributions to the electronics industry, and congratulations on a job well done!

Sincerely,

John MitchellPresident & CEOIPC


2 || IPC Fall STANDARDS DEVELOPMENT Committee Meetings

Sunday, October 13Terms and Definitions Committee 2-30 8:00 am–9:00 am Michael Green, Lockheed Martin Space

Systems Company201B 12

Coalition for Advancement of MicroElectronic Systems Technology (CAMEST)

8-70 8:00 am–3:00 pm Dennis Fritz, MacDermid, Inc. 202B

Joint Meeting — J-STD-001 & IPC-A-610 Task Groups

5-22a/7-31b 8:00 am–3:00 pm Teresa M. Rowe, AAI Corporation; Daniel L. Foster, Missile Defense Agency; Constantino J. Gonzalez, ACME Training & Consulting; Jennifer A. Day, U.S. Army Aviation & Missile Control

201A 12

Joint Meeting — IPC-A-600 and Rigid Printed Board Performance Specifications Task Groups

7-31a/D-33a 9:00 am–4:30 pm Mark Buechner, BAE Systems 201B 12

Supplier Declaration Subcommittee 2-18 1:00 pm–4:30 pm Forrest Christian, Innovation Machine Ltd. 201C 9Assembly & Joining Committee 5-20 3:00 pm–4:30 pm Leo Lambert, MIT, EPTAC Corporation 201A 7

IPC Committee Chairmen’s Reception 6:00 pm–7:00 pm

Monday, October 14Product Assurance Committee 7-30 8:00 am–9:00 am Mel Parrish, STI Electronics, Inc. 121B 12Component and Wire Solderability Specification Task Group

5-23b 8:00 am–10:00 am David Hillman, Rockwell Collins 121A 7

Current Carrying Capacity Task Group 1-10b 8:00 am–10:00 am Michael Jouppi, Lockheed Martin 200 11Laminate/Prepreg Materials Subcommittee 3-11 8:00 am–12:00 pm Antonio Senese, Panasonic Electric Works 204B 8Product Data Description Subcommittee 2-41 8:00 am–12:00 pm Douglas Sober, Shengyi Technology Co. 110B 9

Materials Declaration Task Group 2-18b 8:00 am–5:00 pm Aidan Turnbull, Ph.D., ENVIRON UK Ltd;Mark Frimann, Texas Instruments Inc.

110A 9

Space Electronic Assemblies J-STD-001 Addendum Task Group

5-22as 8:00 am–5:00 pm Garry McGuire, CIT, NASA Marshall Space Flight Center

201A 7

Printed Circuit Board Solderability Specifications Task Group

5-23a 10:00 am–12:00 pm Gerard O’Brien, Solderability Testing & Solutions, Inc.

121B 7

J-STD-001/Conformal Coating Material & Application Industry Assessment Task Group

5-22arr 10:15 am–12:00 pm David Hillman, Rockwell Collins 121A 7

Printed Board Process Capability, Quality and Relative Reliability Benchmark Test Subcommittee

D-36 10:15 am–12:00 pm Gary Long, Intel Corporation 201B 12

Printed Board Storage and Handling Subcommittee

D-35 10:15 am–12:00 pm Joseph Kane, BAE Systems Platform Solutions

200 12

IPC Committee Awards Luncheon 12:00 pm–1:30 pm 203B 6Marking, Symbols and Labels for Identification of Assemblies, Components & Devices Task Group

4-34b 1:30 pm–2:30 pm Lee Wilmot, TTM Technologies, Inc.;Stephen Tisdale, Intel Corporation

121A 10

Cleaning Compatibility Task Group 5-31j 1:30 pm–3:00 pm Eddie Hofer, Rockwell Collins 121B 8Test Coupon and Artwork Generation Task Group

1-10c 1:30 pm–3:00 pm Timothy Estes, Conductor Analysis Technologies, Inc.

201B 11

Thermal Profiling Guide Task Group 5-22h 1:30 pm–3:00 pm Ray Prasad, Ray Prasad Consultancy Group 200 7Woven Glass Reinforcement Task Group 3-12d 1:30 pm–3:00 pm Mike Bryant, BGF Industries Inc. 204B 8Product Data Description (Laminar View) Subcommittee

2-16 1:30 pm–5:00 pm Karen McConnell, CID, Northrop Grumman Corporation

110B 10

Base Materials Roundtable Task Group 3-12e 3:15 pm–5:00 pm Edward Kelley, Isola Group SARL 204B 8Electrical Continuity Testing Task Group 7-32c 3:15 pm–5:00 pm Mike Hill, Viasystems Group, Inc. 200 12High Speed/High Frequency Committee D-20 3:15 pm–5:00 pm Edward Sandor, Taconic Advanced

Dielectric Division121A 10

SIR and Electrochemical Migration Task Group 5-32b 3:15 pm–5:00 pm Keith Sellers, Trace Laboratories – Baltimore

121B 8

Technical Activities Executive Committee (By Invitation)

TAEC 5:00 pm–6:30 pm Douglas Pauls, Rockwell Collins 201A 11

Event Code Time Chair/Moderator Room Page

Meetings will be held at the Forth Worth Convention Center.



Tuesday, October 15Printed Electronics Design Subcommittee D-61 8:00 am–9:30 am Daniel Gamota, Jabil Circuit, Inc. (HQ);

Jie Zhang, Ph.D., Institute of Materials Research & Engineering (IMRE)

121C 11

Metallic Foil Task Group 3-12a 8:00 am–10:00 am Rolland Savage, High Performance Copper Foil Inc.

201A 8

Electronic Documentation Technology Committee

2-40 8:00 am–12:00 pm Karen McConnell, CID, Northrop Grumman Corporation

110B 9

Stencil Cleaning Task Group 5-31g 8:00 am–12:00 pm Mike Bixenman, DBA, Kyzen Corporation 121A 8Printed Electronics Base Material/Substrates Subcommittee

D-62 9:30 am–11:00 am Daniel Gamota, Jabil Circuit, Inc. (HQ);Scott Gordon, DuPont Teijin Films

121C 11

Assembly Process Effects Handbook Subcommittee

7-23 10:00 am–12:00 pm Greg Hurst, RSI, Inc.;Sharon Ventress, U.S. Army Aviation & Missile Command

201A 11

Declaration of Shipping, Pack and Packing Materials Task Group

2-18f 10:00 am–12:00 pm John Ciba, Jr.;Lee Wilmot, TTM Technologies, Inc.

110A 9

Joint Meeting — IPC-A-600 and Rigid Printed Board Performance Specifications Task Groups

7-31a/D-33a 10:00 am–12:00 pm Mark Buechner, BAE Systems 201B 12

Solder Alloy Task Group 5-24c 10:00 am–12:00 pm Jennie Hwang, Ph.D., Sc.D., H-Technologies Group

121B 7

Test Methods Subcommittee 7-11 10:00 am–12:00 pm Joseph Russeau, Precision Analytical Laboratory, Inc.

