CEA | OCTOBRE 2012 | PAGE 1

PICTICPLATEFORME D’IMPRESSION D E COMPOSANTSPOUR LES TECHNOLOGIES DE L’INFORMATION DELA COMMUNICATION ET LES CAPTEUR

(PRINTING FACILITIES FOR SMART SYSTEMS ON FOIL)

christophe.serbutoviez@cea.fr CEA Laboratory Manager LCOI

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PICTIC AND PRINTED ELECTRONICS

Fondamentalresearch

Labodemo

Scale upPrototypes

Pilote line

Technologytransfer

PICTIC

Recherche and développement Industrialization

Pictic Plateform makes the links between Laboratory and Pilote linePictic plateform is opened to industrial partners

PICTIC plateform is under CEA supervision

PICTIC AND PRINTED ELECTRONICS

CEA | OCTOBRE 2012 | PAGE 3320 mm x 380 mm

Laboratory size format PICTIC Format size

110mmx 110mm

Issues:• substrat handling• Curing• Printing reliability• interconnexion

TECHNICAL CHOICES

Sheet to sheet mode for accuracy and process flexibility • Adapted for process and product development• batch production• Compatible with large mix product

PICTIC is unique tool in Europe offering large area sheet to sheet printing

• PICTIC pilot facilities GEN1 (320mmx 380mm) associated with a Lab facilities for proof of concept (110mmx110mm)

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Produits

PICTIC EXPERTISE

SystemDevice t &

circuitsProcessFormulationMatériaux

PRINTING TOOL PERFORMANCEST

hrou

ghpu

t

Minimum feature size

Low

Med

ium

Hig

h

1 µm 10 µm 100 µm

Gravure/Flexo Slit coater

>>500 µm

inkjet

nanoimprint

Screen printing

Excimer laser

Spray ultrasonic

Adapted from OEA

DEVICE INTERCONNEXION

Foil to foil interconnexion Interconnexion of active matrix to sensor array

Silicon sur PEN

Packaging

| PAGE 6CEA | OCTOBRE 2012

Plastic moulding

InkViscosity

Surface tensionSettelment

Solvant evaporation rate

Equipements :Inkjet heads

PlatesRegistration

Handlingdrying

Substrat/curingWetting :

RoughnessMax curing temperature

SAM

Printing Challenge

Track reccordInkjet inks for ferroelectric polymersPd Inkjet inks for fuel cellScreen printable inks for n and p OSC

EQUIPMENT OVERVIEW

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SCREEN PRINTING

Screen printing line:

Semi automatic line withinfrared oven

Layer thickness : 50nm < e <200µm

Layer registration: +/- 50 µm

Material : OSC, dielectrics, conductive ink, resistdeposition,, chemicalpatterning…

ink is forced by a squeegee through a stencil or a mask

X,Y, θ alignment capability

GRAVURE PRINTER

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Gravure Printing : • Layer thickness : 100 nm< e < 20µm • Layer registration +/- 25 µm• Material : OSC, dielectrics, conductive

ink• Engraved cylinders complient with

aggressive organic solvents, such as toluene and chlorobenzene

Process principle of sheet to sheet

gravure press

substratecylinder

InkAnd doctor Blade

INKJET PRINTING

1 2 3 4 5

timeJetting frequency 10 000 Hz for graphic art inks Jetting frequency 1000 Hz of organic materials

1 2 3 4 5 Printing head

Piezzo printing head, Thermal headsPiezo drop-on-demand technology has several advantages over thermal:

More robust leading to longer life timesMore controlled droplet formation processGreater range of ink chemistries possibleTolerates wide range of ink physical properties

Preferred printhead technology for industrial applications despite higher cost

Dimatix patent Xaar patent

Ink Jet printer with curing station and drop watcher (stroboscopic viewer) • 128/256 nozzles, driver per nozzle• BMP and DXF files compatible• Layer registration +/- 25 µm• Material : low viscosity fluids 5-20 mPa.s

with or without nanoparticules .

INKJET PRINTER

DIGITAL AEROSOL JET PRINTING

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Aerosol jetting :• Layer thickness : 15 nm< e < 1µm • Pattern resolution : down to 10µm• Layer registration +/- 50 µm• Tolerate wide inks formulation up to 200 cps• 2D or 3D Printing

From optomec website

Slit-nozzle

Coating Head moving up

Coated layer

Substrate

Head moving above substrate (from 50 to 300

µm

Schematic view of printing head

substrate

coating

Slit coaterink

SlOT DIE COATING

Stripe coating

Step coating

Bloc coating

SLOT DIE COATING

Slot die coater• Layer thickness 30 nm < e <2 µm• Thickness uniformity = 10%• Pattern : blanket coating, block coating or

stripes• Material : OSC in organic or aqueous

solvant, dielectric material, inks withnanoparticles

• Substrate curing performed by automated system, including vacuum oven, hot plate and cool plate

MASK PROJECTION LASER

Mask projection excimer laser ablation:• High throughput layer patterning• Pattern resolution : down to 5µm (upon

material)• Registration :+/- 5 µm• Ablated Material : Metal, TCO, polymer …

CHARACTERIZATION TOOLS

Ellipsometer for process controllayer thickness and homogeneity,

visual inspection

Specific opto-electrical equipments:Automated tools, remotely controlled

Elite 300 prober : Foil level measurementsOptical benches: package level tests

FOCUS ON PRINTED ELECTRONICS AT CEA \DTNM

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PRINTED DEVICES

PrintedOrganicCMOS

OPD Organic

Photodetecteur

Printed PLEDfor signage

Developpement performed in collaboration with industrial partners

PrintedRLC

Filters

Printedpressure sensorHaptic devices

PRINTED FUNCTIONNAL CMOS BLOCKS

20

10 cm

DAC R2R

Compteur 4 bits

(~100 transistors)

11 cm

Comparateur

COSCOSCOSCOSMICMICMICMIC

FP7 Cosmic Project Process flow developped by CEA

CONVERTISSEUR ANALOG to DIGITAL 4 bits !

⇒Accepté à ISSCC Conférence⇒Highlight : inclus dans le Press Kit de la Conférence !

PRINTED SENSORS

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�Printed high sensitivity temperature sensorsInnovative material ,sensitivity simillar to PtArrays of sensors for temperature mapping

�Printed pressure sensors�Next challenges

Integration to paper, plastic products (moulding)

PRINTED PHOTODIODES

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� Technology under tranfered to ISORG (based on Bulk Heterojunction )

� Common lab for process industrialization

ISORG watch presentation on the Web !

SUMMARY

�CEA PICTIC Plateform is operationnal and is opened to industrial

�CEA-Liten has acces to a portfolio of Technologies (Pmos, Cmos, diodes,PLED, Passive Components … ) including

�Process (ink and equipment)�Design rule�Model

�First Demo products (LOPE’C 2012)

• PrintedTemperature sensor• Printed Pressure sensor• PrintedAnalogic /digital convertor• Printed Photodetector

First Products (within PICTIC Plaform) Printed Photodetector (by ISORG Compagny)advanced optical coating for OLED