I hereby declare that the work presented in this ...€¦ · To conclude, sol-gel spin-coating...
Transcript of I hereby declare that the work presented in this ...€¦ · To conclude, sol-gel spin-coating...
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Title
Optoelectronic and Mechanical Properties of Sol-Gel Derived Multi-Layer
ITO Thin Films Improved by Elemental Doping, Carbon Nanotubes and
Nanoparticles
Hatem Taha, BSc, MSc
Thesis submitted in a partial fulfillment of the requirements for the degree of Doctor of
Philosophy in the School of Engineering & Information Technology at
Murdoch University
2018
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II
DECLARATION
I hereby declare that the work presented in this dissertation is my own version of
research and contains as its main content work which has not been previously
submitted elsewhere for the award of a degree at any tertiary education institute.
Hatem Taha
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III
Copyright
Copyright by
@ Murdoch University, Australia
2018
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IV
Dedication
This noble study has been dedicated to my parents, brothers, wife and children the
most loving people in this planet for your love, understanding, encouragement,
patience and prayers.
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ABSTRACT
Transparent conductors (TCs) are an essential ingredient in numerous new applications which
are emerging in the 21st century including high efficiency solar cells, rigid and tactile displays,
light emitting diodes, photonics for communications and computing, energy efficient and smart
windows and gas sensors, since they allow efficient light transmission while electric signals are
applied or collected. So far, indium tin oxide (ITO) reflects the best trade-off between low
electrical resistivity and high optical transparency, making it the first candidate as transparent
conductor for most optoelectronics technologies despite its drawbacks such as expensiveness and
poor mechanical characteristics. However, due to the intricacy of ITO, the coating characteristics
strongly depend on the deposition conditions. Despite many developments in ITO-based
transparent conductive coatings; these coating are yet to be commercialized for optoelectronic
applications. Many challenges still exist in terms of the fabrication of high quality ITO-based
transparent conductive coatings, in order to meet the criteria of better, cost-effectiveness and
environmentally-friendly characteristics, especially in the context of transparent conductive
electrodes.
In this study, the deposition conditions along with incorporating thin ITO films with transition
metals (Ti and Ag), carbon nanotubes (e.g., SWCNTs) and metals nanoparticles (Ag and Au
nanoparticles) were optimized to synthesize high quality ITO based TCs via a facile,
environmentally friendly and cost-effective sol-gel spin-coating method. ITO thin films were
fabricated with different Ti and Ag doping concentration, different annealing temperature and
different geometry such as single layer, bi-layer and multi-layer. The structural, surface
morphology and composition, electrical, optical and mechanical properties were characterized
using a wide range of complementary techniques, namely, X-ray diffraction (XRD), field
emission scanning electron microscopy (FESEM), electron dispersive X-ray (EDX), atomic force
microscopy (AFM), X-ray photoelectron spectroscopy (XPS), four point probes and Hall Effect,
UV-Vis, nanoindentation and FEM modeling.
All the fabricated ITO-based TCs showed a nano-sized grain-like morphology forming a
homogenous surface structure. XRD results demonstrated a relatively good crystallinity of ITO-
based thin film coatings after applying a suitable heat treatment. XPS and EDX analysis
corroborated the existence of the main elements for each case of thin ITO coating. In the case of
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pure ITO and (Ti- and Ag-) doped ITO thin films with a thickness of 350 ±5 nm and 500 C
annealing temperature, the highest optical transparency was determined to be 92% for pure ITO,
4 at.% Ti-doped ITO and 2 at.% Ag-doped ITO thin films, while the lowest electrical resistivity
of 1.6×10-4
Ωcm was achieved for the ITO film prepared with 4 at.% Ti content. However, these
thin films exhibit mechanical characteristics namely hardness and Young’s modulus in the range
of (5.3 – 6.8) GPa and (128 – 148) GPa, respectively.
In order to enhance their mechanical characteristics while maintaining their optoelectronic
properties, SWCNTs were incorporated with ITO with different films thicknesses (i.e. 150, 210,
250 and 320) ± 5 nm, and the characterizations were carried out with respect to the film
thickness. The hardness and Young’s modulus for SWCNTs/ITO thin films were in the range of
(22 – 28) GPa and (254 – 306) GPa, respectively. The lowest electrical resistivity of 4.6×10-4
(Ω
cm) was achieved for the thicker film, while the highest transmittance of 91.5 % was obtained
from the thinner film. Obtained results show a significant improvement in the mechanical
properties of SWCNT/ITO thin films compared with their counterparts of pure and doped ITO
thin films, along with distinctively good optoelectronic properties.
To minimize the consumption of indium, ITO thin films were combined with (very thin metal-,
metal nanoparticles- and metal oxide-) layers in bi-layered and tri-layered geometries of (AuI),
((Au)nI), ((Ag)nI) and ((AgO)I), and (IAuI), (I(Au)nI), (I(Ag)nI) and (I(AgO)I), respectively, with
films thicknesses (~ 130 ± 5 nm). For these coating systems, the lowest electrical resistivity
1.2×10-4
Ωcm was for ITO/Au/ITO thin film, while the highest optical transparency ~ 91.5% was
for ITO/AgO/ITO thin film. Two thin films with the configurations of ITO\AgO\ITO and
AgO\ITO for tri-layer and bi-layer coatings, respectively with the best optoelectronic performance
were nominated as transparent conductive electrodes in designing inverted organic solar cells, and
compared with pure ITO thin films. Power conversion efficiencies of 4.9%, 4.2% and 3.8% were
found for ITO/AgO/ITO, AgO/ITO and ITO thin film coatings, respectively.
To conclude, sol-gel spin-coating derived ITO based transparent conductive coatings present
high quality crystal structure, distinctively good optoelectronic properties as well as reasonably
mechanical characteristics, and comparable with those achieved from other sophisticated
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VII
fabrication techniques such as sputtering, pulsed laser deposition, electron beam evaporation etc.
All these attributes render the ITO-based coatings promising as transparent conductors in many
industrial and technological applications.
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Table of Contents
Title .................................................................................................................................................. I
DECLARATION ............................................................................................................................ II
Copyright ...................................................................................................................................... III
Dedication ..................................................................................................................................... IV
ABSTRACT ................................................................................................................................... V
Table of Contents ....................................................................................................................... VIII
List of Figures ............................................................................................................................ XIV
List of Tables ............................................................................................................................ XVII
Glossary of Abbreviations and Technical Symbols ................................................................. XVIII
Acknowledgments..................................................................................................................... XXII
List of publications ................................................................................................................. XXIV
Conference papers ................................................................................................................... XXVI
1. CHAPTER 1 General Introduction and Review of the Early Works ...................................... 1
1.1. Transparent Conductive Materials ................................................................................... 1
1.2. Literature Review of Transparent Conductive Materials ................................................. 3
1.3. Recent Advances in Metal Oxide Based Transparent Conductive Coatings ................... 4
1.4. Strategies to Obtain High Carrier Concentration in TCO Materials ................................ 6
1.5. Strategies to Obtain High Carrier Mobility in TCO Materials ................................. 7
1.6. P-Type Transparent Conductors .................................................................................... 10
1.7. Introduction to ITO Thin Films ...................................................................................... 11
1.7.1. Indium Oxide and Indium Tin Oxide Structure ............................................................. 11
1.7.1.1. Indium Oxide and Indium Tin Oxide Band Structures ........................................... 14
1.7.1.2. Recent Advances in ITO Based TCOs .................................................................... 15
1.7.1.3. Survey of the progress of sol-gel derived ITO based TCO coatings ...................... 20
1.7.2. Recent Advances of Some Characterization Techniques for ITO Based TCOs Coatings
21
1.7.2.1. XRD Analysis of ITO Based TCOs ........................................................................ 21
1.7.2.2. Synchrotron X-ray Scattering Analysis of ITO Based TCOs ................................. 21
1.7.2.3. XPS Analysis of ITO-Based TCOs......................................................................... 22
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1.7.2.4. High Resolution Transmission Electron Microscopy (HRTEM) Analysis of ITO
Based TCOs............................................................................................................................... 22
1.7.2.5. Computational Modeling Analysis of ITO Based TCOs ........................................ 23
1.7.2.6. Mechanical Characteristics and Finite Element Modeling (FE) for ITO Based
TCOs 23
1.8. Alternatives to Metal Oxides Based TCMs.................................................................... 24
1.9. Industrial Applications of TCO ...................................................................................... 27
1.9.1. Transparent Conductive Electrodes in Solar Cells ......................................................... 27
1.9.2. Transparent Conductive Electrodes in Information Displays ........................................ 27
1.9.3. Transparent Conductive Electrodes in Architectural Glass ........................................... 28
1.10. Challenges and Significances of the Study .................................................................... 29
1.11. Research Questions Addressed in this Study ................................................................. 29
1.12. Methodology .................................................................................................................. 30
1.13. Outline of the Dissertation ............................................................................................. 32
2. CHAPTER 2 Background Theory of Transparent Conductive Materials, Sol-Gel Process
and Characterization Techniques .................................................................................................. 33
2.1. Transparent Conductive Materials ................................................................................. 33
2.1.1. Material Types................................................................................................................ 33
2.1.2. Semiconductors .............................................................................................................. 33
2.1.3. Fermi-Dirac Statistics and Fermi Level ......................................................................... 36
2.1.4. Semiconductors and Transparent Conducting Oxides ................................................... 38
2.1.5. Electrical Properties of ITO Films ................................................................................. 39
2.1.5.1. Carrier Concentration.............................................................................................. 39
2.1.5.1.1. Defect Models ......................................................................................................... 40
2.1.5.1.2. Limitation of Free Carrier Density ......................................................................... 42
2.1.5.2. Free Carrier Mobility of ITO Films ........................................................................ 43
2.1.5.2.1. Scattering Mechanism ............................................................................................. 43
2.1.5.2.2. Limitation of Carrier Mobility ................................................................................ 44
2.1.6. Optical Properties of ITO Films ..................................................................................... 45
2.1.6.1. Optical Constants .................................................................................................... 46
2.2. Sol-Gel Spin Coating Process, Fundamental, Theory and Advantages ......................... 49
2.2.1. General Overview .......................................................................................................... 49
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X
2.2.2. Sol-Gel Process .............................................................................................................. 49
2.2.3. Sol-Gel Chemistry .......................................................................................................... 51
2.2.4. Film Formation ............................................................................................................... 52
2.2.4.1. Dip-Coating Process ............................................................................................... 52
2.2.4.2. Spin Coating Process .............................................................................................. 53
2.2.4.3. Deposition of the Solution via Spin Coating .......................................................... 54
2.2.4.3.1. Spin Up ................................................................................................................... 54
2.2.4.3.2. Spin Off ................................................................................................................... 55
2.2.4.3.3. Drying of the Film .................................................................................................. 55
2.3. ITO Thin Films Synthesis .............................................................................................. 56
2.4. Instrumentations and Characterizations Techniques ...................................................... 58
2.4.1. XRD Measurements ....................................................................................................... 58
2.4.1.1. Analysis of XRD Data ............................................................................................ 59
2.4.1.2. Identifications of Phases ......................................................................................... 59
2.4.1.3. Determination of Crystallite Size from XRD Data ................................................. 60
2.4.1.4. Determination of Lattice Parameter ........................................................................ 60
2.4.1.5. X-ray Diffraction Measurements Technique .......................................................... 60
2.4.2. X-ray Photoelectron Spectroscopy (XPS) ...................................................................... 61
2.4.2.1. Applications of XPS Technique.............................................................................. 62
2.4.2.2. Experimental Procedure of X-ray Photoelectron Spectroscopy (XPS) analysis .... 63
2.4.3. Scanning Electron Microscopy (SEM), Energy Dispersive Spectroscopy (EDS) and
Field Emission Scanning Electron Microscopy (FESEM) ........................................................ 63
2.4.3.1. Experimental Technique of SEM............................................................................ 64
2.4.4. Atomic Force Microscopy (AFM) ................................................................................. 65
2.4.5. Raman Analysis.............................................................................................................. 66
2.4.5.1. Experimental Technique of Raman Analysis ......................................................... 67
2.4.6. Optical Properties of Thin Films .................................................................................... 67
2.4.6.1. Measurements of Optical Transmittance via UV-Vis Spectroscopy ...................... 68
2.4.6.2. Band Gap Calculations ........................................................................................... 68
2.4.7. Electrical Properties of Thin Film Coatings ................................................................... 69
2.4.7.1. Four-Point Probes Measurements ........................................................................... 70
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XI
2.4.7.2. Hall Effects Measurements ..................................................................................... 71
2.4.8. Mechanical Characterization: Nanoindentation Measurements and Finite Element
Modeling (FEM) of Thin Film Coatings ................................................................................... 72
2.4.8.1. Experimental Technique of Nanoindentation Measurement .................................. 74
2.4.8.2. Finite Element Modeling (FEM) ............................................................................ 75
3. CHAPTER 3 Improving the Optoelectronic Properties of Titanium Doped Indium Tin Oxide
Thin Films ..................................................................................................................................... 76
3.1. Abstract .......................................................................................................................... 77
3.2. Introduction .................................................................................................................... 78
3.3. Experimental Techniques ............................................................................................... 79
3.3.1. Thin Films Deposition .................................................................................................... 79
3.3.2. Sol-Gel and Thin Films Preparation............................................................................... 79
3.3.3. Analysis Techniques ...................................................................................................... 80
3.4. Results and Discussions ................................................................................................. 80
3.4.1. Structural Properties ....................................................................................................... 80
3.4.2. Surface Morphology Properties ..................................................................................... 86
3.4.3. Electrical Properties ....................................................................................................... 88
3.4.4. Optical Properties ........................................................................................................... 91
3.5. Conclusions .................................................................................................................... 95
4. CHAPTER 4: Probing the Effects of Thermal Treatment on the Electronic Structure and
Mechanical Properties of Ti-Doped ITO Thin Films ................................................................... 96
4.1. Abstract .......................................................................................................................... 97
4.2. Introduction .................................................................................................................... 98
4.3. Experimental Details ...................................................................................................... 99
4.3.1. Thin Films Deposition .................................................................................................... 99
4.3.2. Characterization Techniques ........................................................................................ 100
4.4. Results and Discussions ............................................................................................... 101
4.4.1. Raman Analysis............................................................................................................ 101
4.4.2. Atomic Compositions and Surface Chemical Bonding States ..................................... 103
4.4.3. Mechanical Properties (Hardness, Young’s modulus and Wear resistance) ................ 115
4.5. Conclusions .................................................................................................................. 120
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XII
5. CHAPTER 5: Improved Mechanical Properties of Sol-Gel Derived ITO Thin Films via Ag
Doping......................................................................................................................................... 121
5.1. Abstract ........................................................................................................................ 122
5.2. Introduction .................................................................................................................. 123
5.3. Experimental Methods ................................................................................................. 124
5.3.1. Raw Materials .............................................................................................................. 124
5.3.2. Sol-Gel and Thin Films Preparation............................................................................. 124
5.3.3. Analysis Techniques .................................................................................................... 125
5.4. Results and Discussions ............................................................................................... 126
5.4.1. Crystallographic Structure Properties .......................................................................... 126
5.4.2. Morphological and EDX Analysis ............................................................................... 130
5.4.3. Electrical Properties ..................................................................................................... 132
5.4.4. Optical Properties ......................................................................................................... 136
5.4.5. Determination of Optical Constants ............................................................................. 141
5.4.6. Mechanical Characteristics .......................................................................................... 144
5.5. Conclusions .................................................................................................................. 154
6. CHAPTER 6: Novel Approach for Fabricating Transparent and Conducting SWCNTs/ITO
Thin Films for Optoelectronic Applications ............................................................................... 156
6.1. Abstract ........................................................................................................................ 157
6.2. Introduction .................................................................................................................. 158
6.3. Experimental Section ................................................................................................... 159
6.3.1. Raw Materials .............................................................................................................. 159
6.3.2. SWCNTs/ITO Sol Preparation and Samples Deposition ............................................. 160
6.3.3. Analysis Techniques .................................................................................................... 161
6.4. Results and Discussions ............................................................................................... 162
6.4.1. Structural Properties ..................................................................................................... 162
6.4.2. Elemental Compositions and Surface Chemical Bonding States ................................. 164
6.4.3. Raman Studies .............................................................................................................. 167
6.4.4. Surface Morphology and Topography ......................................................................... 168
6.4.5. Electrical Properties ..................................................................................................... 172
6.4.6. Optical Properties ......................................................................................................... 176
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XIII
6.4.7. Mechanical Characteristics .......................................................................................... 179
6.5. Conclusions .................................................................................................................. 182
7. CHAPTER 7: ITO-Based Bi-Layer and Tri-Layer Thin Film Coatings ............................. 183
7.1. Abstract ........................................................................................................................ 183
7.2. Introduction .................................................................................................................. 184
7.3. Experimental Details .................................................................................................... 186
7.3.1. Sol Preparation ............................................................................................................. 186
7.3.2. Substrate Cleaning........................................................................................................ 187
7.3.3. Thin Films Depositions ................................................................................................ 187
7.3.4. Fabrication of Organic Solar Cells (OSCs) .................................................................. 187
7.3.5. Characterization Techniques ........................................................................................ 188
7.4. Results and Discussions ............................................................................................... 189
7.4.1. Characterizations of Au-NPs and Ag-NPs Colloidal Solutions ................................... 189
7.4.2. XRD Analysis of The Thin Films ................................................................................ 191
7.4.3. Surface Morphology ..................................................................................................... 194
7.4.4. Atomic Compositions and Surface Chemical Bonding States ..................................... 196
7.4.5. Electrical Properties ..................................................................................................... 198
7.4.6. Optical Properties ......................................................................................................... 200
7.4.7. Characteristics of OSCs ............................................................................................... 209
7.5. Conclusions .................................................................................................................. 210
8. CHAPTER 8: Conclusions and Recommendations............................................................. 212
8.1. Conclusions .................................................................................................................. 212
8.2. Recommendations ........................................................................................................ 216
References .................................................................................................................................. 217
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XIV
List of Figures
Figure 1.1 Bixbiyte crystal structure of In2O3 ..................................................................................... 12
Figure 1.2 In2O3 structure with two non-equivalent cataionic b and d sites ....................................... 13
Figure 1.3 Schematic diagram of the energy band model for ITO adopted (a) low doping level and
(b) high doping level ............................................................................................................................ 15
Figure 2.1 Band gap structures of conductor, semiconductor and insulator materials ........................ 34
Figure 2.2 Fermi-Dirac distribution function plot .............................................................................. 37
Figure 2.3 Location of Fermi level for intrinsic semiconductor and n-type and p-type extrinsic
semiconductors ................................................................................................................................... 38
Figure 2.4 Dependence of the free carrier density Ne on the Sn concentration c. Dots represent
experimental points; drawn curves represent (a) NInc, (b) NInc(1-c)8 ................................................. 42
Figure 2.5 Typical spectral dependence of transparent conductive oxides .......................................... 46
Figure 2.6 Complex refractive index (left) and dielectric constant (right) of ITO thin films ............. 48
Figure 2.7 The main steps of spin coating .......................................................................................... 53
Figure 2.8 Flow diagram of sol-gel spin-coating process .................................................................... 57
Figure 2.9 Incident and scattered X-rays in XRD analysis ................................................................. 59
Figure 2.10 Schematic diagram of SEM technique with the CRT screen .......................................... 64
Figure 2.11 Typical Tauc plot for estimating the band gap energy of a thin film ............................... 69
Figure 2.12 A geometry defining the sheet resistance calculation ...................................................... 69
Figure 2.13 Configuration of four point probes measurements .......................................................... 71
Figure 2.14 A schematic diagram of Hall Effect measurements ........................................................ 72
Figure 2.15 Typical loading and unloading curves of the nanoindentation ........................................ 74
Figure 3.1 The XRD patterns of as deposited and post annealed ITO thin films ................................ 82
Figure 3.2 The XRD patterns of Ti-doped ITO films prepared at 2at% and 4 at% Ti concentrations
and post annealed at different temperatures ......................................................................................... 83
Figure 3.3 The annealing temperature dependent grain size ............................................................... 85
Figure 3.4 Peaks shift of (222) for the ITO and Ti-doped ITO thin films annealed at 500 °C ............ 85
Figure 3.5 FESEM images of prepared and post annealed ITO thin films .......................................... 87
Figure 3.6 FESEM images of Ti-doped ITO thin films, (a1-a4) for 2 at% and (b1-b4) for 4 at% Ti
concentrations and post annealed at different temperatures ................................................................ 87
Figure 3.7 Electrical resistivity of pure ITO and Ti-doped ITO thin films for 2 at% and 4 at% Ti
concentrations and post annealed at different temperatures ................................................................ 89
Figure 3.8 Variations of carrier concentration and Hall mobility of ITO and Ti-doped ITO thin films
for 2 at% and 4 at% Ti concentrations with annealing temperature .................................................... 90
Figure 3.9 Optical transmittance of pure ITO and Ti-doped ITO thin films annealed at different
temperatures ......................................................................................................................................... 92
Figure 3.10 Estimated optical band gaps of pure ITO and Ti-doped ITO thin films for 2 at% and 4
at% Ti concentrations post annealed at different ................................................................................. 94
Figure 4.1 Raman shift of Ti-doped ITO films (a): 2 at % and (b): 4 at % of Ti, annealed at different
temperatures ....................................................................................................................................... 103
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XV
Figure 4.2 XPS survey scans of Ti-doped ITO films (a): 2 at % and (b): 4 at % of Ti, annealed at
different temperatures ........................................................................................................................ 104
Figure 4.3 In 3d XPS spectra of Ti doped ITO films (a): 2 at % and (b): 4 at % Ti, annealed at
different temperatures ........................................................................................................................ 106
Figure 4.4 Sn 3d XPS spectra of Ti doped ITO films (a): 2 at % and (b): 4 at % Ti, annealed at
different temperatures ........................................................................................................................ 108
Figure 4.5 Ti 2p XPS spectra of Ti doped ITO films (a): 2 at % and (b): 4 at % Ti, annealed at
different temperatures ........................................................................................................................ 109
Figure 4.6 O 1s XPS spectra of Ti doped ITO films (a): 2 at % and (b): 4 at % Ti, annealed at
different temperatures ........................................................................................................................ 111
Figure 4.7 Cl 2p XPS spectra of Ti-doped ITO films (a): 2 at % and (b): 4 at % Ti, annealed at
different temperatures ........................................................................................................................ 112
Figure 4.8 Load-displacement curves of Ti-doped ITO films (a): 2 at % and (b): 4 at % Ti, annealed
at different temperatures .................................................................................................................... 116
Figure 4.9 Hardness and Young’s modulus of Ti doped ITO films (a): 2 at % and (b): 4 at % Ti,
annealed at different temperatures ..................................................................................................... 119
Figure 5.1 The XRD patterns of as deposited and annealed ITO thin films ...................................... 127
Figure 5.2 The XRD patterns of as deposited and annealed Ag-doped ITO films prepared at different
Ag concentrations .............................................................................................................................. 128
Figure 5.3 Variations the crystallite size of as deposited and annealed ITO and Ag-doped ITO thin
films with Ag concentration ............................................................................................................... 130
Figure 5.4 FESEM images of annealed ITO and Ag-doped ITO thin films at different Ag
concentrations .................................................................................................................................... 131
Figure 5.5 EDX analyses of annealed (a): ITO and (b): Ag-doped ITO thin films ........................... 131
Figure 5.6 Electrical resistivity and conductivity of ITO and Ag-doped ITO thin films with different
Ag concentration, (a): as deposited and (b): annealed ....................................................................... 134
Figure 5.7 Mobility and carrier concentration of ITO and Ag-doped ITO thin films with different Ag
concentration, (a): as deposited and (b): annealed ............................................................................. 135
Figure 5.8 Transmittance spectra of ITO and Ag-doped ITO thin films with different Ag
concentration, (a): as deposited and (b): annealed ............................................................................. 137
Figure 5.9 Optical band gap of ITO and Ag-doped ITO thin films with different Ag concentration,
(a): as deposited and (b): annealed ..................................................................................................... 139
Figure 5.10 Variation the absorption coefficient of ITO and Ag-doped ITO thin films with different
Ag concentration, (a): as deposited and (b): annealed ....................................................................... 141
Figure 5.11 Variation the refractive index of ITO and Ag-doped ITO thin films with different Ag
concentration, (a): as deposited and (b): annealed ............................................................................. 143
Figure 5.12 Variation the extinction coefficient of ITO and Ag-doped ITO thin films with different
Ag concentration, (a): as deposited and (b): annealed ....................................................................... 144
Figure 5.13 Typical load-displacement curves of ITO and Ag-doped ITO thin films with different Ag
concentration, (a): as deposited and (b): annealed ............................................................................. 146
Figure 5.14 Variation the hardness and Young’s modulus of ITO and Ag-doped ITO thin films with
different Ag concentration, (a): as deposited and (b): annealed ........................................................ 148
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XVI
Figure 5.15 Variation of hardness with grain size (D-1/2) of ITO and Ag-doped ITO thin films with
different Ag concentration, (a): as deposited and (b): annealed ........................................................ 150
Figure 5.16 (a): FEM modelling result of von Mises stress distribution of as-deposited ITO film and
(b): a comparison of displacement in two different films under study, top: ITO with 6% Ag film and
bottom: pure ITO film ........................................................................................................................ 153
Figure 6.1 XRD pattern of SWCNT/ITO thin films prepared at various thicknesses and annealed at
350 °C ................................................................................................................................................ 163
Figure 6.2 Effect of film thickness on the grain crystallite size of SWCNTs/ITO thin films ........... 164
Figure 6.3 XPS wide scans of SWCNTs/ITO thin films prepared at various thicknesses and annealed
at 350 °C ............................................................................................................................................ 165
Figure 6.4 High resolution scans of (a)- In3d, (b)- Sn3d, (c)- O1s and (d)-C1s of SWCNTs/ITO thin
films ................................................................................................................................................... 167
Figure 6.5 Raman spectra of SWCNTs/ITO thin film ....................................................................... 168
Figure 6.6 FESEM images of SWCNTs/ITO thin films prepared at various thicknesses and annealed
at 350 °C ............................................................................................................................................ 169
Figure 6.7 Elemental distributions of SWCNTs/ITO thin films (annealed at 350 °C) by EDX ........ 170
Figure 6.8 AFM images of SWCNTs/ITO thin films annealed at 350 °C ......................................... 171
Figure 6.9 Variations of (a) electrical resistivity and conductivity, (b) mobility and carrier
concentration of SWCNTs/ITO thin films with film thickness ......................................................... 175
Figure 6.10 Schematic diagram of free carrier injection from ITO network to SWCNTs and carrier
transfer in SWCNTs/ITO thin film .................................................................................................... 176
Figure 6.11 Optical transmittance spectra of SWCNT/ITO thin films annealed at 350 °C ............... 177
Figure 6.12 Absorption coefficients of SWCNT/ITO thin films annealed at 350 °C ........................ 177
Figure 6.13 Tauc plot of SWCNT/ITO thin films annealed at 350 °C .............................................. 179
Figure 6.14 Hardness and Young’s modulus of SWCNTs/ITO thin films annealed at 350 °C ......... 181
Figure 7.1 Absorption spectra of Ag-NPs and Au-NPs colloidal solutions ....................................... 191
Figure 7.2 XRD patterns of (a) bi-layer and (b) tri-layer thin films annealed at 500 °C ................... 193
Figure 7.3 Top-view images of bi-layer (a1 – a4) and tri-layer (b1 – b4) thin films. Cross-sectional
images for (c1) - IAuI and (c2) - I(Au)nI thin films ........................................................................... 195
Figure 7.4 Schematic diagram shows the differences in the formation of the mid-layer thin film
coatings .............................................................................................................................................. 196
Figure 7.5 High resolution scans of (a)- In 3d, (b)- Sn 3d and (c)- O 1s of IAuI thin film ............... 198
Figure 7.6 Transmittance spectra of (a)- bi-layer and (b)- tri-layer thin films .................................. 202
Figure 7.7 Absorption coefficient of (a)- bi-layer and (b)- tri-layer thin films .................................. 203
Figure 7.8 Variations of the band gap energy of (a)- bi-layer and (b)- tri-layer thin films ............... 205
Figure 7.9 Refractive index spectra of (a)- bi-layer and (b)- tri-layer thin films ............................... 207
Figure 7.10 Extinction coefficient spectra of (a)- bi-layer and (b)- tri-layer thin films ..................... 208
7.11 (a)- Device architecture and (b)- J-V characteristic curves of the fabricated and compared OSCs
in this investigation ............................................................................................................................ 210
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XVII
List of Tables
Table 1.1 Typical TCO materials and their related dopants and compounds ................................. 9
Table 2.1 Examples of semiconductor materials .......................................................................... 35
Table 2.2 Comparison of some important binary TCOs and their corresponding preparation
methods and optoelectronic properties ......................................................................................... 48
Table 3.1 Structural parameters for the ITO and Ti-doped ITO thin films at 2 at.% and 4 at.% Ti
concentration and post annealed at different temperatures ........................................................... 86
Table 3.2 The optical and electrical parameters of as prepared and post annealed ITO and Ti-
doped ITO thin films for 2 at.% and 4 at.% Ti concentrations ..................................................... 93
Table 4.1 Elemental compositions of Ti doped ITO thin films at 2 at.% and 4 at.% Ti
concentrations after being annealed at different temperatures ................................................... 105
Table 4.2 Fitting results of the XPS data of Ti doped ITO films for the core level binding
energies ....................................................................................................................................... 113
Table 4.3 Mechanical properties of Ti doped ITO films after being annealed at different
temperatures ................................................................................................................................ 119
Table 5.1 Structural parameters for as deposited and annealed ITO and Ag-doped ITO thin films
..................................................................................................................................................... 128
Table 5.2 Electrical and optical properties for as deposited and annealed ITO and Ag-doped ITO
thin films ..................................................................................................................................... 133
Table 5.3 Mechanical properties for as deposited and annealed ITO and Ag-doped ITO thin films
..................................................................................................................................................... 147
Table 6.1 Elemental compositions of SWCNTs/ITO thin films annealed at 350 °C ................. 165
Table 6.2 Electrical properties of SWCNTs/ITO, pure ITO and Ti-doped ITO thin films ........ 173
Table 6.3 Structural, and optical properties of SWCNTs/ITO, pure ITO and Ti-doped ITO thin
films ............................................................................................................................................ 178
Table 6.4 Mechanical properties of SWCNTs/ITO thin films annealed at 350 °C and Ti-doped
ITO thin film annealed at 400°C ................................................................................................. 181
Table 7.1 Structural parameters of the fabricated bi-layer and tri-layer thin films .................... 194
Table 7.2 Variation of the atomic percentage of the main elements for bi-layer and tri-layer thin
films ............................................................................................................................................ 196
Table 7.3 3 Electric properties of fabricated bi-layer and tri-layer thin films ............................ 200
Table 7.4 Optical, sheet resistance and FOM values of synthesized thin films.......................... 204
Table 7.5 Photovoltaic performance parameters of fabricated OSCs ......................................... 210
Table 8.1 A comparison of the best achieved results of ITO-based TCOs thin films fabricated in
this study ..................................................................................................................................... 215
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XVIII
Glossary of Abbreviations and Technical Symbols
LEDs Light Emitting Diodes
TCMs Transparent Conductive Materials
T Optical Transparency
ρ Electrical Resistivity
TCOs Transparent Conductive Oxides
HDTVs High Definition Televisions
CNTs Carbon Nanotubes
CVD Chemical Vapour Deposition
Ω Ohm
PVA Polyvinyl Alcohol
HOMO Highest Occupied Molecular Orbital
LUMO Lowest Unoccupied Molecular Orbital
PEDOT:PSS poly (3, 4- ethylenedioxythiophene): poly (styrenesulfonate)
DMSO Dimethyl Sulfoxide
Cu-NWs Copper Nanowires
Ag-NWs Silver Nanowires
eV Electron Volt
e Electron Charge
VB Valance Band
CB Conduction band
Eg Electronic Energy Band Gap
Ne Free Electron Concentration
N(E) Density of Allowed Energy States
d(E) Incremental Energy Range
Ec Bottom of the Conduction Band
Etop Top of the Conduction Band
KB Boltzmann Constant
F(E) Fermi-Dirac Distribution Function
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XIX
EF Fermi Energy
T Absolute Temperature
Å Angstrom
ESCA Electron Spectroscopy for Chemical Analysis
RT Room Temperature
σ Electrical Conductivity
μ Free Carrier Mobility
λ Wavelength
h Plank’s Constant
me Electron Mass
τ Average Collision Time
°C Degree Celsius
Ni Density of Impurity Scattering Centers
ɛ0 Permittivity of Free Space
ɛr Low Frequency Relative Permittivity of Low-Loss Dielectrics
ɡ(x) Screening Function
m* Electron Effective Mass
V Volt
s Second
λgap Band Gap Absorption
λp Plasma Edge or Plasma Wavelength
UV Ultraviolet
IR Infrared
ωp Frequency of Plasma Absorption
ωgap Frequency of Band Gap Absorption
˂ n ˃ Complex Refractive Index
n Refractive Index of Low-Loss Dielectrics
no Refractive Index of Air
n1 Refractive Index of the Substrate
c Speed of Light in Space
v Speed of Light in A Medium
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XX
k Extinction Coefficient
ɛ Complex Dielectric Constant
t Thin Film Thickness
ɛ1 Real Part of Dielectric Constant
ɛ2 Imaginary Part of Dielectric Constant
α Absorption Coefficient
C0 Initial Solvent Concentration
ω Spinning Speed
RF Radio Frequency
DC Direct Current
2D, 3D Two Dimensions, Three Dimensions
PLD Pulsed Laser Deposition
FDTD Finite-Difference Time-Domain
LCD Liquid Crystal Display
R2R Roll-to-Roll
OSCs Organic Solar Cells
XRD X-ray Diffraction
XPS X-ray Photoelectron Spectroscopy
HRTEM High Resolution Transmission Electron Microscopy
TD-DFT Time Dependent Density Function Theory
HF Hartree Fock
FEM Finite Element Modeling
PVP Polyvinylpyrrolidone
HTL Hole Transport Layer
ETL Electron Transport Layer
PCE Power Conversion Efficiency
Voc Open Circuit Voltage
FF Fill Factor
PET Polyethylene terephthalate
DI Deionized
rpm Revolution per Minute
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XXI
GO Graphene Oxide
D Crystal Size
Β, (FWHM) Full Width at Half Maximum
a Lattice Constant
VH Hall Voltage
B Magnetic flux Density
H Hardness
E Elastic (Young’s) Modulus
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XXII
Acknowledgments
Firstly, all thanks to almighty Allah (swt), the creator, the sustained, the most merciful and the
controller of the universe, who command has made everything possible for me.
The research work presented in this dissertation reflects the help and support of many people
whom I wish to give noteworthy salutations here.
I would like to thank my supervisors, Dr Zhong-Tao Jiang, Dr David J. Henry, Dr Chun-Yang
Yin and Dr Amun Amri for their inspiration, encouragement and support. Many thanks to each
of them, and I deeply appreciate the motivation and commitment they have instilled in me
throughout this journey towards achieving my PhD degree.
I would also like to acknowledge Dr Jean-Pierre Veder and Dr Elaine Miller (John de Laeter
Centre, Curtin University), Dr David Ralph (postgraduate research Director of School of
Engineering and information Technology), Dr Marc Hampton, Mr. Kenneth Seymour, Jacqueline
Briggs and Caitlin Sweeney (School of Engineering and Information Technology, Murdoch
University), for their assistance, valuable comments and discussions during my research work.
I give my sincere thanks to Dr Xiaoli Zhao (School of Engineering, Edith Cowan University) for
his assistance, appreciated discussions and comments during the preparation of the journal
articles.
Appreciation is extended to my colleagues: M. Mahbubur Rahman, Oday H. Ahmed, Khalil
Ibrahim, Hussein Jan, Zainab Jaf, Ehsan Mohammadpour, Hantarto Widjaja and Nick Mondinos
for their support and friendship.
I pay my deepest love, respects and thanks to my parents, brothers and other family members for
their patience, love and prayer. With their support, and encouragement, I have been able to
achieve my dream of completing my PhD study.
Special thanks and love to my wife who has love, support, inspire and encourage me during the
past four years of my study. Her belief in me has inspired me to force the hard time that I
experienced, to stay firm and to keep going through this very hard journey of research work.
Thank you for believing in me, for loving me, for supporting me; and for the memorable and
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XXIII
lovely past, present and future moments. My love has also payed to my sweet daughter Maryam
and to my sweet son Muhammad, the loveliest gifts from Allah (swt).
I am immensely grateful to all of my friends here in Australia, especially Mr Emad Al-Shwany
and Mr Nacer Fellah and his family for their assistance, support and incredible friendship. I am
sure I will miss you, but will never forget you.
Last but not least, I would like to thank the Iraqi Government represented by the Ministry of
Higher Education and Scientific Research / University of Baghdad/ College of Education for
Pure Science, Ibn Al-Haitham, for providing the PhD scholarship.
Hatem Taha
Murdoch University
March 2018
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XXIV
List of publications
1. Hatem Taha, Zhong-Tao Jiang, David J. Henry, Amun Amri, Chun-Yang Yin, M.
Mahbubur Rahman, Improving the Optoelectronic Properties of Titanium-Doped Indium Tin
Oxide Thin Films, Semiconductor Science and Technology, 32 (2017) 065011-065021.
2. Hatem Taha, David J. Henry, Chun-Yang Yin, Amun Amri, Xiaoli Zhao, Syaiful Bahri,
Le Minh Cam, Nguyen Ngoc Ha, M. Mahbubur Rahman, Zhong-Tao Jiang, Probing the Effects
of Thermal Treatment on the Electronic Structure and Mechanical Properties of Ti-doped ITO
Thin Films, Journal of Alloys and Compounds, 721 (2017) 333-346.
3. Hatem Taha, Zhong-Tao Jiang, David J. Henry, Amun Amri, Chun-Yang Yin, Afishah
Binti Alias, Xiaoli Zhao, Improved Mechanical Properties of Sol-Gel Derived ITO Thin Films
via Ag Doping, Materials Today Communications, 14 (2018) 210-224.
4. Hatem Taha, Zhong-Tao Jiang, Chun-Yang Yin, David J. Henry, Xiaoli Zhao,
Geoffrey Trotter, Amun Amri, Novel Approach for Fabricating Transparent and Conducting
SWCNTs/ITO Thin Films for Optoelectronic Applications, The Journal of Physical Chemistry C,
122 (2018) 3014-3027.
5. Tapos Kumar Bromho, Khalil Ibrahim, Humayun Kabir, M. Mahbubur Rahman, Kamrul
Hasan, Tahmina Ferdous, Hatem Taha, Mohammednoor Altarawneh, Zhong-Tao Jiang,
Understanding the Impacts of Al+3
-Substitutions on the Enhancement of Magnetic, Dielectric
and Electrical Behaviours of Ceramic Processed Nickel Zinc Mixed Ferrites: FTIR assisted
studies, Materials Research Bulletin, 97 (2018) 444-451.
6. Khalil Ibrahim, Hatem Taha, M. Mahbubur Rahman, Humayun Kabir, Zhong-Tao Jiang,
Solar Selective Performance of Metal Nitride/Oxynitride Based Magnetron Sputtered Thin Film
Coatings: A Comprehensive Review, Journal of optics, 20 (2018) 033001-033016.
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XXV
7. Khalil Ibrahim, M Mahbubur Rahman, E. Mohammadpour, Hatem Taha, Zhifeng Zhou,
Chun-Yang Yin, Aleksandar Nikoloski, Zhong-Tao Jiang, Structural, Morphological, and
Optical Characterizations of Mo, CrN and Mo:CrN Sputtered Coatings for Potential Solar
Selective Applications, Applied Surface Science, 440 (2018) 1001-1010.
8. Khalil Ibrahim, Xiaoli Zhao, Hatem Taha, M Mahbubur Rahman, Zhi-Feng Zhou,
Mohmmednoor Altarawneh, T.S.Y. Moh, Aleksandar Nikoloski, Zhong-Tao Jiang, Tailoring the
Structural, Morphological, Opto-Dielectric and Mechanical Behaviours of Mo-Doped CrN
Coatings: Experimental Studies and Finite Element Modelling, Submitted to Surface and
Coatings Technology, January (2018).
9. Khalil Ibrahim, Syed Mahedi Hasan, Hatem Taha, M Mahbubur Rahman, Muna
S. Kassim, Chun-Yang Yin, Zhong-Tao Jiang, A First-principle Study of Electronic Structural
and Optical Properties of CrN and Mo:CrN Clusters, Submitted to Journal of Alloys and
compounds, January (2018).
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XXVI
Conference papers
1. Hatem Taha, David J. Henry, Zhong-Tao Jiang, Compositional analysis and mechanical
properties of sol-gel derived Ti-doped ITO thin films, Murdoch University Annual Research
Symposium, November 2017, Murdoch University, WA, Australia.
2. Hatem Taha, Henry, D., Rahman, M.M. and Jiang, Z-T (2016) Optoelectronic properties
of spin coated titanium doped indium tin oxide thin films. Australian Institute of Physics (AIP)
Postgraduate Students Conference, October 2016, University of Western Australia, WA,
Australia.
3. Hatem Taha, Zhong-Tao Jiang, David Henry, Amun Amri, Chun-Yang Yin, M.
Mahbubur Rahman, Hantarto Widjaja, Ehsan Mohammadpour, Nicholas Mondinos "Structural
and optical properties of spin coating ITO thin films". Australian Institute of Physics (AIP)
Postgrad Student Conference, October 2015, University of Western Australia, WA, Australia.
4. Ehsan Mohammadpour, Zhong-Tao Jiang, Mohammednoor Altaraweh, Bogdan Z.
Dlugogorski, Mohammad Rahman, Hantarto Widjaja, Hatem Taha, "Study the structural
changes in CrAlN coatings by in-situ synchrotron radiation X-ray diffraction". Australian
Institute of Physics (AIP) Postgrad Student Conference, October 2015, University of Western
Australia, WA, Australia.
5. M. Mahbubur Rahman, Zhong-Tao Jiang, Zhi-feng Zhou, Hatem Taha, Hantarto
Widjaja, Ehsan Mohammadpour, Chun Yang Yin, Nick Mondinos, Mohammednoor Altarawneh,
Bogdan Z. Dlugogorski "Solar Selective Absorbing Characteristics and Thermal Stability of
TiAlSiN Coatings". Australian Institute of Physics (AIP) Postgrad Student Conference, October
2015, University of Western Australia, WA, Australia.
6. Hantarto Widjaja, Zhong-Tao Jiang, M. Mahbubur Rahman, Ehsan Mohammadpour,
Hatem Taha, Mohammednoor Altarawneh, Chun-Yang Yin, Nicholas Mondinos, and Bogdan
Z. Dlugogorski"Geometrical investigations on the electronic structure of elemental adsorption on
graphene". Australian Institute of Physics (AIP) Postgrad Student Conference, October 2015,
University of Western Australia, WA, Australia.
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XXVII
Statement of Contribution
Journal Publications
1. Hatem Taha, Zhong-Tao Jiang, David J. Henry, Amun Amri, Chun-Yang Yin, M.
Mahbubur Rahman, Improving the Optoelectronic Properties of Titanium-Doped Indium Tin
Oxide Thin Films, Semiconductor Science and Technology, 32 (2017) 065011-065021.
http://iopscience.iop.org/article/10.1088/1361-6641/aa6e3f/pdf
Author’s Name
Contribution
Overall
Percentage
(%)
Signature
Hatem Taha
Fabricating the Ti-doped ITO
thin films, analysis and
interbretation of the results,
writing the manuscript and
related submition documents.
70
Zhong-Tao Jiang
Project leader
Data analysis and disucssion
Manuscript preparation and
submission
Corresponding author
David J Henry
PhD Supervisor.
Advisor on sol-gel process and
chemistry. Result discussion
and manuscript preparation
30
Amun Amri
Result discussion and
manuscript preparation
Chun-Yang Yin
Result discussion and
manuscript preparation
CY Yin
M. Mahbubur
Rahman
Result discussion and
manuscript preparation
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XXVIII
Statement of Contribution
Journal Publications
2. Hatem Taha, David J. Henry, Chun-Yang Yin, Amun Amri, Xiaoli Zhao, Syaiful Bahri,
Le Minh Cam, Nguyen Ngoc Ha, M. Mahbubur Rahman, Zhong-Tao Jiang, Probing the Effects
of Thermal Treatment on the Electronic Structure and Mechanical Properties of Ti-doped ITO
Thin Films, Journal of Alloys and Compounds, 721 (2017) 333-346.
http://www.elsevier.com/locate/jalcom
Author’s Name
Contribution
Overall
Percentage
(%)
Signature
Hatem Taha
Fabricating the Ti-doped ITO
thin films, analysis and
interbretation of the results,
writing the manuscript and
related submition documents.
70
David J Henry
PhD Supervisor.
Advisor on sol-gel process and
chemistry. Result discussion
and manuscript preparation
Chun-Yang Yin
Result discussion and
manuscript preparation
30
CY Yin
Amun Amri
Result discussion and
manuscript preparation
Xiaoli Zhao
Machenical property analysis
and
Manuscript preparation
Syaiful Bahri
Manuscript preparation
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XXIX
Le Minh Cam
Manuscript preparation
Nguyen Ngoc Ha
Manuscript preparation
M. Mahbubur
Rahman
Result discussion and
manuscript preparation
Zhong-Tao Jiang
Project leader
Data analysis and disucssion
Manuscript preparation and
submission
Corresponding author
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XXX
Statement of Contribution
Journal Publications
3. Hatem Taha, Zhong-Tao Jiang, David J. Henry, Amun Amri, Chun-Yang Yin, Afishah
Binti Alias, Xiaoli Zhao, Improved Mechanical Properties of Sol-Gel Derived ITO Thin Films
via Ag Doping, Materials Today Communications, 14 (2018) 210-224.
www.elsevier.com/locate/mtcomm
Author’s Name
Contribution
Overall
Percentage
(%)
Signature
Hatem Taha
Fabricating the Ag-doped ITO
thin films, analysis and
interbretation of the results,
writing the manuscript and
related submition documents.
70
Zhong-Tao Jiang
Project leader
Data analysis and disucssion
Manuscript preparation and
submission
Corresponding author
David J Henry
PhD Supervisor.
Advisor on sol-gel process and
chemistry. Result discussion
and manuscript preparation
30
Amun Amri
Result discussion and
manuscript preparation
Chun-Yang Yin
Result discussion and
manuscript preparation
CY Yin
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XXXI
Afishah Binti
Alias
Manuscript prepartion
Xiaoli Zhao
Machenical property analysis
and
Manuscript preparation
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XXXII
Statement of Contribution
Journal Publications
4. Hatem Taha, Zhong-Tao Jiang, Chun-Yang Yin, David J. Henry, Xiaoli Zhao,
Geoffrey Trotter, Amun Amri, Novel Approach for Fabricating Transparent and Conducting
SWCNTs/ITO Thin Films for Optoelectronic Applications, The Journal of Physical Chemistry C,
122 (2018) 3014-3027.
https://pubs.acs.org/doi/abs/10.1021/acs.jpcc.7b10977
Author’s Name
Contribution
Overall
Percentage
(%)
Signature
Hatem Taha
Fabricating the SWCNTs/ITO
thin films, analysis and
interbretation of the results,
writing the manuscript and
related submition documents.
70
Zhong-Tao Jiang
Project leader
Data analysis and disucssion
Manuscript preparation and
submission
Corresponding author
Chun-Yang Yin
Manuscript preparation and
Discussion
30
CY Yin
David J Henry
PhD Supervisor.
Advisor on sol-gel process and
chemistry. Result discussion
and manuscript preparation
Xiaoli Zhao
Machenical property analysis
and
Manuscript preparation
Geoffrey Trotter
Manuscript preparation
Amun Amri
Result discussion and
manuscript preparation
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1
1. CHAPTER 1 General Introduction and Review of the Early
Works
1.1. Transparent Conductive Materials
In many daily optoelectronic devices, such as touch screens, solar cells, displays, smart widows,
sensors and light emitting diodes (LEDs), light needs to be efficiently transmitted while applying
or collecting electrical signals. This function is recognized by specific groups of materials named
as transparent conductive materials (TCMs) whose characteristics impact the performance of the
optoelectronic devices and accordingly their specifications differ based on their requirements.
For instance, the optical scattering (haze) can decrease the clearness in displays but increases the
efficiency in solar cells. On the other hand, the surface roughness and work function are very
crucial for LEDs, yet they are less important in touch screens. Mechanical flexibility is
indispensable for flexible applications but not important for devices fabricated on rigid
substrates. However, both optical transparency (T) and electrical resistivity (ρ) are essential
factors for all the aforementioned optoelectronic devices. Each TCM has a trade-off between
optical transparency and electrical resistivity, since the higher the TCM film thickness the lower
both T and ρ will be.
Materials like metals are usually electrically conductive but do not transmit light, whereas,
materials like glass are highly transparent but electrical insulating. The challenge of fabricating
TCMs is to decouple these two characteristics in such a way that one can tune the optical
transparency without impacting the electrical properties and vice versa. To attain this, most
efforts have been in developing dielectric transparent materials into conductive ones without
significantly affecting their optical transparency. E.g. transparent conductive oxides (TCOs) [1].