201C 12

Printed Electronics Functional Materials Subcommittee

D-63 11:00 am–2:00 pm Josh Goldberg, Taiyo America Inc. 121C 11

Conductive Anodic Filament (CAF) Task Group 5-32e 1:30 pm–3:00 pm Karl Sauter, Oracle America, Inc. 201A 8Conformal Coating Handbook Task Group 5-33c 1:30 pm–3:00 pm Amy Hagnauer, Raytheon Company;

Jason Keeping, Celestica121B 8

Flux Specifications Task Group 5-24a 1:30 pm–3:00 pm Renee Michalkiewicz, MIT, Trace Laboratories – Baltimore

121A 7

Plated-Through Via Reliability-Accelerated Test Methods Task Group

6-10c 1:30 pm–3:00 pm Randy Reed, Viasystems Group, Inc. 201B 12

TDR Test Methods Task Group D-24a 1:30 pm–3:00 pm Louis Hart, Ph.D., CIT, Compunetics Inc. 201C 10Embedded Devices Process Implementation Subcommittee

D-55 1:30 pm–5:00 pm Rajesh Kumar, Viasystems North America, Inc.; Vern Solberg, Solberg Technical Consulting

110B 10

Laboratory Report Declaration Task Group 2-18j 1:30 pm–5:00 pm William Haas, Seagate Technology LLC 110A 9Printed Electronics Final Assembly Subcommittee

D-64 2:00 pm–3:30 pm Daniel Gamota, Jabil Circuit, Inc. (HQ) 121C 11

Conformal Coating Task Group 5-33a 3:15 pm–5:00 pm John Waryold, HumiSeal Division of Chase Corporation

121B 8

High Frequency Test Methods Task Group: Frequency-Domain Methods

D-24c 3:15 pm–5:00 pm Glenn Oliver, DuPont 201C 10

Ion Chromatography/Ionic Conductivity Task Group

5-32a 3:15 pm–5:00 pm John Radman, Trace Laboratories–Denver 121A 8

IPC-2221/2222 Task Group D-31b 3:15 pm–5:00 pm Gary Ferrari, CID+, CIT, FTG Circuits 201B 11UL/CSA Task Group 3-11f 3:15 pm–5:00 pm Douglas Sober, Shengyi Technology Co. 201A 8Printed Electronics Process Subcommittee D-66 3:30 pm–5:00 pm Hirofumi Matsumoto, Nippon Mektron Ltd.;

Kurt Schroder, Novacentrix121C 11

Wednesday, October 16High Speed/High Frequency Board Performance Subcommittee

D-22 8:00 am–10:00 am Lance Auer, Raytheon Missile Systems 203C 10

Solder Paste Task Group 5-24b 8:00 am–10:00 am Karen Tellefsen, Ph.D., Alpha 203B 7UL 796F & 746F Task Group D-12a 8:00 am–10:00 am Duane Mahnke, DBMahnke Consulting 202A 10Flip Chip Mounting Task Group 5-21g 8:00 am–12:00 pm Vern Solberg, Solberg Technical Consulting 100 7Joint Meeting — IPC-D-620 Wire Harness Design and IPC-HDBK-620 Handbook Task Groups

7-31h/7-31k 8:00 am–12:00 pm Brett Miller, USA Harness, Inc.;Robert Cooke, CIT, NASA Johnson Space Center

203A 12

Conflict Minerals Data Exchange Task Group 2-18h 8:00 am–5:00 pm John Plyler, BlackBerry 204B 9IPC-HDBK-4691 Electronic Assembly Adhesives Task Group

5-11c 10:00 am–12:00 pm Nate Grinvalds, Rockwell Collins 109 7




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DFM Standards Think Tank (By Invitation) 10:15 am–12:00 pm 203CFlexible Circuits Specifications Subcommittee D-12 10:15 am–12:00 pm Nick Koop, CID, TTM Technologies 202A 10Plating Processes Subcommittee 4-14 10:15 am–12:00 pm George Milad, Uyemura International

Corp.; Gerard O’Brien, Solderability Testing & Solutions, Inc.

203B 10

Flexible Circuits Design Subcommittee D-11 1:30 pm–3:00 pm William Ortloff, Sr., Raytheon Company 202A 10High Speed/High Frequency Base Materials Subcommittee

D-23 1:30 pm–3:00 pm Edward Sandor, Taconic Advanced Dielectric Division

203B 10

IPC-7070 Task Group 5-21a 1:30 pm–5:00 pm Rainer Taube, MIT, Taube Electronic GmbH;Thomas Hausherr, CID+, PCB Libraries

100 7

Microsection Subcommittee 7-12 1:30 pm–5:00 pm Russell Shepherd, MIT, Microtek Laboratories Anaheim

203C 12

Underfill Materials Design, Selection and Process Task Group

5-24f 1:30 pm–5:00 pm Bill Vuono, Raytheon Company;Brian Toleno, Ph.D., Henkel Corporation

203A 7

Bare Board Cleanliness Assessment Task Group 5-32c 3:15 pm–5:00 pm David Lober, Kyzen Corporation 203B 8Flexible Circuits Base Materials Subcommittee D-13 3:15 pm–5:00 pm Clark Webster, ALL Flex LLC 202A 10Thursday, October 17Corrosion of Metal Finishes Task Group 3-11g 8:00 am–10:00 am Beverley Christian, Ph.D., BlackBerry 202C 8Technology Roadmap Subcommittee 8-41 8:00 am–12:00 pm John Fisher, Interconnect Technology

Analysis, Inc.201A 11

Conflict Minerals Due Diligence Committee E-30 8:00 am–5:00 pm John Ciba, Jr. 202A 11IPC-A-630 Requirements for Structural Enclosure Task Group

7-31j 8:00 am–5:00 pm Eddie Hofer, Rockwell Collins;Richard Rumas, CIT, Honeywell Canada

201B 12

IPC-SM-817 SMT Adhesive Task Group 5-21k 10:15 am–12:00 pm Nate Grinvalds, Rockwell Collins 202C 7IPC Committee Awards Luncheon 12:00 pm–1:30 pm 203B 6Printed Board Process Effects Handbook Subcommittee

7-24 3:15 pm–5:00 pm Dennis Fritz, MacDermid, Inc.;Larry Foster, Lockheed Martin Missiles & Fire Control

201A 11


Meetings will be held at the Forth Worth Convention Center.

General Information


A B CD

E

FW

M122

120

113B113A

111

MW

109107

106108

110A110B

M W

112114118

116

BOX OFFICE

HOUSTON ARENA LOBBY

COMMERCE ARENA

LOBBY

9TH STREET ARENA

LOBBY9TH STREET

DOOR #6

DOOR #5

CONCESSIONS EXHIBIT ANNEXDock/Storage

45,000 sf

EXHIBIT HALL

BALLROOM

TRUCK DOCKS

F E D C B AM

W

DOOR #4

MW

CONCESSIONS

ANNEX

LOBBYMW

DOOR #2

DOOR #1

A

B

C

D

E

F

FREIGHT ELEVATOR TERRACE

100

MW

COMMERCE ENTRANCE

WATER GARDENSEVENTS PLAZA

GRANDLOBBY

13TH STREETLOBBY

STAR TOWER

ENTRANCE

101

102

103

104

A

B

105

11TH STREETLOBBY

12TH STREETLOBBY

CONCOURSE

ARENA25,960 sf

M W

ESCALATOR

ESCALATOR

W

M

W

M

M W

ELEVATOR TO GENERAL OFFICES

CONCOURSE

COMMERCE STREET

HOUSTON STREET

W M

200

201

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C

202

A B

C D

203

204

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B W M

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ESCALATORESCALATOR

ELEVATOR

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ELEVATOR

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FREIGHTELEVATOR

A

B

C

First Level/Ground

Second Level

PARKINGGARAGE

N

PARKINGGARAGE

121

W M

ENTRANCE DOORS

ENTRANCE DOORS

ENTRANCE DOORS

ENTRANCE DOORS

ENTRANCE DOORS

EXIT

ENTRANCE DOORS

ESCALATORS

ENTRANCE DOORS

Fort Worth Convention Center Floor Plan

IPC Committee Meeting Locations

IPC Committee Meeting Locations

Several parking lots are available near the Convention Center. Parking in the convention center garage on Commerce is $10 per day.

General Information


Technical Activities Executive CommitteeChair: Douglas Pauls, Rockwell CollinsJack Bramel, Jack Bramel & AssociatesThomas Bresnan, R&D CircuitsJames DiNitto, Medisem, Inc.Andy (Shi Hao) Duan, SiemensC. Don Dupriest, Lockheed Martin Missiles & Fire ControlGary Ferrari, FTG CircuitsJohn Fisher, Interconnect Technology Analysis, Inc.Dennis Fritz, MacDermid, Inc.Lionel Fullwood, WKK Distribution, Ltd.Thomas Gardeski, Gemini Sciences, LLCReza Ghaffarian, Jet Propulsion LaboratoryPatricia Goldman, P.J. Goldman ConsultingFoster Gray, ConsultantMichael Green, Lockheed Martin Space Systems CompanyMike Hill, Viasystems Group, Inc.Greg Hurst, RSI, Inc.William Jacobi, William Jacobi & AssociatesBernard Kessler, Bernard Kessler & Associates, Ltd.Nick Koop, TTM TechnologiesLeo Lambert, EPTAC CorporationJames Maguire, Intel CorporationChris Mahanna, Robisan Laboratory Inc.Steven Martell, Sonoscan Inc.Karen McConnell, Northrop Grumman CorporationDavid McGregor, DuPontRenee Michalkiewicz, Trace Laboratories – BaltimoreGeorge Milad, Uyemura International Corp.Robert Neves, Microtek (Changzhou) LaboratoriesDebora Obitz, Trace Laboratories – BaltimoreMel Parrish, STI Electronics, Inc.Gary Roper, Roper Resources, Inc.Edward Sandor, Taconic Advanced Dielectric DivisionA. Jerry SiegmundRichard Snogren, My Camp KitchenDouglas Sober, Shengyi Technology Co. Ltd.Vern Solberg, Solberg Technical Consulting

Vicka White, Honeywell Inc. Air Transport Systems Dewey Whittaker, Honeywell Inc. Air Transport SystemsMikel Williams, JPS Industries, Inc.Cao Xi, Huawei Technologies Co., Ltd.Zhang Yuan, Huawei Technologies Co., Ltd.

IPC Board of DirectorsChairmanStephen (Steve) Pudles, Spectral Response, LLCVice ChairmanMarc Peo, Heller IndustriesSecretary/TreasurerJoseph (Joe) O’Neil, Hunter TechnologyImmediate Past ChairmanRobert (Bob) Ferguson, Avantor Performance MaterialsPresident and CEOJohn Mitchell, IPCDirectorsRobert (Bob) J. Black, Jr., Juki Automation Systems, Inc.Michael (Mike) Carano, OMG Electronic Chemicals, LLCAndy Hyatt, Creation TechnologiesBhawnesh Mathur, EPIC TechnologiesRobert (Bob) Neves, Microtek (Changzhou) LaboratoriesRex Rozario, OBE, Graphic PLCDon Schroeder, Paradigm Shift DevelopmentDongkai Shangguan, Ph.D., National Center for Advanced

Packaging (NCAP), ChinaRaymond (Ray) P. Sharpe, Isola S.A.R.L.Shane Whiteside, TTM TechnologiesMikel Williams, JPS Industries, Inc.Mark Wolfe, Phoenix International Corp.Alan Wong, Aavid CorporationTony Zhou, RayVal Technologies Co., Ltd.

IPC Committee Awards Luncheons Monday, October 14 & Thursday, October 17 12:00 pm–1:30 pm Room 203B Celebrate the accomplishments of IPC committee members during the IPC Committee Awards Luncheons. Tickets may be purchased for $45 each at the registration desk.

Official IPC HotelBlackstone Courtyard by Marriott 601 Main Street, Fort Worth, Texas, 76102 1-817-885-8700

RegistrationSunday, October 13–Wednesday, October 16 7:00 am–5:00 pm

Thursday, October 17 7:00 am–1:00 pm

IPC Standards Development Meetings


Assembly and Joining5-11c IPC-HDBK-4691 Electronic Assembly Adhesives

Task GroupWednesday, October 16 10:00 am–12:00 pm 109Chair: Nate Grinvalds, Rockwell CollinsThis subcommittee will provide documentation and training content for the processes associated with adhesive bonding in electronics assembly operations.

5-20 Assembly & Joining CommitteeSunday, October 13 3:00 pm–4:30 pm 201AChair: Leo Lambert, MIT, EPTAC CorporationVice Chair: Renee Michalkiewicz, MIT, Trace Laboratories–

BaltimoreThis is a planning meeting for the task group and subcommittee leaders of the Assembly and Joining Processes Committee.

5-21a IPC-7070 Task GroupWednesday, October 16 1:30 pm–5:00 pm 100Chairs: Thomas Hausherr, CID+, PCB Libraries;

Rainer Taube, MIT, Taube Electronic GmbHThis task group is developing IPC-7070, Component Mounting – Issues and Recommendations, which will supersede IPC-CM–770. Some of the details are being moved from IPC-7351 into the new document and this will be an opportunity to explain the do’s and don’ts of robust component mounting.