So far, the most important applications of TCMs are as electrodes for photovoltaic cells, displays
and LEDs [2]. The key technical drivers of commercial products are cost effectiveness, low
power consumption, large-sized devices, minimum reflection, simplified value chain, thinness
and robustness, flexibility and ease of patterning.
Over the past few decades, the majority of TCO materials were based on three main n-type
TCOs, In2O3, ZnO and SnO2 thin films. These mainly experimental studies were accomplished
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with the aims of improving the performance of these TCOs to meet ever-increasing industrial
demands with various specific requirements.
Within these aforementioned TCOs, In2O3 and/or tin-doped In2O3 (named as indium tin oxide or
ITO) are the most widely used. ITO has reached the industrial level, especially with the use of
the sputtering deposition process. However, thin ITO films can also be fabricated by other
physical and/or chemical methods. For optoelectronic applications and devices, countless
research has been carried out on improving either the electrical conductivity or the transparency
of thin ITO films. The optical transparency can be optimized by introducing a proper level of
oxygen gas into the sputtering chamber or heating up the substrates during or after the
fabrication process [3, 4]. Alternatively, the electrical conductivity can be improved by
increasing the film thickness, thermal treatment (pre-heating the substrates or post annealing
process) and introducing foreign atoms as dopants to the host structure. However, there is a
trade-off between the electrical conductivity and the transmittance of thin ITO film. For
example, the electrical resistivity of ITO might be increased when an excess amount of oxygen is
present or it severely annealed (i.e., ˃ 500 °C), despite the enhancement of its optical
transparency. In general, the physical properties of semiconductors are characteristic of both the
properties of the host structure and the presence of impurities and defects. Dopant impurities
which mainly substitute the host atoms provide electronic states in the band-gap close to the
conduction and valence band edges and hence control the conductivity and the type of the
material. These electronic states (so-called shallow level impurities) facilitate a wide range of
semiconductor characteristics. On the other hand, other impurities along with crystal structure
defects introduce deeper electronic states (named as deep level defects) in the band-gap that can
also tune the properties of the semiconductor but may make a semiconductor inappropriate for its
proposed applications. It is therefore important to control carefully the deposition process to fine-
tune the desired characteristics of ITO based TCO thin films.
It is believed that the performance of ITO thin films in an optoelectronic device is linked to its
structural, morphological, electrical and optical characteristics. High quality ITO films are
mainly deposited within high vacuum systems via physical processes including chemical vapor
deposition or sputtering techniques. Both methods are energy intensive due to their high vacuum
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system requirement, their high squandered energy through sample fabrication and their high cost
of maintenance [5].
Recent development in the synthesis of TCOs highlight the need for materials with good
optoelectronic properties along with a cost-effective and environmentally-freindly fabrication
process. In this context, the sol-gel process is potentially a very promising technique and can
meet these criteria [6, 7]. The sol-gel process is a well-known simple, low-cost and
environmentally friendly fabrication technique resulting in a thin film with uniform chemical
composition. Also, it is a wet chemistry process where the precursors are commonly in the form
of colloidal solutions that transform into extensive networks of discrete or continuously-
connected molecules. The sol-gel method facilitates fine-tuning of coating parameters including,
homogeneity, thickness, particle size distribution, absorber particle size and chemical
composition of the synthesized thin film. All these eventually make the sol-gel technique a good
prospect for scaling up to an industrial level [8-10]. Duta et. al. [11] carried out a comparitive
study of sol-gel versus sputtering ITO thin films, and they proposed that a simple and low-cost
sol-gel method can effectively replace the expensive sputtering technique in fabricating high
quality ITO thin films. The most important benefit of the sol-gel process over conventional
coating techniques is its capability to tailor the microstructure of the fabricated coatings at low
temperatures [12].
1.2. Literature Review of Transparent Conductive Materials
The past few decades have witnessed an extraordinary increase in both volume and variety of
optoelectronic applications in to the consumer-electronic markets. Along with this growth, there
has also been a switch to devices that provide eye-catching features including energy efficiency,
transparency, tactility, stretchability and flexibility [13]. Most optoelectronic devices with these
properties necessitate transparent electrodes that facilitate these functionalities. Sustainable
production of transparent electrodes with easily available raw materials is also an important
benchmark for successful commercialization. The well-known TCMs include metal oxide thin
films so-called transparent conductive oxides (TCOs), graphene, carbon nanotubes, metal nano (-
particles, –wires and rods) and conductive polymers. This section includes comprehensive
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literature reviews, fundamental theories and principles, and recently published studies on the
importance, characteristics and applications of metal oxides based transparent conductive
coatings for their optoelectronic and mechanical properties.
1.3. Recent Advances in Metal Oxide Based Transparent Conductive Coatings
Electrically conductive and optically transparent TCOs thin films are an extraordinary class of
material that achieves high value of electrical conductivity while maintaining a high optical
transparency in the visible region of the light spectrum. Since the first realization of such type of
material, vast amount of research and development have been gone into marketable these thin
films. The combination of optical transparency and electrical conductivity of TCOs is usually not
observed in stoichiometric materials, but can be successfully achieved by fabricating these
materials with a non-stoichiometric composition or by incorporating appropriate dopants to the
host lattice.
The most common commercial TCM products so far are based on TCOs materials. In 1907
Baedeker discovered that he could produce a transparent thin cadmium film while sustaining
electrical conductivity by thermally oxidizing cadmium to produce a cadmium oxide (CdO) thin
film. In 1937, a tin oxide thin film was fabricated by post-oxidation of an evaporated metal film.
With the development of the chemical deposition process (pyrolysis) in 1940s, tin oxide (SnO2)
from SnCl4 and indium oxide from InCl2 were synthesized and the indium oxide thin film had
electrical conductivity of 10 S/cm. The early uses of TCOs were as transparent electrodes and
anti-static coatings in electroluminescent panels and as transparent electrical heaters for airplane
windshield de-frosting in World War 2 [14]. With the development of vacuum deposition
systems in the late 1950s and 1960s, ITO thin films were successfully fabricated via vacuum
evaporation of In/Sn metals and via direct current (DC) and radio frequency (RF) sputtering of
metal In/Sn alloy targets. Thin film deposition of metal oxide compounds using vacuum
evaporation was found to be a more controllable process starting with fully oxidized
(stoichiometric) or partially oxidized (sub-oxide) materials, than starting with metal targets and
supplying the required amount of oxygen for reaction. Studies on preparing and sintering
powders of metal oxides as sputtering targets to fabricate TCO thin films started, in order to
attain an easy and scalable process. Vossen in 1970s [15] used oxidized targets and an RF
sputtering system to fabricate ITO and SnO2 films. Investigation of doped binary compounds
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such as indium oxide and tin oxide were continued in the 1980s along with huge developments in
vacuum deposition hardware and equipment.
Most TCOs are binary or ternary compounds, containing one or two metallic elements. Their
resistivity can be as low as 10-4
Ωcm, and their wide optical band gap (Eg) can be greater than 3
eV. Although, this combination of conductivity and transparency is usually impossible in
intrinsic stoichiometric oxides, it can be achieved by producing a non-stoichiometric material or
by doping.
The usefulness of transparent conductive oxide thin films depends on both their electrical and
optical properties. Therefore, both these parameters have to be considered together with other
parameters such as stability, electron work function, corrosion resistance, mechanical flexibility
and compatibility with substrate as appropriate for the applications [16, 17]. Other considerations
are the readily available raw materials and their recyclability along with economical and
sustainable fabrication method which are important criteria in choosing the appropriate TCO
materials for successful commercialization [18].
The demand for TCOs has risen recently due to their role as key components of electrodes in
touch screen technology, liquid crystal displays and photovoltaic solar cells [19-21]. Other
applications include waveguides in plasmonic devices, bio-analytical devices, antireflective
coatings and organic light emitting devices [22-25]. So far, the highest dollar-value market for
TCOs is as transparent electrodes in flat panel displays, valued at $US 97 billion in 2014 and
expected to reach $US 135 billion in 2020 [26].
During the last three to four decades, countless TCOs were developed from this interesting field.
While some of the TCOs had long been known as intrinsic n-type semiconductors, their potential
as transparent conductive materials came to be realized later by numerous research groups [27].
Efforts speedily moved on from intrinsically (un-doped) TCOs in which the conductivity is
related to oxygen vacancies, defects and lattice interstitial, to extrinsically (doped) TCOs such as
ITO and indium doped tin oxide [28, 29]. The most common TCOs have been so far tin oxide
(SnO2), indium oxide (In2O3), indium tin oxide (In2O3:Sn or ITO), zinc oxide (ZnO) and
aluminium doped zinc oxide (AZO), which have found application in electronic and
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optoelectronic devices[30-33]. Of these TCOs, ITO is the most important TCO used in the last
few decades.
1.4. Strategies to Obtain High Carrier Concentration in TCO Materials
Works have been carried out to improve the performance of ITO based transparent conductive
coatings via enhancing the electrical and optical characteristics. Most of the efforts were focused
on improving the electrical properties while maintaining the optical transparency [34]. This can
be achieved throughout different processes, systems and mechanisms including doping, thermal
treatment, or incorporating with other materials, etc. The most effective way was found to be by
using a suitable dopant atom which results in increasing the carrier concentration in the film
material [35]. Both carrier concentration and carrier mobility were reported to be crucial factors
for improving electrical conductivity [36-38].
The number of electrons in TCO materials can be increased by doping them with elements that
have higher valence electron count than that of the host. For instance, tin atoms with a valence of
four acts as a cationic dopant in the indium oxide lattice when replacing indium. Since indium
has a valence of three, the Sn can donate an electron to the conduction band results in n-doping
of the lattice. Furthermore, there are studies on the use of tellurium (Te) [39], erbium (Er) [40,
41], germanium (Ge) [42, 43], silicon (Si) [44], fluorine (F) [45-47], sulphur (S) [48] and zinc
(Zn) [49-51] as dopants for indium. Nevertheless, most studies have been carried out on tin-
doped indium oxide [52-54]. All the aforementioned studies aimed to maximize the carrier
concentration, thereby improving the electrical conductivity of the film coatings without altering
their carrier mobility. The relatively low impurity concentration in the host matrix (~ 1 - 5 at %)
is a trade-off between carrier concentration and increasing scattering centres at the dopant sites.
When the carrier concentration in a TCO is very low compared to a metal element, the mobility
of these carriers becomes a very important factor in determining the electrical conductivity of the
TCO [55]. Other macroscopic parameters to optimise the doping level have also been postulated.
For example, a high dopant level leads to distortion of the crystal structure, therefore neither the
generation of oxygen vacancies nor the generation of Sn4+
ions on substitutional sites will be
effective [56]. Also, excessive distortion in the form of an inter-granular amorphous phase is
observed [57, 58]. On the other hand, it has been reported that excessive tin oxide inversely
affected the characteristics of ITO coatings through the formation of a continuous SnO2
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precipitate at the grain boundaries [59]. Since doping is the most effective mechanism to
improve the optoelectronic characteristics of ITO, different types of elements were employed
recently for this purpose. While some of these elements have different ionic radiuses relative to
the host ions, others were nominated based on their physical or chemical nature, stability,
robustness, high work function, etc. These elements include silver (Ag) [60], copper (Cu) [61],
titanium (Ti) [62], molybdenum (Mo) [63] and chromium (Cr) [64], to name a few. Introduction
of an impurity atom with smaller ionic radius than that of the host ensures that the original
crystalline structure will not change, however, this dopant could enhance the crystalline quality
of the host [65].
The effect of thermal treatment onto the electrical properties has also been extensively studied.
Heat treatment can be performed either through the deposition process (pre-heating the substrate)
or after deposition process (post annealing). Currently, the majority of the fabrication techniques
include a relatively high substrate temperature (≥300 °C). It has been reported that the sputtered
ITO film exhibits a structure changing from amorphous to polycrystalline after annealing [66].
Also, thermal annealing can oxidize the non-stoichiometric compositions of both indium oxide
and tin oxide and results in a re-arrangement of the atoms in the form of stable polycrystalline
thin films [67]. Beside the traditional heat treatment process, post annealing in vacuum and in oil
bath was also reported. An ITO thin film annealed at 350 °C in silicon oil was reported to show a
better crystalline structure with grain size of 51 nm compared to the same thin film annealed at
same temperature under vacuum [68].
1.5. Strategies to Obtain High Carrier Mobility in TCO Materials
Conventionally, the carrier mobility has been increased by enhancing the crystalline quality by
means of appropriate thermal treatment, choice of suitable deposition technique and choice of
substrate. It has been widely reported that TCO thin films fabricated without pre heating the
substrate or post annealing process show low carrier mobility due to scattering by point defects
and/or grain boundaries [69, 70]. However, a post deposition calcination process even at ambient
conditions decreases point and dislocation defects in amorphous or poorly crystallised TCO thin
films, by enlarging their crystallite size and improving the overall crystallite quality [71].
Another very important factor that controls the properties of TCO thin films is selecting a
suitable deposition method and its corresponding conditions. For example, TCO thin films
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prepared with highly energetic particles may have large crystallite size, however, an extreme
transfer of momentum could deteriorate the film structure and therefore the carrier mobility [72].
For instance, the discharge voltage at the surface of the target (during sputtering deposition
process) repels both neutral argon atoms and negative oxygen ions that reach the substrate with
kinetic energy (~100eV) and distorts the crystal lattice of the TCO thin film [73]. Therefore, RF
sputtering with low discharge voltage is preferred for obtaining TCO films with high values of
carrier mobility [74]. A typical system of pulsed laser deposition with kinetic energy of particles
varied from (1eV – 100eV) was reported to be easier to control than sputtering, and resulted in
better TCO thin film structures and higher carrier mobility [75]. Control of crystal structure of
the TCO thin film by using a highly oriented substrate can also increase the carrier mobility by
improving the film crystallinity. ITO thin films are often grown on yttria-stabilised zirconia
(YSZ) substrate because the lattice constant matching between ITO or indium oxide (10.18Å)
and YSZ (10.20Å) is excellent. Kamie et al. have used an electron beam deposition technique to
grow epitaxial ITO layers onto (111) YSZ substrate [76]. Their results indicated that the ITO
layers have excellent crystallinity as confirmed by reflective high energy electron diffraction,
low energy electron diffraction and X-ray photoelectron diffraction. These ITO layers also
demonstrated carrier mobility in the range of (30 - 40) cm2 V
-1 s
-1 at room temperature.
So far, the manufacturing of TCOs has been limited to three metal oxides, In2O3, SnO2 and ZnO
along with mixtures of these such as ITO and zinc-doped In2O3 (IZO) [77] or with other dopants
such as fluorine (F), antimony (Sb), gallium (Ga), aluminium (Al), boron (B) etc. that yield F-
doped SnO2 [78, 79], Sb-doped SnO2 [55, 80], F-doped ZnO [81, 82], Ga-doped ZnO [83, 84],
Al-doped ZnO [85, 86], B-doped ZnO [87, 88] etc. As for other conventional TCOs, these
materials are formed with metal atoms that have electronic configuration of (n-1)d10
ns2 [89, 90].
The excellent interaction of oxygen p states and metal s states leads to metal-oxide orbital
overlap in these structures and gives rise to low effective electron masses, thereby, the formation
of a wide band gap energy (Eg ˃ 3 eV), permitting the transmittance of light in the visible region
and below. All these materials are very important host lattices for optoelectronic applications
[91, 92]. Recently, other materials with TCO characteristics were reported including titanium
oxide (TiO2) and calcium aluminate (12CaO.7Al2O3) [93, 94]. Binary and ternary compounds
and solid solutions with suitable optical, electrical and mechanical characteristics have also been
developed for numerous applications [95-97]. Since early in the 1990s, multi-cation TCOs which
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consist of metal ions beyond the conventional In, Sn, Zn and Cd have been developed. These
materials which include Ga2O3, GaInO3 and MgIn2O4 have attracted wide attention [98]. Multi-
cation oxides of InGaZnO4, InGaMgO4, InAlMgO4 and InAlCdO4 fabricated in the form of
layered structures which have identified the hybrid nature of the conduction band due to the
strong hybridization between the states of each cation and its neighbouring oxygen atoms in the
matrix [99-101]. An interesting approach for improving the TCOs performance was based on
employing correlated metals such as SrVO3 and CaVO3, where strong electron-electron
interaction leads to a significant increase in the density of effective electron mass in the TCO
matrix and hence decrease the plasma frequency at fixed electrical resistivity [102]. Table 1.1
summarizes some important TCO materials and their related dopants and compounds.
Table 1.1 Typical TCO materials and their related dopants and compounds
Materials Dopants or compounds Ref.
In2O3 Sn, Ti, Mo, Zr, Ge, Ta, Hf, W, Te, F, Nb [30, 103-105]
SnO2 As, Nb, F, Ta [106, 107]
ZnO Al, Ga, In, B, F, Ti, Zr, Y, S, Hf, V, Sc, Ge [108-110]
Ga2O3 Sn [111, 112]
CdO In, Sn, Sm [113, 114]
TiO2 Nb, V, Ta [115-118]
In2O3-ZnO Zn2In2O5, Zn3In2O6 [119]
In2O3-SnO2 In4Sn3O12 [120]
ZnO-SnO2 Zn2SnO4, ZnSnO3 [121, 122]
GaInO3, (Ga, In)2O3 Sn, Ge [123]
Zn-In2O3-SnO2 Zn2In2O5-In4Sn3O12 [77]
CdO-In2O3-SnO2 CdIn2O4-Cd2SnO4 [124]
CdSb2O6 Y [125]
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1.6. P-Type Transparent Conductors
All high performance TCOs used in industrial applications are n-type binary systems with
polycrystalline features and doped with halides, group XIII or XV elements. Equivalent p-type
transparent conductive materials have yet to be industrialized. Recently, there have been some
reports on p-type transparent conductors in the literature; however, their electrical conductivities
and figures of merit are still orders of magnitudes less than those of n-type transparent
conductors. Transparent p-type conductors could be useful in numerous applications including,
interconnection layers (recombination junctions) in tandem photovoltaic, electrodes provide
carrier selectivity and carrier collection in photovoltaic devices and electrodes for fully
transparent devices [126]. Fabricating an optimal un-doped or doped p-type TCO seems to be
more difficult than n-type TCOs. This difficulty stems from the ionicity of the metallic atoms
and the electronic structure of the wide band gap metal oxide with strong localization of holes
(large effective mass) at oxygen 2p states [127]. These localized holes require high energy to
overcome a high ionization potential in order to move through the crystal lattice, resulting in low
hole-mobility [128]. To cope with this result and improve the hole-mobility, most p-type TCOs
similar to their n-type counterparts, require high thermal treatment to enhance their crystal
quality. The highest p-type conductivity of 220 Scm-1
was reported for Mg-doped CuCrO2 thin
film [129]. High p-type conductivity has also been investigated practically in perovskites-
structured TCOs such as SrInxTi1-xO3 and SrxLa1-xCrO3 [130, 131], spinel-structured TCOs such
as NiCo2O4 [132] and composite or amorphous oxides such as In-doped MoO3 and ZnORh2O3
[133, 134].
An alternative strategy is to look beyond oxides to materials such as CuI [135, 136]. Non-oxide
wide band gap materials with N, S or P anions have also attracted much attention for p-type
materials due to their more delocalized valence bands resulting in lower hole effective masses
[128]. This new strategy has been established experimentally via Cu-based transparent
chalcogenides and oxychalcogenides include BaCu2S2, CuAlS2, BaCu2(S, Se)F and Cu-Zn-S
which resolve the issues of localised O 2p orbital, achieving electrical conductivity higher than
10 Scm-1
[137-139].
The majority of the p-type transparent conducting materials discussed previously have carrier
concentrations of the order of (1017
- 1019
cm-3
) and usually conduct by hopping mechanism or an
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11
activated transport mechanism. For instance, the chalcogenide-based systems are degenerately
doped semiconductors with a conductivity found to be independent of temperature, limited by
ionized impurity scattering and have smaller band gap energy compared to oxides.
Compensation by deep donors could decrease the hole density and the mobility through
increasing ionized impurity scattering. This trade-off was discovered theoretically for some
oxide based materials investigations [140]; however, a more general process directing non-
oxides would be valuable. To avoid this trade-off, Varley et al. proposed a system of boron
phosphide with wide band gap larger than 3.1 eV and low hole mass [141]. To conclude, while
n-type TCOs can achieve high conductivity even in their amorphous state, p-type TCOs show
lower conductivity at quite high temperature.
1.7. Introduction to ITO Thin Films
Indium Oxide and Indium Tin Oxide (ITO) are very interesting transparent conducting oxides
(TCOs). Although band theory predicts them to have wide direct band gaps (> 3.5 eV), they are
electrically conductive n-type semiconductors. The direct wide band gap makes the transmission
window between wavelengths 300 - 1500 nm, depending on the processing conditions. In the
ultraviolet region - high energy (short wavelengths) electronic transitions from the valence band
to the empty states in the conduction band limit the transmission up to the band gap. In the
infrared region - low energy (long wavelengths) light is reflected due to the quasi-free electron
plasma. Therefore, the wavelength cut-off in the infrared region depends on the charge carrier
density. Weiher and Ley [142] have calculated the indirect band gap for ITO which is about
2.62eV, but it is still not widely reported in the literature. The combination of high transmittance
in the visible range and high electrical conductivity, make ITO thin films suitable for
optoelectronic and electroluminescence applications. Typical ITO films have transmittance close
to 90% in the range of 400 - 700 nm and electrical resistivity below 2×10-4
Ωcm. ITO films also
have high luminous transmittance, high infrared reflectance, excellent substrate adherence, quite
good hardness (~ 5 – 6 GPa), and chemical inertness.
1.7.1. Indium Oxide and Indium Tin Oxide Structure
The structure of Indium tin oxide (ITO) and indium oxide (In2O3) are closely related. During the
synthesis of In2O3, which is classified as an ionically bound semiconductor oxide, some defects
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12
are formed and these defects involve interstitial indium atoms and oxygen vacancies. Since these
defects are electrically charged, ionized impurity scattering is unavoidable in In2O3 and ITO.
In2O3 crystallizes in a cubic bixbyite structure (C-type rare-earth sesquioxide structure) with a
space group Ia3 and a standard lattice parameter of 10.118 Å (JCBDS card no. 06-0416). The
In2O3 unit cell consists of 80 atoms, which show a fluorite-related superstructure Figure 1.1.
Figure 1.1 Bixbiyte crystal structure of In2O3 [143]
One quarter of the oxygen anions residing along the four >111< axes are missing, 32 sites are
occupied by cations located in two non-equivalent six-fold coordinated sites, 8 In3+
ions are
located on trigonally compressed octahedral sites named as (b site) and the rest of the In3+
ions
are located at highly distorted octahedral sites (d site). Both b and d sites can be described as a
cube with eight corners and the indium atoms exist in the centre of this distorted cube. Six
corners occupied by oxygen atoms and the remaining two corners are empty. In the b sites, the
oxygen vacancies are located along the body diagonal while, they are located along the face
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diagonal for the d sites. Figure 1.2 shows the schematic representation of cubic In2O3 structure
with two non-equivalent cataionic b and d sites.
Based on his in-situ electrical property measurements, De Wit [144] reported that In2O3 is an
anion-deficient n-type semiconductor where the intrinsic oxygen vacancies population (~ 1%)
limits the electron concentration. This electron concentration deficiency continues at high
temperature even under equilibrium deposition conditions.
Figure 1.2 In2O3 structure with two non-equivalent cataionic b and d sites [145]
Indium Tin Oxide (ITO) is produced by doping In2O3 with tin (Sn) atoms which replace the In3+
atoms from the cubic bixbyite structure of indium oxide. ITO films have a lattice parameter in
the range of (10.12 - 10.31 Å) close to that of In2O3 (10.118 Å). The Sn atoms create an
interstitial bond with oxygen and form SnO or SnO2. Thus, they have a valency of +2 or +4,
respectively, which has a direct effect on the conductivity of ITO. The SnO2 (Sn4+
) acts as an n-
type donor releasing electrons to the conduction band. On the other hand, the lower valence state
occurs due to the reduction in carrier concentration which results because a hole is created and
acts as a trap and reduces conductivity. However, in ITO, not only the tin atoms but also oxygen
vacancies contribute to the carrier density and hence to the high conductivity, where in the ideal
case, each doubly charged oxygen vacancy contributes two free electrons. It has been observed
that the Sn dopant concentration can play an important role in controlling defects that are
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responsible for lattice stress, which occurs when the film suffers transition from compressive
stress to tensile stress. These defects create impurity states which overlap the conduction band,
creating degenerate semiconductors with behaviour similar to semi-metals.
Theoretical electronic structure calculations by Odaka et al. [146] used a primitive unit cell
having 40 atoms (similar to that of In2O3 crystal). With one In atom either at b-site or d-site
substituted by an Sn atom, resulting in a system of 2.5 at.% Sn concentration along with
approximately 1 × 1021
cm−3
free electron concentration, if each substituted Sn atom donated one
electron. The latter theoretical calculation is in good agreement with the experimental results
reported by Shigesato et al. [36] on ITO thin films having the same free electron concentration
along with very low electrical resistivity. This implies that the super-cell model appears to be a
useful approximation of real ITO thin film coatings.
1.7.1.1. Indium Oxide and Indium Tin Oxide Band Structures
Despite the observed high sensitivity of their characteristics to growth conditions [147], it is
generally accepted that the electronic band structure is a key factor for understanding the unique
interplay between electrical and optical properties of TCOs. However, the band structure of
In2O3 and ITO is very complicated to model due to the complexity of both the lattice structure
and electronic interaction in these materials. Therefore, the characteristics of In2O3 and ITO are
commonly described and discussed on the basis of an assumed band structure comprising of an
isotropic parabolic conduction band [146].
Based on Electron Spectroscopy for Chemical Analysis (ESCA)/XPS measurements, Fan and
Goodenough [148] were the first to report a typical schematic energy band model for In2O3 and
ITO as presented in Figure 1.3. Although this band model is generally simplified, it is still
widely used and the only one offering a qualitative explanation of the observed concurrent high
electrical conductivity and optical transparency in ITO thin films. This band model shows band
gap energy of (3.5eV) along with high optical transparency in the visible region. The conduction
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band was assumed to be principally from indium 5s electrons while the valence band from
oxygen 2p electrons and the Fermi level is very close to the conduction band.
Figure 1.3 Schematic diagram of the energy band model for ITO adopted (a) low doping level
and (b) high doping level [148]
At low doping level, the density of states for donor atoms is low and is formed below the
conduction band while the Fermi level lies between the donor level and the bottom band edge of
the conduction band (Figure 1.3a). On the other hand, at high doping level, the donor density
increases and the donor states overlap the conduction band (Figure 1.3b).
1.7.1.2. Recent Advances in ITO Based TCOs
As stated earlier, ITO remains the key component in most optoelectronic devices that require
transparent conductive electrodes owing to its two key characteristics, electrical conductivity and
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optical transparency in the visible range. ITO has been fabricated in different forms, shapes and
structures including thin films, nanoparticles, nanowires, nanorods, 2D and 3D structures. Of
these, ITO thin films have been widely fabricated and studied as a function of deposition
technique and conditions, dopant types, dopant concentration, substrate types, film thickness, etc.
As for other TCOs, all these parameters were found to play significant roles in improving the
performance of TCO thin films through enhancing both electrical conductivity and optical
transparency which also strongly depend on the crystalline structure of the ITO thin film. It has
been extensively observed that heat treatment led to enhanced crystalline quality of ITO thin
films along with their grain size, thereby, improving the optoelectronic performance [149]. The
properties of ITO thin films are strongly dependent on different parameters including thin film
nature, geometry (thickness), which are also associated with deposition techniques and their
corresponding conditions and post deposition processes. Recently, Amalathas and Alkaisi have
reported that the electrical and optical properties of sputtered ITO thin films are strongly
dependent on the film thickness. They found that when the film thickness increased from 75 nm
to 225 nm, the minimum sheet resistance assigned to be 27.5 Ω/sq along with carrier
concentration of 1.12 1021
cm-3
were achieved [150]. Further investigations on the effect of
ITO film thickness on the optoelectronic characteristics have also been carried out by many
groups of researchers [52, 151, 152]. Additionally, efforts on employing an appropriate dopant to
improve the carrier mobility of ITO thin films were made. Other dopants including Mo, W, Ti
and Nb have also shown promise. A Mo-doped ITO thin film with a molar ratio (In:Sn:Mo =
9.6:2:2) was prepared via aerosol-assisted chemical vapor deposition (AACVD) and exhibited a
mobility of the order of 119 cm2 V
-1 s
-1 compared with the same thin film without Mo which
showed a mobility of 25 cm2 V
-1 s
-1. With further increase of the Mo (mol%) up to 5(mol%), the
mobility dropped to 109 cm2 V
-1 s
-1 while the carrier concentration increased to 7 10
20 cm
-3
yielding the lowest resistivity of 8.3 10-5
Ω cm [153]. This implies that higher conductivity is
best achieved through combining high mobility with relatively low carrier concentration rather
than low mobility with higher carrier concentration.
Since the deposition technique also exerts a significant impact on the performance of an ITO thin
film, different techniques have been employed to fabricate high quality ITO coatings and the
competition between these techniques continues up to the present. DC sputtering and RF
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sputtering [154, 155] are the most widely used techniques for fabricating ITO based TCO
coatings for industrial development, due to high deposition rate, possibility of using available
sputtering system and good reproducibility [5]. Other techniques such as chemical vapor
deposition (CVD), Pulsed laser deposition (PLD), thermal evaporation, electron beam
evaporation, spray pyrolysis, sol-gel process, to name a few, have also been employed for this
purpose [6, 156-160]. Usually, magnetron sputtering depositions are implemented at high
substrate temperatures which achieve the best results in terms of thin film conductivity and
transparency. However, numerous applications such as flexible devices require a quite low
deposition temperature. For this reason, the RF sputtering technique was mostly employed by
researchers to investigate this challenging task.
The increasing demands for advanced devices requires new electrodes with a resistivity lower
than that achieved before and with optical properties higher than those of the present generation
of materials. Minimizing the consumption of indium while maintaining the optoelectronic
properties may be achieved by combining ITO films with other thin metal films that have a
resistivity in the range of 10−6
Ω.cm. Bi-layer and multi-layer systems have been reported to be
an efficient strategy for obtaining high quality ITO based TCO thin films. Of these systems,
combining a metal layer with ITO thin films (i.e., ITO/metal or metal/ITO), insertion of a metal
layer between two ITO thin films (ITO/metal/ITO) or even encapsulating ITO thin film by two
metal layers (metal/ITO/metal) have been proposed as new strategies for TCM production.
Although (metal/ITO/metal) and metal/ITO structure offer very low electrical resistivity, they
suffer from a great reduction in optical transparency due to the single or double opaque metal
layer. Recently, bi-layer ITO/metal thin films were reported by Ng et al. [161]. The authors
investigated the effect of different types of metal layers such as (Ag, AuSn, In, Ni, Sn and SiO2)
on the optical and electrical properties of ITO thin films. Their results showed a decrease in the
electrical resistivity from 16.2 × 10-4 to 7.58 × 10
-4 Ω cm by inserting a thin metal layer
underneath the ITO film. TCO/metal/TCO multilayer structures have also been proposed to be
interesting TCOs due to their higher electrical and optical properties relative to those of a single-
layered TCO thin film. This multi-layer structure gives excellent optoelectronic properties
despite its quite low thickness. Most of these structures were fabricated to be 100 nm thick or
less from similar or even different TCOs thin films encapsulating a thin metal layer. This metal
layer is the key aspect to determine the lowest available resistivity. Silver is the most widely
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used metal in these systems due to its very low electrical resistance compared to other elements
[162].
Optimization of the electrical and optical characteristics of sputtered indium gallium zinc
oxide/Ag/indium gallium zinc oxide (IGZO/Ag/IGZO) multilayer thin films with respect to
IGZO film thickness has been investigated by Kim and his research group [163]. In their study,
the authors reported that the transmission edge slightly broadened and red shifted toward lower
energies and the free carrier density decreased while the mobility was almost stable along with
increasing IGZO thickness. Also, for further understanding the optical properties, the authors re-
calculated the transmittance spectra in the wavelength range (300 – 800 nm) using Finite-
Difference Time-Domain (FDTD) modeling. Theoretical results for transmittance spectra were
fairly similar to the experimental ones. Nickel doped indium zinc oxide (NIZO) multilayer thin
films with Ag layer were deposited via RF magnetron sputtering technique and studied as
effective transparent conductive electrodes for liquid crystal display (LCD) devices. Despite the
loss of optical transparency, the Ag layer brought improvement in the electrical resistivity and
figure of merit values [164]. Besides Ag, other conductive elements including gold (Au), copper
(Cu), chromium (Cr), platinum (Pt) etc., to name a few, have also been employed in such thin
film systems [165-168]. The majority of recent thin film solar cells and flat panel displays are
based on glass substrates which offer a rigid support and can withstand high temperatures
required for consecutive fabricating processes [169-172]. However, it is important to replace the
rigid substrates by flexible plastics which provide easier handling than panes of glass. Polymer
foils and/or flexible substrates are light, bendable and have a price advantage relative to rigid
glass, thereby, allowing cost-effective mass production by a roll-to-roll (R2R) manufacturing
processes [20]. However, they cannot withstand the high temperature required for industrial mass
production processes. On the other hand, it is very difficult to fabricate high quality transparent
electrodes on these substrates due to the quite high temperature required for obtaining high
electrical conductivity. Compared to a single-layered traditional ITO thin film, the tri-layer
systems have exhibited high conductivity, low absorption in the visible range and room
temperature deposition process. The latter has encouraged researchers around the world to
develop low temperature thin film coatings [173-175]. The most recent investigation in this sense
was made by Kim et al. on sputtered ITO/Ag/ITO thin film at room temperature as electrodes for
organic solar cells [176]. The authors have reported superior results of this coating system
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compared with those of a high-temperature-fabricated single-layered ITO thin film. Silver oxide
has also been reported as a substitute for the metal layer in tri-layer thin film coatings for flexible
electronic applications. The observed optoelectronic results of ITO/AgOx/ITO are comparable
with those of common ITO/Ag/ITO; however, an improvement in the power-conversion
efficiency was achieved for highly flexible organic solar cells (OSCs) [177]. All the
aforementioned multilayer thin films were fabricated using Dc or RF sputtering system.
However, other techniques such as thermal evaporation and direct laser patterning have also been
used for depositing such coatings [178-180].
Recently, ITO has been investigated in different forms such as nanoparticles, nanowires,
nanorod, 2D and 3D structure. The XRD analysis carried out by Pramod et al. on indium oxide
nanoparticles confirms the formation of polycrystalline features similar to that of layered ITO
thin films [181]. Also, the authors discussed and calculated the optical properties in terms of
transparency, direct and indirect optical band gap. Further investigations on the gas sensing
properties of the prepared thin films have also been reported by the authors. Surface modification
of ITO nanoparticles have been reported by Lee and co-authors [182]. In their study, the authors
demonstrated that effective surfactant removal can improve the electronic performance of ITO
nanoparticles, which were uniformly assembled onto glass and silicon substrates via a spin-
coating process. ITO nanorods were employed as an anode in polymer light emitting diodes
(LEDs). The optical characteristics of these nanorods were investigated via dark-field optical
microscopy and transmission spectroscopy, and the results revealed that the optical transparency
and the light scattering properties of ITO nanorods were better than those of ITO thin films
[183]. Additionally, multifunctional single crystalline ITO nanowires with controlled Sn doping
were fabricated through a vapor transport process by Gao et al. [184]. The authors have reported
these ITO nanowires as promising TCOs where a thin film of these nanowires exhibits a sheet
resistance as low as 6.4 Ω/sq and measurements on single nanowire show a resistivity of the
order of 2.4 10-4
Ω cm along with free carrier density up to 2.6 1020
cm-3
. ITO thin films are
also fabricated and characterized as a three dimensionally structured electrode for current
collection applications in lithium ion (Li-ion) batteries [185]. Further investigations on the
electrochemical stability of this 3D structure of ITO with WO3 as a negative electrode
demonstrates the 3D ITO structure can successfully perform as a suitable current collector.
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1.7.1.3. Survey of the progress of sol-gel derived ITO based TCO coatings
So far, the sol-gel process has been developed and extensively used as alternative technique for
producing different kinds of transparent conductive thin films. This section presents a survey of
using the sol-gel process for fabricating ITO based TCO thin films.
Kesim and Durucan [186] have been reported the effect of incorporating oxalic acid dihydrate in
ITO solution on to the optoelectronic properties of ITO thin films. The oxalic acid concentration
in the ITO solution was varied (0.05, 0.1, 0.3, 0.5 or 1.0) M. Their results show that the film
formation efficiency, homogeneity and surface coverage were improved with the addition of
oxalic acid. Also, a sheet resistance of 3.8 kΩ/sq and optical transparency of 93% were achieved
for 45 nm ITO film. Eco-friendly pure aqueous sol-gel process was modified by Misra [187] and
co-authors to fabricate ITO thin films. DI-water was used as an alternative to organic solvents for
preparing the ITO solution, and the resulted thin films were annealed at (200 – 400 °C) in step of
50 °C, and treated with argon plasma. The authors reported that the sheet resistance of 45 nm
ITO thin film was considerably decreased to 443 Ω/sq after 2h of plasma treatment. In addition,
the XPS results established that the number of oxygen vacancies in thin ITO film increased with
increasing annealing temperature and applying the plasma treatment. Ren et al [188] have
studied the effect of using benzoylacetone (BzAch) as a chemical modifier in the preparation of
nanocrystalline ITO films with plasmon electrochromic properties. The BzAch was found to
decrease the crystallite size of ITO thin film, and the growth of these crystals was governed by
varying the BzAcH concentration in the ITO film materials. Also, ITO film shows significant
localized surface plasmon resonance absorption features that can be influenced via
electrochemical doping. The plasmonic mechamism in ITO films revealed a significant
reversible and persistent variation in their optical transparency in the near-infrared range of the
electromagnetic radiation.
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1.7.2. Recent Advances of Some Characterization Techniques for ITO Based TCOs
Coatings
1.7.2.1. XRD Analysis of ITO Based TCOs
The crystallographic characteristics are a key factor in improving the performance of ITO. The
XRD spectra of the ITO thin films fabricated on glass substrates at room temperature have been
widely reported to be amorphous in nature [189]; however, XRD analysis of ITO films
synthesized at different temperatures shows the formation of crystalline structure. Bragg peaks
observed around 31.5°, 35.5°, 51.2°, 60.8° were identified as a body centred cubic bixbyite
structure with space group of la3/cubic and a lattice parameter of the order of 10.20Å similar to
In2O3 (JCPDS card 06-0416). Features for polycrystalline ITO thin films are demonstrated by the
(222), (400), (411), (332), (440) and (622) reflection directions of In2O3. Also, at high annealing
temperature, the degree of crystallinity of ITO phase was improved along the (222) plane [190-
192]. Both the cubic and rhombohedral structures with broadened diffraction lines were observed
by Korosi and his research group [193] for spin coated ITO thin films treated with NH3 and
annealed at 550 °C. These broadened peaks reflect the overlap of several reflection lines of the
aforementioned crystal phases.
1.7.2.2. Synchrotron X-ray Scattering Analysis of ITO Based TCOs
The structural evolution of transparent ITO/Ag/ITO thin films has been investigated as a
function of annealing temperature by means of synchrotron X-ray scattering. The results showed
that the as deposited and 200 °C annealed ITO/Ag/ITO thin films have similar weak (222) and
(400) reflection planes of ITO. This shows that the synthesized thin films at low temperature
consisted of nanocrystalline ITO and Ag phases and there was no significant change in the
crystalline structure below 200 °C. With increasing annealing temperature above 300 °C, the
ITO/Ag/ITO thin films shown strong crystalline structure with peaks featured at (211), (222),
(400) and (440) reflection orientations similar to ITO, indicating high crystalline quality of the
top and bottom ITO layers. Also, strong Ag peaks observed at (111) and (220) planes
demonstrated enhanced crystal structure of the Ag layer after annealing [194].
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1.7.2.3. XPS Analysis of ITO-Based TCOs
XPS analysis has been implemented to investigate the surface electronic structure of ITO
coatings. Multiple oxidation states for indium e.g., In0 and In
3+ and tin e.g., Sn
2+, 4+ were
observed, while oxygen was from lattice, surface and subsurface. Residual carbon was also
observed at the film surface even after etching. Removing the impurities from the top surface of
sol-gel derived ITO thin film coatings has been reported to decrease the electrical resistivity of
such coatings [195]. It was noted that the increase of tin concentration in the ITO matrix
promoted the reduction of In3+
to In0 which is similar to oxygen being etched out of the film
surface through argon sputtering [196-198].
1.7.2.4. High Resolution Transmission Electron Microscopy (HRTEM) Analysis of
ITO Based TCOs
HRTEM analysis was performed to study the degradation mechanism of post annealed
ITO/Ag/ITO thin films. The cross-sectional HRTEM image of as deposited ITO/Ag/ITO thin
film shows well-defined top ITO layer, mid Ag layer and bottom ITO layer without any
observable interfacial layers, and the mid layer appears as a continuously connected layer
between both bottom and top ITO layers. On the other hand, cross sectional HRTEM images of
600 °C annealed ITO/Ag/ITO thin films show that discrete Ag islands were formed between the
crystalline top and bottom ITO layers. Decreased optical transparency and increased electrical
resistivity of annealed thin films was attributed to the formation of these discrete Ag islands
which gave rise to light and electron scattering. The high magnification images of the as
deposited and annealed samples expose the transformation of continuous Ag layer for as
deposited sample to discrete Ag islands due to the agglomeration of Ag atoms during the
annealing process. At high annealing temperature, the top ITO layer exhibited the formation of
grain boundaries that act as an oxygen diffusion path from this top layer to the Ag layer. Further
investigations reveal that in some regions, both the top and bottom layers were connected with
the absence of the Ag layer due to lateral diffusion of Ag atoms. All these processes eventually
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23
result in degradation of the electrical and optical properties of ITO/Ag/ITO thin films at high
annealing temperature (600 °C) [194].
1.7.2.5. Computational Modeling Analysis of ITO Based TCOs
Computational modelling analysis of different materials and their corresponding structures and
properties can be very beneficial in interpreting experimental results and identifying different
types of materials for specific applications. So far, several investigations have focused on the
principles and parameters required in development of ITO based TCOs.
ITO and indium oxide are reported to have similar body centred cubic (BCC) structure. The
electronic characteristics including excitation energy, dipole momentum, frontier molecular
orbital energies, absorption wavelengths, along with the complete vibrational analysis and the
optimized structural parameter calculations of indium oxide were obtained from Time Dependent
Density Function Theory (TD-DFT) and the Hartree-Fock approximation (HF), as reported by
Panneerdoss et al. [199]. The authors have confirmed that indium oxide composites have BCC
frame work with C2v point group symmetry, and the most stable structure has a preferred (222)
reflection plane of the bixbyite structure with symmetrical In-O bonds. In and O atoms are
coupled linearly, where the O atom is centred and two In atoms bonded symmetrically with equal
inter-nuclear distance to form a V-shape structure. Also, the calculated highest occupied
molecular orbital (HOMO) and the lowest unoccupied molecular orbital (LUMO) energies
confirm the inter charge transformation within the structure, resulting in enhanced band gap
energy.
1.7.2.6. Mechanical Characteristics and Finite Element Modeling (FE) for ITO
Based TCOs
ITO is likely to be susceptible to cracking and delamination due to its brittle nature and to the
large misfit in hardness and Young’s modulus values between the ITO coating and the substrate.
Therefore, it is believed that the mechanical properties of ITO coatings play a significant role in
determining the performance of the optoelectronic device. However, there is little information on
the mechanical characteristics of ITO based TCO coatings particularly in the (nano- or micro-)
structure scales. Recently, an interesting combination of experimental nanoindentation
measurements and theoretical finite element modelling were performed by Gupta et al. to
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investigate the mechanical behaviour of thick sputter deposited ITO thin films grown on Si
substrate [200]. In their investigations, the contributions of the substrate and the film coating
were considered in a power law formulation based nonlinear material model. Experimental p-h
curves were effectively simulated by finite element modelling. Also, the FE model successfully
predicted the stress-strain curves, the vertical deformation distribution throughout the film
thickness and the Von-Mises stress distribution with respect to the horizontal distance from the
indenter to the axis of symmetry. The FE model also predicted yield strength of 2.2 GPa and 7.75
GPa for ITO thin film and silicon substrate, respectively.
1.8. Alternatives to Metal Oxides Based TCMs
With the vast demand for TCMs in recent decades, research on new materials which are non-
metal oxide based transparent conductors has increased. These materials include graphene,
CNTs, metal nanowires, conductive polymers and perovskite materials. AS for the TCOs, these
materials have also witnessed a gradual development since their first discovery.
Two-dimensional (2D) materials have been extensively proposed as transparent conducting
electrodes in electronic and optoelectronic devices due to their atomic monolayer thickness (that
allowing high optical transparency over the visible range of the electromagnetic radiation) and
the probability of ballistic transport (without electrons scattering even at room temperature).
Among these materials, graphene layers are arguably the most widely used as potential TCMs
for their high optical transparency (~2.3% visible light absorbed per single graphene layer), their
high carrier mobility (103-10
4 cm
2V
-1s
-1) and their mechanical flexibility [201-203]. High
electron mobility have been achieved for graphene thin films grown by CVD on boron nitride
substrates [204]. Despite this high mobility, the electrical conductivity is quite low compared
with other TCMs, which is largely due to its inherently low carrier density (˂ 1013
cm-3
) [203].
Many investigations were carried out aiming to increase the carrier density via a multilayer
graphene thin film growth [205], impurity doping [206] and a recent method using intercalation
doping [207]. Also, graphene has proven itself operable in flexible PV devices under bending of
138° compared to operable bending of 60° in a brittle ITO cell [208]. It has been reported that
four layers of graphene are required to obtain good optical transparency along with a sheet
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25
resistance as low as that for ITO of the order of 30 Ω/sq [209]. CNT networks are also one of the
materials recently developed as an efficient substitute to ITO and other TCO materials in the
state of the art of optoelectronic devices, particularly, those for flexible electronics, due to the
extraordinary mechanical and electrical (even under extreme bending conditions) characteristics
these networks possess [210]. CNTs have been extensively adopted for production of composite
materials for printed electronics. Nano-composite films of CNTs were electrochemically
deposited on conducting ITO and Ag grid printed on PET substrate, and the results revealed that
the composite films exhibit non-linear optical characteristics along with antireflective
performance over a visible to long IR range, allowing their potential application as optical
materials [211]. Besides that, Mo and co-workers [212] have reported a high performance TC
coating made by combining an Ag grid with CNTs. These thin films exhibit tremendous overall
performance with a sheet resistance of 14.8 Ω/sq and 82.6% transmittance at room temperature.
Their analysis also indicates that the improvement in the conductivity of the hybrid Ag
grid/CNTs coatings was related to the filling spaces between the Ag grids and interconnecting
the CNTs with Ag nanoparticles. Moreover, the hybrid coatings exhibit high flexibility along
with excellent mechanical strength compared to an ITO coating. The electrical and optical
properties of CNT thin films were evaluated by Hwang et al. [213] as a function of post (fuming-
and immersion-) nitric acid treatments. The treated CNT thin films possessed lower sheet
resistance and improved optical transparency over the visible range of 210 Ω/sq and 90%,
respectively, compared to those thin films that had not undergone acid treatment. However, the
mechanism by which acid treatment improved the optoelectronic properties of CNT based thin
films is still unclear. Earlier reports attributed this improvement to the effective removal of
residual amorphous carbon on the surface of CNTs and the decreasing of the cross-junction
resistance between CNTs [214-216]. Additionally, a random mesh structure of metallic nanowire
film coatings, especially Ag-NWs has attracted considerable attention as a high performance
flexible TC film. These TC films have been extensively adopted in solar cells, displays and
touchscreens to achieve new-generation optoelectronic devices that can be bent, compressed,
stretched, twisted and deformed into complex, non-planar shapes while maintaining high
conductive performance, integration and reliability. Lee et al. [217] have demonstrated Ag-NWs
based flexible transparent conductive composite thin films comprise of a spin-coated Ag-NW
layer followed by a buffer layer of sputtered indium doped zinc oxide (IZO). The latter has a
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26
significant potential in prohibiting the surface oxidation of the Ag-NWs, thereby, successfully
avoiding undesirable changes in the conductivity. In their study, a significant enhancement in the
sheet resistance value of pristine Ag-NWs was achieved after being buffered with IZO layers,
(19.84 Ω/sq and 10.35 Ω/sq) for Ag-NWs and Ag-NWs/IZO thin films, respectively. Recently,
transparent conducting films (TCFs) based on Ag-NWs were successfully fabricated as a
function of spraying times, annealing time and solution concentration through a simple spraying
process by Hu and co-workers [218]. Polyvinylpyrrolidone (PVP) was used to modify the
interface of the substrate. A quite stable low sheet resistance of 30 Ω/sq was obtained in this
study, even after 500 cycles of bend testing with bending radius of 5 mm. Conductive polymers
(so-called intrinsically conducting polymers) are organic polymers that possess excellent
electrical conductivity. The superior potential of these materials is their simple processability,
mainly by dispersion. PEDOT:PSS is the most extensively used and commercially available
conducting polymer due to its high optical transparency, suitable thermal stability, high
mechanical flexibility and easy solution based processability [219-222]. Unfortunately, it has
low electrical conductivity compared to other conductive polymers. However, the conductivity
of pure PEDOT:PSS has been improved through solvent treatment including dimethyl sulfoxide
(DMSO), sulphuric acid (H2SO4) and ethylene glycol (EG) [223-225]. Introduction of
appropriate dopant atoms has also proven to be beneficial in improving the conductivity of
PEDOT:PSS films. In this sense, copper bromide (CuBr2) has been adopted to dope
PEDOT:PSS as the HTL in polymer solar cells [226]. A significant improvement in the
conductivity and the power conversion efficiency (PCE) of doped PEDOT:PSS has been
observed by the authors (5.6 × 10-2
Scm-1
and 7.05%, respectively) compared to those of un-
doped (1.9× 10-4
Scm-1
and 5.84%, respectively). This improvement has been attributed to two
mechanisms, (1) the weakening of the columbic attractions between PEDOT and PSS
components, and (2) the increase of the work function value of PEDOT:PSS with CuBr2 doping
which results in increase of both the open circuit voltage (Voc) and the filling factor (FF) of the
solar cell. Further investigations to improve the performance of optoelectronic devices based on
hybrid TCFs are continuing.