5-21g Flip Chip Mounting Task GroupWednesday, October 16 8:00 am–12:00 pm 100Chair: Vern Solberg, Solberg Technical ConsultingThis task group will be working on Revision A of IPC-7094, Design and Assembly Process Implementation for Flip Chip and Die Size Components. This revision will include information on the new semiconductor packaging concepts of 2.5- and 3-D configurations.

5-21k IPC-SM-817 SMT Adhesive Task GroupThursday, October 17 10:15 am–12:00 pm 202CChair: Nate Grinvalds, Rockwell CollinsIPC-SM-817 covers requirements and test methods for dielectric adhesives used to hold components in place from mounting to the soldering process and for their long-term properties as a part of the printed wiring board. This meeting will continue the process to Revision A.

5-22arr J-STD-001/Conformal Coating Material & Application Industry Assessment Task Group

Monday, October 14 10:15 am–12:00 pm 121AChair: David Hillman, Rockwell CollinsThe goal of the working group is to document the current “state of the industry” of conformal coating application on printed wiring assemblies. The project will look at the major conformal coating types (e.g., AR, ER, UR, SR, XY) and method of application (e.g., spray, dip, brush).

5-22as Space Electronic Assemblies J-STD-001 Addendum Task Group

Monday, October 14 8:00 am–5:00 pm 201AChair: Garry McGuire, CIT, NASA Marshall Space Flight CenterVice Chair: Kathy Johnston, CIT, Raytheon Missile SystemsThis task group is developing a space electronics hardware addendum for Revision F of J-STD-001.

5-22h Thermal Profiling Guide Task GroupMonday, October 14 1:30 pm–3:00 pm 200Chair: Ray Prasad, Ray Prasad Consultancy GroupThis task group is responsible for developing guidelines (IPC-7530) for thermal profiling, including thermocouple placement, and is responsible for developing a test method to standardize thermal profiling. This group is currently opening the document for Revision A.

5-23a Printed Circuit Board Solderability Specifications Task Group

Monday, October 14 10:00 am–12:00 pm 121BChair: Gerard O’Brien, Solderability Testing & Solutions, Inc.Vice Chair: Michah Pledger, HZO Inc.This group is celebrating the publication of the J-STD-003C. This revision addresses more wetting balance data generation and provides improved solder float test and solder spread test protocols.

5-23b Component and Wire Solderability Specification Task Group

Monday, October 14 8:00 am–10:00 am 121AChair: David Hillman, Rockwell CollinsVice Chair: Dennis Fritz, MacDermid, Inc.This group will discuss the ongoing Round Robin Test S (found in the J-STD-002 document) to better define solder stencil aperture requirements.

5-24a Flux Specifications Task GroupTuesday, October 15 1:30 pm–3:00 pm 121AChair: Renee Michalkiewicz, MIT, Trace Laboratories – BaltimoreVice Chair: John Rohlfing This group will revise/update test methods applicable to J-STD-004.

5-24b Solder Paste Task GroupWednesday, October 16 8:00 am–10:00 am 203BChair: Karen Tellefsen, Ph.D., AlphaVice Chair: Beverley Christian, Ph.D., BlackBerryThis group is revising IPC-HDBK-005 and will be discussing relevant test methods.

5-24c Solder Alloy Task GroupTuesday, October 15 10:00 am–12:00 pm 121BChair: Jennie Hwang, Ph.D., Sc.D., H-Technologies GroupVice Chair: David Adams, Rockwell CollinsThe task group will be celebrating the publication of J-STD-006C, Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications.

5-24f Underfill Materials Design, Selection and Process Task Group

Wednesday, October 16 1:30 pm–5:00 pm 203AChairs: Brian Toleno, Ph.D., Henkel Corporation;

Bill Vuono, Raytheon CompanyVice Chair: Fonda Wu, Raytheon CompanyThis group is updating J-STD-030, Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages, through a Revision A and a re-title of the document to “Design, Selection and Process Implementation for Underfill Materials,” that allows the document to be less constrained on topic and serve as both a specification and a guideline.

Contribute to the industry standards and guidelines that your company, customers, suppliers and competitors rely on. Registration is required.



Base Materials3-11 Laminate/Prepreg Materials SubcommitteeMonday, October 14 8:00 am–12:00 pm 204BChair: Antonio Senese, Panasonic Electric WorksVice Chair: Douglas Sober, Shengyi Technology Co. Ltd.This subcommittee is revising IPC-4101, Specification for Base Materials for Rigid and Multilayer Printed Boards to its D revision. The updates include: adding an optional fracture toughness test method; adding DMA as well as DSC and TMA thermal analysis test methods as an allowed means of determining the Tg for selected specification sheet materials; cleaning up the use of N/A in all of the specification sheets to prevent confusion; eliminating some specification sheets for obsolete materials; and adding any new materials not already delineated in existing specification sheets.

3-11f UL/CSA Task GroupTuesday, October 15 3:15 pm–5:00 pm 201AChair: Douglas Sober, Shengyi Technology Co. Ltd.This task group addresses issues relative to UL’s standards on rigid (nonflexible) laminates (UL-746E) and on rigid (nonflexible) printed boards (UL-796). The technical issues will feed into the UL STP meeting on these two UL standards.

3-11g Corrosion of Metal Finishes Task GroupThursday, October 17 8:00 am–10:00 am 202CChair: Beverley Christian, Ph.D., BlackBerryVice Chair: Helen Holder, Hewlett-Packard CompanyThis group is exploring and gathering data on the effects of corrosion on surface finishes through the use of mixed flowing gas (MFG) testing. Test facilities capable of running very high levels of hydrogen sulfide (≥1700 ppb) in conjunction with three other corrosive gases were located and first round robin MFG testing was completed.

3-12a Metallic Foil Task GroupTuesday, October 15 8:00 am–10:00 am 201AChair: Rolland Savage, High Performance Copper Foil Inc.Vice Chair: Arvind Partha, Ph.D., Somers Thin StripThis group is generating a noncontact test method and is gathering data on copper foil surface roughness measurements for possible inclusion in Revision B of IPC-4562, Metal Foil for Printed Board Applications.

3-12d Woven Glass Reinforcement Task GroupMonday, October 14 1:30 pm–3:00 pm 204BChair: Mike Bryant, BGF Industries Inc.Vice Chair: Douglas Eng, PPG Industries Inc.This task group completed the B revision of IPC-4412, Specification for Finished Fabric Woven from “E” Glass for Printed Boards. The B revision in hard copy format will be distributed to the task group members of record in appreciation of their efforts.

3-12e Base Materials Roundtable Task GroupMonday, October 14 3:15 pm–5:00 pm 204BChair: Edward Kelley, Isola Group SARLVice Chair: Douglas Sober, Shengyi Technology Co. Ltd.Using an open discussion format, this group will explore needed specifications and characterization methods for strategic materials used to manufacture laminates and prepregs. Discussions on reinforcements, resins, fillers and metal foils are anticipated.