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1.9. Industrial Applications of TCO
TCOs have been extensively used in various industrial applications and ITO seems to be the
most widespread TCOs employed due to its advantages discussed previously, despite its cost
perspective. The main three commercial applications of TCOs thin films in terms of the surface
area covered and their total values are solar cells, flat panel displays and coatings on architectural
glass.
1.9.1. Transparent Conductive Electrodes in Solar Cells
TCO films that act as transparent electrodes are employed in almost solar cells. The main
considerations in selecting the appropriate TCO for this purpose, besides transparency and lateral
conductivity, are processing requirements, electronic compatibility with adjacent layers in the
solar cell and stability under environmental conditions. Design of a conventional photovoltaic
(PV) solar cell consists of deposition of different layers consequently on rigid or flexible
substrates such as glass or PET. Of course, some of these layers are TCO electrodes (anode and
cathode). The TCO anode is deposited on glass substrate, followed by hole transparent layer
(HTL) such as poly(3,4-ethylenedioxythiophene) polystyrene sulfonate (PEDOT:PSS). The
photoactive layer which is directly connected to a low-work function and reflective metallic
cathode is deposited upon the HTL. In some cases, there is no need for an intermediary electron
transport layers (ETL). ITO is the most widely proposed TCO anode in a PV cell.
1.9.2. Transparent Conductive Electrodes in Information Displays
Since the mid-1990s, transparent organic light emitting diode (TOLED) displays have been in
development [227]. Evolution in the fields of TCs and active matrix organic light emitting diode
(AMOLED) displays has resulted in their combining to establish a new and exciting generation
of transparent AMOLED displays. Early TOLED displays consisted of a quite high work
function TCO anode (typically ITO) with a low work function metal cathode such as Au, Ca or
Ag-Mg, encapsulating an organic semiconductor layer along with ETL and HTL transport layers.
While even a thin metallic cathode layer can hinder the optical transparency by 50% [228],
prototype transparent televisions have been developed by Samsung through adoption of twin ITO
electrodes [229]. However, the challenge continues to discover a cathode layer with comparable
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optoelectronic properties to ITO but a lower work function for efficient electron injection.
Recently, it has been observed both theoretically [230] and experimentally [231] that doping of
ZnO with Ga or Al can effectively reduce its work function and increase its surface carrier
concentration. Similarly, in order to enhance band alignment with HTL layer and hence overall
device efficiency, most recent investigations have also intended to increase the work function of
the ITO anode [232]. The usual industrial deposition of ITO via sputtering could damaging the
underlying organic layers of the OLED device [233]. However, deposition of additional
protective layers via thermal evaporation, prior to the sputtering process, has thus far been able
to address the damage issue [229]. Additionally, it has been reported that with many TCO thin
films such as F-doped SnO2, Sb-doped SnO2 and B-doped ZnO, the chemical vapour deposition
technique can often produce films with superior optoelectronic properties to those achieved via
sputtering [78, 79, 87, 88, 234]. In recent years, many results have been reported for
experimental investigations and computational modelling concerning the modification of the
work function of doped TCOs [92, 230, 232], and it is predicted that the ongoing correlation
between experimental and theoretical approaches can provide tangible development to this
quickly growing field.
1.9.3. Transparent Conductive Electrodes in Architectural Glass
TCO coatings are widely applied to architectural glass as part of multilayer stacks. In this
context, the electrical conductivity is immaterial, but the high infrared reflectivity is exploited, to
minimize heating costs in the winter and air conditioning costs in the summer. Almost 25% of
plane glass is coated, and energy preserving coatings are required in various areas of
applications. The most common technique for applying such coatings is via a very stable and
low-cost, atmospheric pressure chemical vapour deposition (APCVD), along with the float glass
fabrication route. However, the APCVD technique is not very adaptable due to limitations of the
available options for the coating architecture. A more expensive, but also more flexible process
is magnetron sputtering. Usually, many rotating targets (e.g. 20-60) are placed in a long modular
vacuum chamber and multilayer stacks are deposited when the glass plates are moved
underneath various cathodes.
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1.10. Challenges and Significances of the Study
Both the optical and electrical properties of ITO are correlated and could be tailored to a wide
range of optoelectronic applications. ITO thin films are very sensitive to microstructure and
crystallinity, and show brittle surface structure. Increasing ongoing demands from industrial and
technological applications for high quality optoelectronic devices showing higher performance
limits involve maintaining the structure properties including (crysatllinity, phases and
stoichiometry) as well as the morphology properties including (texture and crystallite size),
which govern the electrical, optical and mechanical properties of thin polycrystalline ITO films.
The nanostructure of ITO is itself sensitive to fabrication conditions. Therefore, controlling this
nanostructure is necessary to produce high quality thin films with suitable optoelectronic and
mechanical characteristics for such applications.
Most of the industrial and technological applications are looking for fabricating high quality ITO
thin films either from low-cost materials or by using simple, clean and efficient fabricating
techniques. However, high quality ITO thin films were mostly fabricated via physical vapour
deposition techniques provided with complicated high vacuum systems and control unit such as
sputtering, pulsed laser deposition, electron beam evaporation, chemical vapour deposition, etc.
These techniques when combined with expensive indium result in high-cost end products.
Therefore, fabricating high quality ITO thin films using a low-cost technique still represent the
main challenge for researchers over the globe. In this study a simple, low-cost and
environmentally friendly sol-gel spin-coating method was used to fabricate high crystalline
quality thin ITO films comparable to those fabricated from complicated physical vapour
deposition techniques. The optoelectronic and mechanical properties of ITO thin films were
improved by using suitable dopants and annealing temperatures. Also, ITO-based multi-layer
thin film coatings were successfully fabricated via sol-gel spin-coating method, and used as
electrodes in OSCs application with improved power conversion efficiency.
1.11. Research Questions Addressed in this Study
Can a simple, cost effective and environmentally friendly method be used to produce
high quality thin ITO films with properties comparable to those prepared from
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complicated and costly physical vapour deposition techniques such as sputtering, pulsed
laser deposition, electron beam evaporation, etc.?
Is it possible to control the fabrication conditions of the sol-gel spin-coating process to
fabricate high crystalline quality thin film coatings?
Can suitable annealing temperatures be identified that will not significantly change the
structural properties of ITO but improve the network?
Can the carrier concentration of sol-gel derived ITO-based thin films be increased by
doping with metals that have higher valency and work function values compared to
indium? This increment could be made either by substituting the host atoms by dopant
atoms with high valency that contribute extra free charge carriers in the ITO network, or
by enhancing the injection of the free carriers from metals that have high work function
values.
Can the carrier mobility of sol-gel derived ITO-based thin films be enhanced through
improvement of the crystalline quality of these films by doping and/or heat treatment, and
by combining the ITO with conducting material such as CNTs that may provide highly
conducting pathways to the free electrons within the ITO structure?
Can the sol-gel process be beneficial in fabricating the ITO thin films with different
materials in bi-layer and tri-layer coatings with low films thicknesses that offer
optoelectronic properties comparable to thick single ITO film?
Can the mechanical properties of brittle ITO thin films be improved via doping, applying
heat treatments and incorporating a robust material such as CNTs in the ITO matrix?
1.12. Methodology
The methodology developed in this experimental work was designed to address each of the
research questions posed in the previous section.
The sol-gel process was used as low-cost alternative to physical vapour deposition techniques to
prepare ITO thin films. This was then combined with a spin-coating approach to prepare uniform
thin films on suitable substrates such as soda-lime glass slides. In addition to the low-cost and
ease of operation, the sol-gel spin-coating approach has the potential to be scaled-up for large
surface thin film coatings.
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A number of experimental variables were manipulated in the sol-gel spin-coating process to
achieve high crystalline quality thin films including, solution concentration, solution viscosity,
spin-coater dispensing rate, spin-coater rotation speed, calcining process, film thickness. The
spin-coating deposition parameters consist of three main steps with different spinning speed and
spinning time. These steps include: (1) dispensing the sol onto the rotated substrates, (2)
spreading the sol uniformly and (3) drying the thin films. These steps were followed by a
calcined process at specific temperature which depends on the solution concentration, and the
deposition process was repeated until the desired film thickness was achieved. The thin films
thicknesses were varied in the range of (150 – 350 ± 5 nm).
Annealing was carried out in the range of (350 – 600 °C) throughout the present study to
improve the crystalline quality and enhance the homogeneity of the prepared thin films.
Doping the ITO thin films was achieved by incorporating selected 3d transition metal salts in the
sol-gel process including titanium (IV) isopropoxide (Ti[OCH(CH3)2]4), silver nitrate (AgNO3)
and CNTs. The level of Ti and Ag dopants was varied in the range of (2 – 10 at.%) , while CNTs
were incorporated at a level of 0.25 wt.%. Combining of the dopant level and annealing
temperatures were explored to achieve high carrier concentration and mobility as well as good
mechanical properties in the fabricated ITO thin films.
ITO thin films were combined with metal-, metal nanoparticles- and metal oxide- layers in the
geometries of bi-layered and tri-layered thin film coatings with thicknesses of ~ 130 ± 10 nm.
These combined layers could facilitate obtaining optoelectronic properties comparable to thick
single ITO film (≥ 350 nm).
Structural, surface morphology and roughness, surface composition/electronic structure,
electrical, optical and mechanical properties were investigated using a variety of
complementary techniques, such as X-ray diffraction (XRD), X-ray photoelectron spectroscopy
(XPS), Raman analysis, scanning electron microscopy (SEM) and field emission scanning
electron microscopy (FESEM), energy dispersive X-ray spectroscopy (EDS), atomic force
measurements (AFM), 4-point probes, Hall effect measurements, UV-Vis spectrophotometry,
and nanoindentation and FEM measurements.
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1.13. Outline of the Dissertation
This dissertation consists of eight chapters. Chapter 1 provides general introduction together
with a review of relevant literature, challenges, significance, research questions, and
methodology used in the current study. Chapter 2 includes the background aspects of ITO and
its correlated optoelectronic characteristics along with the theory of sol-gel spin coating method
and the equipment and characterization techniques used in this work. Chapters 3 to 7 comprise
the main findings obtained from the characterization of the synthesized thin film coatings with
further discussions and commentaries. In particular, Chapter 3 includes the results obtained
from Ti doping including the effects of Ti concentration and annealing temperature on the
structural, morphological, electrical and optical properties of Ti-doped ITO thin films. The
contents of this chapter have been published in Semiconductor Science and Technology (Journal
article 1). Chapter 4 describes the surface chemical bonding states and mechanical properties of
Ti-doped ITO thin films. The major results of this chapter have been published in Journal of
Alloys and compounds (Journal article 2). The results presented in Chapter 5 cover the effects
of Ag additive on the mechanical, structural and optoelectronic properties of ITO thin film
coatings. The results of this chapter have been published in Materials Today Communications
(Journal article 3). The major results of incorporating SWCNTs with ITO thin films have been
extensively described in Chapter 6 in terms of the structural, morphological, optoelectronic and
mechanical characteristics. The findings of this chapter have been published in The Journal of
Physical Chemistry C (Journal article 4). Chapter 7 presents the optoelectronic properties of bi-
layered and tri-layered ITO-based thin films. A summary of the present work, the need for
further developments and scope of further investigations are presented in Chapter 8 as
Conclusions and future works. Since this is a thesis by publications, the reader may find some
repeated information, especially in the introductions of some chapters and/or in the discussion of
the results.
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2. CHAPTER 2 Background Theory of Transparent Conductive
Materials, Sol-Gel Process and Characterization Techniques
2.1. Transparent Conductive Materials
Transparent and conductive materials (TCMs) are a class of materials, which are characterized
by very low electrical sheet resistance and simultaneously high optical transparency. These
materials have attracted much attention so far on account of their extraordinary and
tremendously useful characteristics. [92, 235].
2.1.1. Material Types
Solid state materials can be categorized with respect to their electrical conductance into three
main categories: conductors, semiconductors and insulators, and the electrical characteristics of
given materials depend on the electronic populations of the different allowed bands. While
conductors have abundance of free electrons for electric conduction, insulators have no free
electrons under atmospheric conditions for electrical conduction. Semiconductors have electrical
characteristics that lie in between those of conductors and insulators [236]. The band gap
structures of conductors, semiconductors and insulators are shown in Figure 2.1. Among the
aforementioned materials, semiconductors are the one of great interest. Therefore, the
semiconductor materials will be discussed in more details in the next section.
2.1.2. Semiconductors
In this type of material, the free electrons can be easily excited from the almost filled valence
band to the almost empty conduction band because they generally have small band gap energy (~
1 - 3eV). Semiconductors behave like insulators at zero Kelvin where there are no free electrons
in the conduction band. However, with increasing temperature, some of the free electrons are
excited in to the conduction band and the electrical conductivity of semiconductor materials
increases. In addition, the excited electrons leave behind positive holes in the valence band. The
resultant semiconductor current is determined by summing both electron and hole currents that
flowing in opposite directions.
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Figure 2.1 Band gap structures of conductor, semiconductor and insulator materials
Semiconductor materials can be categorized into three main categories including: elemental
semiconductor, composite semiconductor (III-V composites and II-VI composites) and alloy
semiconductor. Since early nineteenth century when the research on semiconductor materials
started, many semiconductors have been discovered and investigated. The most well-known
elemental semiconductor materials are silicon (Si) and germanium (Ge) which both belong to
group 14 of the periodic table of elements. In the mid of last century, germanium was the most
employed semiconductor in photodiodes and rectifiers. However, it was not suitable for
applications at high temperature or of weak current consumption. Later, silicon replaced
germanium semiconductors owing to its low cost and low power consumption. Composite
semiconductors were built with two or more different elements such as gallium Ga (III) and
arsenide (As) to form semiconductor gallium arsenide GaAs (III-V) and aluminum Al (III), Ga
and As in the form of AlxGa1-xAs. These composite and alloy semiconductors were demonstrated
to have optical and electrical characteristics that were not achievable with elemental
semiconductors. Table 2.1 shows examples of each type of semiconductor material.
Full VB
Empty CB
Eg ˃ 4eV
Insulator
e- e
- e
- e
- e
- e
- e
-
Almost full VB
Almost empty CB
e- e
- e
-
Semiconductor
Almost full CB
VB
Conductor
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Table 2.1 Examples of semiconductor materials
Semiconductor materials can also be classified as intrinsic or extrinsic based on stoichiometry.
Intrinsic semiconductors or undoped semiconductors are pure semiconductors i.e., there is no
foreign atom in their crystalline structures. The number of free carriers is therefore determined
by the characteristics of the semiconductor itself. In such type of materials, the number of
excited electrons and the number of holes are equal (n = p). In general, the population of
thermally excited free carriers in most intrinsic semiconductor materials at room temperature is
very low. Therefore, intrinsic semiconductor materials have high electrical resistivity and hence
low electrical conductivity [237]. Extrinsic semiconductors can be defined as modified intrinsic
semiconductors through adding impurity atoms which improve their number of free carriers and
therefore electrical conductivity. Depending on the desired carrier type, a selected impurity atom
(so-called dopant atom) can be added into the intrinsic semiconductor. Dopant atoms are atoms
of a different element which have either more or less valence electrons than the intrinsic
semiconductor. These dopant atoms can act as acceptors or donors to pure semiconductors.
Acceptor dopant atoms have less valence electrons than the replaced atoms in the host lattice.
Thus, they provide excess holes to the host resulting in increased hole carrier concentration,
thereby forming a p-type semiconductor. On the other hand, donor dopant atoms have more
valence electron than the replaced atoms in the intrinsic semiconductor lattice. These donor
atoms donate free electrons to the conduction band of the host material, lead to excess free
electrons to the intrinsic semiconductor and hence creating an n-type semiconductor [238].
General classification Specific examples
1- Elemental semiconductors Si, Ge
2a- III-V composite semiconductors GaAs, GaSb, AlP, GaN, AlAs, GaP, InP, InSb, InAs,
SiC
2b- II-IV composite semiconductors CdS, CdTe, CdSe, HgS, ZnO, ZnS, ZnTe, ZnSe
3- Alloys AlxGa1-xAs, GaAs1-xP, GaIn1-xAs1-yPy, Hg1-xCdxTe
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2.1.3. Fermi-Dirac Statistics and Fermi Level
Fermi-Dirac statistics or Fermi-Dirac distribution function can be applied to determine the
distribution of electrons over energy states in any solid state material. In the case of
semiconductor materials at thermal equilibrium, the electron energy distribution is described by
the law of Fermi-Dirac distribution function and therefore provides carrier concentration at a
certain temperature without external excitations such as electric field, pressure or light. At
certain temperatures, continuous thermal agitation leads to the excitation of electrons from the
valence band to the conduction band [239]. The density of electrons (the number of electrons per
unit volume) in an intrinsic semiconductor is determined by the electron density n(E) in an
incremental energy range dE [240, 241]. The electron density is also given by multiplying the
density of states N(E) which represent the density of allowed energy states per unit volume per
energy range by the probability of occupying that energy range F(E) as in the following
relations:
∫ ( )
∫ ( ) ( )
(2.1)
The integration limit is taken from the bottom of the conduction band (Ec) (which is taken to be
E = 0 for simplicity) to the top of the conduction band (Etop).
The probability of an electron to occupying an electronic state of energy E is given by the Fermi-
Dirac distribution function.
( )
( ) ⁄ (2.2)
where K is the Boltzmann constant, T the absolute temperature in Kelvin and EF is called the
Fermi energy or the Fermi level which is defined as the energy state where the probability of
being occupied by an electron is equal to one-half.
In the high energy region (i.e., E – EF ˃˃ KT), the probability of a state being occupied decreases
exponentially with increasing E and equation (2.2) can be approximated as:
( ) ( ) ⁄ (2.3)
Equation (2.3) is known as the Boltzmann approximation.
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In the low energy region (i.e., E – EF ˂˂ KT), the occupation probability of a state approaches 1.
Therefore, the low energy states tend to be fully occupied and equation (2.2) can also be
approximated with:
( ) ( ) ⁄ (2.4)
Also, in the low energy region, the probability of a state being occupied by holes is:
( ) ( ) ⁄ (2.5)
Figure 2.2 shows the Fermi-Dirac distribution function [241].
Figure 2.2 Fermi-Dirac distribution function plot [241]
It is very important to understand that there is only one Fermi level in a system at thermal
equilibrium. The F(E) is symmetrical around the Fermi level. When the number of energy states
in the conduction band is equal to the number of energy states in the valence band, and the
number of electrons in the conduction band is the same as the number of holes in the valence
band, the Fermi level will lie in the middle of the band gap. For an n-type semiconductor
material where the number of electrons in the conduction band is more than the number of holes
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in the valence band, the Fermi level will be closer to the bottom of the conduction band.
Similarly, for p-type semiconductor materials where the number of holes in the valence band is
more than the number of electrons in the conduction band, the Fermi level will be closer to the
top of the valence band. Figure 2.3 illustrates the location of the Fermi level for an intrinsic
semiconductor and n-type and p-type extrinsic semiconductors [241].
Figure 2.3 Location of Fermi level for intrinsic semiconductor and n-type and p-type extrinsic
semiconductors [241]
2.1.4. Semiconductors and Transparent Conducting Oxides
A subset of semiconductor materials, transparent conducting oxides have become of great
interest so far, due to their combining of high optical transparency and electrical conductivity.
Among TCOs, ITO is still the most extensively used material in daily optoelectronic
applications. The physical properties of semiconductors in general and TCOs in particular are
determined by the properties of the host crystal, the impurities and crystalline defects. Dopant
atoms which substitute for host crystal atoms introduce electronic states in the band gap energy
close to the conduction and valence band edges and hence determine the conductivity type of the
material as discussed previously. These so-called shallow level defects facilitate a wide range of
TCOs properties and their corresponding applications. However, foreign impurities along with
crystalline defects of the host which generate electronic states deeper in the band gap energy
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(known as deep level defects), can also modify the properties of the TCOs and therefore make
these materials unsuitable for their intended purposes. It is then important to control carefully the
doping level to fine-tune the required characteristics.
2.1.5. Electrical Properties of ITO Films
2.1.5.1. Carrier Concentration
Generally, the transport process in a polycrystalline structure is more complex than in a single
crystal structure. Thin films of ITO may consist of crystalline or amorphous phases or a mix of
them. In general, polycrystalline thin films have better optoelectronic properties than amorphous
ones [242]. This especially occurs when thin films are deposited on preheated substrates or after
annealing the amorphous thin films [243, 244]. In ITO thin films, introducing the Sn atoms leads
to reduce electrical resistivity if these atoms are thermally activated (i.e., diffusion of Sn atoms
from interstitials and/or grain boundaries to In sites), which increases the number of the free
electrons in the conduction band [245, 246]. However, for as deposited ITO films, this process is
not efficient enough at room temperature (RT). As a result, the resistivity at low substrate
temperatures is generally higher compared to In2O3 thin films because the Sn atoms can act as
scattering centres [247].
The electrical conductivity (σ) basically depends on both the concentration (Ne) and mobility (μ)
of the free carriers as follows:
(2.6)
where e is the electron charge.
Therefore, high carrier concentration and carrier mobility should be simultaneously considered to
obtain high conductivity ITO thin films. In2O3 acts as an insulator in its stochiometric form.
However, indium oxide can achieve high n-type doping levels (~ 1019
cm-3
) due to its intrinsic
defects (so-called oxygen vacansies (Vo)) if fabricated in its oxygen decient form. The
generation of oxygen vacancies contributes two free electrons to the In2O3 matrix as follows:
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( )
. Consequently, different electrical properties can be achieved
depending on the stoichiometry of In2O3 (i.e., without doping) [4].
Most research efforts have been directed to increase the electrical conductivity of In2O3 thin
films by increasing the number of free carriers via tin doping. Despite some success, this process
is self- limiting, especially when the dopant atoms occupy random sites in the host matrix (eg. at
the grain boundaries) which impair the carrier mobility while increasing the carrier
concentration. Therefore, achieving the lowest electrical resistivity is a trade-off between carrier
concentration and carrier moility. Johnson and Lark-Horovitz [248] deduced a relation for a
completely degenerate semiconductor as follows:
( ⁄ )( ⁄ ) ⁄ ⁄ ⁄ (2.7)
This relation shows that the carrier concentration and mobility are no longer independent.
Moreover, at high doping levels, the observed carrier concentration of ITO thin films is lower
than expected. This implies that some of the tin atoms remain electrically inactive.
2.1.5.1.1. Defect Models
As mentioned before, the free carriers for ITO films are due to two different defects; oxygen
vacancies and substitutional tetravalent tin atoms which govern and control the free carrier
density in the bixbyite structure. Frank and Köstlin [249] performed numerous experiments and
analyses on ITO films with different tin contents, synthesized via chemical vapor deposition
(spray pyrolysis) and treated in reducing and oxidizing atmospheres. Accordingly, they proposed
the formation of the following lattice defects.
A. Neutral defect (Sn2*Oi
")
This neutral defect is formed when two Sn4+
ions which are not on nearest neighbor
positions, are loosely bound to an interstitial oxygen anion. This interstitial defect
dissociates on annealing under reducing conditions and Oi may drift away:
( )
(2.8)
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(2.9)
B. Neutral defect (Sn2O4)x
This neutral defect is formed at high doping level when two nearest neighbor Sn4+
ions
are bound to three nearest neighbors on regular anion sites and an interstitial oxygen ion
on a nearest quasianion site. Here, the Sn-O bond is quite strong; hence, it is a
detrimental effect since it may not be reduced by heat treatment.
C. Defect (Sn2Oi)(Sn2O4)x
It is composed of both of the above defects including loosely and strongly bound extra
oxygen and it is a common phenomenon in very highly doped systems.
(
) ( ) ((
)( )
) (2.10)
D. Impurity ion-substitutional tin (Sn*)
Tin atom can act as a cationic dopant and substitutes the indium in the In2O3 lattice. Since
indium has a valence of three, the tin doping is providing an electron to the conduction
band, resulting in n-type doping of the lattice. Therefore, the overall charge neutrality is
preserved.
(2.11)
E. Oxygen vacancy VO**
The oxygen vacancies behave as doubly ionized donors and contribute two electrons to
the electrical conductivity as shown in the following relation:
( )
(2.12)
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Fabrication of ITO films in an oxygen-rich environment will lead to a film which is saturated
with oxygen. Increasing heat treatment will shift both equations (2.9) and (2.10) to the left,
resulting in free electrons, dissolving interstitial oxygen and substitutional Sn. Interstitial oxygen
(Oi) can effectively diffuse within the ITO matrix and reach the grain boundaries. At the grain
boundaries, absorbed oxygen (O2(a)) can be formed and desorbed. Depending on the ambient
conditions, the reactions can also be reversed.
2.1.5.1.2. Limitation of Free Carrier Density
The plot of free carrier density versus the doping concentration of Sn is shown in Figure 2.4.
Theoretically, maximum carrier density Ne due to only Sn doping in typical ITO thin film is Ne =
NIn c, where NIn = 3.0 10
22 cm
-3 the concentration of indium atoms and c is the concentration
of tin atoms. As seen in Figure 2.4 (curve a), at very low tin concentration (c < 4 at. %) the free
carrier density tracks a straight line, indicating that each substitutional Sn atom acts as a donor,
which donates one free electron to the ITO matrix. On the other hand, at higher Sn concentration,
the free carrier density rises up to a maximum at about 10 at.% tin, and then drops with further
increasing c following the relation Ne = NIn c (1 - c)
8 (curve b). This surmises that a portion of
the tin atoms are inactive at high doping level. This is because the higher the tin concentration,
the more possible the tin ions occupy the nearest-neighbouring anion sites, resulting in the
formation of a neutral defect (Sn2O4) as discussed previously.
Figure 2.4 Dependence of the free carrier density Ne on the Sn concentration c. Dots represent
experimental points; drawn curves represent (a) NInc, (b) NInc(1-c)8 [250]
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2.1.5.2. Free Carrier Mobility of ITO Films
2.1.5.2.1. Scattering Mechanism
For ITO thin films used as transparent conductive electrodes, it is essential to make a
compromise between optical transparency and electrical conductivity. Reduction of the electrical
resistivity consists of either an increase in the free carrier concentration or in the free carrier
mobility. However, increasing the first can also results in an increase in the visible absorption.
Therefore, increasing the mobility is very important for ITO thin films for high electrical and
optical characteristics.
The free carrier mobility µ can be defined as:
(2.13)
where me is the effective electron mass in the conduction band and is the average collision time
of electrons.
Weiher [251] and Groth [245, 252] were the first to report high Hall mobilities (160 and 170
cm2/V s) for single crystal In2O3 and zirconium doped In2O3, respectively. ITO thin films
mobility is strongly dependent on the disorder of the In2O3 structure and on the modification of
the network due to the tin doping process. Therefore, a strong scattering process on the free
carrier could occur at high doping concentrations. There are many sources of electron scattering
which may influence the mobility, such as ionized impurity scattering, neutral impurity
scattering, grain boundary and external surface scattering, acoustical phonon scattering, defect
lattice scattering, etc. In the case of ITO films, which have good crystallinity, the electron
scattering due to the structural disorder and dislocations is predicted to be less important and can
be neglected. The scattering by acoustical phonons seemingly is also of a little importance in
ITO films where there is no significant temperature dependence detected between 100 and
500⁰C. Furthermore, the free carrier mobility is not affected by surface scattering unless the
mean free path is comparable to the film thickness. However, for ITO films having small
crystallite size, grain boundary scattering is supposed to be an important factor which contributes
to decreasing the carrier mobility. It is well-known that grain boundaries act as sites for the
impurities and these sites act as scattering centers for free carriers. However, for a heavily
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degenerate semiconductor, the mean free path of electrons is much smaller than the crystallite
size. Hence, grain boundary scattering is perhaps insignificant at high carrier densities. Weijtens
[253] has reported that the mobility is mainly determined by grain boundary scattering when the
carrier density is below 7 1020
cm-3
. Kulkarni and Knickerbocker [254] also proposed that, for
polycrystalline materials, the grain boundary scattering may predominate at very high carrier
concentration (>1 1020
cm-3
) due to enhancement of the grain boundary potential.
2.1.5.2.2. Limitation of Carrier Mobility
Generally, the conductivity of practical transparent conductive oxides with relatively high free
carrier concentrations is intrinsically limited since the free carrier concentration and the mobility
cannot be independently increased. One important scattering mechanism that cannot be ignored
is scattering against ionized donor impurities. These ions are important for preserving charge
neutrality in highly doped thin films. However, the Coulomb interactions between the free
carriers and these impurities provide a source of scattering, which is intrinsic to the doped
semiconductors leading to reduced carrier mobility. This drastically affects the conductivity and
the optical transmission near the infrared edge. The contribution by ionized impurities to the
electrical resistivity is based on the Coulomb interaction and the relation below has been used by
many researchers to define the effect of these impurity scattering centers on the mobility
[ ( )
] [ ( ) ] (2.14)
Where N is the carrier concentration, ni is the density of impurities scattering centers, m* is the
electron effective mass, ɛ0 and ɛr are permittivity of free space and low frequency relative
permittivity respectively, Z is the charge of the ionized centers, ɡ(x) is the screening function and
h is Planck’s constant.
For metal oxides with high free carrier density, some absorption of incident radiation takes place
by interaction with the electron gas, which increases with increasing carrier concentration.
Therefore, at carrier densities greater than 2×1021
cm−3
, the TCO exhibits plasma frequencies
which shift to visible light from absorbing infrared wavelengths, and reduce the transparency in
the visible region. Recently, developed TCO materials, including un-doped and doped binary,
ternary, and quaternary compounds suffer from the above limitations. A few exceptional samples
have a resistivity of ≤1×10-4
Ωcm. However, it is difficult to approach a resistivity of 4×10−5
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Ω.cm because additional scattering processes result from grain boundaries, neutral impurities,
and other forms of structural disorder, which depend on the materials and the preparation
techniques [255].
2.1.6. Optical Properties of ITO Films
The optical properties of ITO films are governed and modified by the band structure and
defects. The spectral range of interest for the optical properties of ITO films lies between 200-
3000 nm, and it is controlled by three different kinds of electronic excitation in different spectral
regions. The electronic excitations include inter-band transitions from the valence band into the
conduction band, intra-band transitions for the free carriers within the conduction band and band
gap transitions. Consequently, there are three different regions that can be recognized for the
transmittance curve as follow:
Ultraviolet (UV) region: In this region, ITO films exhibit high UV absorption related to
interband transitions. This absorption is due to the fundamental direct band gap around 3.5 eV.
The band gap absorption (λgap), named the absorption edge, strongly depends on the preparation
technique [256], and it lies in the range of (3.5 - 4.1) eV. Manifacier et al. [257] observed that
the higher the free electron density, the shorter the wavelength of the absorption edge. When the
free electron density is very high the conduction band is partially filled up, thus the first
noticeable transition happens for higher photon energy. Therefore, the free electron density is a
crucial factor in defining the optical properties in this region.
Infrared (IR) region: In this region, the ITO films enter a reflecting area with a plasma edge or
plasma wavelength λp that is defined by reflectance = transmittance, with metallic properties
where the metal-like infrared reflectance equals the dielectric-like transmittance [250]. Classical
Drude theory can be used to explain the optical phenomenon in this region [258]. The absorption
process for the free carriers in this region is important for reflectance and transmittance of the
ITO films. Therefore, as in the UV region, the free electron density is a crucial factor in defining
the optical properties in this region as well.
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Visible region: In between the UV and IR regions (λgap and λp), there is a very high
transmittance region for around 90% of the visible wavelengths that depends on the preparation
conditions. Figure 2.5 shows the typical spectral dependence of transparent conductive oxides.
ωp and ωgap are the frequencies at which the plasma absorption and the band gap absorption takes
place, respectively. The wide optical band gap <3.5eV prohibits inter-band transitions thereby
making it transparent in this region. The transmittance window is defined by the absorption edge
toward the shorter wavelengths and by the plasma edge toward the longer wavelengths.
Figure 2.5 Typical spectral dependence of transparent conductive oxides
2.1.6.1. Optical Constants
The optical properties of the materials are defined by the complex refractive index ˂ n ˃ and the
complex dielectric constant (ε). The complex refractive index describes the velocity of light in
the medium (v) following the relation: n = c/v where c is the speed of light in vacuum (Eq.
2.15). The complex dielectric constant is given by equation (2.16).
(2.15)
(2.16)
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The relation between refractive index and dielectric constant is:
√ (2.17)
Where,
, (2.18)
and k is the extinction coefficient which describes the attenuation of light wave as it goes through
a material. k is directly correlated to the absorption coefficient (α) of a medium and is shown as:
(2.19)
where λ is the wavelength of light in vacuum.
The transmittance (T) is then given by:
(
) ( ) (2.20)
and
(
)
(( ) ) (( )
) (2.21)
no, n and n1 are the refractive indices of air, film and substrate, respectively and t is the film
thickness.
As for the optical spectra, the dielectric constant also consists of three regions. In the UV region,
the imaginary part of the dielectric constant increases sharply. In the visible region, the
imaginary part approaches zero and in the IR region, increases while, decreases until it
crosses zero at the plasma frequency and strongly reaches its negative value. Figure 2.6 shows
the complex refractive index and dielectric constant of an ITO film.
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Figure 2.6 Complex refractive index (left) and dielectric constant (right) of ITO thin films [145]
Table 2.2 Comparison of some important binary TCOs and their fabrication techniques and
relevant optoelectronic properties
Species Deposition method ρ ×10-4
(Ω.cm) T% Ref.
ITO PLD 0.77 85 [259]
ITO DC sputtering 1.5 92 [260]
ITO RF sputtering 1.29 85 [189]
ITO Sol-gel 3 80 [261]
SnO2:F CVD 5.2 80 [78]
SnO2:Sb RF sputtering 20 85 [234]
SnO2:N RF sputtering 9.1 80 [262]
ZnO:Al PLD 0.85 88 [85]
ZnO:Al RF sputtering 2 80 [86]
ZnO:Ga PLD 0.51 85 [84]
ZnO:Ga RF sputtering 2.7 85 [83]
TiO2:F PLD 16 95 [263]
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49
2.2. Sol-Gel Spin Coating Process, Fundamental, Theory and Advantages
2.2.1. General Overview
Many techniques have been proposed for fabricating high quality thin film coatings. But, these
generally fall into two main categories, depending on whether the process is physical or chemical
[264]. Physical vapor deposition produces a thin film coating by means of thermodynamic,
mechanical or electromechanical processes. Common physical deposition systems require a low
pressure environment along with a complicated controlling system to functionalize thin film
coatings properly. Examples of physical vapor deposition techniques include, thermal
evaporation, sputtering, electron beam evaporation, pulsed laser deposition and molecular beam
epitaxy [265]. Chemical deposition processes can involve gas-phase or solution-phase
precursors. Gas-phase precursor-based processes include chemical vapor deposition (often
involving a hydride or halide elements) and plasma enhanced chemical vapor deposition (using
ionized vapor as precursor). The solution-phase precursor-based process is also known as wet
chemical deposition, and the prepared thin films tend to be conformal. Examples of wet chemical
deposition processes include, electroplating, spray pyrolysis and sol-gel methods [242]. Among
these wet chemical processes, sol-gel is of great interest and widely used because of its low
temperature and ease of handling. In the next sections, the fundamental, theory and advantages
of the sol-gel process are discussed.
2.2.2. Sol-Gel Process
Fabricating thin film coatings via a sol-gel process represents the oldest application of this
technique. The first patent on sol-gel thin film formation was granted to Schott and Gen in 1939
for their dip coated silicate thin film. Sol-gel derived thin film coatings of: mirror coatings have
been in production since 1953, antireflection coatings since 1964 and design coatings since 1969
[266]. Over the past few decades, sol-gel thin film coatings have been widely considered for a
variety of additional applications including, optical coatings [267, 268], high and low dielectric
constant thin films [269], sensors [270], electro-chromic coatings [271], semiconducting anti-
static coatings [272], strengthening and protective layers [273, 274], superconducting films
[275], planarization and passivation layers [276] and ferroelectric coatings [277, 278]. The sol-
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50
gel process is mainly used for the production of uniform metal oxides thin film coatings using
metal alkoxides precursors. Samples fabricated via this process normally do not require
annealing temperature as high as those fabricated via conventional techniques such as sputtering,
thermal evaporation, chemical vapor deposition, to name a few. This makes the sol-gel process
suitable for fabricating samples that are unstable at high temperatures. Compared to other
conventional thin film fabricating techniques, this process requires considerably less equipment,
is generally very simple, cost effective and free of difficult technical challenges that may result
from using specialized equipment. This process also offers many other advantages [279]:
Low processing temperature that allows the use of volatile components.
The intimate mixing of the starting precursors, results in a high degree of coating
homogeneity.
Dopants can be easily introduced and controlled even at a trace level.
The viscosity and thereby the film thickness can be adjusted by adequate choice of
concentration, solvent, chelating agent, etc.
Large area sample coating along with desired thickness and composition are obtainable.
The sol-gel method can be classified based on the solvent type into two different routes, aqueous
and non-aqueous processes [280]. In aqueous sol-gel process, oxygen which supplied by water is
essential for the formation of metal oxide. The key aspects such as hydrolysis, condensation and
drying which are take place concurrently leading to some difficulties including, controlling the
particle morphology and reproducibility of the final protocol during the sol-gel process. In non-
aqueous sol-gel process, oxygen required for the formation of metal oxide is supplied from the
organic solvents such as ketones, alcohols, aldehydes and/or by the metal precursors. These
organic solvents not only supply the oxygen but also provide a versatile tool for controlling
many other parameters such as surface properties and morphology, crystallite size and
composition of the resultant metal oxide [281].
Non-aqueous process can also be divided into solvent- and surfactant- controlled approaches
[282]. Surfactant-controlled processes include the transformation of the precursor species into
the oxidic compound in the presence of stabilizing ligands in a specific temperature range of 250
to 350 °C. An alternative to surfactants is the use of organic solvents that act as reactant as well
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as control agent for particle growth, enabling the synthesis of high purity nanomaterials in
surfactant-free medium. In comparison to the synthesis of metal oxides using the surfactants, the
solvent-controlled approaches are simpler because the initial reaction mixture only contains the
metal oxide precursors and a common organic solvent. The synthesis temperature is in the range
of 50 to 200 °C, which is also lower than in the surfactant-controlled routes. Despite solvent-
controlled approaches result in some agglomeration, the dispersibility properties of the
nanoparticles can be improved by post-synthetic steps [283].
Preliminary syntheses are often carried out under ambient conditions, usually without any special
environment. Initial precursors are mixed together in a solution and interact easily to form a
homogeneous mix [284]. This process comprises the conversion of a colloidal solution of
molecular precursors via chemical reactions to a sol or gel through drying followed by post
annealing at high temperature. This assists the transformation of formed sol/gel into a
polycrystalline structure thin film [285]. Typical sol-gel processes for thin film coatings
fabrication consist of three main steps: (a) preparation of the precursor solution, (b) depositing of
the prepared solution onto the substrate and (c) annealing the xerogel film. The xerogel is
defined as the dried gel at ambient conditions, while the aerogel is the dried gel in supercritical
conditions [286].
2.2.3. Sol-Gel Chemistry
The sol-gel process comprises the use of metal-organic or solid inorganic precursors in a solvent
which forming a colloidal dispersion. The precursors are hydrolyzed and condensed in the
organic solvent resulting in inorganic polymers that consist of oxo (M-O-M) bonds. For many
inorganic precursors, the hydrolysis proceeds via a proton removal from an aquo ion
[M(OH2)n]z+
resulting in the formation of an oxo (M=O) or hydroxo (M-OH) ligand (M=metal)
[287]:
[ ] [ ]
( )
(2.22)
Condensation reactions of hydroxo ligands give rise to the formation of inorganic polymers in
which metals are bridged by oxo (M-O-M) or hydroxyl (M-μ(OH)-M) bonds [12]. The most
often used metal organic precursors are metal alkoxides M(OR)z, where R is an alkyl group
CxH2x+1. Usually the alkoxide is dissolved in alcohol and hydrolyzed by adding water under
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52
acidic, neutral or basic conditions. Hydrolysis leads to the substitution of an alkoxide ligand by a
hydroxyl ligand [12]:
( ) ( ) ( ) (2.23)
Condensation then follows a similar pattern to that of hydrolyzed inorganic precursors. Basically,
the preparation of a sol-gel solution consists of the use of metal organic or inorganic precursor,
aqueous, organic and/or alcoholic solvent, along with the addition of an acid/base as a catalyst
[288]. The structure of the growing polymers for both metal-organic and inorganic precursors
depends on the functionality of the metal and the degree of hydrolysis [289].
2.2.4. Film Formation
Several deposition options for sol-gel technique include dip-, spin-, spray-, roll- and flow-coating
used to manufacture various materials in different forms: powders, fibers, monoliths and/or thin
films [290]. Dip-coating and/or spin coating are the major processes adopted for manufacturing
coatings via the sol-gel technique. Additionally, the sol-gel process facilitates the fabricating of
multi-component film coatings with a complex structure [291].
2.2.4.1. Dip-Coating Process
After preparing the desired precursor solution, the substrate is dipped vertically into the solution
for a certain time (dwell time). Then the coated sample is withdrawn slowly and steadily. Both
the dipping rate and withdrawal rate are to be considered and maintained in the film fabrication.
The withdrawn sample is dried for a short period of time on a hot plate or in a conventional oven,
and then the coating procedure repeated until the desired thickness is achieved. Finally, thermal
treatment is applied on the coated sample. Therefore, the sol-gel dip-coating process can be
summarized in the following main stages: substrate preparation, sol preparation, dipping,
withdrawing the coated sample and annealing.
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2.2.4.2. Spin Coating Process
Spin coating is the predominant process employed for fabricating homogeneous and uniform thin
film coatings with thicknesses of the order of nanometers or micrometers. The first attempts of
the spin coating process were performed by Emslie and co-others [292] who considered the
spreading of an axisymmetric thin film coating of Newtonian sol onto a flat substrate spinning
with a constant angular velocity. Usually, the coating material is applied onto the substrate in the
form of a sol from which the solvent vaporizes [293]. In this process, centrifugal force spreads
the solution radially outward while the surface tension and viscous force result in a thin film to
be retained on the planar substrate. The spin coating process can be classified into four major
steps including, deposition of the sol, spin up, spin off and film drying [294]. The deposition of
the sol, spin up and spin off occur consecutively, while the drying step occurs throughout the
process. Figure 2.7 shows the main steps of spin coating process.
Figure 2.7 The main steps of spin coating [295]
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2.2.4.3. Deposition of the Solution via Spin Coating
Different techniques have been used to apply the solution onto the substrate and depend on the
type of spin coating machine. Some machines have specific electronic injectors where the
amount (volume) of solution can be controlled and maintained while the others are use syringes
or dropers for this purpose. In the deposition step, the solution can be applied in different ways
[296]:
(1) As a bolus on the center of the substrate with the solution flowing over the rest of it.
(2) In the form of heavy rain that floods the substrate.
(3) As a continuous stream at the center of the substrate with the solution spreading outward over
the substrate.
(4) As a continuous stream from a raised distribution port that moves radially over the substrate.
The different ways for applying the solution onto the substrate depend on the concentration and
viscousity of the sol, which can be achieved either by pouring the sol onto the substrate for a
period of time before spinning or introduce the sol while the substarte is rotating at a constant
angular velocity. In both cases the amount of solution deposited is such that the substrate top
surface receives a high enough excess of the solution to be completely covered [297].
2.2.4.3.1. Spin Up
This stage starts when the substarte accelerates up to the final desired rotation velocity resulting
in an aggressive sol rejection from the substrate. Spiral whirlpools may exist during this step due
to the initial depth of the sol on the surface of the substrate. These spiral whirlpools form because
of the twisting motion caused by the inertia that the top of the sol layer wields while the substrate
below rotates very fast. Eventually, the resultant film thickness is thin enough and completely
uniform and homogenuous to be co-spinning with the substrate at the desired speed, where the
viscosity balances the spinning accelerations. The final film thickness is found to be independent
of the way of sol dispensing, the amount of sol applied to the substrate and the acceleration level
of the substrate to the final rotating velocity [298, 299]. The resultant film thickness might
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depend on the aforementioned conditions if the amount of sol is insufficient to fully cover the
substrate surface or if the substrate accelerates slowly [300]. Due to the importance and
complexity of the spin coating process, a huge effort has been focused on establishing
experimental relationships that describe the dependence of spin coating technique on process
factors. The main result of these studies was that the final film thickness (t) was found to be
proportional to a function of the initial solvent concentration and the power of the spinning speed
[301, 302] as seen in the following relation:
( ) (2.24)
where C0 is the initial solvent concentration, ω is the spinning speed and b was found to be -1/2
and it depends on the viscosity level and evaporation conditions.
2.2.4.3.2. Spin Off
This step starts when the substrate is rotating at a constant speed and the viscous force dominates
the sol thinning behavior. The centrifugal force works to drive the sol outward off the edge of the
substrate obstructed only by the viscous force. The radial drift rapidly decreases because the sol
becomes very thin and solvent evaporation increases the viscosity by several orders of
magnitude. Therefore, it is convenient to describe the spin coating process by two discrete
mechanisms with an abrupt conversion from pure centrifugal sol-drift sol flow to pure solvent
evaporation [293, 303-306]. The idea behind this separation is that the film thickness is
controlled first by the centrifugal force and second by the solvent evaporation [295, 307] due to
the strong concentration dependence of the viscosity, the solvent evaporation may play an
important role through the flow dominated system. It was reported by Jenekhe [308] that the
main effect of solvent evaporation is through altering rheological characteristics of the regime.
2.2.4.3.3. Drying of the Film
This step starts when the spin off step ends. Through this step, the centrifugal solution out flow
halts and further shrinkage of the film arises due to solvent loss alone. As mentioned before, the
solvent concentration profile depended on solution convection flow, the cross term in the solvent
conservation equation (see Eq. 2.23). Nevertheless, the solvent conservation could be considered
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56
independently when the spinning speed reaches zero and the solvent concentration profile
dependence becomes unimportant. At this stage, the solvent evaporation rules the film thinning
behaviour. Through the drying step, the dissolved or suspended materials become concentrated at
the surface of the sol so as to produce a low diffusivity, high viscosity or solid skin. This leads to
the formation of a thin film onto the substrate.
2.3. ITO Thin Films Synthesis
Thin ITO films preparation consists of four main steps: (1) preparation of the glass substrates, (2)
sol-gel solution preparation, (3) thin film deposition and (4) thermal treatment at different
temperatures of the deposited thin films. Soda-lime glass substrates were used in this study,
which were cleaned carefully by using ethanol and DI-water and then sonicated in an ultra-sound
bath. The concentration of ITO solution was maintained at (In:Sn = 90:10 at.%) in preparing all
pure, doped and incorporated ITO thin films. Details of thin film deposition process (spinning
speed and spinning time) using a Polos spin-coater was varied based on the type of dopant and/or
incorporated materials used with ITO. In general, the deposition steps consist of: dispensing the
prepared solution onto rotated substrate, spreading the solution and drying the thin film, followed
by the calcination of the thin films on a hot plate at a suitable temperature. These steps were
repeated until the desired film thickness was achieved. Annealing was performed on the resultant
thin films. Details of the specific experimental conditions for fabricating ITO based transparent
thin film coatings are provided in subsequent chapters. Figure 2.8 shows the flow diagram of the
sol-gel spin-coating procedure.
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In(NO3)3.5H2
O
Ethanol
Refluxed separately
Mixed and refluxed
SnCl2.2H2O
Doping or
incorporating
material
Ageing for 24 hours
Film deposition by
spin-coater
Drying
Post annealing
Resulted thin films
Figure 2.8 Flow diagram of sol-gel spin-coating process
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2.4. Instrumentations and Characterizations Techniques
Since nanoscale materials are quite different from their bulk counterparts, high precision devices
and instruments are needed to study, quantify and characterize these kinds of materials. The
crystalline structure and film coating surface were confirmed by XRD, XPS and EDX, whereas,
the surface morphology and topography were imaged by SEM, FESEM and AFM. The electrical
properties were investigated by using 4-point probe method and Hall-effect measurements, while
the optical properties were characterised by UV-VIS spectroscopy. The mechanical properties
were determined by a nanoindentation technique. The instruments and the characterisation
techniques used in this study will be briefly discussed in the following sections.
2.4.1. XRD Measurements
XRD is one of the oldest and most effective analysis techniques for investigating the
crystallographic and atomic arrangements in a crystal structure [309]. X-ray wavelengths are
found to be of the same order of magnitude as the lattice constants of the crystals [310]. XRD is
a non-destructive tool which works basically on the interaction between the periodical crystal
lattices and the incident monochromatic X-ray radiation. This interaction happens when the X-
ray beam with a certain specific incident angle (θ) and wavelength (λ) hits the surface of a
crystalline specimen yielding a reflected radiation pattern. Therefore, intense peaks (which are
known as Bragg peaks) are produced from the reflected radiation. Bragg expressed this result by
suggesting that each crystal generally consist of discrete parallel planes separated by constant
distance named as inter-planar d-spacing. It was assumed that, Bragg peaks occurred if the
reflected X-ray radiation from different crystal planes interfered constructively according to
Bragg’s law [311].
(2.25)
where n is an integer determined by the reflection order, λ is the wavelength of the incident X-
ray radiation, d is the inter-planar distance (d-spacing) and θ is the angle between the incident
radiation and the surface of the specimen which is also called (Bragg’s angle). Figure 2.9 shows
the incident and the scattered X-ray radiation.
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Figure 2.9 Incident and scattered X-rays in XRD analysis [309, 312]
It is believed that most materials are not single crystals but consist of billions of small crystallites
randomly orientated and are referred to as polycrystalline structures or powder form. Therefore,
when these materials are examined by X-ray radiation, many inter-atomic planes from different
crystallites will be realized. However, the diffraction from each plane will take place at specific
diffraction angles (θ).
2.4.1.1. Analysis of XRD Data
The value of 2θ is estimated for each diffraction peak after the XRD pattern appears and the d-
spacing (dhkl) values calculated from 2θ values via Bragg’s law. These values are used to derive
crystallographic parameters of thin films such as, identification of phases, calculation of the
crystallite size, lattice parameter determination, etc.
2.4.1.2. Identifications of Phases
The XRD technique has proven itself a powerful tool to identify the phases of elements,
compounds and materials, as well as, provide important information on the dimensions of the
unit cell. In a crystalline structure, electrons cause a scattering to the incident X-ray radiation
resulting in XRD pattern with maxima and minima peaks following Bragg’s law. From the XRD
pattern, the position and the intensity of the peaks, the characteristics of crystal structure and
atomic composition of material can be determined. By comparing the positions of Bragg’s peaks
with standard crystalline XRD cards, the phase identification and existence of multiple phases in
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a compound can be established and quantified. Furthermore, the XRD approach can also afford
precise results for lattice parameters, unit cell volume, constituents of the coatings and crystal
symmetry with atom positions.
2.4.1.3. Determination of Crystallite Size from XRD Data
The Debye-Scherrer equation is derived from Bragg’s law and can be used to calculate the
crystallite size as follow:
(2.26)
where, K is Scherrer constant (constant of proportionality) which is depends on the shape of the
crystal, β full width at half maximum (FWHM) of Bragg peak and λ wavelength of X-ray beam.
2.4.1.4. Determination of Lattice Parameter
The lattice parameters of a crystal structure can be easily calculated by using Bragg’s law to
determine dhkl value, the standard Bravias lattice relation for a cubic system and Miller indices
(hkl) related to the reflection orientation as follow:
(2.27)
where λ = 0.154 ± 10-5
nm for Cu K radiation source, d inter-planar spacing and a lattice
constant
2.4.1.5. X-ray Diffraction Measurements Technique
The X-ray diffraction data can be obtained by either reflection or transmission geometry. In this
study, the XRD data was collected using a GBC EMMA X-ray Diffractometer supplied with
LynxEye detector which collects the data in reflection mode. The XRD analysis was conducted
at room temperature using a Cu-Kα radiation with a primary beam power of 35 kV and 28 mA.
Cu-Kα primary beam radiation has a wavelength of 1.5406 Å. The fundamental diffraction peaks
of the samples were measured over a 2θ range from 20° and 70° with a step size of 0.02° and a
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scanning rate of 2°/min. Both receiving and divergence slits were used to control the output
intensity and the irradiated beam area from the sample. In order to get parallel X-ray beams, two
solar slits were used; one after the tube and the other in front of the detector. QualX program was
used for the XRD analysis in this study by inquiring the PDF-2 and PDF-4 databases and the
new freely POW-COD database which has been developed by the authors of QualX program.
The POW-COD database was generated based on the structure information contained in the
Crystallography Open Database.
2.4.2. X-ray Photoelectron Spectroscopy (XPS)
XPS is well known as a powerful surface analysis tool that yields information over 5 – 10 nm
probing depth, making it an accurate surface analysis technique. For instance, XPS analysis
offers detection limits of 0.2-0.4 at.% for nitrogen, oxygen and carbon, 0.03 at.% for lighter
transition metals and 0.001-0.005 at.% for heavy metals [313]. XPS is based on the photoelectric
effect to investigate the electronic structure and the chemical composition of sample materials. It
was first developed by K. Siegbahn and his research group in mid the 1960s. The fundamental
idea of XPS phenomenon is the discharge of electrons from a surface which has been bombarded
by energetic photons. Due to the short range of photoelectrons released out of bombarding
surface, XPS is considered a highly sensitive surface analysis technique. XPS analysis is also
defined in some literature as electron spectroscopy for chemical analysis (ESCA). XPS is the
most common surface analysis technique to determine the chemical and electronic bonding states
and the elemental composition of surfaces. XPS surface analysis is made by using soft X-rays
(i.e., monochromatic photons of energy (~200 - 2000 eV) to investigate the inner shell (core
level) electrons. The most widely used X-ray sources are Al Kα radiation (hν = 1486.6 eV) and
Mg Kα radiation (hν = 1253.6 eV). By illuminating the atoms of a surface, placed in an ultrahigh
vacuum system, by a monochromatic soft X-ray photons, a photoelectron in an inner shell is
ejected with a kinetic energy (Ek) expressed by the following relation [314]:
(2.28)
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where is the kinetic energy of X-ray photon, is the binding energy of the orbital from
which the electron is ejected and is the work function of the sample. The emitted
photoelectrons are moved through a hemispherical photoelectron energy analyser with energy
governed by electrostatic fields prior to hitting the detector.
A typical XPS spectrum is obtained by plotting the electron count rate (y-axis) versus binding
energy (x-axis). The specific binding energy indicates the element while the intensity of the peak
is related to the concentration of the element in the specimen. Each element has a specific
binding energy that relates to each core atomic orbital, resulting in a series of separate peaks in
the photoelectron spectrum [315]. The composition of the sample can be obtained by utilising the
peak height and the peak area, while the variations in the oxidation states and/or the structural
configuration of the elements can be recognized by noting the shifts in the binding energies of a
particular core level. Therefore, the elemental identity, elemental composition, chemical states
and electronic states of the studied surface area of the sample can be analysed by the XPS
technique.
2.4.2.1. Applications of XPS Technique
XPS analysis technique is mostly used in different types of material characterizations including:
- Identification of the stoichiometry of the coatings,
- Changes in surface composition of materials due to absorption, heating and radiation,
- Detection of surface contamination,
- Identification of the interface properties of nanomaterials,
- Studying multilayer film structure,
- Identification of material corrosion and degradation,
- Identification of interface reactions and diffusions, and
- Determination of the problems of protective coating caused by segregation of materials.
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2.4.2.2. Experimental Procedure of X-ray Photoelectron Spectroscopy (XPS) analysis
XPS measurements were carried out via a kratos axis ultra-X-ray photoelectron spectrometer
installed at Curtin University. The samples were mounted horizontally on steel sample holders
using double-sided sticky copper tape and the probed surfaces were normal to the electrostatic
lens. A charge neutralizer was used to balance the electron shortage on the sample surface during
the measurements. The analyser entrance and electrostatic lens mode of the XPS machine were
set to slot mode and hybrid (Irs = 0.6 and aperture = 49), respectively. The background pressure
of the analyser chamber was less than 10-9
Torr, which was maintained during data collection.
The voltage and current of X-ray beam radiation were 12 kV and 12 mA, respectively. Primary
survey scans were probed with pass energy of 80 eV, while high resolution scans were carried
out with pass energy of 10 eV and step size of 0.1 eV.
The peak positions in XPS spectra are affected by both the sample surface and the spectrometer
conditions. Therefore, calibration of the binding energy before XPS peak identification is
important to overcome the charging effects. This is commonly done by using the C 1s peak of
saturated carbon (C-H or C-C) at a binding energy of 284.6 eV. The conducted XPS data was
analysed via CASA XPS software (version 2.3.15) with Shirley background subtraction.
2.4.3. Scanning Electron Microscopy (SEM), Energy Dispersive Spectroscopy (EDS) and
Field Emission Scanning Electron Microscopy (FESEM)
Scanning electron microscopy (SEM) analysis is one of the most powerful electron microscope
techniques. SEM images materials having microscopic structure by scanning the surface of the
specimen with much greater depth and much higher resolution than confocal microscopes. This
technique is used to image the morphology and the surface microstructure by scanning the
surface of the sample with a well-focused high energy electron beam. Based on the interactions
between the primary electron beam, which is generated from an electron gun or filament and the
sample, a number of signals such as secondary electrons, back scattering electrons and X-rays
will be produced [316]. Both secondary electrons and back scattering electrons are of great
interest because they provide information about the microstructure and the morphology of the
scanned area. A photomultiplier detector is used to detect and record these signals to regenerate
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an image for the surface of interest which is displayed on a screen. Figure 2.10 shows a
schematic diagram of SEM technique.
Figure 2.10 Schematic diagram of SEM technique with the CRT screen [316]
Both elemental compositions and thickness of a thin film deposited on a substrate can be
accurately determined by measuring different X-ray intensities at various accelerating voltages.
When the accelerated electron beam interacts with atoms in a sample, the energy generated by X-
rays is dependent on the atomic structure. In other words, each atom shows a characteristic X-ray
emission spectrum. Therefore, these X-rays are characteristic of the elements present in the
sample. Also, these rays can be separated in the energy spectrum to identify the elemental
composition of the sample. This phenomenon is known as Energy Dispersive X-ray spectroscopy
(EDX). This technique provides quick analysis of the elemental composition of the sample
because a spectrum in the range of 0.1 to 20 KeV can be recorded in a short time (10 ~ 100 s).
2.4.3.1. Experimental Technique of SEM
SEM has been widely used in elemental and morphological analysis of materials. It also provides
very clear images of samples that are outside the capabilities of commonplace microscopes. An
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SEM image is generated by a focused electron beam which hits and probes over the surface of a
sample. The most important advantage of SEM is its ability to form three-dimensional images
due to its great depth of field which can reach the order of micrometres at 104 × magnification.
Also, the SEM technique is relatively simply operated and maintained, compared with
transmission electron microscopy (TEM). In the present study, a JCM-6000 scanning electron
microscope supplied with an EDX analysis column was used to determine thin film thicknesses
and the elemental compositions of the samples.
FESEM is similar to a SEM instrument, except that the FESEM is supplied with an extra field
emission cathode in the electron gun. The electrons ejected from the cathode are accelerated by
high electric field then focused and deflected by specific electronic lenses in a high vacuum
column yielding a narrow beam that hits the specimen surface. Accordingly, secondary electrons
are released from the specimen with velocities and angles related to the surface structure of the
specimen. The FESEM technique provides better images compared with SEM due to the sharper
probing beam at high and low electron energy, yielding both enhanced resolution of the image
and minimising the damage and charging of the sample [317]. In this work, surface
morphologies of synthesized thin films were examined via a PHILIPS XL 20 SEM equipped
with a Zeiss Neon 40EsB FESEM with a maximum extra high tension (EHT) voltage field
emission gun of 30 kV. SE2 detectors and InLens were used to obtain FESEM images at
different magnifications. For FESEM analysis, samples were mounted on a sample holder using
double-sided carbon tape and coated with platinum (3 nm thick) to minimise the charging effect
prior to imaging.
2.4.4. Atomic Force Microscopy (AFM)
Atomic force microscopy is a common and powerful tool to image and analyse the roughness
and topography of coating surfaces. In comparison with the optical and electron microscopes that
image the coating’s surface, AFM involves measuring the deflection of a sharp force-sensing tip
in contact with the surface. This sharp tip is usually made from Si or SiN. The changes in the
coating’s surface contours result in moving the cantilever vertically (i.e., z-axis) for each (x, y)
point. A four segment-photodiode detector is used to monitor the changes in the deflection of the
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cantilever and these changes are recorded and processed by computer to create a topographic
image for the coating’s surface [318].
In this study, the AFM images of the fabricated thin films were obtained via a Bruker Dimension
(Santa Barbara, CA) fast scan atomic force microscope. The thin films were mounted on
adhesive tape prior to AFM scans, and the images were performed in tapping mode using a
standard tapping mode probe (type NCHV with resonant frequency of 300 kHz and spring
constant of 40N/m).
2.4.5. Raman Analysis
Raman spectroscopy is a common vibrational spectroscopy technique that is used for material
characterization. It provides specific structural information at the atomic scale on organic and
inorganic compounds [319]. Raman Effect, discovered by C. V. Raman in 1928, is based on the
phenomenon of electromagnetic radiation scattering (Raman scattering) by molecules of the
material [320]. When a photon of light of single wavelength interacts with a molecule in a
sample, the photon may be absorbed and/or scattered. The absorption process occurs when the
resonance condition is satisfied (i.e., the energy of the incident photon and the energy difference
between two states of the molecule are equal), and transitions between these states are
accompanied by a change in the dipole moment of the molecule. Photons which are not absorbed
will be scattered elastically and/or in-elastically. Elastic scattering occurs if the scattered photon
has the same energy (frequency) and therefore, wavelength as that of the incident radiation. This
phenomenon is commonly known as Rayleigh scattering [321]. Inelastic scattering, referred to as
Raman scattering, occurs when the energy of scattered and incident radiations are no longer
equal. In Raman scattering, the molecule may either lose energy, or gain energy from the photon
of light. When the scattered photon has energy lower than the incident photon, this phenomenon
is known as Stokes Raman scattering. Conversely, when the scattered photon has energy higher
than the incident photon, this phenomenon is known as anti-stokes Raman scattering. When a
molecular vibration encourages a change in the polarizability of molecule’s electric field,
vibrational Raman scattering takes place [322]. The selection rules for Raman active vibrational
modes are related to molecular symmetry and enable detection of vibration modes which alter
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the polarizability of the molecule. A Raman spectrum can be obtained by plotting the intensity of
Raman scattered photon versus its frequency difference from the incident photon (Stokes-shifted
frequencies). This difference in frequency is referred to as Raman shift, which is independent of
the frequency of incident photon. Frequency shifts between the Raman scattered photons and the
incident photon relate to the vibrational energy levels of the crystal and/or molecule. Several
parameters such as symmetry of the crystal, molecular geometry, structural disorder, crystal
strain, atomic mass, bond order, local environment and atomic environment may affect the
vibrational energy. Therefore, Raman spectroscopy can help to investigate the crystal lattice
vibrations, intra-molecular vibrations and other types of motions of extended solids [322].
2.4.5.1. Experimental Technique of Raman Analysis
In this study, Raman analysis was conducted using a Nicolet 6700 Fourier transform infrared
(FT-IR) spectrophotometer equipped with NXR FT-Raman module. Raman spectra were
collected using a Helium-Neon (He-Ne) monochromatic laser with 1064 nm excitation
wavelength and 0.204 W operation power, CaF2 beam splitter, InGaAs detector with 90°
detection angle, optical velocity of 0.3165, gain of 1, aperture of 150, and 16 scans with
resolution of 8 cm-1
in the range of 0 - 4000 cm-1
.
2.4.6. Optical Properties of Thin Films
The optical characteristics of TCO thin film coatings are very important in optoelectronic
applications. Thin film coatings are classified as transparent if they show a typical transparency
greater than 80% in the entire visible range of the electromagnetic spectrum. Transmission or
transparency is defined as the ratio of transmitted light to the incident light. The optical
properties of a solid can be categorized into three phenomena named as transmission, reflection
and absorption [323]. These interactions depend on the nature of the solid matter and the
wavelength of the incident light. The amount of light transmitted mainly depends on the
reflectivity from the front and back surface as well as the way the light is absorbed within the
medium [324]. The optical properties of ITO thin films prepared in this study were characterized
by means of optical transmittance measurements. The main optical properties included optical
band gap energy and optical constants such as refractive index, extinction coefficient and
dielectric constant that cannot be directly obtained from the measurements.
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2.4.6.1. Measurements of Optical Transmittance via UV-Vis Spectroscopy
In this study, a Perkin Elmer lambda 650 UV-Vis spectrophotometer was used to collect the
transmittance data of the prepared thin films. This instrument consists of a double beam light
source, double monochromators with a diffraction grating, ratio recording optical system and
detector (photodiode). A halogen lamp is often used as the radiation sources to cover the working
wavelength range (190 - 900 nm). All reflecting optical components of this instrument are coated
with silica (SiO2) for durability. Prior to each optical measurement, light intensity calibration
was performed and comprised in taking a baseline spectrum without sample in the measurement
chamber (air blank) then uncoated substrate was also measured as a reference. This calibration
process facilitates the suppression of residual noise. The transmittance spectrum of the film
coatings at a desired wavelength was then conducted and compared with the reference one
(uncoated substrate). For a transmission measurement, the coated side of the sample was
irradiated by incident monochromatic light perpendicular to the sample surface. The optical
transmittance data presented in this study consists of the transmittance of both the thin film
coating and the substrate.
2.4.6.2. Band Gap Calculations
Transmission data can be used to determine thin film optical band gap energy. Jan Tauc
reported that the transmittance data of a thin film coating can be used to calculate the absorption
coefficient (α) of a coating along the entire wavelength. Plotting (αhυ)1/n
versus photon energy
results in a Tauc plot, which shows the linear drop of the absorption edge. The value of n
depends on the type of electron transition whether it is direct (n = 1/2) or indirect (n = 2). By
extrapolating the linear part of Tauc plot toward X-axis, the optical band gap energy is obtained
[37]. Figure 2.11 shows a typical Tauc plot for estimating the band gap energy.
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2.4.7. Electrical Properties of Thin Film Coatings
The electrical performance of the thin film coating is evaluated by means of electrical resistivity
(given in Ω.cm) or sheet resistance (given in Ω/sq.) of the film. Figure 2.12 shows the geometry
defining the sheet resistance of a thin film with thickness t. The sheet resistance is then given by
the following relation [325]:
(2.29)
where t is the film thickness and A is the effective cross-sectional area (A=b×h).
t
b
I
b
3 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4
Photon energy (eV)
( 𝛼 𝑣) ( 𝑐𝑚 𝑒𝑉
)
Figure 2.11 Typical Tauc plot for estimating the band gap energy of a thin film
Figure 2.12 A geometry defining the sheet resistance calculation
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Electrical conductivity is the inverse of resistivity (σ = 1/ρ) and is expressed in Siemens per
meter (S/m). In this study, the electrical properties including resistivity, conductivity, carrier
concentration and Hall mobility of the synthesized thin films were investigated by means of four-
point probes and Hall effects measurements. Since the electrical properties of the material are
temperature dependent, all the electrical measurements adopted in this work were carried out at
room temperature.
2.4.7.1. Four-Point Probes Measurements
The 4-point probe system is a powerful tool commonly used to measure the electrical resistivity
and sheet resistance of semiconductor materials. Compared to traditional 2-point probe, 4-point
probe gives more accurate results of material resistivity because it eliminates the contact and
probe resistance. This device generally comprises of four uniformly spaced probes organized in
linear configuration (see Figure 2.13). The spaces between each two neighbouring probes are
1mm. An electric current is passed through the two outer probes, while the voltage recorded
from the two inner probes, which allows the measurement of the film resistivity, provided the
thickness is known. The electrical resistivity is given by the following relation:
( ) (
) (2.30)
where t is the film thickness, V is the voltage across the inner two probes and I is the current
passed through the outer two probes. For accurate resistivity measurements, the four probes must
perfectly attached the film surface and the contact diameter should be smaller than the spaces
between the probes [325].
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Figure 2.13 Configuration of four point probes measurements [326]
2.4.7.2. Hall Effects Measurements
Hall effect is one of the most commonly used methods for characterizing electrical properties of
thin film coating and materials including charge carrier concentration, carrier mobility and type
of conductivity ( n- or p- type). The Hall Effect is the product of a transverse voltage difference
(Hall voltage VH) resulting from the deflection of the charge carrier by Lorentz force, when an
electric current flows through a conductor placed in a magnetic field [327]. The current and
magnetic field are perpendicular to each other and the resultant Hall voltage is perpendicular to
both of them. Figure (2.14) shows the scheme of Hall Effect. The sign of the Hall voltage,
whether it is positive or negative, reflect the induced Lorentz force direction as well as the carrier
type. The Hall voltage is expressed by the following relation:
(2.31)
where I and B are respectively the electrical current and the magnetic field, n is the carrier
concentration (density), e is the electron charge and t is the film thickness.
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Figure 2.14 A schematic diagram of Hall Effect measurements [279]
Therefore, by calculating VH from identified values of B, I, q and t, the carrier concentration can
be determined. The Hall mobility is given by the following relation:
(2.32)
where Rs is the sheet resistance, which is determined via four-point probe.
Thus, a combination of Hall measurements and resistivity is needed to obtain both the carrier
concentration and hall mobility. This is known as the Van Der Pauw method [241].
2.4.8. Mechanical Characterization: Nanoindentation Measurements and Finite Element
Modeling (FEM) of Thin Film Coatings
Determination of the mechanical characteristics of different types of thin film coatings are very
important for many electronic and optoelectronic systems. Mechanical characteristics including
hardness (H) and Young’s modulus (E) can identify strengthening and deformation mechanisms
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73
on a small scale [328]. In addition, the hardness and Young’s modulus are important aspects to
estimate the wear resistance of thin film based transparent conductive materials. The stability and
the performance of thin film coatings could be maintained by monitoring the wear resistance
behaviours of the film coatings [329]. Nanoindentation is a well-established technique performed
to investigate the mechanical properties of thin film coatings at a nanometre scale. A load (P) is
applied through a diamond head, initially in contact with the film surface. Both load and
penetration depth or displacement (h) are controlled during the loading and un-loading
measurement processes, and the penetration depth of the diamond head into the film coating is
recorded, along with the applied load. Different parameters such as hardness, Young’s modulus,
residual stress and fracture toughness can be investigated from the load-penetration depth curve
(P-h curve) [330]. The most important part in the nanoindentation system is the indenter which
has to have well-known geometry and high precision. Most nanoindentation systems use a
diamond indenter with specific geometry such as flat-ended cylindrical, spherical or sharp. Of
these, the sharp indenter (including Vickers, cube corner and Berkovich) is preferred, especially
for nano and micro-scale measurements of thin films.
Oliver and Pharr proposed that the hardness and Young’s modulus could be determined directly
from a set of indentation load and penetration depth (p-h) measurements, recorded in both
loading and unloading modes without the need to image the hardness impression [331]. Three
important quantities can be estimated from the p-h plot: maximum load (Pmax), the maximum
displacement (hmax) and elastic unloading stiffness (S) (also known as the contact stiffness),
which is represented by the slope of the higher part of the unloading curve within the early stage
of unloading (See Figure 2.15). The hardness which is defined as a measure of how resistant a
solid is to deform permanently under an applied compressive force can be calculated by the
following relation:
(2.33)
where Pmax is the maximum load and A is the area of the hardness impression (contact area).
Young’s modulus is known as the ratio of stress to strain within the elastic (Hooke) limit which
can be determined from the values of contact stiffness S and contact area A via the following
relation:
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74
√ √ (2.34)
where β is a dimensionless constant taken as unity and Eeff can be expressed as:
(
) (2.35)
where σ and E are the Poisson’s ratio and Young’s modulus of the thin film, respectively. σi and
Ei are the Poisson’s ratio and Young’s modulus of the indenter, respectively.
Figure 2.15 Typical loading and unloading curves of the nanoindentation [331]
2.4.8.1. Experimental Technique of Nanoindentation Measurement
The mechanical characteristics of the thin film coatings can be determined either in lateral or
depth geometry without removing the thin film from the substrate. The nanoindentation system
measures the depth of pentration by a capacitance or inductance displacement sensor. The main
part of this system is the indenter. In this work, the mechanical properties of the thin film
coatings were investigated via a nanoindentation workstation (Ultra-Micro Indentation System
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75
2000, CSIRO, Sydney,Austarlia) supplied with a sharp Berkovich-type indenter of 5μm radius
according to Oliver and Pharr model [332]. Prior to the nanoindentation measurements, the area
of the indenter head was calibrated with a standard fused silica substrate. The nanoindentatuion
results were performed under a load control method with a maximum load of 200 nN. The low
peak loading is based on the consideration that the maximum displacement during indentation
should be no more than 10% of the coating thickness, and that high loading may result in micro-
cracks in the coating, which is thought to be relatively brittle, compared with metal coatings. To
obtain better resolution, the number of measuring points were increased to 15 during loading,
and 20 during unloading, respectively.
2.4.8.2. Finite Element Modeling (FEM)
FEM was performed to study the stress distribution throughout the thin films and the substrates
underneath the indentation tip and to evaluate the mechanical response of the coatings to
external loading. Experimental results of the mechanical properties obtained from the
nanoindentation measurements were used as input parameters in FEM modelling. COMSOL
multiphysics version 3.5a software was used in the simulation, and a two dimensional (2D)
axisymmetric model was built with the loading direction along the z-axis. Details of this model
set-up are breifly outlined here. A spherical indenter with a radius of 5 μm loaded onto a film of
2 μm thickness placed on top of glass substrate, with a maximum indentation depth of 0.2 - 0.6
μm, was modelled. Note that this film thickness, which is different from those of our
experimental thin films, was used here for a general assessment and comparison, and is designed
to match the loading conditions. The consideration here is that, under real application
environments, loadings with a dimension in the order of μm are more accurate than smaller and
sharper ones.
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76
3. CHAPTER 3 Improving the Optoelectronic Properties of
Titanium Doped Indium Tin Oxide Thin Films
Paper I
Hatem Taha, Zhong-Tao Jiang, David J. Henry, Amun Amri, Chun-Yang Yin,
M. Mahbubur Rahman, Improving The Optoelectronic Properties of Titanium-
Doped Indium Tin Oxide Thin Films. Semicond. Sci. Technol. 2017, 32, 065011-
065021.
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77
3.1. Abstract
The focus of this study is on a sol–gel method combined with spin-coating to prepare high
quality transparent conducting oxide (TCO) films. Structural, morphological, optical, and
electrical properties of sol-gel derived pure and Ti-doped indium tin oxide (ITO) thin films were
studied as a function of Ti concentration (i.e., 0, 2 and 4 at.%) and annealing temperatures (150 –
600 °C). FESEM measurements indicate that all the films are 350 nm thick. XRD analysis
confirmed the cubic bixbyite structure of the polycrystalline indium oxide phase for all of the
thin films. Increase of the Ti ratio, as well as the annealing temperature, improved the
crystallinity of the films. The highly crystallite structures were obtained at 500 C, with average
grain sizes of about 50, 65 and 80 nm for Ti doping of 0 at.%, 2 at.% and 4 at.%, respectively.
Electrical and optical properties improved as the annealing temperature increased, with an
enlarged electronic energy band gap and the optical absorption edge below 280 nm. In particular,
the optical transmittance and electrical resistivity of samples with 4 at.% Ti content improved
from 87% and 7.10×10-4
Ωcm to 92% and 1.6×10-4
Ωcm, respectively. The conductivity,
especially for the annealing temperature at 150 °C, is acceptable for many applications such as
flexible electronics. These results demonstrate that, unlike the more expensive and complex
vacuum sputtering process, high quality Ti-doped ITO films can be achieved by a fast
processing, simple wet-chemistry, and easy doping level control with the possibility of producing
films with high scalability.
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78
3.2. Introduction
Research on transparent conductive oxide (TCO) materials has received significant attention in
order to develop a good combination of unique optoelectronic properties including high visible
light transmittance and low electrical resistivity. A large number of metal oxides such as indium
oxide (In2O3), tin oxide (SnO2), zinc oxide (ZnO), titanium dioxide (TiO2), cadmium oxide
(CdO), aluminium doped zinc oxide (AZO) and indium tin oxide (ITO) are widely utilized as
transparent conductive materials [126, 333, 334]. Amongst this family of materials ITO has a
large number of favourable properties such as low electrical resistivity, high transparency in the
visible light region, great film-substrate adhesion and good chemical stability. Therefore, ITO
films are of great interest and represent the prime candidate for numerous applications in
optoelectronic devices such as flat panel displays, solar cells, organic light-emitting diodes,
sensors, functional glass and electro-chromic devices [153, 335-341]. Numerous techniques are
employed for synthesizing ITO films such as, DC and RF magnetron sputtering, thermal
evaporation, pulsed laser deposition, electron beam evaporation, screen printing and sol-gel
processes [342-346]. Among the existing methods, some of them require sophisticated
equipment including high vacuum systems coupled with physical vapour deposition (PVD)
processes that consume a large amount of bulk material and are detrimental to the environment,
which results in very expensive end products. Therefore, finding an alternative to the PVD
process to synthesize high quality transparent conductive films becomes an important objective
for materials scientists around the world. The sol–gel method combined with spin-coating and/or
dip-coating offers certain advantages such as lower processing time, cost effectiveness, no
vacuum requirements, easy control of the doping level, and producing films with high scalability,
along with the flexibility of achieving desired shapes and surface areas [196, 347, 348].
The electrical conductivity of TCO films can be improved by increasing either its carrier
concentration or carrier mobility. Doping In2O3 or ITO with some transition-metal elements, e.g.,
Mo, Ti, Nb and W, can improve their optoelectronic properties significantly as a result of (1) the
smaller ionic radii and the higher mobility of these elements [349], and (2) facilitating the
production of transparent conductive films with low resistivity, high electron mobility and
superior near-infrared transmittance [350].
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79
In this study, simple and low cost spin-coating derived Ti-doped ITO thin films were fabricated
with two different Ti concentrations and various post annealing temperatures (400 - 600) C. The
films were then compared with pure ITO prepared under the same conditions. The roles of Ti
additives and annealing temperature were examined for the effects on structural, morphological,
electrical and optical characteristics, as these are effects which have not been previously looked
at in detail especially that annealed at high temperature of 600 °C.
3.3. Experimental Techniques
3.3.1. Thin Films Deposition
ITO and Ti-doped ITO solutions were prepared using hydrated indium nitrate (In(NO3)3.5H2O,
purity 99.9%, Alfa Aesar), tin chloride dihydrate (SnCl2.2H2O, purity 98%, Chem-supply) and
titanium(IV) isopropoxide (Ti[OCH(CH3)2]4, purity 99.9%, Sigma Aldrich). All these chemicals
were used as received. Absolute ethanol was used as a solvent and the ITO films were deposited
onto soda-lime glass slides.
3.3.2. Sol-Gel and Thin Films Preparation
In order to prepare an ITO solution with concentration of 0.1M, the required amounts of
hydrated indium nitrate In(NO3)3.5H2O and tin chloride dihydrate (SnCl2.2H2O) were dissolved
in absolute ethanol and stirred for 1 hour. The resultant solutions were then mixed and refluxed
at 85 °C for 1 hour. The percentages of In was kept constant (~ 90 at.%) in all initial solutions.
Two different varieties of the Ti-doped ITO solutions were prepared with 2 at.% and 4 at.% Ti
contents with respect to 0.1M of ITO solutions. In separate beakers, hydrated indium nitrate, tin
chloride dihydrate and titanium (IV) isopropoxide (Ti[OCH(CH3)2]4 were first dissolved in
absolute ethanol and stirred for 1 hour. The resultant solutions were then mixed together and
refluxed at 85 °C for 1 hour. The final solutions were aged for 24 hours at room temperature. In
order to obtain uniform and homogenous thin films, glass substrates were first cleaned with
detergent and rinsed in deionized water (DI water). Then, the substrates were sonicated in
ethanol at 60 °C for 10 minutes, and DI water cleaning was repeated. The final step was the
sonication of substrates in DI water at 60 °C for 10 minutes. All the glass substrates (soda–lime–
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80
silicate with 25×25 mm dimensions) were dried in a conventional vacuum drying oven at 100 °C
for 20 minutes prior to the coating process. Spin coating experimental procedures were (1)
dispensing the solution on to the substrate at 300 rpm for 15 seconds, (2) spreading the solution
at 2500 rpm for 20 seconds, (3) drying the solution at 4000 rpm for 20 seconds, and (4) heat
treatment on a hot plate at 150 °C for 10 minutes. These steps were repeated until the desired
thickness was achieved. Fabricated samples were then annealed at the temperatures of 400, 500
or 600 °C for 2 hours in air atmosphere.
3.3.3. Analysis Techniques
The structural properties of the sol–gel derived thin films were investigated via X-ray diffraction
(XRD) analysis using a GBC EMMA diffractometer with CuKα radiation (=0.154nm). The
diffraction angle (2) of measurement was within the range of 20° - 70° with a scanning rate of
2°/min and 2 step size of 0.01. The surface morphology was examined by using Zeiss Neon
40EsB field emission scanning electron microscopy (FESEM). For FESEM, the samples were
mounted onto the substrate holder using double-sided carbon sticky tape and then coated with
platinum (3nm thick) to reduce the charging effects prior to FESEM imaging. The electrical
properties of prepared films were measured by a 4-point probe method (Dasol Eng. FPP-HS8)
and the Hall-effect measurements were performed on specimens of (10×10 mm). Au contacts
were thermally evaporated on the coated samples in a system of four probes. The measurements
were carried out using ECOPIA HMS-2000 system with Polytec Bipolar Operation Power
supplies (BPO) at 0.9 Tesla of magnetic field. The optical properties were obtained by using UV-
VIS Perkin Elmer spectrometer in a wavelength range of 250 - 800 nm.
3.4. Results and Discussions
3.4.1. Structural Properties
Figures 3.1 and 3.2 show the XRD spectra for the ITO and Ti-doped ITO coatings as deposited
(150 °C heat treatment only) and annealed at different temperatures, respectively. The XRD data
indicate that all the films are polycrystalline with a body centred cubic bixbyite structure similar
to In2O3 with space group of Ia3/cubic (JCPDS card 06-0416) as expected and there are no
impure phases related to tin or titanium compounds, indicating that the prepared solutions were
homogeneous. The main peaks from as deposited and post annealed thin films at temperatures of
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81
400, 500 or 600 °C are assigned to be (222), (400), (411), (332), (440) and (622) reflection
planes of In2O3. These results confirm the observation that the polycrystalline feature of In2O3
may act as a network with a body centred cubic bixpyite structure with lattice parameter of
10.118 Å [351, 352]. Both as deposited ITO and Ti-doped ITO thin films show poor crystallinity
because of the crystallization temperature of ITO in the range of 150-160 °C [68, 353]. This is
also consistent with Yang et al. who reported the same crystalline properties for as deposited Ti-
doped ITO films [354]. As the ionic radii of Titanium (Ti4+
), tin (Sn4+
) and indium (In3+
) are
0.06, 0.07 and 0.09 nm, respectively [65], the small ionic radii of Sn4+
and Ti4+
imply that the
crystalline structure may not change if these elements are used as dopant into In2O3 and/or ITO
frameworks. As such, we postulate that enhancing the preferred orientation and enhancing the
crystal growth of the 3-d metal-doped ITO thin films could be attributed to introduction of Ti as
a dopant for these thin films [244, 355]. Figures 3.1 and 3.2 also show that for both ITO and Ti-
doped ITO films the (222) and (400) peaks around 30.5° and 35.2°, respectively, are featured
prominently. This indicates the coexistence of <100> and <111> textures. The films have further
observable characteristics as the annealing temperature was increased, indicating enhanced
crystalline quality. When the annealing temperature was increased from 150 °C to 600 °C, the
ITO thin film exhibits the same (222) orientation, while the (400) diffraction peak becomes very
strong for both Ti concentrations, indicating a preferred orientation in <111> direction. It has
been observed by Suzuki et al. and Latz et al. that ITO films prepared by sputtering exhibit a
change in the orientation direction from (222) to (400) when the substrate temperature was
increased during the sputtering process [243, 356]. Kumar and Mansingh also reported that the
structure and the orientation direction for ITO samples was governed by the energy of the
sputtered particles reaching the substrate and they assumed that the higher energy sputtered
particles orientate in the (400) direction while the thermalized sputtered particles prefer the (222)
orientation [357]. However, the pure ITO thin films did not show the tendency of changing the
orientation direction from (222) to (400) reported by the aforementioned studies of Suzuki et al.
and Latz, et al. [243, 356] which may be attributed to the nature of sol-gel spin coating process.
Regarding the Ti-doped ITO thin films adopted in this work, the change of the major orientation
direction from (222) to (400) with the increase of annealing temperature is in good agreement
with Pu et al. results for vacuum synthesised Ti-doped ITO films at different substrate
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82
temperatures. They reported that the high substrate temperatures provided the ad-atoms with
sufficient energy to migrate along the (400) direction [244].
25 30 35 40 45 50 55 60 65
Inte
nsi
ty (
a.u.)
2θ (degree)
(222
)
(400)
(440)
(411)
(622)
(332)
150°C
400°C
500°C
600°C
Figure 3.1 The XRD patterns of as deposited and post annealed ITO thin films
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83
25 30 35 40 45 50 55 60 65
Inte
nsi
ty (
a.u
.)
2θ (degree)
(222)
(400
)
(440
)
(332
)
(622
)
150°C
400°C
500°C
600°C
(2 at.%)
25 30 35 40 45 50 55 60 65
Inte
nsi
ty (
a.uu.)
2θ (degree)
(22
2)
(40
0)
(44
0)
(33
2)
(62
2)
(4 at%)
600°C
400°C
500°C
150°C
Figure 3.2 The XRD patterns of Ti-doped ITO films prepared at 2at.% and 4 at.%
Ti concentrations and post annealed at different temperatures
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84
The Scherrer equation (Eq. 2.26) was used to calculate the grain size from the line broadening or
the full width at half maximum (FWHM) of the main peak (222). While, Bragg's law (Eq. 2.25)
was used to estimate the inter-planar spacing (d spacing) and the standard Bravais lattice for a
cubic system (Eq. 2.27) was used to obtain the lattice constant.
From Table 3.1 and Figure 3.3, it is clearly shown that the grain sizes of the thin films are
enlarged with the increase in Ti-contents. This is because the additional Ti atoms act as
nucleation centres that help the early coalescence of the particles, resulting in formation of larger
crystals [358]. It is also found that with gradual increase in annealing temperature the grain sizes
of the films are enlarged as well, reaching a maximum at 500 °C and then decreasing (see data at
600 C). Both Ti doping level and annealing temperature enhanced the peak intensities and
hence the crystalline structure for ITO and Ti-doped ITO coatings, through substitution of In
atoms by both Sn and Ti atoms. Also, the vibration of the doping atoms could also result in an
annealing effect that supports nucleation and growth of the film along the preferred orientations.
For the as deposited and post annealed thin films, the average calculated lattice constants of both
ITO and 2 at.% and 4 at.% Ti-doped ITO films were estimated to be 10.13 Å, 10.14 Å and 10.17
Å respectively, which are slightly greater than the reported value for un-doped indium oxide of
10.118 Å. This increment in the lattice constant for both ITO and Ti-doped ITO thin films is
related to the small ionic radius of both Sn and Ti relative to the substituted In atoms in the In2O3
matrix. Also, it appears that the extent of Sn and Ti incorporation is intensely temperature
dependent, resulting in an increase in the lattice constants for ITO and Ti-doped ITO thin films
compared with un-doped In2O3. This in turn, has a noticeable impact on the film structure
leading to improved electron mobility in optimally doped films. Bourlange and co-authors
attributed the increase of the lattice constant to the occupation of conduction band states which
are In-O anti-bonding [359]. Also, the alteration in the lattice parameters could be associated
with the growth induced stress near the film surface during doping and annealing [360], which
may be raised from the oxygen deficiency and thermal expansion coefficient mismatch between
the film and the substrate [361, 362]. Figure 3.4 shows the shifting of the main peaks (i.e., (222)
orientation) for ITO and Ti-doped ITO thin films annealed at 500 °C. The shifts of (222) toward
lower 2θ value indicates distortion in the lattice structure takes place due to Ti additives, and thus
leading to an expansion in calculated lattice parameters.
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85
10
20
30
40
50
60
70
80
100 200 300 400 500 600 700
Gra
in s
ize
(nm
)
Annealing temperature (°C)
4 at%
2 at%
ITO
28 28.5 29 29.5 30 30.5 31 31.5 32 32.5 33
Inte
nsi
ty (
a.u.)
2θ (degree)
2θ =30.52° 2θ =30.44°
4 at% Ti
2 at% Ti
ITO
Figure 3.3 The annealing temperature dependent grain size
Figure 3.4 Peaks shift of (222) for the ITO and Ti-doped
ITO thin films annealed at 500 °C
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86
Table 3.1 Structural parameters for the ITO and Ti-doped ITO thin films at 2 at.% and 4 at.% Ti
concentration and post annealed at different temperatures
3.4.2. Surface Morphology Properties
The FESEM images of the synthesized ITO and Ti-doped ITO films as deposited (150 °C) and
after being annealed at 400, 500 and 600 °C are presented in Figures 3.5 and 3.6. The surfaces of
all the thin films are smooth, homogeneous, and composed of uniform coalesced clusters, and
show a grain structure demonstrating the nanocrystalline features. However, the as deposited thin
film of 4 at.% Ti shows a smoother surface and larger grains compared to those of pure ITO and
2 at.% Ti-doped ITO that may be due to the enhancement of crystallinity with Ti ratio. Also,
increasing the annealing temperature up to 500 °C resulted in an increase in grain size and
decreased grain boundaries which are in a good agreement with the results obtained from XRD
measurements. As the annealing temperature was further increased to 600 °C, micro-cracks were
formed on the surfaces of all the films due to induced stress resulting from possible different
thermal expansions between the film and its substrate.
Ti at.% T°C 2θ (in degrees) d-spacing Å (h k l) Lattice constant Å Crystallite size nm 150 30.56 2.921 (222) 10.12 17
0 at.% 400 30.52 2.925 10.13 31
500 30.52 2.925 10.13 50
600 30.52 2.925 10.13 46
150 30.52 2.925 (222) 10.13 19
2 at.% 400 30.50 2.925 10.14 38
500 30.52 2.925 10.13 65
600 30.48 2.923 10.15 60
150 30.42 2.934 (222) 10.16 21
4 at.% 400 30.34 2.942 10.19 47
500 30.44 2.933 10.16 80
600 30.46 2.931 10.15 68
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87
a4 a3
a2 a1 150°C 400°C
500°C 600°C
600°C b4 500°C b3
b2 400°C b1 150°C
600°C 500°C
400°C 150°C
Figure 3.5 FESEM images of prepared and post annealed ITO thin films
Figure 3.6 FESEM images of Ti-doped ITO thin films, (a1-a4) for 2 at.% and (b1-b4) for 4
at.% Ti concentrations and post annealed at different temperatures
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88
3.4.3. Electrical Properties
The dependence of electrical resistivity, carrier concentration and carrier mobility on Ti dopant
concentration and thermal annealing temperature are shown in Figures 3.7 and 3.8 respectively.
Figure 3.7 indicates that the resistivity for as deposited thin films with 4 at.% Ti content is lower
than those for as deposited pure ITO and 2 at.% Ti thin films. This is most likely attributed to the
level of Ti doping which contribute to a large number of electrons and hence increasing the
number of free carries in the thin films. Furthermore, during the sol-gel spin coating process, the
formation of both defects and oxygen vacancies (those are considered as electron donors) were
introduced easily which also results in a decrease in the film resistivity. Additionally, the
resistivity of the films decreased with increasing annealing temperature for both pure ITO and
Ti-doped ITO at both Ti concentrations. The lowest resistivity values (1.6×10-4
Ωcm and
1.8×10-4
Ωcm) were obtained from samples annealed at 500 °C with 4 at.%, 2 at.% Ti
concentrations and pure ITO, respectively. These results are as good as that fabricated using
vacuum sputtering techniques, e. g., 1.8×10-4
Ωcm [363]. It was reported by Chopra et al. that
the low resistivity and/or the high conductivity of the ITO films is related to carrier
concentration, which is linked to the dopant level and/or oxygen vacancies [14, 342, 364]. The
annealing temperature leads to enhanced substitution of indium atoms by titanium and tin atoms,
yielding an increase in carrier concentration in the thin films. Moreover, increased annealing
temperature assisted desorption of interstitial oxygen atoms at the grain boundaries which has led
to improved crystal structure and reduced the grain boundaries of the films. Therefore, the
trapped electrons at the grain boundaries were released which contributed to increase the carrier
concentration, as well as conductivity. This is evident in Figure 3.8, where the carrier
concentration and the Hall mobility increased to their maximum values of (7×1020
, 7.4×1020
and
8.6×1020
) cm
-3 for pure ITO, 2 at.% and 4 at.% Ti concentrations, respectively. Similarly, the
Hall mobility is strongly depended by the disordered of the crystallite structure, which can be
manipulated by a number of approaches, such as doping and annealing temperature. It is
interesting to note that, however, the as deposited film with 4 at.% Ti has a higher carrier
concentration but lower Hall mobility compared with those of pure ITO and 2 at.% Ti thin films.
This is probably attributed by the solubility limits of Sn and Ti dopants resulting in the increase
of occupational random sites in the ITO matrix. With increasing the annealing temperature up to
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1
2
3
4
5
6
7
8
100 200 300 400 500 600 700
Res
isti
vit
y×
10
-4(Ω
.cm
)
Annealing temperature (°C)
Pure ITO
1
2
3
4
5
6
7
8
100 200 300 400 500 600 700
Res
isti
vit
y×
10
-4(Ω
.cm
)
Annealing temperature (°C)
4 at% Ti
2 at% Ti
500 °C, the highest Hall mobility values (39 cm2/Vs, 42 cm
2/Vs and 49 cm
2/Vs) and lowest
resistivity were accomplished for all the films studied here.
As the annealing temperature was further increased to 600 °C, the resistivity increased while the
carrier concentration and the carrier mobility decreased for both Ti concentrations. This
behaviour is expected, due to oxygen chemisorbed on the sample surface [364, 365]. Also, all the
thin films annealed at this temperature show some micro-cracks, see FESEM images above.
These cracks may be due to the mismatch of thermal coefficients between films and substrates
which causes a significant increase of compressive stress in the films. Eventually these micro-
cracks increase resistivity of the films. A summary of electrical properties of these films are
presented in Table 3.2.
Figure 3.7 Electrical resistivity of pure ITO and Ti-doped ITO thin films for 2 at.%
and 4 at.% Ti concentrations and post annealed at different temperatures
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4
5
6
7
8
9
10
100 200 300 400 500 600 700
Car
rier
co
nce
ntr
atio
n×
10
20(c
m-3
)
Annealing temperature (°C)
4 at% Ti
2 at% Ti
15
25
35
45
55
0 100 200 300 400 500 600 700
Mo
bil
ity (
cm2/V
s)
Annealing temperature (°C)
4 at% Ti
2 at% Ti
3.5
4.5
5.5
6.5
7.5
10
20
30
40
50
0 100 200 300 400 500 600 700
Car
rier
con
cen
trat
ion
× 1
02
0 (
cm-3
)
Mo
bil
ity (
cm2/V
s)
Annealing temperature (°C)
Pure ITO
Figure 3.8 Variations of carrier concentration and Hall mobility of ITO and Ti-doped
ITO thin films for 2 at.% and 4 at.% Ti concentrations with annealing temperature
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91
3.4.4. Optical Properties
The optical transmittance spectra of ITO and Ti-doped ITO thin films are shown in Figure 3.9.
The optical transmittance of as deposited ITO and Ti-doped ITO thin films are very similar;
however, the ITO film doped with 4 at.% Ti exhibits a higher optical transmittance of 87% over
the entire wavelength range. This may be due to the enlargement of the grain size and Ti
additive, as explained in the XRD and FESEM results (see section 3.4.1 and section 3.4.2).
Moreover, decreasing the level of defects, which could act as scattering centres, may contribute
to a higher optical transparency in the thin films. The highest optical transmittance of 92% was
achieved for the thin film annealed at 500 °C. Higher annealing temperature leads to higher
optical transmittance due to the improvement in the film quality through the increase in the
crystallinity and grain size of the film (see the XRD results) as well as reduced grain boundaries.
All these factors eventually reduce light scattering yielding better transmittance. It is also
observed from Figure 3.9 that there is a shift in the absorption edge to shorter wavelengths as the
annealing temperature is increased up to 500 °C which is related to the Burstein-Moss shift (shift
of Fermi level due to increasing the carrier density in the conduction band) [366, 367]. This
carrier concentration increment is comparable with the results obtained from electrical studies
(section 3.4.3). Thus, the higher optical transmittance and the move of the optical absorption
edge toward higher photon energy from Ti-doped ITO thin films essentially confirmed the
overall improvement of the optical properties of TCO films.