Cleaning and Coating5-31g Stencil Cleaning Task GroupTuesday, October 15 8:00 am–12:00 pm 121AChair: Mike Bixenman, DBA, Kyzen CorporationThis task group is responsible for maintenance of the guideline document, IPC-7526, Stencil and Misprinted Board Cleaning Handbook. This meeting will continue the process of updating the standard to Revison A.

5-31j Cleaning Compatibility Task GroupMonday, October 14: 1:30 pm–3:00 pm 121BChair: Eddie Hofer, Rockwell CollinsVice Chair: Mike Bixenman DBA, Kyzen CorporationThis group will develop a standard test method to replace MIL-STD-202G, Method 215K which does not accurately represent modern cleaning chemistries and cleaning equipment. The new test method will determine the compatibility of cleaning agents and mechanical delivery systems with general electronics assemblies, component hardware, and electronics assembly materials.

5-32a Ion Chromatography/Ionic Conductivity Task GroupTuesday, October 15 3:15 pm–5:00 pm 121AChair: John Radman, Trace Laboratories – DenverVice Chair: Joseph Russeau, Precision Analytical Laboratory, Inc.This group is reviewing comments to test methods for ionic cleanliness testing.

5-32b SIR and Electrochemical Migration Task GroupMonday, October 14 3:15 pm–5:00 pm 121BChair: Keith Sellers, Trace Laboratories – BaltimoreVice Chairs: Graham Naisbitt, Gen3 Systems Limited;

Russell Shepherd, MIT, Microtek Laboratories AnaheimThis task group is working to complete IPC-9203, User Guideline for the IPC B-52 SIR Test Board.

5-32c Bare Board Cleanliness Assessment Task GroupWednesday, October 16 3:15 pm–5:00 pm 203BChair: David Lober, Kyzen CorporationThis task group is working toward the integration of the IPC-5704 cleanliness specification into the IPC-6010 printed board performance specifications.

5-32e Conductive Anodic Filament (CAF) Task GroupTuesday, October 15 1:30 pm–3:00 pm 201AChair: Karl Sauter, Oracle America, Inc.Vice Chair: Graham Naisbitt, Gen3 Systems LimitedThis group added the A revision of Test Method 2.6.25 into IPC-TM–650, and is working on the B revision of IPC-9691.

5-33a Conformal Coating Task GroupTuesday, October 15 3:15 pm–5:00 pm 121BChair: John Waryold, HumiSeal Division of Chase CorporationVice Chair: Debora Obitz, MIT, Trace Laboratories – BaltimoreThis task group is initiating Revision C of the IPC-CC-830 conformal coating specification in order to address new conformal coating materials. The group will also discuss an adhesion testing method and the development of a QPL.

5-33c Conformal Coating Handbook Task GroupTuesday, October 15 1:30 pm–3:00 pm 121BChairs: Amy Hagnauer, Raytheon Company;

Jason Keeping, CelesticaVice Chair: Fonda Wu, Raytheon CompanyThis task group will be celebrating the publication of the IPC-HDBK-830A conformal coating handbook.



Data Generation & Transfer/Documentation2-18 Supplier Declaration SubcommitteeSunday, October 13 1:00 pm–4:30 pm 201CChair: Forrest Christian, Innovation Machine Ltd.The group will review the XML schema for all supplier declaration standards and discuss further enhancements.

2-18b Materials Declaration Task GroupMonday, October 14 8:00 am–5:00 pm 110AChairs: Mark Frimann, Texas Instruments Inc.;

Aidan Turnbull, Ph.D., ENVIRON UK Ltd.This task group will discuss an amendment to IPC-1752A, Materials Declaration Management, which allows for the exchange of information related to materials in products. The standard is part of the IPC-175x series of data exchange standards.

2-18f Declaration of Shipping, Pack and Packing Materials Task Group

Tuesday, October 15 10:00 am–12:00 pm 110AChairs: John Ciba Jr.; Lee Wilmot, TTM Technologies, Inc.This task group will discuss possible enhancements to the IPC-1758 standard on declaration requirements for shipping, pack and packing materials.

2-18h Conflict Minerals Data Exchange Task GroupWednesday, October 16 8:00 am–5:00 pm 204BChair: John Plyler, BlackBerryThis task group is developing a standard for the exchange of supply chain data necessary for compliance with the Dodd-Frank conflict minerals regulation and OECD Due Diligence Guidelines for conflict minerals. The data standard is being developed as a part of the IPC-175x declaration family.

2-18j Laboratory Report Declaration Task GroupTuesday, October 15 1:30 pm–5:00 pm 110AChair: William Haas, Seagate Technology LLCThis task group will continue development of a data exchange standard for laboratory chemical analysis reports between supply chain members. Companies are being asked to provide laboratory analytic data to show compliance with the RoHS Directive and other customer requirements, such as halogen-free.

Electronic Documentation Technology2-40 Electronic Documentation Technology CommitteeTuesday, October 15 8:00 am–12:00 pm 110BChair: Karen McConnell, CID, Northrop Grumman CorporationThis committee covers documentation (IPC-2610 series), which includes hard copy, electronic copy and machine-usable data. The group will review the entire IPC-261X series to provide needed changes. In addition, the committee will consider a potential new review of IPC-2614 as well as the development of IPC-2616 and IPC-2617.

2-41 Product Data Description SubcommitteeMonday, October 14 8:00 am–12:00 pm 110BChair: Douglas Sober, Shengyi Technology Co. Ltd.The purpose of the meeting is to analyze the data model for laminate construction and convert a portion of it into the XML schema identified in IPC-2581. IPC-2614-1 has been reserved for laminate description in digital form; thus, the document will essentially become a users’ guide on how to describe all the characteristics needed in the board stackup, considering laminate material, performance and regulatory requirements.

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Electronic Product Data Description2-16 Product Data Description (Laminar View)

SubcommitteeMonday, October 14 1:30 pm–5:00 pm 110BChair: Karen McConnell, CID, Northrop Grumman CorporationThis committee will review the success of the release of IPC-2581B, Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology. New recommendations will be made for trials of the new stackup configurations and enhancement of assembly process descriptions. The committee hopes to develop a shopping list for potential C revision activity.

Embedded DevicesD-55 Embedded Devices Process Implementation

SubcommitteeTuesday, October 15 1:30 pm–5:00 pm 110BChairs: Rajesh Kumar, Viasystems North America, Inc.;

Vern Solberg, Solberg Technical ConsultingThis subcommittee will discuss IPC-7092 which describes the design and assembly challenges for implementing passive and active components in either formed or inserted methodology on a printed board. Focusing on fabrication and assembly processes, the new standard will be prepared for industry review.