To obtain the band gap energy (Eg) from the transmittance data, we used the relation:
(αhv)2=A(hv-Eg) (3.1)
where α is the absorption coefficient, hv photon energy, A the proportionality coefficient. Plots
of photon energy hv versus (αhv)2 are shown in Figure 3.10. The energy band gap was obtained
by extrapolating the straight line part of the plotted curves along the energy axis. Table 3.2
summarizes the optical and the electrical properties of pure ITO and Ti-doped ITO thin films at
different annealing temperatures.
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92
0
10
20
30
40
50
60
70
80
90
100
200 300 400 500 600 700 800
Tra
nsm
itta
nce
%
Wavelength (nm)
150°C
400⁰C
500⁰C
600⁰C
2 at.% Ti
contents
0
10
20
30
40
50
60
70
80
90
100
200 300 400 500 600 700 800
Tra
nsm
itta
nce
%
Wavelength (nm)
150°C
400⁰C 500⁰C 600⁰C
4 at.% Ti
contents
0
10
20
30
40
50
60
70
80
90
100
200 300 400 500 600 700 800
Tra
nsm
itta
nce
%
Wavelength (nm)
150°C
400⁰C
500⁰C
600⁰C
Pure ITO
Figure 3.9 Optical transmittance of pure ITO and Ti-doped ITO thin films
annealed at different temperatures
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93
Table 3.2 The optical and electrical parameters of as prepared and post annealed ITO and Ti-
doped ITO thin films for 2 at.% and 4 at.% Ti concentrations
Table 3.2 shows that the optical band gaps of as deposited (150 °C) ITO films in both pure and
Ti-doped vary between 3.21 and 3.4 eV. Both pure and Ti-doped ITO thin films exhibit the
largest optical energy band-gap after being annealed at the temperature of 500 °C, i.e., 3.7, 3.73
and 3.77 eV for pure ITO, 2 at.% and 4 at.% Ti dopant levels of ITO thin films, respectively. A
gradual increase in the optical energy band gap due to the annealing temperature can be
associated with the change of grain size and modified carrier concentration (as seen in XRD
results) [368]. This can be explained by noting that free electrons are normally trapped in the
grain boundaries and by increasing the annealing temperature the grain size increases and the
volume of grain boundaries decreases. Consequently, fewer carriers may be trapped in the grain
boundary regions leading to an overall increase in the free carrier concentration, and as a result, a
higher electrical conductivity is obtained (see section 3.3). Furthermore, the enhancement of
optical band gap can also be explained through the (ΔEgBM
) Burstein-Moss relation [369, 370]:
(
)
(3.2)
where is the electron effective mass calculated from mv and mc. mv and mc are the effective
electron mass in valance and conduction bands, respectively. n is the carrier concentration. The
results are consistent with the prediction given by equation (3.2), and in good agreement with
Hall measurement results as well [244, 371].
Ti at.% T (°C) T (%) Eg (eV) ρ ×10-4
(Ω.cm) n ×1020
(cm-3
) μ (cm/Vs)
150 86.7 3.4 7.6 3.9 20
0 at.% 400 89 3.5 3.6 5.8 25
500 90.5 3.7 2.2 7 39
600 90 3.55 4.5 6 33
150 86.7 3.21 7.25 4.3 20
2 at.% 400 88.9 3.54 3.78 6 27
500 90.2 3.73 1.8 7.4 42
600 89.8 3.62 3.2 6.4 31
150 87 3.4 7.1 4.6 19
4 at.% 400 89 3.59 3.3 6.4 30
500 92 3.77 1.6 8.6 49
600 90.5 3.7 2.87 6.8 32
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94
3 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4 4.1 4.2 4.3
Photon energy (eV)
150⁰C
400⁰C
500⁰C
600⁰C
( 𝛼 𝑣) ( 𝑐𝑚 𝑒𝑉
) 4 at.% Ti
3 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4 4.1 4.2 4.3
Photon energy (eV)
150⁰C
400⁰C
500⁰C
600⁰C
( 𝛼 𝑣) ( 𝑐𝑚 𝑒𝑉
) 2 at.% Ti
3 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4
Photon energy (eV)
150⁰C
400⁰C
500⁰C
600⁰C
( 𝛼 𝑣) ( 𝑐𝑚 𝑒𝑉
) Pure ITO
Figure 3.10 Estimated optical band gaps of pure ITO and Ti-doped ITO thin
films for 2 at.% and 4 at.% Ti concentrations post annealed at different
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95
3.5. Conclusions
In this work, transparent conductive oxide thin films of pure ITO and Ti-doped ITO were
fabricated on to soda-lime glass substrates using an efficient and low cost sol-gel spin coating
technique. The effects of doping concentrations (i.e., 0 at.%, 2 at.% and 4 at.% Ti) and annealing
temperature (ranging of 150 – 600 °C) on the structural, morphological, electrical and optical
properties were studied. The conductivity and optical transparency of Ti doped ITO, particularly
those for as deposited (i.e., at 150 °C), are acceptable for many applications such as flexible
electronics. All these properties were improved as the Ti concentration was increased from 0% to
4% and the annealing temperature increased up to 500 °C. Increasing both Ti doping level and
annealing temperature leads to an enhanced substitution of indium atoms by titanium and tin
atoms, yielding an increase in carrier concentration in the thin films. Moreover, increased
annealing temperature assists desorption of interstitial oxygen atoms at the grain boundaries
which has led to improved crystal structure and reduced the grain boundaries of the films.
Likewise, higher Ti ratio and annealing temperature can lead to a higher optical transmittance,
due to the improvement in the film quality through the increase in the crystallinity and grain size.
The best performing Ti-doped ITO thin films were achieved with 4 at.% Ti concentration,
annealed at 500 °C. In particular, these films exhibited low resistivity (1.6×10-4
Ωcm), high
carrier concentration and mobility of (8.63×1020
cm-3
and 48.7 cm2/Vs, respectively), high
transmittance 92%) and a high optical band gap (3.77 eV). These results confirm that high
quality Ti-doped ITO thin films, suitable for various optoelectronic applications, can be
synthesized by a simple sol-gel and spin coating process.
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96
4. CHAPTER 4: Probing the Effects of Thermal Treatment on
the Electronic Structure and Mechanical Properties of Ti-Doped
ITO Thin Films
Paper II
Hatem Taha, David J. Henry, Chun Yang Yin, Amun Amri, Xiaoli Zhao, Syaiful Bahri,
Le Minh Cam, Nguyen Ngoc Ha, M. Mahbubur Rahman, Zhong-Tao Jiang, Probing the Effects
of Thermal Treatment on The Electronic Structure and Mechanical Properties of Ti-doped ITO
Thin Films. J. Alloys Compd. 2017, 721, 333-346.
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97
4.1. Abstract
Titanium-doped indium tin oxide thin films were synthesized via a sol-gel spin coating process.
Surface chemical bonding states and mechanical properties have been investigated as a function
of titanium content (2 and 4 at.%) and annealing temperature ranging from 400 to 600 °C with
increments of 100 °C. Raman analysis was performed to study the phonon vibrations for the
prepared samples and the results revealed the existence of ITO vibrational modes. The elemental
compositions, bonding states and binding energies of the film materials were investigated using
X-ray photoelectron spectroscopy (XPS) technique. The XPS results indicated that the ratio of
the metallic elements (In, Sn, Ti) to the oxygen on the surface of the thin film coatings decreased
due to the increase of the oxide layer on the surface of the thin films. Also, by increasing the
annealing temperature up to 600 °C, the Ti 2p and Cl 2p signals were no longer detected for both
2 and 4 at.% Ti contents, due to the thicker surface oxidation layer. Mechanical properties of the
synthesized films were also evaluated using a nanoindentation process. Variations in the
hardness (H) and the elastic modulus (E) were observed with different Ti at.% and annealing
temperatures. The hardness is within the range of 6.3 - 6.6 GPa and 6.7 - 6.8 GPa for 2 and 4
at.% Ti content samples, respectively, while the elastic modulus is within the ranges of 137 - 143
and 139 - 143 GPa for 2 at.% and 4 at.% Ti contents samples, respectively. A combination of the
highest H and E was achieved in the sample of 4% Ti content annealed at 600 °C. Furthermore,
the H/E ratio ranges from 4.5 10-2 to 5.0 10
-2 which reflects a reasonable level of wear
resistance.
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98
4.2. Introduction
Transparent conductive oxides (TCOs) receive widespread attention from researchers due to
their unique combination of very low electrical resistivity and high optical transparency over the
visible spectral region [336, 372-374]. They exhibit favorable properties which include high
infrared reflection, good chemical stability and good mechanical properties along with low
electrical contact resistance and high optical transparency in the visible light region. Indium
oxide (In2O3) and/or indium tin oxide (ITO) based TCOs are the most commonly used
transparent conductive oxides compared with zinc oxide (ZnO), aluminium doped zinc oxide
(AZO), tin oxide (SnO2), and cadmium oxide (CdO) [159, 367]. ITO-based TCO films can
exhibit different electro-optical, mechanical, electronic structure and composition properties
depending on manufacturing technique. Many deposition techniques are used to prepare TCO
coatings such as Dc and/or RF sputtering, chemical vapour deposition, reactive evaporation,
molecular beam epitaxy, sol-gel method, electron beam evaporation and pulsed laser deposition
[193, 243, 259, 375-379]. However, the sol-gel technique has many advantages including cost
effectiveness, short processing time, simplicity and the opportunity to fabricate coatings with
high scalability along with the flexibility of fine-tuning coatings to have preferred shapes and
surface areas [196, 347, 348, 380].
Novel ITO composites doped with 3-d and/or 4-d transition metals, such as (Ti, Ag, Cr, Mo, W,
Ta and Cu), are being considered as potential candidates in a wide range of optoelectronic
applications such as organic and inorganic solar cells, touch screens, organic light-emitting
diodes, sensors and electro-chromic devices [153, 217, 335, 338, 381, 382]. In order to satisfy
the demands for some of these applications, TCO composites with improved durability are
required. The durability of ITO based coatings depends on their physical, mechanical and
structural properties. Therefore, it is expected that the mechanical properties of ITO based films
play a significant role in the performance of optoelectronic devices. It has been reported that the
bare ITO films have a brittle surface and seem to be susceptible to cracking and delamination. So
far, there has been scarce information on the mechanical properties of ITO thin films,
particularly, their micro or nanostructure. The elastic modulus and the hardness of 240 nm thick
sputtered ITO thin film coatings were reported by Chen et al. [20] to be 140 GPa and 12 GPa
respectively. The hardness and elastic modulus were enhanced by introducing hydrogen into the
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99
gas mixture during the deposition process [383]. We propose that incorporating a transition metal
such as titanium into the ITO nanostructure may enhance the mechanical properties of this
material. Therefore, the main objective of the present study is to evaluate the influence of
variations in the Ti concentration and annealing temperature on the chemical bonding states and
the mechanical properties, including Young’s modulus (E) and Hardness (H) of spin coated Ti-
doped ITO thin films, technical aspects which have not been reported thus far, to the best of the
authors’ knowledge.
4.3. Experimental Details
4.3.1. Thin Films Deposition
Hydrated indium nitrate (In(NO3)35H2O, purity 99.9%, Alfa Aesar) titanium(IV) isopropoxide
(Ti[OCH(CH3)2]4, purity 99.9%, Sigma Aldrich), and tin chloride dihydrate (SnCl22H2O, purity
98%, Chem-supply) were used as received as precursors to produce Ti-doped ITO films via a
sol-gel spin coating process. Absolute ethanol was used as a solvent and the ITO films were
deposited onto soda-lime glass slides.
ITO solutions (0.1 M) were prepared by dissolving appropriate amounts of In(NO3)35H2O and
SnCl22H2O separately in absolute ethanol. The solutions were combined and stirred vigorously
for 1 hour. Required amounts of (Ti[OCH(CH3)2]4) were then dissolved in ethanol and added to
ITO solutions in order to obtain solutions of Ti doped ITO with 2 and 4 at.% Ti contents,
respectively. The resultant solutions were then refluxed at 85 °C for 1 hour and aged for 24 hours
at room temperature. Since uniformity and homogeneity of the thin films mainly depends on the
cleanness of the substrates, the glass substrates with (25×25 mm dimensions) were first washed
with soap and rinsed repeatedly in deionized water. Then, the substrates were sonicated at 60 C
for 10 min in ethanol and DI water, respectively and dried in a vacuum drying oven at 100 °C,
prior to the coating process. A Polos spin coater was used to fabricate Ti-doped ITO films based
on three main spin steps. Firstly, the solution was dispensed on to the substrate at 300 rpm for 15
seconds followed by spreading at 2500 rpm for 20 seconds and finally dried at 4000 rpm for 20
seconds. The sample was calcined on a conventional hot plate at 150 C for 10 minutes. These
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100
steps were repeated until the desired coating thickness (300 – 400 nm) was achieved. Thermal
annealing in air atmosphere was performed upon the fabricated samples at (400, 500 and 600) C
for 2h.
4.3.2. Characterization Techniques
Raman analysis was performed on a Nicolet 6700 Fourier transform infrared (FT-IR)
spectrophotometer attached with an NXR FT-Raman module. Raman spectra were obtained by
using the following settings: Helium-Neon (He-Ne) laser beam with excitation wavelength and
operation power of 1064 nm and 0.204 W, respectively, InGaAs detector with 90° detection
angle, optical velocity of 0.3165, CaF2 beam splitter, gain of 1, aperture of 150, maximum peak
to peak signal along with optimum focusing and side-to-side values, and 32 scans with resolution
of 8 cm-1
in the range of 0 - 4000 cm-1
. Information of elemental compositions, chemical
structures and bonding states of the thin film coating surfaces were probed using a Kratos Axis
Ultra-X-ray Photoelectron Spectrometer. The X-ray source was Al-Kα monochromatic radiation
(hv = 1486.6 eV) with a power of 15 kV and 10 mA. The base pressure of the analysis chamber
maintained at 2.9 × 10-9
Torr. The XPS survey and high resolution scans were collected before
etching. Typical high resolution XPS core level spectra were focused on the regions of In3d,
Sn3d, Ti2p, O1s and C1s. The deconvolution of high resolution spectra was carried by
employing the CASA XPS software (version 2.3.1.5) which provides information for the
analyses of chemical bonding states.
The elastic modulus (E) and the hardness (H) of the coatings were measured using a
nanoindentation workstation (Ultra-Micro Indentation System 2000, CSIRO, Sydney, Australia),
equipped with a diamond Berkovich indenter [332]. The area function of the indenter tip was
calibrated using a standard fused silica specimen. Load control method was used with a
maximum loading of 200 nN. The low peak loading was based on the consideration that the
maximum displacement during indentation should be no more than 10% of the coating thickness,
and that high loading may result in micro-cracks in the coating, which is thought to be relatively
brittle compared with metal coatings. To obtain good resolution, 15 measuring points were used
during loading and 20 during unloading.
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101
4.4. Results and Discussions
4.4.1. Raman Analysis
The structural and morphological properties of the synthesized and annealed Ti-doped ITO thin
film coatings were characterized via x-ray diffraction (XRD) and field emission scanning
electron microscopy (FESEM) techniques and were discussed in our previous work [384]. The
XRD results confirm the formation of body centred cubic bixbiyte structure with space group of
Ia3/cubic similar to In2O3 (JCPDS card 06-0416). The ionic radiuses of tin (Sn4+
), Titanium
(Ti4+
) and indium (In3+
) are 0.07, 0.06 and 0.09 nm, respectively. The small ionic radii of Sn4+
and Ti4+
imply that the crystalline features of In2O3 and/or ITO frameworks should not change if
these elements are used as dopants. Grain sizes increase with the introduction of Ti dopants
along with increasing annealing temperature, reaching the maximum value of 80 nm for the film
prepared with 4 at.% Ti concentration and post-annealed at 500 °C. Therefore, we propose that
enhancing the crystal growth and the preferred orientation of the 3-d metal doped ITO thin films
could be attributed to introduction of Ti as a dopant for these thin films.
The FESEM images of the synthesized ITO and Ti-doped ITO films as deposited (150 °C) and
after being annealed at 400, 500 and 600 °C show that the surfaces of all the thin films are
smooth, homogeneous, and composed of uniform coalesced clusters, and show a grain structure
demonstrating nanocrystalline features. However, the as deposited thin film of 4 at.% Ti shows a
smoother surface and possesses larger grains compared to those of pure ITO and 2 at.% Ti-doped
ITO, which may be attributed to the enhancement of crystallinity with Ti ratio.
Raman spectroscopy was used to study the effect of Ti contents and annealing temperature on
the electronic and mechanical properties of Ti doped ITO thin films. It is well known that ITO
based materials have a body centred cubic structure that belongs to Ia3 space group, similar to
that of In2O3. Two types of cation are present in the ITO based structure: (1) 8 In3+
with 3 sides
symmetry at b-sites and (2) 24 In3+
with 2-fold point symmetry at d-sites. Moreover, the 48
oxygen atoms in this structure occupy general e-sites with no symmetry. Thus, six possible
vibration modes may be identified [321]:
4Ag + 4Eg + 14Tg + 5Au + 5Eu + 16Tu
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102
The Ag, Eg and Tg symmetry vibrations are Raman active and infrared (IR) inactive modes;
whereas, Tu vibration modes are Raman inactive and IR active. The Au and Eu vibration modes are
inactive for both Raman and IR measurements. Figure 4.1 presents the results of Raman active
modes for the Ti doped ITO thin films at 2% and 4% Ti concentrations after being annealed at
the temperatures of 400, 500 and 600 °C. The observed vibrational modes correspond to 106,
135, 176, 275, 367, 432, 584, 633 and 704 cm-1
which represent an unequivocal finger print for
In2O3 and/or ITO cubic structure. These results are in good agreement with Raman active modes
observed from In2O3 and ITO based materials [385, 386]. The peaks recorded at a wavenumbers
below 500 cm-1
are attributed by In-O stretching vibrational modes in the ITO matrix. However,
the line at 633 cm-1
is due to the overlapping of the contributions from In-O, Sn-O and O-Ti-O
vibrational modes with frequencies of 630, 633 and 636 cm-1
respectively. Indeed, these
observed vibrational modes in Ti doped ITO structure may be ascribed to a good incorporation
of Ti and Sn dopants into the In2O3 lattice. It is also noticed that, along with the increase in
annealing temperature from 400 to 500 C, the intensity of the high frequency peaks at 633 and
704 cm−1
was gradually enhanced. However, the intensity of the low frequency peak at 175 cm−1
decreased. For the sample annealed at 600 C, the intensity of the high frequency peaks
decreased and the low frequency peak at 135 cm−1
disappeared. Increasing the annealing
temperature up to 600 °C also led to the disappearance of the peaks at 367 and 432 cm-1
.
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103
50 150 250 350 450 550 650 750 850
Inte
nsi
ty (
a.u)
Raman shift (cm-1)
(a)
50 150 250 350 450 550 650 750 850
Inte
nsi
ty (
a.u)
Raman shift (cm-1)
(b)
400°C
600°C
600°C
500°C
500°C
400°C
Figure 4.1 Raman shift of Ti-doped ITO films (a): 2 at % and (b): 4 at % of Ti, annealed at
different temperatures
4.4.2. Atomic Compositions and Surface Chemical Bonding States
The elemental compositions of Ti-doped ITO thin films were obtained via XPS survey scans.
Figure 4.2 (a, b) shows the survey scan results for the synthesized Ti doped ITO thin films for
both Ti contents. The photoelectron peaks for In 3d, Sn 3d, Ti 2p, O 1s, Cl 2p and C 1s in the
binding energy range of 0 - 1200 eV were observed. The XPS survey spectra confirm the
existence of the principal elements (In, Sn, Ti, Cl and O), as well as carbon, in the related sample
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0100200300400500600
Inte
nsi
ty (
a.u)
Binding energy (eV)
Cl2p C1s
In3d
Ti2p
Sn3d O1s
(a)
600 °C
500 °C
400 °C
0100200300400500600
Inte
nsi
ty (
a.u)
Binding energy (eV)
Cl2p
C1s
In3d
Ti2p
Sn3d
O1s
(b)
400 °C
600 °C
500 °C
coatings. Table 4.1 lists the atomic compositions of the Ti doped ITO thin films at 2% and 4% Ti
concentrations after being annealed at 400, 500 and 600 °C. The results imply that the surface
elemental composition of the film materials was significantly affected by annealing temperature.
As the annealing temperature increased, the ratio of atomic percentages of the principal elements
(In, Sn and Ti) to oxygen on the surface of the thin film coatings decreased for both levels of Ti
doping. At 600 °C the Ti 2p and Cl 2p signals were completely absent for both 2 and 4 at % Ti
concentrations, respectively, indicating that surface oxidation is taking place at high temperature.
As the oxygen content becomes higher at high temperatures, the surface oxidation layer should
become thicker. In order to compensate for any charge shifts, the XPS energy scale was
calibrated by the C1s (C-H) line at 284.60 eV (bonding energy).
Figure 4.2 XPS survey scans of Ti-doped ITO films (a): 2 at % and (b): 4 at % of Ti, annealed at
different temperatures
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105
Table 4.1 Elemental compositions of Ti doped ITO thin films at 2 at.% and 4 at.% Ti
concentrations after being annealed at different temperatures
The XPS spectra for these elements are shown in Figures 4.3 – 4.7. The surface chemical
bonding states of the annealed Ti doped ITO films were characterised by de-convoluting the high
resolution In 3d, Sn 3d, Ti 2p, Cl 2p and O 1s photoelectron lines using the Gaussian
distribution, in order to appraise the possible chemical bonding states of these atoms in the
composites. The parameters, derived from the analysis of the XPS spectra, are listed in Table 4.2
and include: the photoelectron lines, bonding states and their corresponding binding energies,
full width at half maximum (FWHM) values and atomic percentages of the elemental
compositions present in the films after being annealed at 400, 500 and 600 °C as evaluated from
XPS curve fittings.
The de-convoluted curves of the high resolution XPS spectra of In 3d5/2 photoelectron lines are
shown in Figure 4.3 (a, b). It is clear that the de-convoluted In3d5/2 spectrum is assigned to three
different bonding states in the range of 443.6 - 445.4eV. The lower energy peaks placed within
the range 443.6 – 443.8 eV (labelled i) is linked to In° bonding state, precisely In-In bonds, while
the mid energy peaks located in the range 444.1 – 444.6 eV (labelled ii) corresponds to In3+
bonding state from In2O3 [387, 388]. The higher energy peaks in the range 444.7 – 445.4 eV
(labelled iii) could be attributed to the In-Cl bonds from InCl.
Ti
Concentration
Annealing
Temperature °C
Atomic percentage of the elements
In Sn Ti O Cl C
400 8.0 1.9 4.4 37.7 1.0 47.0
2 at.% 500 7.7 2.8 2.9 39.6 1.8 45.2
600 7.1 1.6 0.0 50.8 1.0 39.5
400 9.2 3.2 7.4 35.9 1.2 43.1
4 at.% 500 8.3 2.1 5.0 39.7 1.6 43.3
600 6.6 1.9 4.0 52.0 0.0 35.5
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106
Figure 4.3 In 3d XPS spectra of Ti doped ITO films (a): 2 at % and (b): 4 at % Ti, annealed at
different temperatures
441442443444445446447448
CP
S/I
nte
nsi
ty (
a.u
)
Binding energy (ev)
400°C
(i)
(ii)
(iii)
441442443444445446447448
CP
S/I
nte
nsi
ty (
a.u
)
Binding energy (ev)
500°C
(i) (ii)
(iii)
441442443444445446447448
CP
S/I
nte
nsi
ty (
a.u
)
Binding energy (ev)
600°C
(i)
(ii)
(iii)
(a)
441442443444445446447448
CP
S/I
nte
nsi
ty (
a.u
)
Binding energy (ev)
400°C
(i)
(ii)
(iii)
441442443444445446447448
CP
S/I
nte
nsi
ty (
a.u
)
Binding energy (ev)
500°C
(ii) (i)
(iii)
441442443444445446447448
CP
S/I
nte
nsi
ty (
a.u
)
Binding energy (ev)
600°C
(ii)
(i)
(iii)
(b)
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107
Figure 4.4 (a, b) displays the de-convoluted curves of high resolution XPS spectra for Sn 3d5/2
photoelectron lines. Three bonding states in the range of 485.6 - 487.2 eV have been allocated.
The first components are obtained within the range 485.6 - 485.8 eV (labelled ‘i’) correspond to
Sn4+
in SnO2, whereas the second features (labelled ‘ii’) observed in the range 486.0 - 486.5 eV
are related to Sn2+
from SnO. It has been reported by Fan and Goodenough that the Sn3d peak
for Sn2+
in SnO was seen at a binding energy around 0.5eV higher than that for Sn4+
in SnO2
[148, 389]. The SnO phase is thermodynamically less stable than the SnO2 phase; therefore, the
Sn4+
is thought to be the predominant state in the ITO based materials. The last components
(labelled ‘iii’) seen in the range 486.6 - 487.2 eV may be attributed to the SnCl2 bonding state.
The Ti 2p photoelectron lines of Ti-doped ITO films are presented in Figure 4.5 (a, b). The curve
fitting of Ti2p core level XPS spectra assigned three components within the energy range of
457.3-458.5 eV. The lower constituent in the energy range of 457.3 - 457.5 eV (labelled ‘i’)
corresponds to Ti3+
in Ti2O3 bonding state [390]. The second component within the energy range
457.9 - 458.0 eV could be attributed to TiCl3; while the higher energy components in the range
458.4 - 458.5 eV correspond to Ti4+
from TiO2 [391].
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483484485486487488489
CP
S/I
nte
nsi
ty (
a.u
)
Binding energy (eV)
(i)
(ii)
(iii)
483484485486487488489
CP
S/I
nte
nsi
ty (
a.u
)
Binding energy (eV)
(i)
(ii)
(iii)
483484485486487488489
CP
S/I
nte
nsi
ty (
a.u
)
Binding energy (eV)
(i) (iii)
(ii)
(b)
400°C
600°C
500°C
483484485486487488489
CP
S/I
nte
nsi
ty (
a.u
)
Binding energy (eV)
(i)
(ii) (iii)
483484485486487488489
CP
S/I
nte
nsi
ty (
a.u
)
Binding energy (eV)
(i) (ii)
(iii)
483484485486487488489
CP
S/I
nte
nsi
ty (
a.u
)
Binding energy (eV)
(iii)
(i)
(ii)
(a)
400°C
600°C
500°C
Figure 4.4 Sn 3d XPS spectra of Ti doped ITO films (a): 2 at % and (b): 4 at
% Ti, annealed at different temperatures
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109
Figure 4.5 Ti 2p XPS spectra of Ti doped ITO films (a): 2 at % and (b): 4 at % Ti, annealed at
different temperatures
456457458459460
CP
S/I
nte
nsi
ty (
a.u
)
Binding energy (eV)
456457458459460
CP
S/I
nte
nsi
ty (
a.u
)
Binding energy (eV)
(i)
(ii)
(iii)
(a)
456457458459460
CP
S/I
nte
nsi
ty (
a.u
)
Binding energy (eV)
(i)
(ii) (iii)
456457458459460
CP
S/I
nte
nsi
ty (
a.u
)
Binding energy (eV)
(i)
(ii) (iii)
(b)
500°C
500°C
400°C
400°C
456457458459460
CP
S/I
nte
nsi
ty (
a.u
)
Binding energy (eV)
(i)
(ii) (iii)
600°C
(i)
(iii)
(ii)
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110
The de-convolution of O 1s spectra exhibits three sub-peaks within the energy range of 529.3 -
531.8 eV as shown in Figure 4.6 (a, b). The first components in the range of 529.3 - 529.6 eV
correspond to O-In bonds and O-Ti bonds, in In2O3 and Ti2O3. The second components within
the range 530.3 - 530.8 eV are attributed to TiO2 and SnO2 bonding states. Finally, the other
components in the range of 531.4 - 531.8 eV could be due to the existence of O-Sn bonds [387,
388, 391]. For In2O3-based oxide semiconductors, the role of oxygen vacancies (Vo) on the
electrical properties has inspired significant debate. Using first principle calculations and density
function theory, Agoston et.al reported that the oxygen vacancies in indium oxide lattice are
shallow, suitable for generating free electrons in the conduction band. Existence of oxygen
vacancies in indium oxide system and its derivative materials indicate experimentally that these
defects are the major source of n-type conductivity [392].
Figure 4.7 (a, b) shows the results from curve fitting of high resolution XPS spectra for Cl 2p
photon lines. Here also three components were obtained in the range of 197.6 – 199.9 eV. The
first components are observed in the energy range of 197.6 - 198.0 eV (labelled ‘i’) related to
InCl bonding state [393], the second components within 198.5 - 198.7 eV (labelled ‘ii’) may be
attributed to SnCl2 bonding states, while the last components in the range of 199.6 – 199.9 eV
(labelled ‘iii’) corresponds to TiCl3 bonding states [391]. Table 3.2 details the de-convoluting
results of the XPS data of spin coated Ti-doped ITO thin films as a function of Ti concentrations
and annealing temperature.
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111
(a)
527528529530531532533534
CP
S/I
nte
nsi
ty (
a.u
)
Binding energy (eV)
(i)
(ii) (iii)
527528529530531532533534
CP
S/I
nte
nsi
ty (
a.u
)
Binding energy (eV)
(i
(iii) (ii)
527528529530531532533534
CP
S/I
nte
nsi
ty (
a.u
)
Binding energy (eV)
(i)
(iii) (ii
(b)
527528529530531532533534
CP
S/I
nte
nsi
ty (
a.u
)
Binding energy (eV)
(iii)
(ii)
(ii
527528529530531532533534
CP
S/I
nte
nsi
ty (
a.u
)
Binding energy (eV)
(iii
(i)
(ii)
527528529530531532533534
CP
S/I
nte
nsi
ty (
a.u
)
Binding energy (eV)
(iii
(i)
(ii)
400°C
600°C
500°C
600°C
500°C
400°C
Figure 4.6 O 1s XPS spectra of Ti doped ITO films (a): 2 at % and (b): 4 at % Ti, annealed at
different temperatures
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112
196197198199200201202
CP
S/I
nte
nsi
ty (
a.u
)
Binding energy (eV)
(i) (ii)
(iii)
196197198199200201
CP
S/I
nte
nsi
ty (
a.u
)
Binding energy (eV)
(i) (ii)
(iii)
(b)
195196197198199200201202
CP
S/I
nte
nsi
ty (
a.u
)
Binding energy (eV)
(i)
(ii)
(iii)
196197198199200201
CP
S/I
nte
nsi
ty (
a.u
)
Binding energy (eV)
(i) (ii)
(iii)
196197198199200201202
CP
S/I
nte
nsi
ty (
a.u
)
Binding energy (eV)
(i)
(ii) (iii)
(a)
600°C
500°C
500°C
400°C
400°C
Figure 4.7 Cl 2p XPS spectra of Ti-doped ITO films (a): 2 at % and (b): 4 at
% Ti, annealed at different temperatures
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113
Table 4.2 Fitting results of the XPS data of Ti doped ITO films for the core level binding
energies
Ti
concentration
%
Annealing
temperature °C
Photoelectrons
lines
Bonding states
Binding
energy (eV)
FWHM (eV)
Percentages of
the
components %
In°(In-In bonds) 443.7 1.1 49.5
In 3d5/2 In2O3 444.4 1.2 41.9
InCl/InO× 445.1 1.3 8.6
SnO2 485.8 1.3 45.0
Sn3d5/2 SnO/SnO×/Sn 486.3 1.2 41.6
400 SnCl2 486.9 1.3 13.4
Ti2O3 457.4 0.5 28.8
Ti 2p3/2 TiO2 457.9 0.5 43.7
TiCl3 458.4 0.5 27.5
TiO2/In2O3 529.4 1.2 52.6
O 1s InO×/SnO 530.4 2.2 31.1
Ti2O3/SnO2 531.5 1.8 16.3
InCl 198.0 1.3 32.7
Cl 2p3/2 SnCl2 198.6 1.2 32.1
TiCl3 199.7 1.4 35.2
In°(In-In bonds) 443.7 1.2 59.4
In 3d5/2 In2O3 444.3 1.0 24.0
InCl/InO× 444.9 1.2 16.6
SnO2 485.8 1.2 61.7
Sn3d5/2 SnO/SnO×/Sn 486.5 1.0 30.7
2 at.% 500 SnCl2 487.2 1.0 7.6
Ti2O3 457.4 0.5 31.9
Ti 2p3/2 TiO2 457.9 0.6 58.6
TiCl3 458.5 0.3 9.5
TiO2/In2O3 529.5 1.4 66.1
O 1s InO×/SnO 530.8 1.6 20.3
Ti2O3/SnO2 531.8 1.7 13.6
InCl 197.9 0.7 46.6
Cl 2p3/2 SnCl2 198.5 0.9 23.4
TiCl3 199.6 1.0 30.0
In°(In-In bonds) 443.6 1.4 72.1
In 3d5/2 In2O3 444.5 1.1 15.6
InCl/InO× 445.2 1.8 12.3
SnO2 485.7 1.3 41.2
Sn3d5/2 SnO/SnO×/Sn 486.3 1.5 55.4
600 SnCl2 487.0 1.3 3.4
TiO2/In2O3 529.4 1.3 41.8
O 1s InO×/SnO 530.6 2.1 41.5
Ti2O3/SnO2 531.6 2.2 16.7
InCl 197.7 1 39.5
Cl 2p3/2 SnCl2 198.5 0.9 30.1
TiCl3 199.8 0.9 30.4
In°(In-In bonds) 443.7 1.3 64.4
In 3d5/2 In2O3 444.5 1.1 23.1
InCl/InO× 445.3 1.5 12.5
SnO2 485.7 0.9 30.3
Sn3d5/2 SnO/SnO×/Sn 486.3 0.8 37.7
400 SnCl2 486.9 1.2 32.0
Ti2O3 457.5 0.8 25.0
Ti 2p3/2 TiO2 458.0 0.7 33.8
TiCl3 458.5 0.9 41.2
TiO2/In2O3 529.6 1.2 58.7
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114
O 1s InO×/SnO 530.7 1.7 25.9
In2O3 531.7 1.7 15.4
InCl 197.9 0.9 30.7
Cl 2p3/2 SnCl2 198.7 1.2 39.4
TiCl3 199.9 1.2 29.9
In°(In-In bonds) 443.6 1.2 53.5
In 3d5/2 In2O3 444.1 1.0 33.8
InCl/InO× 444.7 1.1 12.7
SnO2 485.6 1.2 35.3
Sn3d5/2 SnO/SnO×/Sn 486.0 1.2 40.7
4 at. % 500 SnCl2 486.6 1.3 24.0
Ti2O3 457.4 0.8 41.9
Ti 2p3/2 TiO2 457.9 0.6 39.7
TiCl3 458.5 0.5 18.4
TiO2/In2O3 529.3 1.2 63.0
O 1s InO×/SnO 530.3 1.7 23.8
TiO2/In2O3 531.4 1.7 13.2
InCl 197.6 1.2 42.6
Cl 2p3/2 SnCl2 198.6 1.3 37.1
TiCl3 199.7 1.2 20.3
In°(In-In bonds) 443.8 1.3 75.7
In 3d5/2 In2O3 444.6 1.1 19.5
InCl/InO× 445.4 1.0 4.8
SnO2 485.7 1.1 31.8
Sn3d5/2 SnO/SnO×/Sn 486.1 1.2 44.6
600 SnCl2 486.7 1.2 23.6
Ti2O3 457.3 0.7 43.0
Ti 2p3/2 TiO2 457.9 0.5 40.4
TiCl3 458.4 0.5 16.6
TiO2/In2O3 529.4 1.3 66.3
O 1s InO×/SnO 530.5 1.8 23.5
TiO2/In2O3 531.6 1.7 10.2
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115
4.4.3. Mechanical Properties (Hardness, Young’s modulus and Wear resistance)
The thickness of the TCO films prepared for this study is within the range of 300 - 400 nm. It has
previously been reported that the indentation depth should be less than 10% of the film thickness
to avoid substrate effects. Therefore, in order to determine the hardness and elastic modulus
values for our Ti-doped ITO thin films, the measurements were taken at a maximum indenter
depth of around 13 nm, which is less than one-tenth our samples thickness.
Figure 4.8 (a, b) shows the load-displacement curves determined from the nanoindentation
measurements corresponding to the Ti-doped ITO samples of both Ti contents and after being
annealed. It was reported by Jian and co-worker that establishment of cracking in films
underneath the nanoindentor resulted in a distinct discontinuity in the loading part of the loading
displacement curve [394]. In this study, the experimental nanoindentation results presented in
Figure 4.8 (a, b) confirmed that continuous loading curves were obtained for all the films,
indicating that the phenomenon of cracking was absent in the Ti-doped ITO films at different Ti
contents and annealing temperatures. Hardness and Elastic (Young’s) modulus can be calculated
directly from the measurements of indentation load and penetration depth for both loading and
unloading process. From a typical load-penetration depth (p-h) curve, maximum load, maximum
displacement and unloading stiffness (also called contact stiffness S) can be determined. The
value of how resistant solid matter is to deformation under an applied force is known as the
hardness which was expressed by (Eq. 2.33). Young’s modulus can also be calculated from (Eq.
2.34) and (Eq. 2.35).
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116
Figure 4.8 Load-displacement curves of Ti-doped ITO films (a): 2 at % and (b): 4 at % Ti,
annealed at different temperatures
255075
100125150175200225
0 3 6 9 12 15
Ind
enta
tion l
oad
(μN
)
Indentation depth (μm)
600 °C
255075
100125150175200225
0 3 6 9 12 15
Ind
enta
tio
n l
oad
(μ
N)
Indentation depth (μm)
500 °C
255075
100125150175200225
0 3 6 9 12 15
Inden
tati
on l
oad
(μN
)
Indentation depth (μm)
400 °C
(b)
255075
100125150175200225
0 3 6 9 12 15
Ind
enta
tio
n l
oad
(μ
N)
Indentation depth (nm)
400 °C
255075
100125150175200225
0 3 6 9 12 15
Ind
enta
tio
n l
oad
(μN
)
Indentation depth (μm)
500 °C
255075
100125150175200225
0 3 6 9 12 15
Ind
enta
tio
n l
oad
(μ
N)
Indentation depth (μm)
600 °C
(a)
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117
The hardness (H) and elastic modulus (E) values of the Ti-doped ITO films derived from
nanoindentation experiments are shown in Figure 4.9 (a, b). A difference is observed between
the trends in the hardness results of the two sets of samples. For the 2 at.% samples, the hardness
decreased with increasing annealing temperature, changing from 6.6 to 6.3 GPa when the
annealing temperature increased from 400 to 600 °C. In contrast, for the 4 at.% samples, the
hardness seems to stabilise around 6.8 GPa after annealing at different temperatures, only
showing a slight decrease after annealing at 500 °C. Overall, the results show that the ITO films
with higher Ti concentrations have the highest average hardness. The hardness of the Ti-doped
ITO thin films measured in the present study are generally consistent with those reported by
Zeng et.al (6.5 ± 1.6 GPa) for 250 nm thick sputtered ITO thin films onto glass substrate using a
Berkovich indenter with 6 mN load [395]. Similar trends were also observed by Yen et.al for
ZnO thin films deposited by atomic layer deposition on Si substrates and then post annealed at
different temperatures. They suggested that the decreasing hardness of the ZnO thin films with
increasing annealing temperature can be related to the increment of the grain size with increasing
temperature [396]. Therefore, it seems here that there is no effect of the grain size to the hardness
of the films prepared with 4 at% Ti since they mostly possess the same hardness. However, the
films prepared with 2 at% Ti show a slight improve in the hardness with decreasing their grain
sizes (as seen in section 3.4.1). However they are still less hard than the 4 at.% samples. Also,
the reduction in the hardness could be ascribed to the changes in elemental compositions
resulting from the diffusion process in the coatings, softening of the substrate, stress relaxations
and formation of new phases. As such, the decrease in the hardness of 2 at.% Ti-doped ITO films
with increasing annealing temperature could be attributed to a number of different mechanisms.
In this work, the samples were annealed in atmospheric environment, so it was expected that the
composition of the surfaces would change due to oxidation. Therefore, it is reasonable to assume
that the change in the hardness of Ti-doped ITO samples is induced by the difference in the
oxygen content on the surface of the film with increasing temperature, as proved in the XPS
results (section 4.4.1). These results are in general agreement with those reported by Biswas and
co-authors, which show that there is a relation between the hardness and the oxygen contents in
the ITO film materials. They found that when the oxygen content increased from 6 to 10 wt% in
the precursor solutions, the hardness of the corresponding ITO films decreased from 9.6 ± 0.9
GPa to 1.6 ± 0.1 GPa [397]. Barna et.al and Petrov et.al reported that, oxygen, impurities and
other defects may lead to grain refinement and then change the morphology of the films [398,
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118
399]. As a summary, a higher annealing temperature leads to larger grain size (as mentioned
previously in Section 4.4.1), which, when combined with substitutions, interstitials, and/or the
formation of oxygen vacancies and other point defects, may cause a hardness decrement,
although this effect is not so significant in our 4 at.% samples. In relation to the annealing
temperature increment, the Young’s modulus of Ti-doped ITO films decreased for the films of 2
at.% Ti, while it increased for the films of 4 at.% as shown in Figure 4.9 (a and b). However,
both thin films with 2 at.% and 4 at.% Ti contents present similar Young’s modulus in the range
of 137 - 143 GPa, which is comparable to the reported results given by Zeng et.al (120 - 160
GPa) [38] and Chen and Bull (141 GPa)[383, 395].
Elastic modulus along with hardness of material can influence wear behaviour. The wear of a
material coupled with elastic limit define the ability of this material to deform under an applied
stress and regain its initial state without being deformed permanently [400]. The ratio, H/E,
which is obtained from nanoindentation measurements can be used to evaluate the wear
resistance of the coating. The larger this ratio is the higher the wear resistance will be [329]. The Ti-
doped ITO thin films exhibited a decrease in H/E values which are correlated to the reduction of
wear resistance through high annealing temperature, as shown in Table 4.3. It is clear from Table
4.3 that both the hardness and Young’s modulus depends on the annealing temperature. As
discussed previously, the prepared Ti-doped ITO thin films were annealed in air atmosphere
resulting in changes of the composition of the sample surface due to an oxidation process. Thus,
the decrease in the hardness of Ti-doped ITO samples along with increasing annealing
temperature could be attributed to increasing the oxygen contents at the surface of the film. A
similar trend for Young’s modulus was observed with increasing annealing temperature. Thus, it
is possible to surmise that the annealing temperature exerts a negative effect on the mechanical
properties of the Ti-doped ITO film coatings. The H/E values in this study are in the range of
4.5 10-2 – 4.6 10
-2 and 4.8 10-2 - 5 10
-2, for the films of 2 at.% and 4 at.%, respectively. These
values represent a reasonable level of wear resistance, which is even better than other metal
oxide ceramics with H/E values of 3 10-2 - 4 10
-2 [401, 402].
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119
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
135
136
137
138
139
140
141
142
143
144
300 400 500 600 700
Har
dnes
s (G
Pa)
Yo
ung's
mo
dulu
s (G
Pa)
Annealing temperature (°C)
Young's modulus
Hardness (H)
(E)
(a)
6.5
6.6
6.7
6.8
6.9
135
136
137
138
139
140
141
142
143
144
300 400 500 600 700
Har
dnes
s (G
Pa)
Yo
ung's
mo
dulu
s (G
Pa)
Annealing temperature (°C)
Young's modulus
Hardness (H)
(E)
(b)
Table 4.3 Mechanical properties of Ti doped ITO films after being annealed at different
temperatures
Ti
concentration
(at.%)
Annealing
temperature °C
Hardness
(GPa)
Young’s
modulus (GPa)
Wear resistance
(H/E 10-2
)
400 6.6 143 4.6
2 500 6.4 141 4.5
600 6.3 139 4.5
400 6.8 137 5.0
4 500 6.7 141 4.8
600 6.8 143 4.8
Figure 4.9 Hardness and Young’s modulus of Ti doped ITO films (a): 2 at % and (b):
4 at % Ti, annealed at different temperatures
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120
4.5. Conclusions
Ti-doped ITO thin films were fabricated on glass substrates using a low cost and efficient sol-gel
spin coating method. The effects of Ti concentrations (i.e., 2 at.% and 4 at.% Ti) and annealing
temperature (ranging from 400 - 600 °C) on the phonon vibrational modes, surface chemical
bonding states and mechanical properties of Ti doped ITO thin films were studied using Raman
spectroscopy, XPS and nanoindentation techniques. Raman analysis revealed the existence of
ITO and/or In2O3 vibrational modes. By increasing the annealing temperature some peaks were
inversely altered. The XPS results show that the main component atomic percentages such as In,
Sn and Ti decreased as the annealing temperature increased from 400 to 600 °C, while the O
atomic percentages increased. Also, at 600 °C, the Ti2p and Cl2p signals were completely absent
for 2 at % and 4 at % Ti concentration, respectively, indicating that surface oxidation takes place
at high temperature.
The nanoindentation load-displacement curves confirmed that all the films exhibited continuous
loading curves, indicating that the phenomenon of cracking was absent in the Ti doped ITO films
at both Ti contents. Variations in the hardness (H) and the elastic modulus (E) were observed
with different Ti at.% and annealing temperature. The hardness is within the range of 6.3-6.6
GPa and 6.7-6.8 GPa for 2 at.% and 4 at.% Ti content samples, respectively. In most cases the
hardness values are negatively affected with increasing annealing temperature, and the films with
higher Ti concentration in the ITO films possess the highest average hardness. Synthesized Ti-
doped ITO thin films at different Ti contents show the same Young’s modulus values in the
range of 137 - 143 GPa. A combination of the highest H and E were achieved in the sample of
4% Ti content annealed at 600 °C. All the Ti-doped ITO films appear to possess high wear
resistance. Combining with optimised control over the doping and annealing processes, the
results from this work are expected to help facilitate the engineering design of customizable Ti-
doped ITO thin films for various industrial applications.
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121
5.9
6.1
6.3
6.5
6.7
6.9
128
132
136
140
144
148
0 2 4 6 8 10 12
Har
dnes
s (G
Pa)
Yo
ung's
mo
dulu
s (G
Pa)
Ag concentration (%)
Young's modulus
Hardness (H)
60
65
70
75
80
85
90
95
100
300 350 400 450 500 550 600 650 700 750 800
Tra
nsm
itta
nce
%
Wavelength (nm)
Ag-doped ITO
Mechanical
UVvis
5. CHAPTER 5: Improved Mechanical Properties of Sol-Gel
Derived ITO Thin Films via Ag Doping
Paper III
Hatem Taha, Zhong-Tao Jiang, David J. Henry, Amun Amri, Chun-Yang Yin, Afishah Binti
Alias, Xiaoli Zhao, Improved mechanical properties of sol-gel derived ITO thin films via Ag doping.
Mat. Tod. Com., 2018, 14, 210-224.
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122
5.1. Abstract
In this work, indium tin oxide (ITO) and silver-doped ITO thin films at different Ag
concentrations (i.e. 2, 4, 6 and 10 at. %) were fabricated via a sol-gel spin coating technique. The
thin film coatings were post annealed at 500 °C. Structural, mechanical, surface morphology,
electrical and optical characteristics of the ITO and Ag-doped ITO thin films were studied as a
function of Ag concentrations. XRD results are consistent with the presence of body centered
cubic structure of the indium oxide polycrystalline phase with a new peak for Ag at 2θ ≈ 38.2°,
indicating that by introducing Ag atoms they do not remarkably change the structural
characteristics of the ITO films. FESEM images display the formation of ITO and Ag-doped ITO
nanocrystals and the average crystallite size increases after annealing treatment as well as the
incorporation of Ag concentration. The mechanical properties of the thin films were
characterised by nanoindentation technique, with significant improvement observed through a
combination of Ag doping and annealing treatment, which helps enhancing the effectiveness of
the grain boundary in obstructing the displacement movements. The observed improvement in E
and H is 14% and 28% respectively, with the hardness and Young’s modulus finally reaching 6.7
GPa and 148 GPa, respectively. Load carrying capability and wear resistance are also enhanced
by doping and annealing treatment. After annealing at 500 C, the thin film coatings with the
electrical resistivity of 2.4×10-4
Ωcm, carrier concentration of 6.8×1020
cm-3
and carrier mobility
of 37 cm2/V s were achieved when the Ag doping level was 4 at.%. On the other hand, the
maximum optical transparency was found to be 92% for both ITO and 2% Ag-doped ITO thin
films after being annealed at 500 °C. The variation of optical constants, such as absorption
coefficient, refractive index and extinction coefficient with different Ag concentrations, were
also studied.