Environment, Health & Safety (EHS)4-34b Marking, Symbols and Labels for Identification of

Assemblies, Components & Devices Task GroupMonday, October 14 1:30 pm–2:30 pm 121AChairs: Stephen Tisdale, Intel Corporation;

Lee Wilmot, TTM Technologies, Inc.This committee will begin to work on a revision to J-STD-609A, as well as review progress on IEC activities with this standard. The standard applies to components and assemblies that contain lead-free and lead-containing solders and finishes.

Fabrication Processes4-14 Plating Processes SubcommitteeWednesday, October 16 10:15 am–12:00 pm 203BChairs: George Milad, Uyemura International Corp.;

Gerard O’Brien, Solderability Testing & Solutions, Inc.This subcommittee develops guidelines, test methods and techniques for evaluating process control parameters on electrolytic and electroless/immersion plating. The subcommittee is working on Revision A of IPC-4552.

Flexible and Rigid-Flex Printed BoardsD-11 Flexible Circuits Design SubcommitteeWednesday, October 16 1:30 pm–3:00 pm 202AChair: William Ortloff Sr., Raytheon CompanyVice Chair: Mark Finstad, CID, Flexible Circuit Technologies, Inc.This subcommittee is working on Revision D of the IPC-2223 flexible printed board design standard.

D-12 Flexible Circuits Specifications SubcommitteeWednesday, October 16 10:15 am–12:00 pm 202AChair: Nick Koop, CID, TTM TechnologiesVice Chair: Mahendra Gandhi, Northrop Grumman Aerospace

SystemsThis subcommittee is initiating Revision D of IPC-6013, the flexible printed board performance specification.

D-12a UL 796F & 746F Task GroupWednesday, October 16 8:00 am–10:00 am 202AChair: Duane Mahnke, DBMahnke ConsultingVice Chair: Crystal Vanderpan, UL LLCThis task group has re-started its activities that provide UL with industry input on revising the UL 796F standard. This revision has just begun.

D-13 Flexible Circuits Base Materials SubcommitteeWednesday, October 16 3:15 pm–5:00 pm 202AChair: Clark Webster, ALL Flex LLCVice Chair: Michael Beauchesne, Amphenol Printed Circuits, Inc.The subcommittee finished its efforts by amending IPC-4204A with details that have arisen since its release in October 2011. It is now updating IPC-4202A.

High Speed/High FrequencyInterconnectionsD-20 High Speed/High Frequency CommitteeMonday, October 14 3:15 pm–5:00 pm 121AChair: Edward Sandor, Taconic Advanced Dielectric DivisionVice Chair: Roy Keen, Rockwell CollinsThis is a general committee meeting addressing goals of the various high speed/high frequency subcommittees and task groups.

D-22 High Speed/High Frequency Board Performance Subcommittee

Wednesday, October 16 8:00 am–10:00 am 203CChair: Lance Auer, Raytheon Missile SystemsVice Chair: Mahendra Gandhi, Northrop Grumman Aerospace

SystemsThis subcommittee is evaluating a draft of the future Revision C of IPC-6018, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards.

D-23 High Speed/High Frequency Base Materials Subcommittee

Wednesday, October 16 1:30 pm–3:00 pm 203BChair: Edward Sandor, Taconic Advanced Dielectric DivisionVice Chair: Dan Welch, Arlon Materials for ElectronicsThis subcommittee is discussing an amendment to IPC-4103A as well as goals for a future Revision B.

D-24a TDR Test Methods Task GroupTuesday, October 15 1:30 pm–3:00 pm 201CChair: Louis Hart, Ph.D., CIT, Compunetics Inc.Vice Chair: Eugene Mayevskiy, TE ConnectivityThis task group is discussing a revision to IPC-TM–650, Method 2.5.5.7 for impedance testing of lines on printed boards.

D-24c High Frequency Test Methods Task Group: Frequency-Domain Methods

Tuesday, October 15 3:15 pm–5:00 pm 201CChair: Glenn Oliver, DuPontVice Chair: John Coonrod, Rogers CorporationThis task group monitors the needs of the microelectronics industry for high frequency dielectric test methods.



Management8-41 Technology Roadmap SubcommitteeThursday, October 17 8:00 am–12:00 pm 201AChair: John Fisher, Interconnect Technology Analysis, Inc.This subcommittee will confirm or amend the strategy used for the 2013 IPC International Technology Roadmap. The Emulator vs. market model will be re-examined for the 2015 release, as will “lessons learned” in a first pass effort at a “distributed processing” model for Roadmap creation.

E-30 Conflict Minerals Due Diligence CommitteeThursday, October 17 8:00 am–5:00 pm 202AChair: John Ciba Jr.This committee will discuss IPC-1081, Conflict Minerals Due Diligence White Paper, which assists the electronics industry in complying with due diligence requirements for conflict minerals under Section 1502 of the Dodd-Frank Act.

TAEC Technical Activities Executive Committee (By Invitation)

Monday, October 14 5:00 pm–6:30 pm 201AChair: Douglas Pauls, Rockwell CollinsThis committee comprises leaders of all IPC general committees and oversees IPC’s standardization efforts.

Printed Board Design Technology1-10b Current Carrying Capacity Task GroupMonday, October 14 8:00 am–10:00 am 200Chair: Michael Jouppi, Lockheed MartinThis task group will review feedback from an industry survey to determine concepts for a revision to IPC-2152 for sizing internal and external conductors, and will discuss high current, microvias, parallel conductors and other potential topics of revision.

1-10c Test Coupon and Artwork Generation Task GroupMonday, October 14 1:30 pm–3:00 pm 201BChair: Timothy Estes, Conductor Analysis Technologies, Inc.Vice Chair: Philip Henault, Raytheon CompanyThis task group maintains test coupon designs referenced in IPC-2221 and IPC-6010 specifications. The task group is evaluating the need for new coupon designs, including CAF and modifications to the A/B-R design.

D-31b IPC-2221/2222 Task GroupTuesday, October 15 3:15 pm–5:00 pm 201BChair: Gary Ferrari, CID+, CIT, FTG CircuitsVice Chair: Clifford Maddox, Boeing CompanyThis task group is discussing goals for a future C revision of IPC-2221, Generic Standard on Printed Board Design.

Printed ElectronicsD-61 Printed Electronics Design SubcommitteeTuesday, October 15 8:00 am–9:30 am 121CChairs: Daniel Gamota, Jabil Circuit, Inc. (HQ);

Jie Zhang, PhD, Institute of Materials Research & Engineering (IMRE)

The subcommittee will focus on reviewing IPC/JPCA-2291, Design Guidelines for Printed Electronics, and begin collecting information for the next revision.

D-62 Printed Electronics Base Material/Substrates Subcommittee

Tuesday, October 15 9:30 am–11:00 am 121CChairs: Daniel Gamota, Jabil Circuit, Inc. (HQ);

Scott Gordon, DuPont Teijin FilmsThe subcommittee will continue to gather input for Revision A of IPC/JPCA-4921, Requirements for Printed Electronics Base Materials.

D-63 Printed Electronics Functional Materials Subcommittee

Tuesday, October 15 11:00 am–2:00 pm 121CChair: Josh Goldberg, Taiyo America Inc.Vice Chair: Daniel Gamota, Jabil Circuit, Inc. (HQ)The subcommittee will review lessons learned on the release of IPC-4591, Requirements for Printed Electronics Functional Materials, and begin collecting data for expansion and an eventual Revision A.

D-64 Printed Electronics Final Assembly SubcommitteeTuesday, October 15 2:00 pm–3:30 pm 121CChair: Daniel Gamota, Jabil Circuit, Inc. (HQ)The subcommittee will focus on developing a draft of IPC-6901, Performance Requirements for Printed Electronics Assemblies.

D-66 Printed Electronics Process SubcommitteeTuesday, October 15 3:30 pm–5:00 pm 121CChairs: Hirofumi Matsumoto, Nippon Mektron Ltd.;

Kurt Schroder, NovacentrixThis group is tasked with capturing and publishing documents that support efficient and correct processing of printed electronics using materials defined in other printed electronics subcommittees.

Process Control7-23 Assembly Process Effects Handbook SubcommitteeTuesday, October 15 10:00 am–12:00 pm 201AChairs: Greg Hurst, RSI, Inc.;

Sharon Ventress, U.S. Army Aviation & Missile CommandThis committee will concentrate on completion of a companion document to the modification and repair document, IPC-7711/7721. The new process effects or troubleshooting guide will have a similar focus for process effects related to the assembly (IPC-9111).

7-24 Printed Board Process Effects Handbook Subcommittee

Thursday, October 17 3:15 pm–5:00 pm 201AChairs: Larry Foster, Lockheed Martin Missiles & Fire Control;

Dennis Fritz, MacDermid, Inc.This meeting will focus on completion of a companion document to the modification and repair document, IPC-7711/7721. The new process effects or troubleshooting guide will have a similar focus for process effects related to the printed board (new document IPC-9121). Based on user input, the new format of the handbook will provide printed board anomaly illustrations with possible cause and solution explanations and will be more closely tied to IPC-A-600 acceptability criteria.



Product Assurance5-22a/ Joint Meeting — J-STD-001 & IPC-A-610

Task GroupsSaturday, October 12 8:00 am–5:00 pm Red Oak A* Sunday, October 13 8:00 am–3:00 pm 201AChairs: Teresa Rowe, AAI Corporation;

Daniel L. Foster, Missile Defense Agency; Constantino Gonzalez, ACME Training & Consulting; Jennifer Day, U.S. Army Aviation & Missile Command

The J-STD-001 and IPC-A-610 task groups will work together to resolve comments to both standards. *Saturday meeting takes place at the Norris Conference Center.

7-30 Product Assurance CommitteeMonday, October 14 8:00 am–9:00 am 121BChair: Mel Parrish, STI Electronics, Inc.Vice Chair: Mike Hill, Viasystems Group, Inc.This is a planning meeting for all task group and subcommittee leaders of the Product Assurance Committee.

7-31h/ Joint Meeting — IPC-D-620 Wire Harness Design and IPC-HDBK-620 Handbook Task Groups

Wednesday, October 16 8:00 am–12:00 pm 203AChairs: Robert Cooke, CIT, NASA Johnson Space Center;

Brett Miller, USA Harness, Inc.Vice Chairs: Gerald Leslie Bogert, Bechtel Plant Machinery, Inc.;

Christopher Olson, CIT, Minnesota Wire and Cable Co.These two task groups have combined to develop the wire harness design document and the wire harness handbook document.

7-31j IPC-A-630 Requirements for Structural Enclosure Task Group

Thursday, October 17 8:00 am–5:00 pm 201BChairs: Eddie Hofer, Rockwell Collins;

Richard Rumas, CIT, Honeywell CanadaThis task group will be celebrating the release of IPC-A-630, Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures. In addition, this group will return to the development of IPC-HDBK-630, Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures.

7-32c Electrical Continuity Testing Task GroupMonday, October 14 3:15 pm–5:00 pm 200Chair: Mike Hill, Viasystems Group, Inc.This task group will discuss goals for a B revision to IPC-9252, Requirements for Electrical Testing of Unpopulated Printed Boards.

Product Reliability6-10c Plated-Through Via Reliability-Accelerated Test

Methods Task GroupTuesday, October 15 1:30 pm–3:00 pm 201BChair: Randy Reed, Viasystems Group, Inc.This task group is revising IPC-TM–650, Method 2.6.26, for DC current induced thermal cycling, addressing IST and CITC test procedures.

Rigid Printed Boards7-31a/ Joint Meeting — IPC-A-600 and Rigid Printed Board

Performance Specifications Task GroupsSunday, October 13 9:00 am–4:30 pm 201BTuesday, October 15 10:00 am–12:00 pm 201BChair: Mark Buechner, BAE SystemsVice Chair: Randy Reed, Viasystems Group, Inc.These task groups are working toward final drafts of IPC-A-600J and IPC-6012D.

D-35 Printed Board Storage and Handling SubcommitteeMonday, October 14 10:15 am–12:00 pm 200Chair: Joseph Kane, BAE Systems Platform SolutionsVice Chair: C. Don Dupriest, Lockheed Martin Missiles & Fire ControlThis subcommittee will review content for a future A revision to IPC-1601, Printed Board Handling and Storage Guidelines.

D-36 Printed Board Process Capability, Quality and Relative Reliability Benchmark Test Subcommittee

Monday, October 14 10:15 am–12:00 pm 201BChair: Gary Long, Intel CorporationThis subcommittee has developed a database for benchmarking printed board fabrication capability, quality and relative reliability. It maintains a family of process capability panel designs and standards for use by both subscribers and suppliers. This subcommittee meeting is open to all interested parties.

Terms and Definitions2-30 Terms and Definitions CommitteeSunday, October 13 8:00 am–9:00 am 201BChair: Michael Green, Lockheed Martin Space Systems CompanyVice Chair: Vicka White, Honeywell Inc. Air Transport SystemsThis committee is working on Revision M of the IPC-T-50, terms and definitions standard.

Testing7-11 Test Methods SubcommitteeTuesday, October 15 10:00 am–12:00 pm 201CChair: Joseph Russeau, Precision Analytical Laboratory, Inc.Vice Chair: Graham Naisbitt, Gen3 Systems LimitedThis subcommittee will meet to review, validate and approve new and/or revised IPC-TM–650 Test Methods.

7-12 Microsection SubcommitteeWednesday, October 16 1:30 pm–5:00 pm 203CChair: Russell Shepherd, MIT, Microtek Laboratories AnaheimVice Chair: Randy Reed, Viasystems Group, Inc.This task group is revising IPC-TM–650 Methods 2.1.1 and 2.1.1.2 for microsection preparation and evaluation, addressing blind and buried via structures.