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123
5.2. Introduction
Transparent conductive films (TCFs) have received significant attention owing to their desirable
optoelectronic characteristics such as high optical transparency and low electrical resistivity. So
far, indium oxide (In2O3) and/or tin-doped In2O3 (ITO) are well-known materials that have been
widely used as transparent conductive oxides (TCOs) in touch screens, solar cells, liquid crystal
displays, smart windows, light emitting diodes (LEDs) and sensors [217, 403-409]. Other than
possessing good electrical and optical properties, ITO thin films also have good chemical and
thermal stability as well as great adhesion and etching characteristics, compared to other TCOs
such as ZnO, TiO2 and SnO2 [199, 410-413]. Many techniques are used for manufacturing ITO
based thin films such as, thermal evaporation, DC and RF magnetron sputtering, electron beam
evaporation, pulsed laser deposition, screen printing, spray pyrolysis and sol-gel methods [26,
212, 414-419]. The most common fabricating methods are based on sophisticated equipment
such as high vacuum systems combined with physical vapour deposition (PVD) processes
supplied with high calcine temperature and complicated controlling unit. These complicated and
harsh processes, which result in very high end products, have greatly encouraged the
development of vacuum-free and low-cost techniques. The sol-gel method combined with a spin
coating process has certain advantages such as cost effectiveness (no vacuum requirements), low
temperature, easy control of the doping level, shorter processing time, and the possibility of
producing coatings with high scalability along with the opportunity of fine-tuning the preferred
shapes and surface areas has been widely used so far for fabricating TCFs [182, 261, 420-422].
To improve the performance of ITO thin films, numerous studies have been carried out to
improve either their electrical conductivity or optical transparency. Introducing suitable foreign
dopants such as Ti, Cr, Cu, Mo, Fe, Nb and Ag to the ITO matrix were found to be beneficial for
improving both the electrical conductivity and optical transparency [423-425]. Among these
dopants, silver (Ag) was found to be favoured due to its low electrical resistivity compared to
other bulk materials [426-429]. However, there have been only limited efforts and attempts to
improve the mechanical characteristics of ITO thin films. In this study, simple and low cost spin-
coating derived ITO and Ag-doped ITO thin films were produced. The concentration of the ITO
solution was fixed at 0.1 M, while the silver (additive) doping concentration varied (2%, 4% 6%
and 10%). All the samples were post annealed at 500 °C. Owing to the brittle surface of ITO, it
is thought that by introducing a foreign metal element with better mechanical properties than
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124
indium in ITO matrix may improve the mechanical properties of the thin films. A review of the
literature indicated that both high Ag doping concentration (10%) and high annealing
temperature (500 °C) for Ag-doped ITO thin films have not been investigated in detail. We
assume that higher Ag concentration may result in enhancing the mechanical properties along
with maintaining the optoelectronic characteristics of ITO thin films. Furthermore, based on our
previous study [430], a better optoelectronic characteristic can be achieved by applying
annealing process. Therefore, the main objective of the present investigation is to study the role
of Ag additive and annealing temperature on the mechanical and optoelectronic properties of sol-
gel synthesized Ag-doped ITO thin films.
5.3. Experimental Methods
5.3.1. Raw Materials
ITO and Ag-doped ITO solutions were prepared by using hydrated indium nitrate
(In(NO3)3.5H2O, Alfa Aesar, 99.9%), tin chloride dihydrate (SnCl2.2H2O, Chem-supply, 98%,),
Silver nitrate (AgNO3, Chem-supply, 99.5%) and polyvinylpyrrolidone (PVP, M = 40000g/mol).
All of these chemicals were used as received. Absolute ethanol was employed as a solvent and
the ITO and Ag-doped ITO thin films were deposited on soda-lime glass substrates.
5.3.2. Sol-Gel and Thin Films Preparation
A 40 ml solution of ITO (0.1M) was prepared by separately dissolving the required amounts of
In(NO3)3.5H2O and SnCl2.2H2O into two separate beakers with 20 ml absolute ethanol. The two
solutions were stirred for 1 hour, then mixed together and refluxed at 60 °C for 1 hour until a
transparent solution was obtained. Then, the resultant solution was divided into five separate
beakers each with 8 ml of ITO solution. The required amounts of AgNO3 and PVP were then
added to four of the previous ITO solutions to make Ag-doped ITO solutions with 2, 4, 6 and 10
at.% Ag concentrations then refluxed at 60 °C for 1 hour. The role of PVP is to provide a
hydrophobic layer to prevent the agglomeration of Ag particles through the preparation of
solutions. The final solutions were stored at room temperature for 24 hours prior to deposition
processes. Soda-lime glass substrates (25×25 mm) were sonicated in absolute ethanol followed
by milliQ water at 60 °C for 10 minutes, then dried under vacuum in a drying oven at 100 °C for
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125
30 minutes. The deposition process included: (1) dispensing the solution at 300 rpm for 15
seconds, (2) spreading the solution at 2500 rpm for 20 seconds and (3) drying the solution at
4000 rpm for 20 seconds. After each deposition step, the sample was calcined at 150 °C for 10
minutes. These steps were repeated until the desired film thickness was achieved. Samples
referred to as deposited samples were calcined but not annealed. The prepared samples were then
annealed at 500 °C for 2 hours in air atmosphere.
5.3.3. Analysis Techniques
The crystallographic structure of the ITO and Ag-doped ITO thin films were examined by X-ray
diffraction (XRD) analysis via a GBC EMMA diffractometer with CuKα radiation (=0.154nm).
All the XRD measurements were carried out at a diffraction angle (2) in the range of 25° - 70°
with a scanning rate of 2°/min and 2 step size of 0.02. The surface morphology was observed
via Philips XL 20 SEM equipped with an electron dispersive X-ray (EDX) analysis column and a
Zeiss Neon 40EsB Field Emission Scanning Electron Microscopy (FESEM). Prior to FESEM
imaging, the samples were first mounted onto the substrates holder using carbon tape followed
by coating with platinum (about 3nm thick) to minimize the charging effects. A 4-point probe
(Dasol Eng. FPP-HS8) was used to measure the electrical properties of prepared films and the
Hall-effect measurements were carried out on specimens of (10×10 mm) using ECOPIA HMS-
2000 system at 0.9 Tesla of magnetic field and Polytec Bipolar Operation Power supplies (BPO).
Au contacts were thermally evaporated on the coated samples in a system of four probes. The
transmittance spectrum was obtained by using UV-VIS Perkin Elmer spectrometer in a
wavelength range of 250 - 800 nm. The mechanical characterisation was performed using a
nanoindentation workstation (Ultra-Micro Indentation system 2000, CSIRO, Sydney, Australia),
equipped with a diamond Berkovich indenter. The area function of the indenter tip was
calibrated using a standard fused silica specimen. The measurements were collected with
maximum loading of 200 nN and maximum penetration depth less than one-tenth of the coating
thickness. In order to attain better resolution, the number of measuring points has been increased
to 15 during loading and 20 during unloading.
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126
5.4. Results and Discussions
5.4.1. Crystallographic Structure Properties
In this investigation, the films prepared with 4 at.% and 6 at.% Ag concentration exhibit quit
similar electro-optical characteristics. Therefore, only the results related to 4 at.% Ag are
discussed in terms of structural, morphological, electrical and optical properties. Figures 5.1 and
5.2 show the XRD patterns for the as deposited (150 °C) and post annealed spin coated ITO and
Ag-doped ITO thin films, respectively. The XRD data for all the samples are consistent with the
presence of polycrystalline features of a body centred cubic bixbyite structure with space group
of la3/cubic similar to In2O3 (JCPDS card 06-0416) with a lattice parameter of 10.118 Å. The
main features for the prepared and post annealed thin films are assigned to be (222), (400), (411),
(332), (440) and (622) ITO reflection directions of In2O3 as well as (111) Ag reflection direction
located around (2θ ≈ 38.2°) for the films of Ag-doped ITO at all Ag concentrations. These results
confirm the observation that the polycrystalline feature of In2O3 may act as a network with a
body centred cubic bixbyite structure and the Ag atoms are well incorporated in the ITO matrix
without any observable changes in the crystal structure of the host. Furthermore, there aren’t any
adulterated phases related to tin compounds observed in the XRD patterns of ITO and Ag-doped
ITO thin films. Both as deposited ITO and Ag-doped ITO thin films show poor crystallinity due
to the crystallization temperature of ITO to be in the range of 150-160 °C [68, 353]. Since the
variation of Ag concentration has not altered the as-deposited crystalline structure for Ag-doped
ITO samples, one XRD spectrum of the thin film with 4 at.% Ag was used as an example in
Figure 5.2. After the annealing process, the increase of Ag concentration slightly enhanced the
Ag phase (111) reflection direction as expected, see Figure 5.2. Mirzaee et al. [431] have
proposed that doping of ITO with silver leads to formation of silver nanoparticles within the
structure of In2O3. They suggest that the reduction of silver ions is facilitated by a redox reaction
with tin as described in the following relation:
Sn2+
+ 2Ag+ → Sn
4+ +2Ag
0 (5.1)
It is also clear from Figures 5.1 and 5.2 that the ITO and Ag-doped ITO thin films had improved
crystalline quality, evident by the intensity of the (222) peak as the annealing temperature (500
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127
°C) was applied. However, there is a slight shift in the main peak (i.e., (222)) position toward
smaller angle of 2θ for the synthesized thin films compared to the standard JCPDS of In2O3. This
indicates that the occurrence of lattice expansion is possibly due to the substitution of In3+
atoms
by both Sn4+
and Ag atoms having different atomic radii. The atomic radii for In, Sn and Ag are
0.09, 0.07 and 0.126 nm, respectively. This phenomenon can be attributed to the fact that
electrons are thermally excited from the donor impurities bands to the conduction band after
applying annealing temperature. These electrons are mainly characterized as Sn and Ag 5s state
with a Sn-O and Ag-O anti-bonding character. The occupations in these anti-bonding states
enhance the reduction of Sn and Ag, which is lower than the forces between Sn and O, Ag and O
as well as the overall energy of the crystal structure, thus inducing the lattice expansion [432,
433]. With the combined effects of both ionic radii and occupations in the anti-bonding states,
the lattice variation can impact the electronic band structure, thereby the electronic properties.
Another consideration for this shift could be related to the strain effect due to thermal expansion
misfit between the substrate and the thin film.
20 25 30 35 40 45 50 55 60 65
Inte
nsi
ty (
a.u.)
2θ (degree)
Annealed at 500° C
As deposited
(22
2)
(62
2)
(44
0)
(41
1) (4
00
)
Figure 5.1 The XRD patterns of as deposited and annealed ITO thin films
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128
Table 5.1 Structural parameters for as deposited and annealed ITO and Ag-doped ITO thin films
Ag
content
(at.%)
2θ (in
degrees)
d-spacing
(Å)
(h k l) Lattice
constant (Å)
Crystallite
size (nm)
0 30.44 2.933 (222) 10.16 23
2 30.46 2.932 10.15 31
As deposited 4 30.52 2.925 10.13 26
10 30.54 2.923 10.12 24
0 30.38 2.938 (222) 10.17 41
2 30.42 2.935 10.16 54
Annealed at 500°C 4 30.44 2.933 10.16 43
10 30.50 2.927 10.14 33
25 30 35 40 45 50 55 60 65
Inte
nsi
ty (
a.u.)
2θ (degree)
(22
2)
(40
0)
(44
0)
(41
1)
(33
2)
(62
2)
As deposited
10 at.% Ag
4 at.% Ag
2 at.% Ag
(11
1)
Ag
Figure 5.2 The XRD patterns of as deposited and annealed Ag-doped ITO films
prepared at different Ag concentrations
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129
Debye Scherrer equation (Eq. 2.26) was used to determine the crystallite size (D) from the full
width at half maximum (FWHM) of the main peak (222).
Also, the lattice constant and the related inter-planar spacing (d-spacing) were calculated using
Bragg's law and related standard Bravias lattice for cubic system (Eq. 2.25) and (Eq. 2.27),
respectively. The calculated results are presented in Table 5.1.
From Table 5.1 and Figure 5.3, it is clearly shown that the calculated crystallite size of the ITO
and Ag-doped ITO thin films at different Ag content is increased after being annealed at 500 °C.
However, the Ag-doped ITO samples showed bigger crystallite sizes than those for pure ITO.
This can be related to the effect of Ag additive that may act as nucleation centres, resulting in the
formation of large crystallites. Also, by enlarging the crystallite sizes for ITO and Ag-doped ITO
thin films along with applying annealing temperature suggest that annealing can improve the
crystallization and enhance the substitution of In3+
by Sn4+
and Ag ions [61]. Furthermore, it has
been reported that the Ag atoms may also vibrate resulting in an annealing effect in the ITO
structure which promotes the nucleation process and growth of the thin film along the preferred
direction [60]. We also note that crystallite sizes in our study are substantially larger than those
reported by Mirzaee et al. annealed at 350 °C [431]. Indeed, the average calculated lattice
constants for all the as deposited and post annealed ITO and Ag-doped ITO thin films were
estimated to be slightly larger than the reported value for un-doped indium oxide of 10.118Å.
The variation in the lattice constants could be due to the size differences of the dopant atoms
(i.e., Sn and Ag) as well as the induced stress near the film surface through both doping and
annealing process. Furthermore, since Ag is an amphoteric dopant, it can be considered that
some of these ions may occupy interstitial sites or become scattered or clustered centres in the
ITO matrix.
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130
5.4.2. Morphological and EDX Analysis
Figures 5.4 presents high magnification FESEM images of the synthesized ITO and Ag-doped
ITO at (2, 4 and 10 at.% Ag content) thin films after being annealed at 500 °C. All thin films
show uniform, dense, smooth and homogeneous surfaces with a grain structure indicating the
nanocrystalline features. However, the Ag-doped ITO thin films prepared at different Ag
contents have larger crystallite sizes compared to that of pure ITO. This can be related to the
effect of Ag dopants that may agglomerate around the preferred orientation resulting in the
formation of large crystallites, thereby improving the crystalline quality of Ag-doped ITO thin
films as noticed previously in the XRD results. These results are in good agreement with those
reported by Jeong et al. [434] for Ag doped ZnO. Figure 5.5 show the EDX analysis of the ITO
and Ag- doped ITO thin films. The results reveal the existence of the main elements (In, Sn, Ag,
and O) in each sample coatings.
0
10
20
30
40
50
60
0 2 4 6 8 10 12
Cry
stal
lite
siz
e (n
m)
Ag content (at.%)
As-deposited
Annealed at 500 °C
Figure 5.3 Variations the crystallite size of as deposited and annealed ITO
and Ag-doped ITO thin films with Ag concentration
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131
4%
ITO
10%
2%
0 1 2 3 4 5
Co
unts
Energy (KeV)
Ag Mg
Na
O
In Sn
In
Si
Al
Pure ITO
4 at% Ag-doped ITO
Figure 5.4 FESEM images of annealed ITO and Ag-doped ITO thin films at different Ag
concentrations
Figure 5.5 EDX analyses of annealed (a): ITO and (b): 4 at% Ag-doped ITO thin films
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132
5.4.3. Electrical Properties
The electrical properties of ITO and Ag- doped ITO thin films were investigated by means of 4-
point probes and Hall-Effect measurements. Figure 5.6 presents the variation of electrical
resistivity and conductivity (σ = 1/ρ) with Ag concentration. The as deposited ITO thin film has
a resistivity of 7.4×10-4
Ωcm with carrier concentration and mobility values of 2.8×1020
cm-3
and 29 cm2/Vs, respectively, as shown in Figure 5.7a. The resistivity of as deposited Ag-doped
ITO thin films decreased from 7.1 to 5.8 ×10-4
Ωcm as the Ag concentration increased from 2
at.% to 4 at.% respectively. Also, it is observed from Figure 5.6a that the resistivities for as
deposited thin films with 2 at.% and 4 at.% Ag concentration were lower than that from pure
ITO thin films. When Ag concentration increased to 10 at.%, the resistivity showed a rapid
increase reaching its maximum value of 8×10-4
Ωcm as seen in Figure 5.6a. This increment in
the electrical resistivity at higher Ag concentration is likely to be related to the solubility limits
of Ag in the ITO matrix. Therefore, the Ag atoms may occupy random sites in the ITO structure,
resulting in an increase of lattice distortion. Also, at higher Ag doping concentration, the increase
of ionized impurities scattering and electron-electron scattering leads to increasing the resistivity
of Ag-doped ITO as well [431]. Ag doping contributes a large number of electrons, thereby,
increasing the carrier concentration in the thin film. This is seen in Figure 5.7a where the as
deposited film of 4 at.% Ag concentration has a high carrier concentration of 3.9×1020
cm-3
.
However, higher dopant concentration can impair the carrier mobility since these dopants may
act as trapping centres for the free carriers. Therefore, the carrier concentration and mobility
were found to be lower than expected for the film prepared with higher Ag doping rate [435].
This suggests that a portion of these dopants may remain electrically inactive, hence, the carrier
concentration and the mobility of the as deposited film of 10 at.% Ag content decreased to values
of 3.5×1020
cm-3
and 22 cm2/Vs, respectively, as seen in Figure 5.7a.
When the annealing temperature was applied on the fabricated samples, the resistivity for ITO
film decreased to 2.7×10-4
Ωcm, while the carrier concentration and the mobility increased to
6.5×1020
cm-3
and 35 cm2/Vs, respectively. The Ag-doped ITO samples showed the lowest
resistivity value of 2.4×10-4
Ωcm for the film of 4 at.% Ag content as shown in Figure 5.6b.
Annealing temperature leads to an improvement in the crystalline quality along with increasing
the crystallite size of fabricated samples as evident in the XRD results. As a result, the grain
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133
boundaries decreased and the trapped electrons were released which led to an increase in the
carrier concentration. For the films of Ag-doped ITO, increasing the crystallite size after
annealing treatment may be due to the growth of the coalescence of Ag particles in the film
matrix, which may provide effective conducting paths for free carriers [179, 436]. Moreover,
annealing treatment enhances substitution of indium atoms by tin and silver atoms, yielding an
increase in carrier concentration as well as conductivity in the thin films. This is evident in
Figure 5.7b where the carrier concentration and the mobility of Ag-doped ITO thin films
increased especially for that of 4 at.% Ag contents reaching their maximum values of 6.8×1020
cm-3
and 37 cm2/Vs, respectively. The film with 10 at.% Ag content exhibits an increase in the
carrier concentration reaching 6.3×1020
cm-3
after being annealed at 500 °C, compared with
6.0×1020
cm-3
obtained from the 2 at.% Ag sample. Meanwhile, in the former thin film the carrier
mobility decreased to 22 cm2/Vs due to the increase of electron-electron scattering and
impurities scattering, as discussed before which in turn reduced the conductivity. It is interesting
to notice that, the film with 10 at.% Ag content has a higher carrier concentration; however, it
also has a higher electrical resistivity compared to that prepared with 2 at.% Ag content. This is
because the lower resistivity and/or the higher conductivity basically depends on both carrier
concentration (N) and mobility (μ) based on the relation of σ = N e μ.
Table 5.2 Electrical and optical properties for as deposited and annealed ITO and Ag-doped ITO
thin films
Ag
(at.%)
T
(%)
Eg
(eV)
ρ ×10-4
(Ωcm)
n ×1020
(cm-3
)
μ
(cm/Vs)
Φ×10-3
(Ω-1
)
0 88.0 3.69 7.4 2.8 29 13
2 88.5 3.71 7.1 3.2 26 14
As deposited 4 88.0 3.68 5.8 3.9 27 16
10 85.0 3.67 8.0 3.5 22 8
0 92.0 3.74 2.7 6.5 35 56
2 92.0 3.75 3.2 6.0 32 47
Annealed at 500°C 4 90.0 3.72 2.4 6.8 37 50
10 87.0 3.67 4.3 5.6 25 20
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134
0
1000
2000
3000
4000
5000
1
2
3
4
5
6
7
8
9
0 2 4 6 8 10 12
Co
nd
uct
ivit
y (
S.c
m-1
)
Res
isti
vit
y×
10
-4(Ω
.cm
)
Ag content (at.%)
0
1000
2000
3000
4000
5000
1
2
3
4
5
0 2 4 6 8 10 12
Co
nd
uct
ivit
y (
S.c
m-1
)
Res
isti
vit
y×
10
-4(Ω
.cm
)
Ag content (at.%)
(b)
(a)
Figure 5.6 Electrical resistivity and conductivity of ITO and Ag-doped ITO thin films with
different Ag concentration, (a): as deposited and (b): annealed
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135
2.8
3
3.2
3.4
3.6
3.8
4
0
5
10
15
20
25
30
0 2 4 6 8 10 12
Car
rier
co
nce
ntr
atio
n×
10
20 (
cm-3
)
Mo
bil
ity (
cm/V
s)
Ag content (at.%)
5.8
6
6.2
6.4
6.6
6.8
7
20
25
30
35
40
0 2 4 6 8 10 12C
arri
er c
on
cen
trat
ion×
10
20 (
cm-3
)
Mo
bil
ity (
cm/V
s)
Ag content (at.%)
(a)
(b)
Figure 5.7 Mobility and carrier concentration of ITO and Ag-doped ITO thin films with different
Ag concentration, (a): as deposited and (b): annealed
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136
5.4.4. Optical Properties
The transmittance spectra of as deposited and annealed pure ITO and Ag-doped ITO thin films
prepared at different Ag content (i.e., 2, 4, and 10) at.% are shown in Figure 5.8. The optical
transparency of as deposited ITO thin film was found to be 88%. When the Ag dopants were
introduced to the ITO film materials, the optical transparency of as deposited Ag-doped ITO thin
film with 2 at.% Ag content was slightly enhanced achieving 88.5 % due to the enlargement of
the crystallite size. This is proved by the XRD and FESEM results while, the film with 4 at.% Ag
appears to have the same transparency as the ITO thin film. However, with further increase of
the Ag content to 10 at.%, the optical transparency of Ag-doped ITO thin film decreased to a
value of 85% as seen in Figure 5.8a, which could be related to increasing both the electrons and
impurities scattering along with increasing the lattice distortion at high doping concentrations.
When the annealing temperature of 500 °C was applied on the deposited ITO and Ag-doped ITO
thin film, the transparency was increased in all of the samples reaching its maximum value of
92% for both pure ITO and 2 at.% Ag-doped ITO thin films (Figure 5.8b). Higher annealing
temperature leads to an improvement of the crystalline quality of the prepared samples through
increasing the crystallite size and decreasing the grain boundaries (as noticed previously in the
XRD analysis), and then higher optical transparency. It is also observed from Figure 5.8 that the
transmittance threshold for as deposited and annealed Ag-doped ITO thin films shift to lower
energy compared with that for pure ITO spectra. This can be related to the Burstein-Moss shift
(shift of Fermi level due to high carrier concentration in the conduction band) [437, 438].
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137
60
65
70
75
80
85
90
95
100
300 350 400 450 500 550 600 650 700 750 800
Tra
nsm
itta
nce
%
Wavelength (nm)
10%
4%
2%
ITO
60
65
70
75
80
85
90
95
100
300 350 400 450 500 550 600 650 700 750 800
Tra
nsm
itta
nce
%
Wavelength (nm)
10%
4%
2%
ITO
(a)
(b)
Figure 5.8 Transmittance spectra of ITO and Ag-doped ITO thin films with different Ag
concentration, (a): as deposited and (b): annealed
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138
The band gap energy (Eg) was obtained from the transmittance data using (Eq. (3.1).
The Tauc Plot of photon energy hv versus (αhv)2
was used to obtain the band gap energies of the
synthesised ITO and Ag-doped ITO thin films by extrapolating the linear part of the plotted
curves along with (αhv = 0).
The estimated energy band gap of ITO and Ag-doped ITO thin films for both as deposited and
after being annealed at 500 °C are presented in Figure 5.9. The results show that the as deposited
ITO and Ag-doped ITO thin films have smaller energy band gaps than those annealed at 500 °C
indicating a band gap broadening occurring after thermal treatment. The energy band gap
increment is possibly due to the improvement of crystalline structure and increasing the
crystallite size, as well as carrier concentration, in the films. The optical band gap energy for ITO
thin film increased from 3.69 eV for as deposited film to 3.74 eV after being annealed at 500 °C.
Thin film with lower Ag concentration, such as 2 at.%, exhibits slightly larger energy band gap
than that of ITO, i.e., 3.71 eV and 3.75 eV for as deposited and annealed thin films, respectively.
However, with the increase of Ag concentration, the optical band gap decreased due to the
increase of electron and ion impurities scattering at high doping concentration (Burstein-Moss
effect) [162, 439]. The films with 10 at.% Ag content appears to have the lowest optical band
gap energy of 3.67 eV for both as deposited and after being annealed at 500 °C. Relevant optical
properties are listed in Table 5.2.
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139
Figure 5.9 Optical band gap of ITO and Ag-doped ITO thin films with different Ag
concentration, (a): as deposited and (b): annealed
3.5 3.55 3.6 3.65 3.7 3.75 3.8 3.85 3.9 3.95 4
Photon energy (eV)
10%
4%
2%
ITO
( 𝛼 𝑣) ( 𝑐𝑚 𝑒𝑉
)
(b)
3.5 3.55 3.6 3.65 3.7 3.75 3.8 3.85
Photon energy (eV)
10%
4%
2%
ITO
( 𝛼 𝑣) ( 𝑐𝑚 𝑒𝑉
)
(a)
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140
The absorption coefficient (α) of the ITO and Ag-doped ITO thin films was calculated by using
the formula as below [440]:
(
) (5.2)
where t is the film thickness and T is the transmittance value.
Variation of the absorption coefficient for as deposited and annealed thin films with respect to
wavelength in the range of (350-800) nm is presented in Figure 5.10. From Figure 5.10, it is seen
that the absorption edge for Ag-doped ITO films shifts to longer wavelength and the thin films
show higher absorption coefficient compared to pure ITO samples. This phenomenon suggests
that the increase of Ag doping level enhances the absorption in the UV – Deep-UV region. Thus,
as noticed previously in the optical band gap calculations, the as deposited and annealed Ag-
doped ITO thin films show larger absorption coefficient, especially, those prepared with 4 % and
10 at.% Ag concentrations.
The performance of our ITO and Ag-doped ITO thin films as transparent conductive materials
was further evaluated by means of figure of merit (Φ). The figure of merit is related to the sheet
resistance and the transmittance of the synthesized transparent conductive thin films, which also
indicates the optimum cooperation of these two values in the performance of the film. The figure
of merit was defined as T10
/Rs by Haacke [441], and/or T/Rs by Fraser and Cook [442], where Rs
is the sheet resistance and T is the transmittance of the film. The higher the figure of merit value,
the better the performance of the transparent conductive device. In this study, the ‘T’ value was
selected at a wavelength of 550 nm for all the samples, the results are presented in Table 5.2. The
highest values of Φ for as deposited and annealed thin films were found to be 16×10-3
and
56×10-3
for 4 at.% Ag and ITO thin films respectively. These results are comparable with those
reported previously [355, 443].
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141
350 400 450 500 550 600 650 700 750 800
Ab
sorp
tio
n c
oef
fici
ent
(α)
Wavelength (nm)
10%
4%
2%
ITO
350 400 450 500 550 600 650 700 750 800
Ab
sorp
tio
n c
oef
fici
ent
(α)
Wavelength (nm)
10%
4%
2%
ITO
(a)
(b)
5.4.5. Determination of Optical Constants
The optical constants of thin film materials such as refractive index (n) and extinction coefficient
(k) are very important aspects for achieving good performance in optoelectronic devices. For
instance, the refractive index of a material is believed to be a measure of its transparency to
incident radiation within a certain area of light spectra. The assessment of the refractive index is
notably very important in integrated optoelectronic devices [444]. The extinction coefficient k of
Figure 5.10 Variation the absorption coefficient of ITO and Ag-doped ITO thin
films with different Ag concentration, (a): as deposited and (b): annealed
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142
ITO and Ag-doped ITO thin films was calculated from (Eq. 2.19), while the refractive index n
was calculated from the following formulae:
(
) √
( ) (5.3)
where R is reflectance and k is the extinction coefficient.
Figure 5.11 shows the variation of refractive index of as deposited and annealed ITO and Ag-
doped ITO thin films. It is seen in Figure 5.11 that the average value of refractive index for Ag-
doped ITO samples is higher than that for pure ITO. This could be due to increasing the carrier
concentration in the Ag-doped ITO thin films along with increasing the Ag concentration.
Increasing carrier concentration at high Ag doping level leads to the formation of Ag clusters
along with defects, which hinders the optical transparency. Chiou and Tsai [445] reported similar
results from antireflective sputtered ITO thin films on glass substrates. Also, Cao et.al, [446]
concluded that the increase of the doping level results in the enhancement of the average value of
n for Ag-doped ITO thin films. The average value of n decreased for annealed ITO and Ag-
doped ITO thin films. However, all the as deposited and annealed samples have large average
refractive index indicating that these types of coatings may become the ideal replacement for the
common antireflection coating.
The extinction coefficient of the as prepared and annealed ITO and Ag-doped ITO thin films is
presented in Figure 5.12. The extinction coefficient of all samples initially decreases in the near
ultraviolet (NUV) region. However, Ag-doped ITO samples show higher average extinction
coefficient values than that of pure ITO which is related to increasing light absorption by Ag
atoms. The extinction coefficients gradually increase in the visible range. This behaviour of Ag-
doped ITO thin films can be useful in the applications of visible light transmittance and UV light
interception. Also, the average extinction coefficient values obtained in this study are of low
order over the entire range of studied wavelength indicating the homogeneity of the samples and
smoothness of the surfaces [447].
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143
1.23
1.24
1.25
1.26
1.27
350 400 450 500 550 600 650 700 750 800
Ref
ract
ive
ind
ex (
n)
Wavelength (nm)
10%
4%
2%
ITO
1.23
1.24
1.25
1.26
1.27
350 400 450 500 550 600 650 700 750 800
Ref
ract
ive
ind
ex (
n)
Wavelength (nm)
10%
4%
2%
ITO
(a)
(b)
Figure 5.11 Variation the refractive index of ITO and Ag-doped ITO thin films with
different Ag concentration, (a): as deposited and (b): annealed
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144
0.5
1
1.5
2
2.5
300 350 400 450 500 550 600 650 700 750 800
Exti
nct
ion c
oef
fici
ent
(k)
Wavelength (nm)
10%4%2%ITO
0.5
1
1.5
2
2.5
300 350 400 450 500 550 600 650 700 750 800
Exti
nct
ion c
oef
fici
ent
(k)
Wavelength (nm)
10%
4%
2%
ITO
(a)
(b)
5.4.6. Mechanical Characteristics
In this study, the thickness of fabricated ITO and Ag-doped ITO thin films is around 350 nm;
therefore, it is essential to use a suitable indentation depth to avoid any influence from the
substrate that may affect the nanoindentation measurements. It is well known that the
nanoindentation measurements should be performed on an indentation depth less than 10 at.% of
the film thickness to assure that the obtained results only reflect the mechanical properties of the
film coating. In order to obtain accurate values of both the hardness H and the elastic (Young’s)
Figure 5.12 Variation the extinction coefficient of ITO and Ag-doped ITO thin films with
different Ag concentration, (a): as deposited and (b): annealed
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145
modulus E for the ITO and Ag-doped ITO films, the nanoindentaion measurements were
collected at a maximum indenter depth of 13 nm which is less than one-tenth the thickness of the
fabricated ITO and Ag-doped ITO thin film.
Since it shows high mechanical properties, the results of the film with 6% Ag concentration have
been included in this section. Figure 5.13 (a) and (b) shows the typical load-displacement (p-h)
curves determined from the nanoindentation measurements for the as deposited and annealed
ITO/Ag-doped ITO samples, respectively. These curves reflect the deformation history of the
synthesized thin films throughout penetration of the Berkovich indenter load with continuous
contact stiffness measurements mode. It was reported by Jian and Lee that establishment of
cracking in films underneath the nanoindentor resulted in a distinct discontinuity in the loading
part of the loading displacement curve [394]. In this study, the experimental nanoindentation
results presented in Figure 5.13 (a) and (b) confirmed that continuous loading curves were
obtained for all the films, indicating that no cracking occurred during indentation for all the
samples being studied.
Both H and E were evaluated from the measurements results of indentation obtained during the
loading and unloading process. Maximum load, maximum depth and the stiffness (S) can be
determined from the load-displacement (p-h) curve. Hardness is defined as a measure of how
well the surface of a solid specimen can withstands deformation under an applied force.
Hardness and Young’s modulus of as deposited and annealed ITO and Ag-doped ITO thin films
were calculated based on (Eq. 2.33), (Eq. 2.34) and (Eq. 2.35).
The hardness and Young’s modulus values of as deposited as well as annealed ITO and Ag-
doped ITO thin films are presented in Figure 5.14. From Figure 5.14a, several as deposited thin
films (i.e., 0 at.%, 2 at.% and 4 at.% Ag-doped ITO thin films) show similar hardness and
Young’s modulus values, around 5.3 GPa and 129 GPa, respectively. In contrast, the as
deposited thin films with 6 at.% and 10 at.% Ag show higher hardness and Young’s modulus
values, which were calculated to be 5.9 GPa, 5.7 GPa and 133 GPa, 134 GPa, respectively. The
high values of H and E for the films prepared with 6 at.% and 10 at.% Ag concentration could be
attributed to metallic Ag cluster formation. Therefore, it may be naturally postulated that
increased Ag concentration within the ITO matrix frame above a certain level would help to
enhance both the H and E values.
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146
50
75
100
125
150
175
200
225
0 3 6 9 12 15
Ind
enta
tio
n l
oad
(μ
m)
Indentation depth (nm)
ITO2%4%6%10%
50
75
100
125
150
175
200
225
0 3 6 9 12 15
Ind
enta
tio
n l
oad
(μ
m)
Indentation depth (nm)
ITO2%4%6%10%
(a)
(b)
Figure 5.13 Typical load-displacement curves of ITO and Ag-doped ITO thin films with
different Ag concentration, (a): as deposited and (b): annealed
Figure 5.14b presents the variations of both the hardness and Young’s modulus of the annealed
ITO and Ag-doped ITO thin films. By applying annealing on the prepared samples at 500 °C, the
H and E values are significantly improved, with the 6 at.% Ag sample reaching the maximum
values of 6.8 GPa and 146 GPa, respectively. It is clear, from Table 5.3 that there is
improvement in the mechanical properties for Ag doped films over Ti-doped ITO films, which
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147
were reported in our previous study [448]. It has been proposed that, the main factors governing
mechanical characteristics of nanostructure materials include: the chemical and physical nature,
and the structural composition [449]. The surface morphology of the thin films (as seen in
previous morphological and EDS analysis section) seems also to be linked to the mechanical
characteristics, which is reflected in the fact that the denser and smoother the surface is, the
higher the mechanical parameters H and E. Also, the as-deposited samples show lower degree of
crystallinity as proved by XRD measurements. While annealed ITO and Ag-doped ITO thin
films show improvement in the crystalline structure, which positively affects the mechanical
properties of the samples. As mentioned previously, the film with higher Ag concentration shows
improved mechanical properties, which could be related to the formation of smaller crystallite
size compared to other thin films (as confirmed in section 5.4.1). Variations in H and E were also
reported by Yen and co-authors [396] for ZnO thin films fabricated on silicon substrates via
atomic layer deposition and then post annealed at different temperatures. In their study, the
increase of the crystallite size of ZnO thin films along with increasing annealing temperature
results in the reduction in the mechanical properties.
Table 5.3 Mechanical properties for as deposited and annealed ITO and Ag-doped ITO thin films
T°C Ag%
Hardness
(GPa)
Young’s
modulus (GPa)
Wear resistance
(H/E 10-2
)
As deposited 0 5.3 128 4.1
2 5.3 130 4.0
4 5.4 129 4.1
6 5.9 133 4.4
10 5.7 134 4.2
Annealed at 500°C 0 6 134 4.4
2 6 136 4.4
4 6.4 141 4.5
6 6.8 146 4.6
10 6.7 148 4.5
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5
5.2
5.4
5.6
5.8
6
127
128
129
130
131
132
133
134
135
0 2 4 6 8 10 12
Har
dnes
s (G
Pa)
Yo
ung's
mo
dulu
s (G
Pa)
Ag concentration (at.%)
Young's modulus
Hardness (H)
5.9
6.1
6.3
6.5
6.7
6.9
128
132
136
140
144
148
152
0 2 4 6 8 10 12
Har
dnes
s (G
Pa)
Yo
ung's
mo
dulu
s (G
Pa)
Ag concentration (at.%)
Young's modulus
Hardness (H)
(a)
(b)
Figure 5.14 Variation the hardness and Young’s modulus of ITO and Ag-doped ITO thin films
with different Ag concentration, (a): as deposited and (b): annealed
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The dependence of material hardness on the grain size may be described by the Hall-Petch
formula [450]:
( ) +
⁄ (5.4)
where H0 denotes the lattice friction stress, KH-P is the Hall-Petch constant and D is the grain size.
Figure 5.15 (a and b) presents the variation of hardness with D-1/2
of as deposited and annealed
ITO/Ag-doped ITO thin films prepared at various Ag concentrations. Although this analysis does
not show strong correlation between hardness and particle size, it facilitates the calculation of
other parameters. Two sets of different values, i.e., lattice friction stress (4.5722, 3.7285) GPa
and Hall-Petch constant (4.8135, 17.148) GPa.m1/2
for as deposited and annealed samples
respectively, were derived. The obtained average H0 value is over the reported value of intrinsic
stress for ITO (ca. 2.1 GPa) [451]. The Hall-Petch values also indicate the effectiveness of the
grain boundary in obstructing the displacement movements. In this case, the annealed samples
demonstrated a larger value, indicating that here the decrease in grain size has a stronger
influence in enhancing the hardness.
The wear resistance of the specimen can be predicted from the H and E values. The H/E value is
considered to be a significant factor for predicting wear resistance, and the larger this ratio the
higher the wear resistance will be [329]. The obtained H/E values for as deposited and annealed
ITO and Ag-doped ITO thin films were in the range of (4.0×10-2
- 4.2×10-2
) and (4.4×10-2
-
4.6×10-2
), respectively, indicating a higher level of wear resistance for the annealed films over
the as-deposited samples, and Ag-doped samples over the pure ITO thin films.
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4.75
5
5.25
5.5
5.75
6
0.17 0.175 0.18 0.185 0.19 0.195 0.2 0.205 0.21
Har
dnes
s (G
Pa)
D-1/2 (nm-1/2)
(a)
10%
6%
4%
2% 0%
5.5
5.75
6
6.25
6.5
6.75
7
0.13 0.135 0.14 0.145 0.15 0.155 0.16 0.165 0.17 0.175
Har
dnes
s (G
Pa)
D-1/2 (nm-1/2)
(b)
2% 0%
4%
6% 10%
Figure 5.15 Variation of hardness with grain size (D-1/2
) of ITO and Ag-doped ITO thin films
with different Ag concentration, (a): as deposited and (b): annealed
To compare the load carrying capability of the samples under investigation, finite element
modelling (FEM) has been performed on as-deposited ITO, as-deposited 6 at.% Ag-doped ITO,
and annealed at 500 °C 6 at.% Ag-doped ITO. A spherical indenter of 5 m in radius loaded onto
a film of 2 m thickness, with a maximum indentation depth of 0.2-0.6 m, is modelled. Note
that this thickness, which is different from those of our experimental samples, is used here for a
general evaluation and comparison between the type of films with different Ag concentration and
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heat treatment. The consideration here is that, under real application environments, loadings with
a dimension in the order of μm are more realistic than smaller and sharper ones. Hence, the
thickness used in the modelling work is designed to match the loading conditions.
The Young’s modulus for the films is taken from Table 5.3, while that of the substrate (glass) is
90 GPa. Comsol software was used in the modelling, and more details of the modelling can be
found in our previous work [452]. The load carrying ability of the films was assessed by the
equivalent stress, or von Mises stress, which is a measure of the severity for potential damage to
the film, and can be expressed by:
[( ) ( )
( )
( )] ⁄
(5.5)
where sequiv represents the equivalent stress, sxx, syy, szz, sxy, syz, szx are the corresponding stress
tensor components, respectively.
The FEM modelling result of von Mises stress distribution in a 2 m as-deposited ITO film
under a spherical indentation of 0.4 m depth along with the displacement along the axial
symmetry line from the surface of the film to the interface between the film and the substrate
under a loading of 58 mN for pure ITO and 6 at.% Ag-doped ITO thin films are presented in
Figure 5.16.
Figure 5.16 (a) shows the modelling image of as-deposited ITO thin film. At an indentation
depth 0.4 μm, the maximum of the von Mises stress is found at the interface between the film
and the substrate, immediately below the centre of the indenter, with the value being 11 GPa.
Such a load resulted in a vertical displacement in the film close to the indenter. Figure 5.16 (b)
shows a comparison of displacement in two different films under study, top: ITO with 6 at.% Ag
and bottom: pure ITO. The displacements are plotted along the centre (axial symmetric) line,
from the surface of the film to the interface between the film and the substrate. When the
indentation loading is kept at 58 mN, the z-displacement was reduced by 10%, within the Ag
doped and annealed film. This reduced the possibility of delamination at the interface between
the film and the substrate.
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In summary, our experimental results show that, the doping of 6 at.% Ag into ITO film resulted
in an increase of 4% and 11% in E and H, respectively. After the films were annealed at 500 °C,
further increases of 9% and 13% respectively in E and H were observed. Taking both changes
into account, the improvement is 14% and 28% for E and H, respectively. Combining Ag doping
and annealing also helps enhancing the effectiveness of the grain boundary in obstructing the
displacement movements. At the same loading smaller deformation will be induced in the Ag-
doped film, hence this film has higher load carrying capability. Wear resistance can also be
enhanced by doping of Ag, as well as by annealing at 500 °C.
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(a)
(b)
Figure 5.16 (a): FEM modelling result of von Mises stress distribution of as-deposited ITO film
and (b): a comparison of displacement in two different films under study, top: ITO with 6 at.%
Ag film and bottom: pure ITO film
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5.5. Conclusions
ITO and Ag-doped ITO thin films were successfully fabricated onto glass substrates via a sol-gel
spin coating technique. The effects of Ag concentrations (e.g., 2, 4, 6 and 10 at.% in this study)
on the structural, surface morphology, mechanical and optoelectronic characteristics of ITO and
Ag-doped ITO thin films were studied by means of XRD, FESEM, nanoindentation, UV-VIS
spectroscopy and Hall Effect measurements. Introducing Ag atoms to the ITO matrix did not
strongly alter the ITO structure. However, Ag phase appears at (2θ ≈ 38.2°) for Ag-doped ITO
thin films. The films of Ag-doped ITO showed larger particle size than that of ITO which are
further enlarged after annealing at 500 °C. Variations in H and E values of ITO and Ag-doped
ITO thin films were observed as a function of Ag concentration. The hardness for as deposited
and annealed thin films were within the range of (5.3 – 5.7) GPa and (6.0 – 6.7) GPa
respectively. While the Young’s modulus values for as deposited and annealed samples were in
the range of (128 – 134) GPa and (134 – 148) GPa respectively. The variation in Ag
concentration exerts a positive effect on both the hardness and Young’s modulus values. A
combination of the highest H and E (6.7 GPa and 148 GPa, respectively) were achieved in the
sample with highest Ag concentration (i.e., 10 at.% Ag) and annealed at 500 °C. Evaluated by
means of comparison, doping of 6% Ag into ITO film resulted in an increase of 4% and 11% in
E and H, respectively, while annealing the films at 500 °C further increases E and H 9% and
13% respectively. Taking both changes into account, the improvement is 14% and 28% for E and
H, respectively. Wear resistance can also be improved by both doping of Ag and thermal
treatment (i.e., annealing at 500 C). It has also been shown that combining Ag doping and
annealing helps enhance the effectiveness of the grain boundary in obstructing the displacement
movements. FEM modelling results indicate that at the same loading, smaller deformation will
be induced in the Ag-doped film; hence this film has higher load carrying capability.
Furthermore, improved wear resistance over pure ITO thin films was also observed for the
samples being studied, indicated by the higher H/E values.
FESEM images show the formation of uniform, dense, smooth and homogeneous surfaces with
a grain structure indicating the nanocrystalline features, and the Ag-doped ITO thin films
prepared at different Ag contents have larger crystallite sizes compared to that of pure ITO. The
electrical resistivity of all samples decreased after applying annealing temperature, and the
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lowest values were assigned to be 2.7×10-4
Ωcm and 2.4×10-4
Ωcm for pure ITO and 4 at.%
Ag-doped ITO thin films, respectively. The maximum optical transparency in the visible region was
found to be 92% for both ITO and 2 at.% Ag-doped ITO thin films, while, the highest optical
band gap energy of 3.76 eV was obtained for the film of 2 at.% Ag content. The optical constants
such as refractive index and extinction coefficient of the prepared samples were extracted from
the transmittance data. The refractive index values for ITO and Ag-doped ITO thin films indicate
that they can be used as an antireflection coating in optoelectronic applications. Moreover, Ag
doping dramatically enhanced the extinction coefficient of ITO samples in the absorption UV
region. With an optimised doping and annealing process, the results from this work are expected
to facilitate the engineering design of customizable Ag-doped ITO thin films for various
industrial applications.
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Spin-coating ITO Sol
SWCNTs Sol
ITO particles
SWCNTs conducting baths
e
6. CHAPTER 6: Novel Approach for Fabricating Transparent
and Conducting SWCNTs/ITO Thin Films for Optoelectronic
Applications
Paper IV
Hatem Taha, Zhong-Tao Jiang, Chun-Yang Yin, David J. Henry, Xiaoli Zhao, Geoffrey Trotter,
Amun Amri, A Novel Approach for Fabricating Transparent and Conducting SWCNTs/ITO
Thin Films for Optoelectronic Applications. J. Phys. Chem. C 2018, 122, 3014-3027
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6.1. Abstract
Single walled carbon nanotubes (SWCNTs) incorporated in indium tin oxide (ITO) was
developed to fabricate transparent conductive thin films via a sol-gel spin coating technique. The
fabricated thin films were annealed at 350 C. The effects of incorporating SWCNTs and
varying film thickness on crystal structure were systematically investigated by Raman shift,
surface elemental compositions, surface topography and roughness, optoelectronic characteristics
and mechanical properties. X-ray diffraction (XRD) results confirmed the body centered cubic
structure of indium oxide polycrystalline phase, indicating that the structural properties of the
ITO films were not significantly altered by incorporating CNTs. The presence of CNTs in the
ITO matrix was confirmed by analyses of Raman spectroscopy, x-ray photoelectron
spectroscopy (XPS) and energy dispersive x-ray spectroscopy (EDX). FESEM images revealed
the formation of SWCNTs/ITO nanoparticles, and the average crystallite size increased along
with increasing film thickness. Electrical characteristics also improved as the film thickness
increased. The lowest electrical resistivity (4.6×10-4
Ωcm), as well as the highest carrier
concentration (3.3×1020
cm-3
) and carrier mobility (41 cm2/V s) were achieved from the 320 nm
thick film. However, the optical transparency decreased from 91% to 87.5% as the film thickness
increased from 150 to 320 nm. The hardness and Young’s modulus of the prepared samples
improved, with the increase of SWCNTs doping level, and achieved the maximum values of 28
GPa and 306 GPa, respectively.
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6.2. Introduction
Over recent years, the demand for transparent conductive materials (TCMs) has been
continuously growing, mainly driven by the significant increase in the volume of components
used in optoelectronic devices. However, strict requirements need to be met before a new
material is qualified for a wide range of optoelectronic applications, particularly, high quality
TCMs should have very high UV/Vis optical transparency with extremely low electrical
resistivity [153, 182]. Transparent conductive oxides (TCOs) are the most common type of
TCMs due to their unique combination of optical transparency and electrical conductivity.
Indium oxide (In2O3) and indium tin oxide (ITO) based TCOs still represent the major TCM in
numerous optoelectronic applications including touch screens, liquid crystal displays, solar cells,
light emitting diodes, functional glasses and sensors [183, 336, 338, 381, 453]. However, one of
the major drawbacks of ITO coatings is their cost due to the scarcity of indium concentration and
fabrication efficiency [454].
Another shortcoming of ITO films is their brittleness which can lead to the formation of micro-
cracks under an applied strain which results in increased electrical resistivity. Incorporating a
hard conductive material in the ITO matrix can reduce the brittleness of the coating [455, 456].
Carbon-based materials (graphene, carbon nanotubes), metal grids and conducting polymers
have good electrical characteristics and can be formed into pure transparent conducting thin
films [457-460]. However, in pure form they have several limitations. Graphene has high charge
carrier mobility (μ) and low electrical resistivity, but it should be completely reduced from
graphene oxide to exhibit suitable electrical characteristics [461]. Metal grids have the
disadvantage of sensitivity of their surfaces to photon scattering and oxidation [462].
Alternatively, the electrical instability to thermal and chemical strain is the main disadvantage of
conducting polymers [463]. Despite relatively low transparency over the visible region, the
electrical, optical, mechanical and chemical characteristics of CNTs make them a favourable
applicant for TCMs [464]. It is known that the electrical conductivity is directly correlated to
charge carrier concentration and mobility [370, 465] and CNTs are considered to have a higher
carrier mobility than ITO [466]. Also, CNTs exhibit electrical properties higher than typical
metals such as copper and aluminium [467] as well as a high Young’s modulus of approximately
1-2 TPa [468]. So far, CNTs have mostly been used in multilayer structures and/or combined
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159
with conductive polymers such as PEDOT:PSS [469-471]. Although efforts have been made to
increase the carrier concentration for ITO thin films by using dopant atoms, this can potentially
exert a negative effect on the conductivity, since these dopant atoms may act as scattering points.
As an alternative, enhancing the carrier mobility of ITO films by introducing CNTs could be
beneficial for improving the electrical conductivity. Inclusion of CNTs into an ITO film may
also improve the mechanical properties of the film.