7-31b

7-31k

D-33a

13

Committee Leadership AwardsDavid Adams, Rockwell CollinsMike Bryant, BCF Industries, Inc.Douglas Eng, PPG Industries Inc.Mahendra Gandhi, Northrop Grumman Aerospace

SystemsAmy Hagnauer, Raytheon CompanyEddie E. Hofer, Rockwell CollinsJennie Hwang, Ph.D., Sc.D., H-Technologies GroupJason Keeping, CelesticaNick Koop, TTM TechnologiesGerard O’Brien, Solderability Testing & SolutionsMichah Pledger, Pledger ConsultingRichard Rumas, Honeywell CanadaKarl Sauter, Oracle America, Inc.Fonda Wu, Raytheon Company

Distinguished Committee Service AwardsGreg Alexander, Ascentech, LLCLance Auer, Raytheon Missile SystemsBruce Badger, GE Medical Systems LLCLameck Banda, Ph.D., Dow Chemical USAJoseph Barber, Raytheon Missile SystemsTab Bates, JPS Composite Materials Corp.Martin Bayes, Ph.D, Four Square ConsultingSilvio Bertling, Circuit Foil Trading, Inc.Gerald Leslie Bogert, Bechtel Plant Machinery, Inc.Steven Bowles, Viasystems Group, Inc.Scott Bowles, L-3 Fuzing and Ordnance SystemsWinn Cannon, Cytec Industries Inc.Curtis Carter, Saint-Gobain Vetrotex AmericaSrinivas Chada, Ph.D., Schlumberger Well ServicesCalette Chamness, U.S. Army Aviation & Missile

CommandDenise Chevalier, Amphenol Printed Circuits, Inc.Sidney Cox, DuPontStephen Craig, Shin-Etsu Silicones of America, Inc.Derek Daily, Senju ComtekMark Finstad, Flexible Circuit Technologies, Inc.Terry Fischer, Hitachi Chemical Co. America, Ltd.Gerald Gagnon, Extech Instruments CorporationJonathan Galaska, Dymax CorporationMahendra Gandhi, Northrop Grumman Aerospace

SystemsRigo Garcia, NASA Goddard Space Flight CenterTom Gardeski, Gemini Sciences, LLCReza Ghaffarian, Ph.D., Jet Propulsion Laboratory

Nate Grinvalds, Rockwell CollinsEmmanuelle Guene, Inventec Performance

ChemicalsLouis Hart, Ph.D., Compunetics Inc.Robert Hearn, Dow Chemical USADavid Hillman, Rockwell CollinsScott Hinaga, Cisco Systems Inc.Christopher Hunt, Ph.D., National Physical

LaboratoryJoseph Kane, BAE Systems Platform SolutionsSean Keating, Amphenol Limited (UK)Richard Kraszewski, Plexus Corp.Vijay Kumar, Lockheed Martin Missile & Fire ControlDouglas Leys, Nelco Products, Inc.Todd MacFadden, Bose CorporationLisa Maciolek, Raytheon CompanyCliff Maddox, Boeing CompanyBrian Madsen, Ph.D., Continental Automotive

SystemsChris Mahanna, Robisan Laboratory Inc.Randy McNutt, Northrop Grumman Corp.Renee Michalkiewicz, Trace Laboratories –

BaltimoreGeorge Milad, Uyemura International Corp.James Monarchio, TTM Technologies, Inc.Carlos Montemayor, Dow Corning CorporationMary Muller, Crane Aerospace & ElectronicsGraham Naisbitt, Gen3 Systems LimitedSteven Nolan, Lockheed Martin Mission Systems

& TrainingScott Northrup, AGYDebora Obitz, Trace Laboratories – BaltimoreGregg Owens, Space Exploration TechnologiesMichael Paddack, Boeing CompanyMel Parrish, STI Electronics, Inc.Douglas Pauls, Rockwell CollinsArthur Perkowski, Electronic Coating TechnologiesJeannette Plante, NASA Goddard Space Flight Ctr.Celine Puechagut, Inventec Performance ChemicalsHector Pulido, Nordson ASYMTEKJagadeesh Radhakrishnan, Intel CorporationHenry Rekers, Schneider ElectricJose Rios, Endicott Interconnect Technologies IncBarry Ritchie, Dow Corning CorporationJohn Rohlfing Brook Sandy-Smith, Indium Corporation of AmericaHenry Sanftleben, Delphi Electronics and SafetyJeffrey Sargeant, HumiSeal Division of Chase Corp.

Karl Sauter, Oracle America, Inc.Douglas Schueller, AbelConn, LLCAntonio Senese, Panasonic Electric WorksRobert Sheldon, Pioneer Circuits Inc.Douglas Sober, Shengyi Technology Co. Ltd.David Sommervold, The Bergquist Company,

PrescottJames Stockhausen, ELANTAS PDGMichael Suwe, ELANTAS Beck GmbHJawn Swan, Crystal Mark, Inc.Shinya Takahashi, NittoboBob Teegarden, Honeywell International – TorranceKaren Tellefsen, AlphaBill Vuono, Raytheon CompanyJohn Waryold, HumiSeal Division of Chase Corp.Dan Welch, Arlon Materials for ElectronicsVicka White, Honeywell Inc. Air Transport SystemsDewey Whittaker, Honeywell Inc. Air Transport Sys.Lee Wilmot, TTM Technologies, Inc.Linda Woody, Lockheed Martin Missile & Fire ControlTony Yim, Kalex Multi-Layer Circuit Board

(Zhongshan) Ltd.Lamar Young, Specialty Coating Systems Inc.Michael Young, Microtek Laboratories Anaheim

Special Recognition AwardsWendi Boger, Viasystems Group, Inc.Trevor Bowers, Adtran Inc.Beverley Christian, Ph.D., BlackBerryDavid Corbett, Defense Supply Center ColumbusC. Don Dupriest, Lockheed Martin Missiles & Fire

ControlMitchell Holtzer, AlphaBrian Madsen, Ph.D., Continental Automotive

SystemsRobert Neves, Microtek (Changzhou) LaboratoriesChristopher Ryder, AT&S Austria Technologie &

Systemtechnik AGAntonio Senese, Panasonic Electric WorksRussell Shepherd, Microtek Laboratories AnaheimDouglas Sober, Shengyi Technology Co. Ltd.Roger Tietze, Huntsman Advanced Technology Ctr.Crystal Vanderpan, UL LLCLinda Woody, Lockheed Martin Missile & Fire Control

Congratulations, IPC Awards Recipients!

IPC extends its sincere gratitude to the individuals and companies listed below for their significant contributions to IPC and the industry. These individuals will be honored at IPC awards luncheons on Monday, October 14 and Thursday, October 17 in Room 203B. Luncheon registration is required.

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IPC Fall Standards Development Committee Meetings

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Transcript of IPC Fall Standards Development Committee Meetings