In order to fully exploit the advantages of incorporating the reinforced materials into the ITO
coatings, a suitable technique needs to be developed. Numerous techniques are employed for
fabricating ITO based TCOs such as, chemical vapour deposition, RF and DC sputtering, pulsed
laser deposition, electron beam evaporation, molecular beam epitaxy and sol-gel method [193,
243, 259, 375-379]. However, most of these techniques are not easily adapted to incorporate
intact nanotubes into an ITO coating. The advantages of using a sol-gel process for fabricating
TCMs are (1) normal ambient wet-chemistry lab conditions, (2) less processing time, (3) lower
cost and (4) high yields [63, 64, 347, 348]. Therefore, in this study, a sol-gel method combined
with spin coating was employed to incorporate CNTs in an ITO matrix. The main objective of
this work is to enhance the characteristics of ITO films through its combination with SWCNTs
which could also potentially reduce the consumption of costly indium and enhance the
mechanical and surface morphology characteristics of ITO thin films.
6.3. Experimental Section
6.3.1. Raw Materials
Hydrated indium nitrate (In(NO3)3.5H2O, Alfa Aesar, 99.9%), tin chloride dihydrate
(SnCl2.2H2O, Chem-supply, 98%), graphene oxide (GO) solution, single walled carbon
nanotubes (SWCNTs) Sigma Aldrich, carbon > 90%, carbon + SWCNTs ≥ 70%, nitric acid
(HNO3) and sulphuric acid (H2SO4) (chem-supply 98%), absolute ethanol (EtOH, Merck,
99.5%), and milliQ water, were used as supplied.
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160
6.3.2. SWCNTs/ITO Sol Preparation and Samples Deposition
In(NO3)3.5H2O and SnCl2.2H2O were dissolved separately in absolute ethanol and refluxed for 1
hour at 85 °C. The two solutions were mixed and refluxed for another 1 hour at 85 °C resulting
in (0.2 M) ITO solution. To be suitable for the incorporation process, SWCNTs were first ultra-
sonicated in a mixture of concentrated nitric acid and sulphuric acid (HNO3: H2SO4= 3:1) for 30
minutes. This acidic treatment process is important to enhance the formation of carboxylic acid
functional groups and break down the nodules in agglomerate SWCNTs, rendering the SWCNTs
hydrophilic and prevents re-bundling when mixed with the ITO solution. Also, it has been
reported that the nitric acid treatment not only reduces the CNT-CNT junction’s resistance but
also facilitates the removal of amorphous carbon and other carbonaceous impurities in these
junctions. All these eventually result in improving the tunnelling contacts between CNTs [216,
472, 473]. The SWCNTs were then washed with milliQ water and centrifuged 5 times to remove
any traces of anions. The resultant functionalized SWCNTs were then dried for 24 hours at 60 °C
in a vacuumoven prior to incorporation with the ITO sol. 0.25 wt% SWCNTs was added to 2 ml
of GO and sonicated for 2 hours, then mixed with ITO sol and stirred for 1 hour. The resultant
solution was aged for 24 hours at room temperature prior to deposition. Soda-lime glass
substrates (25×25 mm) were cleaned by detergent and washed with milliQ water. Then the
substrates were subjected to ultrasonication in ethanol for 15 minutes, and milliQ water washing
was repeated. Finally, the substrates were dried under vacuum in a conventional drying oven at
100 °C for 60 minutes. A Polos spin coater was used for depositing the SWCNT/ITO sol onto
the glass substrates. The spin coating parameters are described below: (1) dispensing the solution
on to the substrate at 300 rpm for 20 seconds, (2) spreading the solution at 2000 rpm for 30
seconds, and (3) finally drying the solution at 3500 rpm for 30 seconds. Subsequently, the
sample was dried at 100 °C for 15 minutes on a hot plate. The coating and calcination steps were
repeated until the desired film thickness was achieved. All samples were then annealed at 350 °C
for 2 hours in an air atmosphere. SWCNTs/ITO coatings with different films thicknesses (i.e.
150, 210, 250 and 320) ± 5 nm were synthesized in this study. In order to estimate the errors of
the measured quantities 4 samples were prepared for each thickness. A thicker film around 370 ±
5 nm was fabricated, but it exhibited a significant drop in the optical transparency (~ 82%) while
its electrical properties were very close to those of the 320 nm film thickness. Thus, the results of
the thicker film (i.e. 370 nm) were not considered and presented in this investigation.
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6.3.3. Analysis Techniques
The crystallographic structures of the SWCNTs/ITO thin films were examined via X-ray
diffraction (XRD) analysis using a GBC EMMA diffractometer with Cu-Kα emission line
(=0.154 nm). The diffraction angle 2 = 20 - 70° was scanned at 2 °/min with a step increment
of 0.02. The analysis was carried out with beam acceleration of 35 kV/28 mA. Information on
elemental compositions, binding energies and chemical bonding states for the outmost 5 nm of
the surfaces were obtained using X-ray photoelectron spectroscopy (XPS) technique. The XPS
analysis was performed using a Kratos axis ultra-X-ray photoelectron spectrometer operating at
15 kV and 10 mA with an Al-Kα monochromatic radiation source (hv = 1486.6 eV). The
specimens were mounted onto a steel sample holder using carbon tape and analysed under
ultrahigh vacuum (2.9 × 10-9
torr). The XPS data for both survey and high resolution scans were
collected without surface etching. Typical high resolution XPS scans of SWCNTs/ITO thin films
displayed In3d, Sn3d, Ti2p, O1s and C1s energy regions. Curve fitting of the high-resolution
scans were carried out using CASA XPS software (version 2.3.1.5) which affords information
about the presence of elemental compositions and chemical bonding states for the analysed
samples. Surface topographic images of the fabricated thin films were obtained via a Bruker
Dimension (Santa Barbara, California, USA) fast scan atomic force microscope (AFM). The
samples were mounted on adhesive tape prior to AFM scans and the images were recorded in
Tapping Mode using a standard Tapping Mode probe (type NCHV, resonant frequency 300 kHz,
spring constant 40N/m.
Raman analysis was conducted using a Nicolet 6700 Fourier transform infrared (FTIR)
spectrophotometer equipped with NXR FT-Raman module. Raman spectra were collected using
a Helium-Neon (He-Ne) monochromatic laser with 1064 nm excitation wavelength and 0.204 W
operation power, CaF2 beam splitter, InGaAs detector with 90° detection angle, optical velocity
of 0.3165, gain of 1, aperture of 150, and 16 scans with resolution of 8 cm-1
in the range of 0-
4000 cm-1
. Field emission scanning electron microscopy (FESEM) (Zeiss Neon 40EsB) was
used to investigate the surface morphology and the EDX analysis of SWCNT/ITO provided the
distributions of elemental concentration. The samples were first assembled onto a steel holder
using carbon tape and then coated with platinum (3nm thick) to decrease the charging effects
before FESEM imaging. The electrical properties of prepared SWCNTs/ITO thin films were
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162
evaluated by a 4-point probe method using (Dasol Eng. FPP-HS8 system). Hall-effect
measurements were carried by a system of four Au deposited probe contacts on the coated
samples (10×10 mm). In this measurement the applied magnetic field was 0.9 Tesla via ECOPIA
HMS-2000 system combined with Polytec Bipolar Operation Power supplies (BPO). The optical
properties were measured within the wavelength range of 250 - 800 nm via a UV-VIS Perkin
Elmer spectrometer. The mechanical characteristics of the synthesized samples were performed
using a nanoindentation workstation (Ultra-Micro Indentation system 2000, CSIRO, Sydney,
Australia), equipped with a diamond Berkovich indenter. The area function of the indenter head
was calibrated by a standard fused silica specimen. The measurements were collected with
maximum loading of 200 nN and maximum penetration depth less than one-tenth of the coating
thickness. In order to attain better resolution, the number of measuring points was increased to
15 during loading and 20 during unloading.
6.4. Results and Discussions
6.4.1. Structural Properties
Figure 6.1 shows the XRD patterns of prepared SWCNTs/ITO coatings with different film
thickness. The XRD results revealed the formation of a body centred cubic bixbyite structure of
indium oxide (In2O3) with space group of Ia3 according to (JCPDS 06-0416) for all
SWCNTs/ITO thin films. No effect from the SWCNTs was observed on the orientation direction
and peak position of the ITO matrix. However, two small peaks where observed at 26.5° and
43.5° which are related to the reflection planes of (002) and (101) respectively of CNTs. It has
been reported that the (002) and (101) reflection planes of CNTs are normally featured as weak
and broadened peaks with low intensity [474]. The first peak at 26.5° indicates the formation of a
hexagonal-like graphene structure, while the second peak at 43.5° is due to in-plane reflection.
The preferred orientations for the SWCNTs/ITO thin films are identified as (222), (400), (411),
(332), (440) and (622) planes similar to those for In2O3, as well as (002) and (101) of CNTs. It is
interesting to notice that both the (332) orientation with a reflection line featured at 43° for ITO
and the (101) orientation with a reflection line featured at 43.5° for SWCNTs overlapped and
formed a weak and broadened peak around 43.4°. Also, it is clear from Figure 6.1 that as the
film thickness increased the preferred orientation plane of (222) and the shape and peak intensity
improved. This phenomenon indicates an enhancement of the degree of crystallinity of the thin
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25 30 35 40 45 50 55 60 65
Inte
nsi
ty (
a.u.)
2θ (Degree)
(2
22)
(
400
)
(
440
)
* (
101
)
*(0
02
)
(
622
)
ITO
*SWCNT
320 nm
250 nm
210 nm
150 nm
films as their thickness increased, which could be a result of an increasing number of SWCNTs
that accumulate along the preferred orientation plane (222).
The crystallite sizes (D) for the SWCNTs/ITO thin films were calculated based on Scherrer
equation (Eq. 2.26) from the values of full width at half maximum (FWHM) of the preferred
orientation peak (222).
Figure 6.2 displays the variation of the crystallite size with respect to the film thickness. It is
clear that the crystallite size of the SWCNTs/ITO thin films increased with increasing film
thickness, due to the improvement in the crystal quality. The maximum crystallite size of 43 nm
was obtained for the thickest film of 320 nm compared with the minimum size of 23 nm for the
film of 150 nm thickness (Table 6.3). The lattice constant (a) value of the SWCNTs/ITO thin
films (10.13 – 10.17) were calculated which is slightly larger than that reported so far for un-
doped indium oxide of 10.118 Å [475]. This variation in the lattice parameters can be related to
increasing the number of oxygen vacancies along with the incorporation of SWCNTs into the
film. These effects will result in stress being developed near the film surface [360], which may
Figure 6.1 XRD pattern of SWCNT/ITO thin films prepared at various thicknesses and
annealed at 350 °C
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164
be due to the thermal expansion coefficient mismatch between the film and the substrate [361,
362].
6.4.2. Elemental Compositions and Surface Chemical Bonding States
Figure 6.3 displays the XPS survey scan results for the prepared and annealed SWCNTs/ITO
thin films, at various films thicknesses, in the binding energy range of (200 - 600) eV. The
expected elements with their photoelectron peaks for In 3d, Sn 3d, O 1s and C 1s were confirmed
by wide XPS spectra. The observed results show that the atomic compositions of SWCNTs/ITO
samples were altered with the increase in film thickness. The atomic percentages of the main
elements (In and Sn) as well as O were increased as the film thickness increased; while, the
carbon percentage was decreased. The increasing oxygen ratio with increasing film thickness
indicates that surface oxidation occurred during the calcination process, following each
deposition step. Table 6.1 summarizes the atomic compositions of the as prepared and post
20
25
30
35
40
45
50
100 150 200 250 300 350
Gra
in s
ize
(nm
)
Thickness (nm)
Figure 6.2 Effect of film thickness on the grain crystallite size of
SWCNTs/ITO thin films
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165
200250300350400450500550600
Inte
nsi
ty (
a.u)
Binding energy (eV)
C
In
Sn O
150 nm
320 nm
250 nm
210 nm
annealed SWCNTs/ITO thin films as a function of film thickness. Note that in all of the
discussions, the analysed XPS results were calibrated with respect to the binding energy of C1s
from C-H bonding state at 284.5 eV to recover any charge shift.
Table 6.1 Elemental compositions of SWCNTs/ITO thin films annealed at 350 °C
Figure 6.3 XPS wide scans of SWCNTs/ITO thin films prepared at various thicknesses and
annealed at 350 °C
t(nm)
(± 5nm) Atomic percentage of the elements %
In Sn O C
150 12.1 ± 0.1 1.4 ± 0.1 41.4 ± 0.1 45.1 ± 0.1
210 11.6 ± 0.1 1.3 ± 0.1 43.5 ± 0.1 43.6 ± 0.1
250 16.0 ± 0.2 1.8 ± 0.1 51.0 ± 0.1 31.2 ± 0.1
320 17.3 ± 0.3 1.9 ± 0.1 51.9 ± 0.1 28.9 ± 0.1
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The surface chemical bonding states of the prepared and post annealed SWCNTs/ITO thin films
were investigated by de-convoluting the high resolution In 3d, Sn 3d, O 1s and C 1s peaks to
evaluate the contributions of metal oxides and/or compounds to the film materials (Figure 6.4).
Figure 6.4a shows the fitting curves of high resolution XPS spectra for In 3d5/2 photoelectron
lines. Two bonding states allocated at 443.99 and 444.69 eV were identified. The lowest binding
energy related to In° bonding state, specifically In-In bonds, while the highest binding energy is
attributed to In3+
bonding state from In2O3 [387, 388]. The fitting curves of high resolution XPS
spectra for photoelectron peaks of Sn 3d5/2 photoelectron peaks are presented in Figure 6.4b. In
the fitting curves, two sub peaks are assigned around 485.99 and 486.54 eV. The first peak at
485.99 eV can be attributed to Sn4+
in SnO2 while the second peak at 486.54 eV is linked to Sn2+
in SnO [389]. Fan and Goodenough [148] reported that the Sn3d peak for Sn4+
from SnO2 has a
binding energy around 0.5 eV lower than that for Sn2+
from SnO. The SnO2 feature is
thermodynamically more stable than the SnO feature and is predicted to be the major phase
between the Sn components in the ITO based surface coatings. The de-convoluted curves for O
1s core level exhibit two different peaks located at 529.64 and 531.34 eV (Figure 6.4c). The first
feature around 529.64 eV is contributed to In-O bonds from In2O3, and the second feature at
531.34 corresponds to Sn-O bonds from both SnO and SnO2 [391].
The chemical bonding of CNTs is comprised entirely of sp2 bonds, similar to those of graphite
and these bonds provide CNTs with their unique mechanical properties. The de-convoluted
curves of high resolution XPS spectra for C 1s photoelectron lines are shown in Figure 6.4d. The
C1s photoelectron peaks can be split up into three sub-peaks allocated at the binding energy
range of 284.5 eV-288.4 eV. The first peak with the lowest binding energy around 284.5 eV has
a high contribution of 66.8% and can be assigned to pure sp2 hybridized graphitic carbon atoms
of (C-C and C=C bonds), and carbon atoms bounded to hydrogen (C-H bonds).
The second peak originated at the binding energy 285.4 eV with a contribution of 17% is
attributed to hybridized sp3 carbon atoms (C-C bonds) which indicates that defects have been
introduced to SWCNTs surfaces. While, the third peak allocated at 288.4 eV with the lowest
contribution of 16.2% corresponds to carbon atoms bounded to oxygen atoms either by single
bonds (C-O) or double bonds (C=O) which are caused by high temperature oxidation of
SWCNTs [476, 477].
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167
6.4.3. Raman Studies
As noted above in the XRD results, the SWCNTs/ITO has a cubic bixbyite structure with Ia3
space group similar to In2O3. The structure consists of two types of cations where 8 In3+
ions
with side symmetry are located at b-sites and 24 In3+
ions with point symmetry at d-sites.
Furthermore, 48 oxygen atoms have general C1 site symmetry. Therefore, the following phonon
vibrational modes are expected:
4Ag + 4Eg + 14Tg + 5Au + 5Eu + 16Tu
Figure 6.4 High resolution scans of (a)- In3d, (b)- Sn3d, (c)- O1s and (d)-C1s of SWCNTs/ITO thin films
527528529530531532533534
CP
S/I
nte
nsi
ty (
a.u
)
Binding energy (eV)
Sn-O, C-O
531.34 eV
In-O
529.64 eV
(c)
441442443444445446447448
CP
S/I
nte
nsi
ty (
a.u)
Binding energy (eV)
In-In
443.99 eV
In3+ in In2O3
444.69 eV
(a)
483484485486487488489
CP
S/I
nte
nsi
ty (
a.u)
Binding energy (eV)
Sn2+ from SnO
486.88 eV
Sn4+ in SnO2
485.99 eV
(b)
281282283284285286287288289290291292
CP
S/I
nte
nsi
ty (
a.u)
Binding energy (eV)
Sp2C-C, C=C, C-H
284.5 eV
Sp3 C-C
285.4 eV
C=O, C-O
288.4 eV
(d)
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168
The phonon vibrational modes with Ag, Eg and Tg symmetry are known to be Raman active but
infrared inactive. The Tu vibrational mode is infrared active and Raman inactive, while the others
(Au and Eu) are inactive for both Raman and infrared. Figure 6.5 displays the Raman spectra of
sol-gel derived SWCNTs/ITO thin film. The peaks seen at 109.8, 269.7, 312.5, 368, 433.3,
558.9, 631.6 and 703.5 cm-1
belong to the cubic structure of In2O3 [68, 386]. The small peaks
featured at 171.7 and 239.7 cm-1
belong to Sn-O vibrational modes within the ITO structure
[385]. The peaks seen at 1292.4 and 1594.6 cm-1
are the D-band and G-band for SWCNTs. The
D-band at 1292.4 cm-1
is attributed to the defect in the SWCNTs, which could result in single
and/or double phonon vibrational modes for Raman scattering processes. While, the G-band at
1594.6 cm-1
is related to a carbon atom vibrational mode along the SWCNT axis with a
frequency very sensitive to the transition of charge carriers from dopants to SWCNTs [478].
Also, the G-band is characteristic of sp2 graphitic material, which is a signature of the existence
of SWCNTs in the ITO matrix [479].
6.4.4. Surface Morphology and Topography
The FESEM images of the prepared and annealed SWCNTs/ITO thin films at various
thicknesses are presented in Figure 6.6. It is evident from Figure 6.6 that all the SWCNTs/ITO
thin films have dense and homogeneous surfaces, with grain features demonstrating the
Figure 6.5 Raman spectra of SWCNTs/ITO thin film
0 200 400 600 800 1000 1200 1400 1600
Inte
nsi
ty (
a.u)
Raman shifts (cm-1)
31
2.5
46
8
G-b
and
63
1.6
55
8.9
D-b
and
70
3.5
171
.7
23
9.7
26
9.7
10
9.8
43
3.3
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169
nanocrystalline structure. No cluster of SWCNTs was identified in the FESEM images,
indicating that they are well dispersed in the ITO films. However, the surface roughness of the
coatings was affected by SWCNTs incorporation. It is also seen from Figure 6.6 that by
incorporating SWCNTs in the ITO matrix, it reduces the surface micro-cracks and improves the
surface roughness especially for the films of 150 nm and 210 nm thickness which could be due
to elasticity and one-dimensional nature of SWCNTs. Nevertheless, the films of higher
thicknesses (i.e., 250 and 320 nm) demonstrate the formation of some micro-cracks. This is
possibly related to increasing the film thickness along with repeating the film drying (or thermal
treatment) during the fabrication process. Furthermore, higher film thickness led to a greater
grain size, which is consistent with the XRD results (section 6.4.1).
150 nm
320 nm 250 nm
210 nm
Figure 6.6 FESEM images of SWCNTs/ITO thin films prepared at various
thicknesses and annealed at 350 °C
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170
EDX analysis confirms the presence of the main elements (i.e., indium, tin, oxygen as well as
carbon) in the thin films (Figure 6.7). The carbon ratios were observed to be higher in thicker
films, which suggest higher concentration distribution of carbon within these films. However,
metal to oxygen and carbon ratios could not be established conclusively since the EDX analysis
was focused on selected areas of the samples, and the presence of some other elements related to
glass substrate in the EDX spectra. Interestingly, while the In and Sn atomic percentages appear
to be close to values obtained from XPS measurements, carbon percentage increased along with
increasing film thickness. This is in contrast with the results obtained from XPS analysis since
the XPS measurements were performed on a maximum depth of ~10 nm from the sample
surface, in which measurements could be affected by the existence of carbon from the external
environment and/or the oxidation process of the top surface layer of the sample.
AFM scans were used to complement the FESEM imaging which provided further information
about the thin films’ roughness. Figure 6.8 shows the AFM images of the fabricated samples.
150 nm 210 nm
320 nm 250 nm
Figure 6.7 Elemental distributions of SWCNTs/ITO thin films (annealed at 350 °C) by EDX
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171
Analysis of the images indicates that these samples possess smooth surfaces with low average
root mean square roughness values of approximately 4 nm. This root mean square (RMS) value
is lower than a previously reported study especially for doped ITO and ITO modified CNTs
transparent films [469]. Additionally, Figure 6.8 shows that the surfaces of thicker
SWCNTs/ITO films have rougher characteristic (with higher RMS values), but they also possess
a relatively homogeneous morphology compared to the thinner films due to increasing
concentration of SWCNTs in the film network. This homogeneous morphology may heighten the
intimate contact of the grains/crystallites through decreasing the density of the grain boundaries
within the ITO framework [480]. This might also be attributed to the improvement in the films
quality through enhancing nucleation, coalescence and continuous films growth with increasing
film’s thickness. This is evident in the XRD and FESEM results where thicker film exhibits more
prominent crystalline structure and larger grain size. This is consistent with the established
notion that changing the grain size and clusters significantly affects the surface roughness of the
films.
210 nm RMS: 3.49 nm 150 nm RMS: 3.36 nm
320 nm RMS: 4.65 nm 250 nm RMS: 4.08 nm
Figure 6.8 AFM images of SWCNTs/ITO thin films annealed at 350 °C
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172
6.4.5. Electrical Properties
In this work, the roles of both high carrier concentration of ITO (~ 1020
/cm3) and high carrier
mobility for CNTs (~ 100 cm2 Vs
-1) on the electrical properties was considered. It is stated that
the electrical conductivity of transparent conductive materials depends on both carrier
concentration (N), carrier mobility (μ) and electron charge (e) based on the relation of σ = Neμ.
We assumed that increased film thickness results in more SWCNTs which should increase the
level of carrier mobility in the film material. Therefore, the effect of incorporating SWCNTs on
the electrical properties of ITO thin films was studied in terms of the film thickness. Figure 6.9
summarizes the dependence of electrical resistivity and conductivity, carrier concentration and
Hall carrier mobility of the SWCNTs/ITO thin films on film thickness. From Figure 6.9a, the
electrical resistivity decreased with increasing film thickness, reaching the lowest value of
4.6×10-4
Ωcm for the film of 320 ± 5 nm. This value for electrical resistivity is lower than that
reported previously by Golobostanfard and co-authors (4.1×10-3
Ωcm) for a dip coated
SWCNTs/ITO thin film prepared with 0.28% of SWCNTs.[481] This could be related to the
better uniformity and homogeneity of these thin films. Incorporation of SWCNTs in the ITO
matrix not only decreased micro-crack formation and enhanced the elasticity of ITO, but also
may have provided conducting bridges in the ITO matrix for the free charge carriers if their
concentration was sufficient enough to create these low resistance conducting bridges. This is
consistent with the results obtained by Ji et al. [222] for the conductivity enhancement of
PEDOT:PSS after incorporated with solfonated CNTs. The authors proposed that the highly
conductive sulfonated CNTs may provide direct charge transport templates and form bridges or
networks to connect the distinct PEDOT islands in the composites, resulting in a great
improvement in the conductivity.
It is known that the electronic characteristics of SWCNTs based transparent conductive system
are strongly dependent on the number of nanotubes in a system. As such, it may be assumed that
the large amount of SWCNTs in the films can be obtained by increasing the thin film thickness.
Increasing the film’s thickness has also improved the degree of crystallinity and increased the
grain size. Therefore, the mean free path of the charge carriers improved, which minimizes
charge scattering and hence reduces the electrical resistivity. It has previously been reported that
the reduction of electrical resistivity of TCO thin films is linked to an increase in the carrier
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173
concentration (i.e., dopants and oxygen vacancies) [342, 364, 372]. However, this phenomenon
can be limited, especially for films synthesized by sol-gel method, since the drying process
following each deposition step affects the oxygen vacancies and leads to the formation of micro-
cracks for a thick film, which, in turn, generally increases the electrical resistivity [482].
However, SWCNTs could reduce the elimination of oxygen vacancies in the film material due to
their strong reduction ability and hence decrease the electrical resistivity. Indeed, the SWCNTs
have a higher work function (5.0 eV) [483] compared with ITO (ca. 4.3 - 4.7 eV) which may
provide a greater carrier injection into the ITO matrix due to the difference in the work functions
[484]. All these features enhance the carrier concentration in thicker SWCNTs/ITO thin film. It
has also been reported by Ho et al. [485] that the work function of ITO thin films improved from
4.68 to 5.25 eV by increasing V+4 doping concentration, and this resulting work function was
stable over a long period of time, and demonstrates potential to offer good reliability and long-
term stability in industrial applications. Figure 6.9b presents the variation of the free carrier
concentration and Hall mobility of SWCNTs/ITO thin films for different film thickness. The
carrier concentration increased from 1.9×1020
to 3.3×1020
cm-3
when the film thickness increased
from 150 ± 5 to 320 ± 5 nm. Likewise, the Hall mobility also increased from 30 to 41 cm2/Vs
with increasing film thickness. These results reflect the advantages of combining the high carrier
concentration of ITO and the high carrier mobility of SWCNTs in a thin film.
Table 6.2 Electrical properties of SWCNTs/ITO, pure ITO and Ti-doped ITO thin films
Coating t (nm)
(± 5 nm)
ρ×10-4
(Ωcm) σ (S/cm) N×1020
(cm-3
) μ (cm/Vs)
150 11.0 ± 0.4 922 ± 70 1.9 ± 0.1 30 ± 1
SWCNTs/ITO 210 8.6 ± 0.3 1198 ± 62 2.1 ± 0.2 35 ± 1
250 6.3 ± 0.2 1480 ± 81 2.5 ± 0.1 37 ± 1
320 4.6 ± 0.2 2157 ± 76 3.3 ± 0.1 41 ± 1
Pure ITO 350 3.6 2320 5.8 25
Ti-doped ITO 350 3.78 2592 6.0 27
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174
Grain boundaries in the film structure can act as trapping centres for free charge carriers thereby
negatively affecting both the carrier mobility and carrier concentration [486]. Also, these
trapping centres may generate a potential barrier which hinders the drift of the free carriers and
hence decreases the electrical conductivity [487]. The enhancement in the electrical properties of
our SWCNTs/ITO thin films with increasing thickness can be linked to the improvement in the
crystalline quality (increasing the grain size and decreasing the grain boundaries) as seen
previously in the XRD and FESEM results. This effect reduces the scattering of the free carrier
due to decrease in grain boundaries. The density of grain boundaries in thinner films is higher
than those in thicker films. Therefore, with increasing SWCNTs/ITO film thickness, the number
of SWCNTs that segregate in the grain boundary regions will increase, thereby, forming
effective conducting paths in the SWCNTs/ITO matrix as discussed previously (see Figure 6.10).
Golobostanfard and co-authors reported the same tendency of forming low resistance transport
bridges in their ITO-CNT thin film network [488]. The electrical properties of thin
SWCNTs/ITO films due to film thickness are presented in Table 6.2.
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175
1.5
2
2.5
3
3.5
4
0
5
10
15
20
25
30
35
40
45
100 150 200 250 300 350C
arri
er c
on
cen
trat
ion×
10
20 (
cm-3
)
Mo
bil
ity (
cm/V
s)
Thickness (nm)
Mobility
carrier concentration
(b)
0
500
1000
1500
2000
2500
0
2
4
6
8
10
12
14
100 150 200 250 300 350
Co
nd
uct
ivit
y (
S/c
m)
Res
isti
vit
y×
10
-4 (
Ω.c
m)
Thickness (nm)
Resistivity
Conductivity
(a)
Figure 6.9 Variations of (a) electrical resistivity and conductivity, (b) mobility and
carrier concentration of SWCNTs/ITO thin films with film thickness
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176
6.4.6. Optical Properties
The transmittance spectra of the synthesized and annealed SWCNTs/ITO thin films are
compared in Figure 6.11. It can be seen that the films exhibit a transmittance around 91% for the
film of 150 ± 5 nm in the visible region (~550 nm). However, the SWCNTs/ITO thin films show
a higher transmittance toward the near infra-red (NIR) region than in the visible region due to
higher transparency of SWCNTs in this region. SWCNTs also exhibit Van Hove singularities in
the density of states (i.e., S1 ~ 0.68 eV, S2 ~ 1.2 eV and M1 ~ 1.8 eV) resulting in chirality
(metallic to semi-conductive ratio) dependent emission and absorption. Furthermore, the
transmittance of the prepared thin films slightly decreased with increasing film thickness,
reaching a value of 87.5% at 550 nm for the film of 320 ± 5 nm. This can be explained by the
fact that, increasing the film thickness results in an increase in both the free carrier concentration
(section 6.4.5) and the number of SWCNTs that distribute in the film matrix. It must be realized
that CNTs in general, are very strong electromagnetic (EM) radiation absorbers in the visible
ITO particles
SWCNTs conducting paths
SW
CN
Ts IT
O
e
e
Figure 6.10 Schematic diagram of free carrier injection from ITO network to
SWCNTs and carrier transfer in SWCNTs/ITO thin film
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177
region of the electromagnetic spectrum [489]. As a result, more light is absorbed, and hence the
optical transparency decreased [343, 490].
The absorption coefficient (α) of the SWCNTs/ITO thin films can be computed from (Eq. 5.2).
The plot for absorption coefficient versus wavelength is presented in Figure 6.12. It is found that
there is a shift in the UV absorption edge towards higher wavelengths with increasing film
thickness.
60
65
70
75
80
85
90
95
100
300 400 500 600 700 800
Tra
nsm
itta
nce
%
Wavelength (nm)
320 nm
250 nm
210 nm
150 nm
350 400 450 500 550 600 650 700 750 800
Ab
sorp
tio
n c
oef
fici
ent
(α)
Wavelength (nm)
320 nm
250 nm
210 nm
150 nm
Figure 6.11 Optical transmittance spectra of SWCNT/ITO thin films
annealed at 350 °C
Figure 6.12 Absorption coefficients of SWCNT/ITO thin films
annealed at 350 °C
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178
The band gap energy (Eg) for the prepared SWCNTs/ITO thin films was obtained from the
transmittance data using (Eq. 3.1).
Figure 6.13 presents the Tauc plot of SWCNTs/ITO thin films for all the four different film
thickness studied. The optical band gap (Eg) value of SWCNTs/ITO thin films was obtained by
extrapolating the linear sections of the plotted curves to the x-axis [491]. It is clear from Figure
6.13 that the band gap energy of SWCNTs/ITO thin films decreased from 3.70 eV to the lowest
value of 3.66 eV, with increasing film thickness from 150 to 320 nm. Indeed, there is a shift in
the absorption edge towards the long wavelength side as the film thickness increases, resulting
from band gap narrowing due to the high optical absorption of SWCNTs in the visible region as
discussed previously, and explained by a Burstein-Moss shift [337]. This behaviour is in good
agreement with the electrical properties presented in the previous section. The electrical and
optical characteristics in this investigation are comparable with those from pure and doped ITO
thin films fabricated under the same conditions in our previous investigations [430]. Table 6.3
summarizes and compares the structural and optical properties of SWCNTs/ITO thin films (this
study) along with the properties of pure ITO and Ti-doped ITO thin films (previous study).
Table 6.3 Structural, and optical properties of SWCNTs/ITO, pure ITO and Ti-doped ITO thin
films
Coating t (nm)
(± 5 nm)
D (nm) α (Å) T (%) Eg (eV)
150 23 ± 1 10.13 ± 0.01 91 ± 0.5 3.70 ± 0.03
SWCNTs/ITO 210 31 ± 1 10.15 ± 0.01 90 ± 0.2 3.69 ± 0.01
250 35 ± 1 10.16 ± 0.01 89 ± 0.5 3.68 ± 0.02
320 43 ± 1 10.17 ± 0.01 88 ± 0.2 3.66 ± 0.02
Pure ITO 350 31 10.13 89.0 3.50
Ti-doped ITO 350 38 10.14 88.9 3.54
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6.4.7. Mechanical Characteristics
The thickness of SWCNTs/ITO thin films fabricated in this work is varied within the range of
150 - 320 nm; therefore, it is crucial to select a suitable range of indentation displacement to
avoid any influence from the substrate that may affect the nanoindentation measurements. It is
well known that the nanoindentation measurements should be performed on an indentation depth
less than 10% of the thin film thickness to ensure that the obtained results are only related to the
film coating. In order to determine both the hardness H and the elastic (Young’s) modulus E
values for SWCNTs/ITO thin films, the nanoindentaion measurements were performed at a
maximum indenter depth of 13 nm which is less than one-tenth of the thickness of the thinnest
film.
Both the hardness and elastic modulus can be determined from the measurements of indentation
load and displacement for both loading and unloading process. Maximum load, maximum
displacement and stiffness (S) can be calculated from a typical load-displacement (p-h) curve.
Hardness is a measure of the resistance from a solid surface to deformation under an applied
3.5 3.55 3.6 3.65 3.7 3.75 3.8 3.85 3.9
Photon energy (eV)
320 nm
250 nm
210 nm
150 nm
( 𝛼 𝑣) ( 𝑐𝑚 𝑒𝑉
)
( 𝛼 𝑣) ( 𝑐𝑚
𝑒𝑉)
Figure 6.13 Tauc plot of SWCNT/ITO thin films annealed at 350 °C
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force. Hardness and Young’s modulus can be determined from (Eq. 2.33), (Eq. 2.34) and (Eq.
2.35).
The hardness and Young’s modulus values of the prepared and annealed SWCNTs/ITO thin
films are shown in Figure 6.14. It is expected that along with increasing the film thickness, the
number of SWCNTs in the film material is also increases. As noticed from Figure 6.14, the level
of resistance to deformation and the Young’s modulus of our sol-gel derived SWCNTs/ITO thin
film coatings increase along with rising thin film thickness, and the film of the highest thickness
(i.e., 320 nm) exhibits the highest resistance to deformation and Young’s modulus ca. to be 28
GPa and 306 GPa, respectively. The obtained hardness and Young’s modulus values for the
samples in the present study are higher than those obtained from our previous study of Ti-doped
ITO thin films [448]. The high values of hardness and Young’s modulus of our SWCNTs/ITO
thin films can be ascribed to uniformly incorporating SWCNTs in the ITO matrix. Winarto et al.
reported a similar effect from inclusion of CNTs in an alumina matrix [492]. An and co-worker
showed in their study on CNTs-alumina-iron samples that the hardness of the fabricated samples
was increased by 33% with the increase in the CNTs ratio compared to the sample with 0%
CNTs [493]. It has been reported that CNTs have hardness and Young’s modulus values of 55
GPa and 1-2 TPa respectively [494]. This high strength of CNTs is attributed to the covalent sp2
bonds formed between the individual carbon atoms (C-C bonds). The sp2 bonds are among the
strongest chemical bonds, resulting in a unique structure which is electrically stable, chemically
inert and mechanically robust. Therefore, we propose that enhancing the mechanical
characteristics of our SWCNTs/ITO thin films is attributed to the high contribution of sp2 bonds
(66.8% as seen in XPS analysis). The improved mechanical properties may also arise from the
improvement of the crystal quality for thicker thin films.
The wear resistance of a solid material coupled with elastic limit describe how this material will
withstand deformation under an applied force and recover its initial state without permanent
deformation once the external loading is removed. The wear resistance can be calculated from
the values of hardness and young’s modulus using the relation H/E. The larger this ratio the
higher the wear resistance will be. The SWCNTs/ITO thin films in this study exhibited an
increase in the wear resistance, which correlates to the increasing of H/E values, with increasing
film thickness. The obtained H/E values, in the range of 8.7×10-2
– 9.3×10-2
, indicate a higher
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level of wear resistance than that for pure ITO thin films [448]. The mechanical properties of the
SWCNTs/ITO thin films in this study are superior in comparison with our previously published
results from Ti-doped ITO thin films see Table 6.4.
21
23
25
27
29
31
33
220
230
240
250
260
270
280
290
300
310
320
100 150 200 250 300 350 400
Har
dnes
s (G
Pa)
Yo
ung's
mo
dulu
s (G
Pa)
Thickness (nm)
Young's modulus
Hardness
Coating t (nm)
(± 5 nm)
Hardness, H
(GPa)
Young’s
modulus, E
(GPa)
Wear resistance
(H/E 10-2
)
150 22.4 ± 0.6 254.4 ± 11 8.8
SWCNTs/ITO 210 24.2 ± 0.6 269.2 ± 8 9.0
250 25.7 ± 0.9 278.6 ± 9 9.2
320 28.0 ± 1.2 306.0 ± 12 9.3
Ti doped ITO 350 6.6 ± 1.2 143 ± 8 4.6
Figure 6.14 Hardness and Young’s modulus of SWCNTs/ITO thin
films annealed at 350 °C
Table 6.4 Mechanical properties of SWCNTs/ITO thin films annealed at 350 °C and Ti-
doped ITO thin film annealed at 400°C
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6.5. Conclusions
In this study, a thin film transparent conductive oxide with dispersed single-walled carbon
nanotubes (SWCNTs/ITO) was successfully produced via a low cost and efficient sol-gel spin
coating technique onto soda-lime glass substrates. The effects of incorporating SWCNTs into the
ITO matrix and variation of film thickness (i.e., 150, 210, 250 and 320 nm) were investigated by
FESEM and EDX measurements, AFM imaging, elemental compositions, Raman shifts,
morphological, electrical, optical, and nanoindentation measurements. Adding the SWCNTs into
the ITO matrix did not alter the crystalline structure, as shown by the lattice constant and
preferred orientation directions. The FESEM images show that the SWCNTs/ITO thin film
surface possesses dense and homogenous features. While micro-cracks were absent in the
thinnest 150 nm film, thicker films exhibited some cracks on their surfaces. The EDX and XPS
results confirmed the presence of all the main elements in the film coatings, while the AFM
imaging shows that the surfaces of thicker SWCNTs/ITO films show rougher but homogeneous
morphology compared to thinner films. The Raman spectra showed the expected peaks for the
In2O3 structure as well as the D and G bands for SWCNTs. With the increase of the film
thickness from 150 to 320 nm, the resistivity decreased from 11.2 × 10-4
to 4.6 × 10-4
Ω cm,
while the carrier concentration and Hall mobility increased, reaching their highest values of 3.3 ×
1020
cm-3
and 41 cm/V s respectively. The maximum of both optical transmittance, in the visible
region, and band gap energy were found to be 91% and 3.7 eV, respectively for the 150 nm film.
As the film thickness increased to 320 nm, the minimum values for visible optical transparency
and band gap energy dropped to 87.5% and 3.64 eV, respectively. The hardness of the different
SWCNTs/ITO films were in the range of 22.4 - 28.0 GPa and the Young’s modulus values were
in the range of 254.4 – 306.0 GPa. The film thickness and the annealing temperature exerted a
positive effect on both the hardness and Young’s modulus values. A combination of the highest
H and E were achieved in the sample with highest thickness and annealed at 350 °C. All the
synthesized thin films appeared to possess very high wear resistance. Combining the high order
of carrier concentration for ITO and the high order of both carrier mobility and mechanical
characteristics of SWCNTs, the results from this study are expected to help facilitate the
engineering design of customizable SWCNTs/ITO thin films for various industrial applications.
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7. CHAPTER 7: ITO-Based Bi-Layer and Tri-Layer Thin Film
Coatings
7.1. Abstract
In this investigation, ITO-based bi-layer and tri-layer thin film coatings (~ 130 nm) were
synthesized via a sol-gel spin-coating process and annealed at 500 C. Thin layers of Au, Au-
NPs, Ag-NPs and AgO were inserted underneath ITO films to form bi-layer thin film systems
and/or encapsulated between two thin ITO layers to form tri-layer thin film systems. Thin film
architectures included Au/ITO (AuI), Au-NPs/ITO ((Au)nI), Ag-NPs/ITO ((Ag)nI) and AgO/ITO
((AgO)I) for bi-layer coatings and ITO/Au/ITO (IAuI), ITO/Au-NPs/ITO (I(Au)nI), ITO/Ag-
NPs/ITO (I(Ag)nI) and ITO/AgO/ITO (I(AgO)I) for tri-layer coatings. The effects of
incorporating these layers with ITO thin films were investigated by X-ray diffraction, X-ray
photoelectron spectroscopy (XPS), field emission scanning electron microscopy (FESEM), UV-
Vis spectroscopy, four-point probes and Hall-Effect. XRD results confirmed the presence of a
body-centred cubic structure of indium oxide. The existence of main elements (In, Sn and O) in
the film surface materials were detected by XPS scans. FESEM images of all fabricated films
revealed formation of dense surfaces with grain-like morphologies indicating the formation of a
polycrystalline structure of ITO. Optical studies on the Ag-NPs and Au-NPs colloidal solutions
resulted in absorption peaks featured at wavelengths 405 and 531 nm, indicating the formation of
10 – 14 nm and 48 nm Ag and Au nanoparticles, respectively. The highest optical transparency
and band gap energy were found to be ~ 91.5% and 3.75 eV for both (AgO)I and (I(AgO)I) thin
films. The lowest electrical resistivity of (1.2×10-4
Ωcm), along with the highest carrier
concentration (11.4×1020
cm-3
) and mobility (40 cm2/V s) were obtained from the IAuI thin film.
An improvement in the power conversion efficiency (PCE) from 3.8 to 4.9% was achieved in an
organic solar cell by replacing the conventional pure ITO electrode with the (I(AgO)I) electrode.
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7.2. Introduction
Recently, transparent conductive materials (TCMs) exhibiting favourable optoelectronic
characteristics of high optical transparency and good electrical conductivity have attracted
considerable research interest due to their potential applications as flat panel displays, touch
screens, solar cells, smart windows, sensors and storage devices [495-497]. As part of these
TCMs, transparent conductive oxides (TCOs) have become the most common TCMs used as
electrodes in optoelectronic devices. Single thin films of metal oxides such as indium oxide
(In2O3), zinc oxide (ZnO), tin oxide (SnO2), aluminium doped zinc oxide (AZO) and indium tin
oxide (ITO) are widely used as transparent conductive materials [77, 110, 498]. In2O3 and ITO
based TCO thin films have been considered the prime candidates among TCOs due to their
numerous favourable characteristics including good thermal and chemical stability, high film-
substrate adhesion and good etching properties [153, 336]. Nevertheless, the scarcity of indium
along with its expensiveness influence the replacement of ITO by other materials having
comparable optoelectronic characteristics, or the reduction of indium consumption in the thin
films production. The typical thickness of ITO thin films used as transparent electrodes lies in
the range of 150 - 700 nm. However, the lower thickness of 150 nm has major drawbacks related
to the brittleness and weakness of this material resulting in increased electrical resistivity [499].
Growing industrial demands for the next generation of optoelectronic devices inspire current
researchers to discover more novel materials and structures having higher optical transparency
and lower electrical resistivity.
Oxide/metal/oxide (OMO) multilayer structures have received much attention as potential
alternatives along with graphene [500], carbon nanotubes [211], metal oxide based nanowires
[501] and metal nanowires [502], to replace single ITO coatings in a variety optoelectronic
devices, owing to their good mechanical properties as well as high electrical conductivity and
optical transparency in the visible region [503, 504]. Similar to single In2O3 and ITO-based TCO
thin films, ITO/metal/ITO multilayers systems have also been proposed in optoelectronic
devices. Different metals such as Au, Ag, Cu, Pt, and Ni were adopted to fabricate a thin layer
encapsulated between two dielectric thin films in OMO hybrid systems [505]. Conventional ITO
thin films are usually fabricated at a temperature higher than 300 °C to obtain good film
crystalline quality with high electrical conductivity and optical transparency. For flexible
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185
applications of ITO thin films, high annealing temperature should be avoided due to the lower
thermal resistance the flexible substrates possess. Therefore, OMO systems fabricated at room
temperature are of interest for these applications. Kim and co-researchers [175] studied the
effects of Ag film thickness on the optoelectronic properties of ITO/Ag/ITO coatings. They
reported that the ITO/Ag/ITO (43 nm/16 nm/43 nm) film exhibited a sheet resistance and
transparency of 8.9 Ω/sq and 79.4%, respectively. ITO/Ag/ITO thin films deposited on PET
substrates exhibited a sheet resistance of 6.7Ω/sq and optical transparency of 83% [506]. The
effect of annealing temperature (200 °C) and radio frequency (RF) power of deposited
ITO/Ag/ITO thin film were investigated by Choi and co-researchers [507]. They produced a film
with sheet resistance and transparency of 4 Ω/sq and 90%, respectively. Yang and co-researchers
[168] studied the effects of Au layer thickness on the structural and optoelectronic characteristics
of Ga-doped ZnO (GZO)/Au/(GZO) thin films. The Au layer thickness was varied in the range
from 3 to 12 nm. A GZO/Au/GZO thin film with Au interlayer thickness of 9 nm exhibited the
highest transparency of 81.9% and the lowest resistivity of 6.63 × 10-5
Ω cm, along with
relatively high figure of merit of 15.4 × 10-3
Ω-1
. Most of the OMO systems were synthesized via
a sputtering technique. An interlayer film ˂ 20 nm is the key aspect for obtaining high
performance in OMO thin films to avoid strongly reflecting incident radiation in the visible and
near-infrared regions. High reflection by the metal layer, which results in a substantial reduction
in the optical transparency of the multi-layer thin films, is an intrinsic characteristic of the metal.
In this investigation, a simple and low cost sol-gel spin-coating process was used to synthesize
bi-layer and tri-layer ITO-based thin films. Silver (-oxide and –nanoparticles) and gold (-film
and –nanoparticles) layers were combined with ITO thin films in these bi-layer and tri-layer
coatings to improve the optical transparency while maintaining the electrical properties of such
coatings. To the best of the author’s knowledge, sol-gel spin-coated ITO-based bi-layer and tri-
layer thin films combined with metal, metal oxide and metal nanoparticles layers have not been
previously reported.
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186
7.3. Experimental Details
7.3.1. Sol Preparation
Sol-gel derived ITO, silver oxide, silver nanoparticle and gold nanoparticle thin films along with
sputtered gold coatings were synthesized. To prepare these thin films, the raw materials used
were hydrated indium nitrate (In(NO3)3.5H2O, purity 99.9%, Alfa Aesar), tin chloride dihydrate
(SnCl2.2H2O, purity 98%, Chem-supply), Silver nitrate (AgNO3, Chem-supply, 99.5%),
hydrogen tetrachloroaurate (III) trihydrate (HAuCl4.3H2O) Sigma Aldrich, 99.99%,
polyvinylpyrrolidone (PVP, M = 40000g/mol), sodium borohydride (NaBH4, Sigma Aldrich,
99.7%), tri-sodium citrate dihydrate (Na3C6H5O7.2H2O) Sigma Aldrich, 99.97%, pure gold target
(purity 99.9%), absolute ethanol and milli-Q water. All precursors were used as received. An
ITO solution with a concentration of 0.1M was used in this study. To prepare the ITO solution,
the required amounts of In(NO3)3.5H2O and (SnCl2.2H2O) were dissolved separately in absolute
ethanol and stirred for 1 hour. The resultant solutions were then mixed and refluxed at 85 °C for
1 hour. A 0.2M Ag nanoparticle solution was prepared by dissolving the required amount of
AgNO3 in 10 ml of milliQ water. A large excess of NaBH4 solution is needed to reduce the ionic
silver and stabilize the formation of Ag-NPs. A 2mM sodium borohydride solution was prepared
by dissolving a required amount of NaBH4 in 30 ml milli-Q water and stirred until the chemical
was completely dissolved. The resultant sodium borohydride solution was chilled in an ice bath
and the silver nitrate solution was added drop-wise. The mixture was stirred vigorously on a
magnetic stirrer plate until the solution turned light yellow after adding all of the silver nitrate
solution. Then, the stirring was stopped and the stir bar removed. The resultant clear yellow
silver solution is stable at room temperature. Silver oxide (AgO) sol with concentration 0.1M
was prepared by dissolving the required amounts of AgNO3 and PVP in 10 ml of absolute
ethanol and stirred vigorously for 60 minutes at 85 °C on a hot magnetic stir plate. To prepare
Au nanoparticle solution, 20 ml of Na3C6H5O7.2H2O (0.5 wt%) was added to 20 ml of an
aqueous solution of HAuCl4.3H2O and PVP (1mM). The solution turned dark grey after less than
30 minutes indicating the formation of Au-NPs solution.
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187
7.3.2. Substrate Cleaning
Microscope glass substrates (Soda-lime silicate substrates with 25×25 mm dimensions) were
used in this study. The substrates were first cleaned with detergent and rinsed in milli-Q water.
Then, the substrates were sonicated in absolute ethanol at 60 °C for 10 min and washed
vigorously with milli-Q water. After that, the substrates were sonicated in milli-Q water at 60 °C
for 10 min followed by drying in high purity nitrogen stream. All glass substrates were dried in a
conventional vacuum drying oven at 100 °C for 30 min prior to coating process.
7.3.3. Thin Films Depositions
The resultant solutions were deposited onto glass substrates in the form of bi-layer and tri-layer
systems using a Polos spin-coater system. These coatings were: Au/ITO (AuI), Au-NPs/ITO
((Au)nI), Ag-NPs/ITO ((Ag)nI), and AgO/ITO ((AgO)I), and ITO/Au/ITO (IAuI), ITO/Au-
NPs/ITO (I(Au)nI), ITO/Ag-NPs/ITO (I(Ag)nI) and ITO/AgO/ITO (I(AgO)I) for bi-layer and tri-
layer thin films, respectively. The spin-coating procedure for thin film deposition was: (1)
dispensing the solution at 300 rpm for 15 seconds, (2) spreading the solution at 2500 rpm for 20
seconds, (3) drying the solution at 4000 rpm for 20 seconds, and (4) heat treatment on a hot plate
at 150 °C for 10 minutes. To fabricate the bi-layer thin films, single layers of Ag-NPs, Au-NPs
and AgO solutions were deposited separately onto the glass substrates, followed by drying on a
hot plate and annealing at 300 °C for 1h. Au layer was also sputtered onto glass substrates and
annealed at 300 °C for 1h. ITO thin films were then deposited sequentially four times onto the
surfaces of Au, Ag-NPs, Au-NPs and AgO layers and annealed at 300 °C. In the case of tri-layer
thin films, ITO thin films were first deposited as bottom-layers onto the glass substrates
following a similar deposition described above prior to depositing the metal based mid layer and
top ITO layers. The resultant thin films were then annealed at 500 °C for 2 h.
7.3.4. Fabrication of Organic Solar Cells (OSCs)
Two thin films with the highest optoelectronic performance in this study were adopted as
electrodes combined with a low band gap photoactive polymers to fabricate organic solar cells
(OSCs). A photoactive layer of 100 nm thickness was prepared using 25 mg/mL of both
poly(3hexylthiophene) (P3HT) and [6,6]-phenyl-C61-butric acid methyl ester (PCBM) dissolved
separately in 1,2-dichlorobenzene and stirred at 50 °C under nitrogen atmosphere in dark glove
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188
box for 8h. The resultant solutions were then mixed and further stirred for 4h prior to deposition.
A buffer layer of poly(3,4-ethylenedioxythiophene):poly-(styrenesulfonate) (PEDOT:PSS) (~50
nm thick) was prepared by diluting a solution of PEDOT:PSS with isopropyl alcohol at a ratio
being 1:2. This buffer layer which acts as a hole transport layer was spin-coated on the fabricated
ITO, AgOI and IAgOI electrodes (3000 rpm for 30s) followed by drying at a temperature of 100
°C for 10 min in a conventional vacuum oven. The solution of P3HT and PCBM was spin-coated
(1500 rpm for 40s) on the top of the PEDOT:PSS layer and stored to dry in the dark glove box at
room temperature for 24h. A layer of Al (100 nm) thick used as a cathode was evaporated on the
photoactive layer using a mask of an active area of (0.4 cm2).
7.3.5. Characterization Techniques
The crystallographic structure of the synthesized thin films were examined by X-ray diffraction
(XRD) analysis via a GBC EMMA diffractometer with CuKα radiation (=0.154nm). All the
XRD measurements were carried out at a diffraction angle (2) in the range of 25° - 70° with a
scanning rate of 2°/min and 2 step size of 0.02. The phase identification of the thin film was
confirmed by comparing observed diffraction peaks with those of the standard database.
Information on elemental compositions and chemical bonding states for the outmost 5 nm of the
synthesized thin film surfaces were obtained using a Kratos axis ultra-X-ray photoelectron
spectrometer (XPS) operating at 15 kV and 10 mA with an Al-Kα monochromatic radiation
source (hv = 1486.6 eV). The specimens were mounted onto sample holders using carbon tape
and analysed under ultrahigh vacuum (2.9 × 10-9
torr). The XPS data for both survey and high
resolution scans were collected without surface etching. Information about the presence of
elemental compositions and chemical bonding states for the analysed specimens were obtained
by de-convoluting the high-resolution scans of the In3d, Sn3d and O1s photoelectron lines using
CASA XPS software (version 2.3.1.5). In order to compensate for any charge shifts, the XPS
energy scale was calibrated by the C1s (C-H) line at 284.60 eV (bonding energy).
The surface topography was obtained using a Philips XL 20 SEM equipped with electron
dispersive X-ray (EDX) analysis column and a Zeiss Neon 40EsB field emission scanning
electron microscopy (FESEM). Prepared thin films were first mounted on the substrate holders
using double-sided carbon tape followed by coating with (3nm thick) platinum to minimize the
charging effects prior to FESEM imaging. The optical properties were determined by means of
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189
transmittance spectra using UV-Vis Perkin Elmer spectrometer in a wavelength range of 250 -
800 nm. A 4-point probe (Dasol Eng. FPP-HS8) was used to observe the electrical properties
(i.e., resistivity and sheet resistance) of the prepared thin films and the Hall-effect measurements
were performed on specimens of (10×10 mm) via ECOPIA HMS-2000 system at 0.9 Tesla of
magnetic field and Polytec Bipolar Operation Power supplies (BPO). Au contacts were thermally
evaporated on the coated thin films in a system of four probes. The current density-voltage (J-V)
characteristics of the fabricated OSCs were measured via a Keithly 2400 source meter
measurements unit under simulated AM 1.5G illumination with an irradiance of 100 mW cm-2
.
7.4. Results and Discussions
7.4.1. Characterizations of Au-NPs and Ag-NPs Colloidal Solutions
The chemical reactions for reducing silver nitrate by sodium borohydride to produce a colloidal
solution of Ag-NPs, and hydrogen tetrachloroaurate (III) trihydrate by tri-sodium citrate
dehydrate to produce a colloidal solution of Au-NPs are as the follows:
(7.1)
(7.2)
The reduction of ionic silver by sodium borohydride and the growth of the silver particles follow
three distinct stages. The early stage of reduction occurs rapidly upon mixing of the reactant
solutions, and the reaction results in the formation of small particles (~ 2 – 3 nm). In the second
stage as the reaction proceeds, the resultant particles enlarge, reaching sizes of (~ 8 – 20 nm)
within a time range of (20 – 60 min). In the last stage of the reaction, the majority of borohydride
is consumed, resulting in the loss of the stabilizing BH4- and the solution switching from a
reducing to an oxidizing environment [508]. The changes in the values of surface potential of the
Ag particles and adsorbed borohydride enhance the aggregation of the Ag particles. Also, the
adsorbed borohydride plays a key role in stabilising the growing Ag nanoparticles by offering a
particle surface charge.
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190
In contrast to the reduction of ionic silver, it has been reported that the preliminary reaction of
the reduction of HAuCl4 by Na3C6H5O7.2H2O creates large clusters (~ 100 – 200 nm) which
shrink in size as the reaction continues until a final cluster size of (~ 15 – 20 nm) is achieved
[509]. Due to the absorption and scattering properties of gold nanoparticles, the shrinking
process of the particles is continued along with a change in the colloidal solution colour from
black to red. This phenomenon could be attributed to competitive adsorption between AuCl4-
ions and citrate ions which reflects different surface charges. Also, initially in the reaction,
AuCl4-
binds and exhibits a low surface potential, resulting in weakly attractive inter-particle
forces. Accordingly, small particles combine reversibly. With the progression of the reaction,
AuCl4- is consumed and the citrate binds to the resultant particle surfaces. Hence, the particle
charge increases, and the pair potential becomes repulsive. Clusters then collapse to produce the
final particle size distribution [510].
The distinctive colours of the prepared colloidal solutions of Ag-NPs and Au-NPs are attributed
to plasmon absorbance, where the incident light produces oscillations in conduction electrons at
the surface of the metal nanoparticles and the electromagnetic radiation is absorbed [511, 512].
The prepared colloidal solutions were first characterized by means of their absorbance spectra
via the UV-Vis spectrophotometer. Figure 7.1 shows the absorbance spectra of both Ag-NPs and
Au-NPs. From Figure 7.1, the absorption peak of Ag-NPs colloidal solution was observed at 405
nm while the absorption peak of Au-NPs colloidal solution was detected at 531 nm. The
wavelength of the plasmon absorption maximum of the colloidal solution can be used to estimate
the particle size of metal nanoparticle. It is well-known that the position and shape of the
plasmon absorption maximum of metal nanoparticles is strongly dependent on the surface
adsorbed species, particle size and dielectric medium [513]. It has previously been reported a
plasmon absorption maximum for a silver nanoparticle colloidal solution at 405 nm corresponds
to a particle size of (10 – 14) nm, while for a gold nanoparticle colloidal solution an absorption
maximum around 531 nm corresponds to a particle size of 48 nm [511].
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0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
350 450 550 650 750 850 950 1050
Ab
sorb
ance
(a.
u)
Wavelength (nm)
Ag-NPs
Au-NPs
7.4.2. XRD Analysis of The Thin Films
The XRD patterns of annealed bi-layer (AuI), ((Au)nI), ((Ag)nI) and ((AgO)I) and tri-layer
(IAuI), (I(Au)nI), (I(Ag)nI) and (I(AgO)I) thin films are presented in Figure 7.2 (a, b). All the
thin films show pattern which are consistent with the growth of polycrystalline body centred
cubic bixbyite structures similar to In2O3, with a space group of Ia3/cubic and lattice parameter
of 10.118 Å (JCPDS card 06-0416). The main peaks for the synthesized thin films are linked to
(222), (400), (411), (332), (440) and (622) reflection orientations similar to In2O3. There is no
impure phase related to tin complexes in the ITO matrix for the bi-layer thin films, which
confirms the investigations that the polycrystalline structure of thick top layer of ITO for this
system can act as a network with a cubic structure and the tin atoms are well integrated.
However, both (I(Ag)nI) and (I(AgO)I) thin films show the existence of (110) reflection line
featured at 2θ ~ 26.6° which reflects the presence of an SnO2 phase (Figure 7.2b). This new
phase can possibly be attributed to the coalescence and agglomeration of Sn atoms at the grain
boundaries of the ITO structure. It is also noticed that the (IAuI) thin film shows a small peak
featured around 33.3° indicating the formation of an AuInO2 crystalline structure phase. This
could be explained based on the fact that, some of Au ions possibly diffused throughout the ITO
Figure 7.1 Absorption spectra of Ag-NPs and Au-NPs colloidal solutions
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192
matrix, and some of them substituted indium atoms on their sites or scattered and/or
agglomerated at the grain boundaries of the ITO system. However, no Au and/or Ag lines were
observed in the bi-layer thin films (Figure 7.2a) which might be attributed to the growth of
thicker ITO films compared to the tri-layer systems. Both the (AuI) and (IAuI) thin films exhibit
the best crystalline quality among the thin films due to uniformity, continuity and enhanced
crystallinity of the Au layers. Annealing temperature also has a potential effect on improving the
crystalline quality of the fabricated thin films by providing sufficient energy to the particles to
accumulate and grow uniformly along the preferred orientations. Compared to the peak positions
of the standard card (JCPDS card 06-0416) of indium oxide, all the synthesized thin films
exhibited a shift toward lower 2θ values indicating crystalline distortion has taken place.
The Debye-Scherrer formula (eq. 2.26) was used to calculate the grain sizes (D) of the
synthesized thin films using the full width at half maximum (FWHM) of the main peak (222) of
the ITO profile. In addition, the lattice parameter (a) and its corresponding inter-planar spacing
(d-spacing) for fabricating thin films were calculated using the standard Bravias lattice for a
cubic system (Eq. 2.27) and Bragg’s law (Eq. 2.25), respectively.
Table 7.1 presents the grain size and lattice constant values of the fabricated bi-layer and tri-
layers thin films. As estimated from the XRD profiles of the synthesized thin films, all the thin
films have larger lattice constants than In2O3 as shown by the shift in the main peak (i.e., (222))
position toward smaller 2θ (JCPDS of (10.118 Å)). The average value of the grain size of the tri-
layer thin films (~ 29 nm) was found to be smaller in relation to the average value for bi-layer
thin films (~ 31 nm), but both are larger than the value of pure ITO reported in our previous
work [430]. The (IAuI) thin film shows the highest values of both D and a assigned to be 33 nm
and 10.16 Å, respectively. This could possibly relate to the substitution of In atoms by Sn and Au
atoms having different atomic radii. On the other hand, the annealing process can not only
enhance the substitution of In by other atoms but also provide the particles of ITO, Au and Ag
with sufficient energy to accumulate and grow uniformly along the preferred orientation of
(222). Both these effects result in increasing the grain sizes along with reducing the level of the
grain boundaries, thereby improving the crystalline structure of the synthesized thin films. The
variation in the lattice constants could also be due to the induced stress near the film surface
through the inter-diffusion of bottom- or mid- layer atoms to the ITO matrix, and thermal
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193
expansion misfit between the glass substrates and the thin films [514]. The Au and Ag atoms
may substitute either In and/or O atoms. Since both atoms have larger radii than In and O atoms,
the increase of lattice space and bond length eventually enlarge the lattice constant.
25 30 35 40 45 50 55 60 65
Inte
nsi
ty (
a.u.)
2θ (degree)
AuI
(Ag)nI
(Au)nI
(AgO)I(2
22
)
(40
0)
(44
0)
(41
1)
(33
2)
(62
2)
25 30 35 40 45 50 55 60 65
Inte
nsi
ty (
a.u.)
2θ (degree)
IAuI
I(Ag)nI
I(Au)nI
I(AgO)I
(22
2)
(40
0)
(44
0)
(33
2) (62
2)
*
# (
11
0)
(a)
(b)
# SnO2
* AuInO
Figure 7.2 XRD patterns of (a) bi-layer and (b) tri-layer thin films annealed at 500 °C
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Table 7.1 Structural parameters of the fabricated bi-layer and tri-layer thin films
7.4.3. Surface Morphology
A comparison of the morphological properties of bi-layer and tri-layer thin films annealed at 500
°C was investigated using the FESEM images and the results are shown in Figure 7.3. All the
fabricated bi-layer and tri-layer thin films appear as dense surfaces with grain-like morphologies
indicating the formation of a polycrystalline structure of ITO. Since the whole thickness for bi-
layer and tri-layer coatings is (~ 130 nm) as proved by cross sectional image, we may assume
that each ITO layer in tri-layer system is (~ 60 nm), while that for bi-layer one it is (~ 120 nm).
Thin films deposited on Au and AgO layers show larger grains along with significant
improvement in the morphology of the top ITO layer compared with other thin films, due to the
high degree of crystallinity that the former films possess. These results are consistent with those
observed from the XRD measurements (section 3.2). Although other thin films grown on (Au)n
and (Ag)n layers show granular morphology surfaces, few micro-cracks, grain boundaries and
pinholes were observed between the granules of the top ITO thin films. This possibly indicates
that both the Au-NPs and Ag-NPs coatings covered the substrates (for bi-layer systems) and
bottom ITO films (for tri-layer systems) incompletely as seen in Figure 7.4. These undesirable
morphologies seem to be an inherent property when ITO is deposited onto a discontinuous layer.
Cross-section imaging was performed on two of the ITO thin films with encapsulating Au and
An-NPs layers and the results are seen in Figure 7.3c. Both Au and Au-NP layers possess
thicknesses of ~ 10 nm. Thus, we may assume that AgO and Ag-NPs insertions possess similar
thicknesses since they are all fabricated with similar deposition conditions. It is clearly seen that
the Au layer covered the bottom ITO film completely, while Au-NP layer exhibited a distinct
System Coatings D (nm) α (Å) d-spacing ( Å )
AuI 32.45 ± 0.55 10.15 ± 0.01 2.931
Bi-layer (Ag)nI 29.32 ± 0.60 10.12 ± 0.01 2.921
(Au)nI 30.50 ± 0.56 10.12 ± 0.01 2.921
(AgO)I 32.66 ± 0.58 10.14 ± 0.01 2.925
IAuI 33.40 ± 0.47 10.16 ± 0.01 2.934
Tri-layer I(Ag)nI 27.71 ± 0.51 10.12 ± 0.01 2.921
I(Au)nI 25.56 ± 0.50 10.14 ± 0.01 2.925
I(AgO)I 30.42 ± 0.52 10.14 ± 0.01 2.925
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195
ITO
ITO
Au
Glass
Resin
ITO
ITO
Resin
Glass
Au-NPs
(c1) (c2)
(b4) (b3) (b2) (b1)
(a1) (a2) (a3) (a4)
I(AgO)I (I(Au)nI)
AuI
(I(Ag)nI)
(AgO)I ((Au)nI) ((Ag)nI)
IAuI
island-like structure. The discontinuity and granularity of Au-NP and Ag-NP coatings explain
the morphological differences between these thin films and other thin films grown on Au and
AgO layers. The formation of island like-structures in the Au-NPs and Ag-NPs coatings for bi-
layer and tri-layer thin films restricted the lateral expansion of the top ITO granules due to the
large numbers of voids and grain boundaries these layers possess. Consequently, there was a
delay in the coalescence of neighbouring ITO particles, resulting in discontinuous film
formation. However, this is not so significant in our bi-layer thin films due to the thicker ITO
films compared to tri-layer thin films as noted in Figure 7.4 (b1 – b4).
Figure 7.3 Top-view images of bi-layer (a1 – a4) and tri-layer (b1 – b4) thin films. Cross-sectional
images for (c1) - IAuI and (c2) - I(Au)nI thin films
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196
7.4.4. Atomic Compositions and Surface Chemical Bonding States
The elemental compositions of the synthesized bi-layer and tri-layer thin films were obtained via
XPS survey scans and the results are presented in Table 7.2. All the synthesized thin films show
the presence of the photoelectron peaks for In 3d, Sn 3d, O 1s, and C 1s in the binding energy
range of 200 - 600 eV, while no peaks related to Au and/or Ag. This was mainly because the
XPS scans were performed on a maximum depth of ~ 10 nm from the top surfaces of the thin
film. It is noticed from Table 7.2 that the atomic percentage of O 1s photoelectron line is higher
than the other photoelectron lines due to the formation of a thick oxide layer owing to both the
wet chemical process and annealing temperature. Also, the ratio of the atomic percentages of In
to Sn obtained from XPS measurements is consistent with the mixed ratio (In:Sn = 90:10 at.%)
for preparing the ITO solution.
Table 7.2 Variation of the atomic percentage of the main elements for bi-layer and tri-layer thin films
Coating Atomic percentage of the elements % In Sn O C
Bi-layer 16.12 ± 0.11 1.73 ± 0.07 51.16 ± 0.7 30.99 ± 0.58
Tri-layer 13.51 ± 0.15 1.46 ± 0.05 53.13 ± 0.65 31.90 ± 0.55
ITO
Au-NPs Ag-NPs AgO Au
Figure 7.4 Schematic diagram shows the differences in the formation of the mid-layer thin film
coatings
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197
Since all fabricated bi-layer and tri-layer thin films exhibit similar photoelectron lines along with
their corresponding binding energies, the surface chemical bonding states of one thin film (i.e.,
IAuI) coating were investigated by de-convoluting the high resolution In 3d, Sn 3d and O 1s
peaks to evaluate the contributions of metal oxides and/or compounds to the film materials
(Figure 7.5).
The fitting curves of high resolution XPS spectra for In 3d5/2 photoelectron line are seen in
Figure 7.5a. Two bonding states with their corresponding binding energies assigned at 444.08
and 444.78 eV were identified and they are attributed to In° bonding state, specifically In-In
bonds, and In3+
bonding state from In2O3, respectively [387, 388]. Figure 7.5b shows the fitting
curves of high resolution XPS spectra of Sn 3d5/2 photoelectron peaks. Two sub peaks are
identified in the fitting curves around 486.38 and 487.45 eV. The first peak with the lowest
binding energy of 486.38 eV can be linked to Sn4+
in SnO2 while the second peak with the
highest binding energy of 487.45 eV is attributed to Sn2+
in SnO. It has previously been reported
that the Sn 3d peak for Sn4+
from SnO2 has a binding energy around 0.5 eV lower than that for
Sn2+
from SnO. Also, the SnO2 phase is thermodynamically more stable than the SnO phase and
is expected to be the major phase between these Sn components in the ITO-based surface
coatings [148, 389]. The de-convoluted fitting curves for O 1s core level show two different
peaks allocated at 529.70 and 531.20 eV, which correspond to In-O bonds from In2O3 and Sn-O
bonds from both SnO and SnO2, respectively (Figure 7.5c) [387]. Oxygen vacancies were found
to be a key aspect in enhancing the electrical properties of In2O3-based thin film coatings through
contributing free carriers to the In2O3 matrix. A theoretical study carried out by Agoston and co-
authors [392] using density function theory (DFT) and first principle calculations, confirmed that
the oxygen vacancies are shallow in the In2O3 matrix and its derivative materials, which facilitate
the production of free electrons (which are the major source of n-type conductivity in In2O3-
based thin film coatings) in the conduction band.
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198
7.4.5. Electrical Properties
The electrical characteristics of bi-layer and tri-layer thin films represented by electrical
resistivity, conductivity, carrier concentration and mobility are shown in Table 7.3. The well-
structured morphology of both (IAuI) and (I(AgO)I) thin films fully accounted for the fact that
the values of electrical resistivity of these tri-layer thin films are much lower compared with their
relative thin films. The (IAuI) thin film shows the lowest electrical resistivity along with highest
carrier concentration and mobility assigned to be 1.2 × 10-4
Ωcm, 11.4 × 1020
cm-3
and 40
cm2/Vs, respectively, while the (I(AgO)I) thin film displays electrical resistivity, carrier
concentration and mobility of 1.6 × 10-4
Ωcm, 9.4 × 1020
cm-3
and 38 cm2/Vs, respectively. The
resistivity for (IAuI) thin film is lower than that obtained in our previous report for 350 nm ITO
and Ti-doped ITO thin films [430]. The superior electrical characteristics of the (IAuI) thin film
are possibly attributed to the uniformity and continuity of the metal Au mid-layer which
441442443444445446447448
CP
S/I
nte
nsi
ty (
a.u)
Binding energy (eV) 484485486487488489490
CP
S/I
nte
nsi
ty (
a.u)
Binding energy (eV)
528529530531532533534535
CP
S/I
nte
nsi
ty (
a.u
)
Binding energy (eV)
In-In
444.08 eV
In3+ in In2O3
444.78 eV
Sn4+ in SnO2
486.38 eV
Sn2+ from SnO
487.45 eV
Sn-O
531.34 eV
In-O
529.64 eV
(a)
(c)
(b)
Figure 7.5 High resolution scans of (a)- In 3d, (b)- Sn 3d and (c)- O 1s of IAuI thin film
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199
restricted the scattering of the free carriers at the interface between this mid-layer and the top
ITO layer, thereby enhance the carrier mobility. The inter-diffusion process of Au atoms to the
top ITO layer may also have increased the carrier concentration of the thin film. In general,
metals have high free carrier concentration of the order of 1022
- 1023
cm-3
, and Au was also
found to have a high work function (ca. 5.1-5.47 eV), which makes it a good electron injector.
Therefore, it is reasonable for the (IAuI) thin film to have a high carrier concentration due to
efficient carrier injection from the Au layer to ITO matrix. Carrier scattering might be less
significant at the interface between the Au mid-layer and ITO layer due to a decrease in the
contact area between these layers when the Au layer formed a continuous film with larger
particles owing to the fast coalescence of its atoms. Annealing also enhances both the diffusion
process and the substitution of In atoms by Au and Ag atoms resulting in improved level of
carrier concentration. (I(Au)nI) and (I(Ag)nI) thin films show significantly higher electrical
resistivity assigned to be 11.4 × 10-4
Ωcm and 8.7 × 10-4
Ωcm, respectively. This could be
related to the formation of distinct Au-NP and Ag-NP mid-layer coatings with agglomeration of
these nanoparticles in the form of island like-structure as discussed previously. Moreover, the
scattering of the free carriers at the interfaces between Au-NP or Ag-NP mid-layer coatings and
ITO films, as well as the grain boundaries noticed in the top ITO layers of the (I(Au)nI), (I(Ag)nI)
and (I(AgO)I) thin films, could be the main reasons that the mobility and carrier concentration of
these thin films were less than that of the (IAuI) thin film. In the case of bi-layer thin films, the
ITO film grown onto an Au layer exhibits the lowest electrical resistivity and the highest carrier
concentration at 3.1 × 10-4
Ωcm, 6.8 × 1020
cm-3
,respectively, while its carrier mobility (29
cm2/Vs) is similar to that of ITO grown onto an AgO layer. It might be surmised that the
electrical properties of the bi-layer coatings mainly depend on the ITO thin films rather than the
bottom layers. The formation of quite thick ITO coatings for the bi-layer thin films compared to
thin top ITO coatings for tri-layer thin films results in better surface morphologies. This shows
that the differences in the electrical properties of bi-layer thin films are not as high as for the tri-
layer thin films. For instance, the ITO coatings grown on Ag- and Au- nanoparticles layers show
only a slight decrease in the electrical properties in comparison with those for tri-layer ones
grown on similar Ag- and Au- nanoparticle mid-layers. This is because thicker ITO coatings for
the bi-layer thin films compensate for the shortcomings of discontinuity of Ag- and Au-
nanoparticle layers through early coalescence and agglomeration of ITO nanoparticles.
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200
Table 7.3 3 Electric properties of fabricated bi-layer and tri-layer thin films
7.4.6. Optical Properties
Despite their high degree of crystallinity, (AuI) and (IAuI) films exhibit lower optical
transparency than ITO and Ag-doped ITO thin films reported in our previous investigation [514]
due to the reflectance losses that the metal layer introduces in the visible region. Figure 7.6 (a, b)
presents the transmittance spectra of the fabricated bi-layer and tri-layer thin films. (AuI) and
(IAuI) thin films have optical transparency of 85% and 82.5% respectively. In comparison, both
((AgO)I) and (I(AgO)I) thin films show high transmittance (~ 91.5%) owing to the oxidation of
Ag, which results in tuning the refractive index of these films. A similar effect has been reported
through increasing the oxygen to argon partial pressure level in a sputtering system [515, 516].
Despite the (AuI) and (IAuI) thin films having similar thicknesses, their optical transmittances
were different. The high transparency of the (AuI) thin film can be possibly related to decrease
light scattering. The bi-layer (AuI) thin film consists of two media with different refractive
indices. For the tri-layer (I(Au)I) thin film, light scattering will occur from the interfaces between
ITO and the Au layer. It is interesting to notice that both the (AuI) and (IAuI) thin films exhibit
their maximum transparencies around 500 nm, while the other thin films exhibit their maximum
transparency at a wavelength around 550 nm. However, the (IAuI) thin film shows a second
maximum transmittance (83.5%) at a wavelength around 750 nm. This high transparency at
longer wavelength can enhance the optoelectronic properties of the thin film especially for
System Coatings ρ×10-4
(Ωcm) σ (S/cm) n×1020
(cm-3
) μ (cm/Vs)
AuI 3.1 ± 0.39 3155.66 ± 140 6.8 ± 0.31 29.4 ± 0.93
Bi-layer (Ag)nI 5.0 ±0.25 1856.12 ± 120 5.8 ± 0.27 20.3 ± 0.70
(Au)nI 7.5 ±0.24 1270.10 ± 95 4.4 ± 0.28 18.5 ± 0.77
(AgO)I 3.8 ±0.24 2598.72 ± 144 5.6 ± 0.30 29.96 ± 0.85
IAuI 1.2 ± 0.15 7296.55 ± 190 11.4 ± 0.28 40.29 ± 0.82
Tri-layer I(Ag)nI 8.7 ± 0.31 1125.21 ± 105 3.0 ± 0.24 24.41 ± 0.68
I(Au)nI 11.4 ± 0.28 874.77 ± 0.91 2.6 ± 0.27 21.33 ± 0.75
I(AgO)I 1.6 ± 0.20 5720.28 ± 200 9.4 ± 0.33 38.48 ± 0.92
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201
producing a high level of photocurrent at this wavelength. Although the films grown on Au-NP
and Ag-NP layers show high transmittances (~ 88%), they are still lower than those for ((AgO)I)
and (I(AgO)I) thin films. This is possibly attributed to the discontinuity of Au-NP and Ag-NP
layers that act as scattering centres for incident radiation.
The transmittance data were used to calculate the absorption coefficient and the optical band
gap energy of the synthesized bi-layer and tri-layer thin films. The absorption coefficient (α) was
calculated using (Eq. 5.2).
Variations of the absorption coefficient for bi-layer and tri-layer thin films in the range of 350-
800 nm are presented in Figure 7.7. It is seen that the AuI and IAuI thin films show the highest
average absorption coefficient among other fabricated thin films. The IAuI thin film exhibits a
shift in the absorption edge to longer wavelength, while the absorption edge of AuI thin film
shifts to shorter wavelength.
The absorption coefficient for the direct allowed transition can be described as a function of
photon energy using (Eq. 3.1). The optical band gap energies of the synthesized thin films were
obtained by extrapolating the linear parts of the plotted curves to the x-axis.
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202
40
50
60
70
80
90
100
300 350 400 450 500 550 600 650 700 750 800
AuI
(Ag)nI
(Au)nI
(AgO)I
Glass
(a)
40
50
60
70
80
90
100
300 350 400 450 500 550 600 650 700 750 800
IAuI
I(Ag)nI
I(Au)nI
I(AgO)I
Glass
(b)
Figure 7.6 Transmittance spectra of (a)- bi-layer and (b)- tri-layer thin films
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203
Figure 7.8 (a, b) shows the variations of the band gap energies of the bi-layer and tri-layer thin
films. The band gap energy between the top of the valence band and the lowest empty state in the
conduction band was found to be proportional to the variations in the grain size, the internal
stress and/or the free carrier concentration (N) [517-519], and it can be increased along with
increasing N due to filling of the lowest energy levels in the conduction band with a broadening
proportional to N2/3
(Burstein–Moss relation) (Eq. 3.2) [370]:
0.5
1
1.5
2
2.5
3
3.5
4
300 350 400 450 500 550 600 650 700 750 800
Ab
sorp
tio
n c
oef
fici
ent
(α)
Wavelength (nm)
AuI
(Ag)nI
(Au)nI
(AgO)I
0.5
1
1.5
2
2.5
3
3.5
4
300 350 400 450 500 550 600 650 700 750 800
Ab
sorp
tio
n c
oef
fici
ent
(α)
Wavelength (nm)
IAuI
I(Ag)nI
I(Au)nI
I(AgO)I
(b)
(a)
Figure 7.7 Absorption coefficient of (a)- bi-layer and (b)- tri-layer thin films
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Despite the high N values, the optical band gap energies of (AuI) and (IAuI) thin films were
estimated to be low compared to the other thin films in this study. This could be mainly related
to the reflectance losses of the Au layer and the introduction of some defects that create localized
states in the Eɡ [179]. The Eɡ for the (AuI) and (IAuI) thin films were 3.73 eV and 3.5 eV,
respectively, due to high optical transparency in the visible region, and the shift of the absorption
edge towards shorter wavelength for the AuI thin film. The highest optical band gap energy (3.75
eV) was observed for both AgOI and IAgOI thin films. This high value of Eɡ is mainly attributed
to high optical transparency owing to the decrease in the light scattering, improved crystalline
quality, enlarged crystallite size and the release of internal stress. Other fabricated bi-layer and
tri-layer thin films on Au and Ag nanoparticle layers exhibit energy band gaps within the range
of (3.65 – 3.72) eV.
The performance of the synthesized bi-layer and tri-layer thin films as transparent conductive
coatings was further appraised through determination of the figure of merit (FOM) of these thin
films. The FOM was pertinent to both the sheet resistance (Rsh) and transmittance (T) (at a
wavelength of 550 nm) of the thin film, and can be expressed by the following relation:
⁄ . A comparison of the FOM of the fabricated and annealed bi-layer and tri-layer thin
films is presented in Table 7.4. It is known that a higher value of FOM suggests better
performance for a transparent conducting thin film. The highest values of FOM were calculated
to be 31 × 10-3
and 13 × 10-3
Ω-1
for (I(AgO)I) and (AgO)I thin films, respectively. These high
values can be mainly attributed to high optical transparency of the (I(AgO)I) and (AgO)I films.
Table 7.4 Optical, sheet resistance and FOM values of synthesized thin films
System Coating T (%) Eg (eV) Rsh (Ω/sq) Φ×10-3
(Ω-1
)
AuI 85.0 ± 0.7 3.73 ± 0.01 23.80 ± 2.1 7.3 ± 0.2
Bi-layer (Ag)nI 87.5 ± 0.4 3.65 ± 0.02 38.45 ± 1.8 6.4 ± 0.2
(Au)nI 88.0 ± 0.2 3.70 ± 0.01 57.70 ± 2.2 4.8 ± 0.2
(AgO)I 91.5 ± 0.2 3.75 ± 0.01 29.23 ± 2.4 13.0 ± 0.1
IAuI 82.5 ± 0.5 3.51 ± 0.02 9.23 ± 1.2 9.0 ± 0.2
Tri-layer I(Ag)nI 88.5 ± 0.2 3.72 ± 0.01 66.92 ± 3.1 4.1 ± 0.2
I(Au)nI 87.5 ± 0.3 3.65 ± 0.03 87.70 ± 2.7 2.8 ± 0.1
I(AgO)I 91.5 ± 0.3 3.75 ± 0.01 12.30 ± 0.9 31.0 ± 0.4
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3.3 3.35 3.4 3.45 3.5 3.55 3.6 3.65 3.7 3.75 3.8 3.85 3.9 3.95 4
Photon energy (eV)
AuI
(Ag)nI
(Au)nI
(AgO)I
( 𝛼 𝑣) ( 𝑐𝑚 𝑒𝑉
)
3.3 3.35 3.4 3.45 3.5 3.55 3.6 3.65 3.7 3.75 3.8 3.85 3.9 3.95 4
Photon energy (eV)
IAuI
I(Ag)nI
I(Au)nI
I(AgO)I
( 𝛼 𝑣) ( 𝑐𝑚 𝑒𝑉
)
(b)
(a)
The optical constants including refractive index (n) and extinction coefficient (k) of the thin film
are considered key aspects for achieving good performance in optoelectronic applications. The
refractive index of a thin film is a measure of its transparency to incident radiation within a
specific region of studied wavelength. The valuation of the refractive index is very important in
Figure 7.8 Variations of the band gap energy of (a)- bi-layer and (b)- tri-layer thin films
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206
integrated optoelectronic devices. The n and k values of the bi-layer and tri-layer thin films were
calculated based on (Eq. 5.3) and (Eq. 2.19), respectively.
Figure 7.9 (a, b) shows the variation of the refractive indices of the fabricated bi-layer and tri-
layer thin films. It can be seen in Figure 7.9 that the refractive indices of all thin films decreased
with increasing the wavelength, and the average values of n for both AuI and IAuI thin films are
higher than that for other thin films fabricated in this study. This could be attributed to the high
carrier concentration and reflectivity that the AuI and IAuI thin films possess. Increasing carrier
concentration might result in the formation of some light scattering centres, which hinders the
optical transparency.
As seen in Figure 7.10 (a, b), the extinction coefficients of all the fabricated bi-layer and tri-layer
thin films initially decrease in the near ultraviolet (NUV) region and then gradually increased in
the visible region. The AuI and IAuI thin films exhibit the highest average extinction coefficient
values in the visible region compared with the other thin film coatings, which could be also
related to increased reflection of light by Au layer.
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1.5
1.75
2
2.25
2.5
2.75
3
350 400 450 500 550 600 650 700 750 800
Ref
ract
ive
ind
ex (
n)
Wavelength (nm)
AuI
(Ag)nI
(Au)nI
(AgO)I
1.5
1.75
2
2.25
2.5
2.75
3
350 400 450 500 550 600 650 700 750 800
Ref
ract
ive
ind
ex (
n)
Wavelength (nm)
IAuI
I(Ag)nI
I(Au)nI
I(AgO)I
(b)
(a)
Figure 7.9 Refractive index spectra of (a)- bi-layer and (b)- tri-layer thin films
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0
0.05
0.1
0.15
0.2
300 400 500 600 700 800
Exti
nct
ion c
oef
fici
ent
(k)
Wavelength (nm)
AuI
(Ag)nI
(Au)nI
(AgO)I
0
0.05
0.1
0.15
0.2
300 400 500 600 700 800
Exti
nct
ion c
oef
fici
ent
(k)
Wavelength (nm)
IAuI
I(Ag)nI
I(Au)nI
I(AgO)I
(b)
(a)
Figure 7.10 Extinction coefficient spectra of (a)- bi-layer and (b)- tri-layer thin films
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209
7.4.7. Characteristics of OSCs
The favourable performance of AgOI and IAgOI identified these thin films for further
investigation in organic solar cells (OSCs) using these thin films as electrodes combined with a
low band gap photoactive polymers. The OSCs configuration:
glass\electrode\PEDOT:PSS\P3HT:PCBM\Al is shown in Figure 7.11a. Characteristics of the
OSCs fabricated with AgOI and IAgOI electrodes were compared with OSC fabricated with an
ITO electrode reported in our previous study [430]. The power conversion efficiency (PCE) of
the OSC is defined by the following formula:
(7.3)
where Voc, Jsc and Pi are the open circuit voltage, short-circuit current density and the input
power of the solar irradiance, respectively. FF is the fill factor which is defined as:
(7.4)
where Jm and Vm are the maximum current density and maximum voltage, respectively.
A comparison of the (J-V) characteristics of the fabricated OSCs based on ITO, AgOI and IAgOI
electrodes showed that the short-circuit current density (Jsc) and fill factor (FF) values of the
solar cell with IAgOI electrode were observably higher than those of AgOI and ITO electrodes
as seen in Figure 7.11b and Table 7.5. Since the configuration of the fabricated OSCs is
identical, all the OSCs showed similar open circuit voltage (Voc). The higher value of Jsc and FF
of the OSC fabricated with IAgOI electrode could be associated with the higher incident-photon
to current conversion efficiency, owing to the higher optical transparency of the IAgOI electrode
in the wavelength range of 400 – 800 nm, and the lower sheet resistance compared to AgOI and
ITO electrodes. Series resistance (Rs) of an electrode has no effect on its Voc value, yet it
decreases the Jsc value of the electrode [20]. The power conversion efficiency (PCE) of the OSC
fabricated with IAgOI electrode is greater than those OSCs fabricated with ITO and AgOI
electrodes, despite similar optical transparency. This high PCE value observed in the OSC
fabricated with IAgOI electrode is the result of the increase in the photocurrent production due to
both low Rsh value, and high optical transparency in the wavelengths between 400 and 800 nm.
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(a)
-14
-12
-10
-8
-6
-4
-2
0
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7
Cu
rren
t d
ensi
ty (
mA
cm-2
)
Voltage (V)
I(AgO)I
(AgO)I
ITO
(b)
Table 7.5 Photovoltaic performance parameters of fabricated OSCs
7.5. Conclusions
In the present study, thin (AuI), (Au)nI, (Ag)nI, (AgO)I, (IAuI), (I(Au)nI), (I(Ag)nI) and (I(AgO)I)
film coatings were successfully fabricated via a low cost, efficient and environmentally friendly
sol-gel spin-coating method onto soda-lime glass substrates, and annealed at 500 C. The effects
of inserting thin Au, Au-NP, Ag-NP and AgO layers in bi-layer and tri-layer ITO-based thin
films were investigated by means of structural, morphological, elemental composition, optical
and electrical characteristics. XRD results confirmed the formation of a body-centered cubic
structure of polycrystalline indium oxide. XPS scans show the existence of the main elements
(In, Sn and O) in the film materials, and the contributions of the element compounds were
estimated by de-convoluting the high resolution In 3d, Sn 3d and O 1s photoelectron lines via a
Gaussian distribution. FESEM images revealed the development of dense surfaces with grain-
like morphologies indicating the formation of polycrystalline features of ITO. Optical studies
Electrode Jsc (mA cm-2
) Voc (V) FF (%) Rsh (Ω cm2) Rs (Ω cm
2) PCE (%)
IAgOI 12.5 0.64 61.25 565.68 7.4 4.9
AgOI 11.53 0.64 57.70 731.74 10.1 4.2
ITO 10.63 0.64 56.10 829.31 14.5 3.8
Figure 7.11 (a)- Device architecture and (b)- J-V characteristic curves of the fabricated and compared OSCs in
this investigation
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211
revealed absorption peaks at wavelengths of 405 nm and 531 nm for Ag-NP and Au-NP colloidal
solutions, respectively, which were attributed to the formation of 10 – 14 and 48 nm Au and Ag
particles, respectively. The maximum transmittance in the visible region and band gap energy
were found to be ~ 91.5% and 3.75 eV for both (AgO)I and (I(AgO)I) thin films. The IAuI thin
film showed the lowest electrical resistivity of (1.2×10-4
Ωcm), along with the highest carrier
concentration (11.4×1020
cm-3
) and mobility (40 cm2/V s). These results are better than those
obtained from 350 nm pure ITO and doped-ITO films An improvement in the power conversion
efficiency (PCE) from 3.8 to 4.9% is achieved in an organic solar cell by replacing the
conventional pure ITO electrode with an (I(AgO)I) electrode.
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8. CHAPTER 8: Conclusions and Recommendations
8.1. Conclusions
An efficient, low-cost and environmentally friendly sol-gel spin-coating method was adopted to
synthesize ITO-based transparent and conducting thin films on soda-lime glass substrates. An
alternative to high energy and vacuum techniques, high crystalline quality sol-gel derived ITO-
based thin films combined with 3d transition metals including Ti and Ag, SWCNTs and metal
nanoparticles were successfully prepared and characterized for their optoelectronic properties by
means of XRD, XPS, FESEM, EDX, AFM, Raman analysis, UV-Vis, four point probes, Hall-
Effect, and nanoindentation measurements. The structural, morphological, optoelectronic and
mechanical properties were investigated for a range of variables including Ti (2 and 4 at.%) and
Ag concentrations (2, 4, 6 and 10 at.%) for 350 nm Ti- and Ag- doped ITO film thickness,
respectively, film thickness (150, 210, 250 and 320 nm) for SWCNTs (0.25 wt%) incorporated
ITO thin films. Three different ITO-based film geometries (single-, bi- and tri- layers) were
synthesized in this study. Single ITO coatings include ITO, Ti- and Ag- doped ITO and CNT
incorporated ITO. While, bi-layer and tri-layer ITO stacks consisted of: Au/ITO (AuI), Au-
NPs/ITO (Au)nI, Ag-NPs/ITO (Ag)nI and AgO/ITO (AgO)I for bi-layer coatings and
ITO/Au/ITO (IAuI), ITO/Au-NPs/ITO (I(Au)nI), ITO/Ag-NPs/ITO (I(Ag)nI) and ITO/AgO/ITO
(I(AgO)I) for tri-layer coatings. All the synthesized ITO-based thin films were fabricated using a
pre-ITO solution of (In:Sn = 90:10 at.%), and post annealed in the range (350 – 600) °C.
XRD results confirmed that all the fabricated ITO-based thin films exhibited the presence of a
body-centered cubic bixbyite structure similar to In2O3 with a space group of Ia3. The crystalline
quality of the fabricated thin films was improved along with enlarging grain sizes and lattice
constants by Ti, Ag and CNTs additives, annealing temperature and depositing ITO layers on
continuous Au and AgO layers. A Thin ITO film prepared with 4 at.% Ti and annealed at 500 °C
exhibited the largest crystallite size of 80 nm compared to other doped ITO-based thin films with
crystallite size in the range of (50 – 65) nm. XRD results also showed the presence of Ag and C
phases for Ag-doped ITO and SWCNTs/ITO thin films, respectively, which were also confirmed
by EDX and Raman analysis. EDX results showed the presence of Ag and CNTs in ITO film
materials, while Raman analysis performed on SWCNT/ITO thin films revealed the existence of
both D- and G-bands for carbon. The D-band seen at 1292.4 cm-1
is related to the defect in the
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SWCNTs, while the G-band seen at 1594.6 cm-1
is characteristic of sp2 graphitic material, which
is attributed to a carbon atom vibrational mode along the SWCNT axis. XPS results of
SWCNTs/ITO thin films are consistent with Raman analysis. By de-convoluting the C1s
photoelectron lines, a high contribution of 66.8% observed at the lowest binding energy around
284.5 eV was assigned to pure sp2 hybridized graphitic carbon atoms of (C-C and C=C bonds),
and carbon atoms bounded to hydrogen (C-H bonds). These sp2 bonds provide CNTs with their
unique mechanical properties.
The surface morphology of the synthesized ITO-based thin films was characterized by FESEM
imaging. All the thin films showed dense and homogeneous surfaces with grain-like structures
demonstrating the nanocrystalline structure. Incorporation of Ti, Ag and CNTs in ITO film
materials resulted in enhancing the surface morphologies of these thin films along with enlarging
their grains. These findings are consistent with the results obtained from the XRD results.
Annealing temperature up to 500 °C enhanced the morphologies of the synthesized thin film.
However, further increase in the annealing temperature up to 600 °C resulted in the formation of
some cracks on the surfaces of ITO and Ti-doped ITO thin films. Also, thicker films (i.e., 250
and 320 nm) for SWCNTs/ITO coatings showed the formation of some cracks on their surfaces
compared to thinner films of the same coating. These cracks significantly affected the surface
topography of thicker SWCNTs/ITO films that displayed RMS values of 4.08 and 4.65 nm for
250 and 320 nm, respectively, compared to 3.36 and 3.49 nm for thinner films (150 and 210 nm,
respectively) as proven by AFM scan results. FESEM images of bi-layer and tri-layer ITO-based
thin film coatings revealed that the films deposited on continuously formed Au and AgO layers
are dense, smooth and homogeneous, while those deposited on Au- and Ag- nanoparticles layers
displayed a few micro-cracks, grain boundaries and pinholes due to discontinuous island-like
structures these coatings possess. These continuous and distinct Au and Au-NPs layers were
confirmed by cross-sectional FESEM images performed on ITO/Au ITO and ITO/Au-NPs/ITO
thin films, respectively.
It is believed that improving the crystalline quality and surface morphology of ITO-based thin
films resulted in enhancing their optoelectronic properties. The highest optical transparency
(~92%) was for ITO, 4 at.% Ti-doped ITO and 2 at.% Ag-doped ITO thin films. This high
optical transparency resulted from the broadening of the optical band gap energy calculated to be
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214
(3.74, 3.77 and 3.75 eV) for the former thin films, respectively. Since the optical constants
including absorption coefficient, complex refractive index and extinction coefficient are very
important parameters for achieving good performance in optoelectronic devices, these
parameters were also calculated in this work for different synthesized thin films. It is noted that
increasing the Ag level in Ag-doped ITO thin films, and the film thickness of SWCNTs/ITO thin
films resulted in a shift in the absorption edge to longer wavelength regions and the thin films
showed higher absorption coefficient values compared to pure ITO films. Similarly, increasing
the Ag level in Ag-doped ITO thin films resulted in increasing the average values of both
refractive index and extinction coefficient. In relation to bi-layer and tri-layer ITO based thin
films, both Au/ITO and ITO/Au/ITO stacks revealed the highest values of both refractive index
and extinction coefficient compared to other stacked thin films.
Incorporating Ag, Ti and CNTs in ITO matrix resulted in improving the electrical and
mechanical properties of ITO thin films. ITO thin films prepared with 4 at.% Ti concentration
and annealed at 500 °C showed an improvement in the electrical resistivity of 1.6×10-4
Ωcm
along with carrier concentration and carrier mobility of 8.6×1020
cm-3
and 49 cm2/Vs,
respectively, compared with pure ITO film with resistivity, carrier concentration and mobility of
2.2×10-4
Ωcm, 7.0 ×1020
cm-3
and 39 cm2/Vs, respectively. Similarly, the ITO film prepared
with 4 at.% Ag concentration showed improved electrical properties among other Ag-doped ITO
thin films. Additionally, increasing the thickness of SWCNTs/ITO thin films resulted in
improving their electrical properties and slightly decreasing the optical transparencies. The
thickest film (i.e., 320 nm) annealed at 350 °C exhibited electrical resistivity, carrier
concentration and mobility of 4.6×10-4
Ωcm, 3.3 ×1020
cm-3
and 41 cm2/Vs, respectively.
However, the lowest electrical resistivity achieved in this study was 1.2 × 10-4
Ωcm, related to
ITO/Au/ITO along with carrier concentration and mobility of 11.4 × 1020
cm-3
and 40 cm2/Vs,
respectively.
Improvement in the mechanical properties of the thin films was attributed to crystalline quality,
chemical and electronic states of the thin films. The contributions of Ti, Ag and CNT in
improving the mechanical characteristics of the synthesized ITO-based thin films were estimated
from the nanoindentation measurements. ITO thin films prepared with the highest levels of both
Ti and Ag and annealed at 500 °C revealed a hardness and Young’s modulus in the range (6.7 -
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215
6.8) and (143 – 148) GPa, respectively. Due to the high contribution of sp2 bonds (66.8%)
obtained from the XPS analysis, significant improvement in the mechanical properties was noted
by incorporating robust SWCNTs in ITO matrix, with a hardness and Young’s modulus of 28
and 306 GPa, respectively, compared to 6.6 and 143 GPa for ITO thin film. These distinctive
mechanical properties of SWCNT/ITO films resulted in a slight drop in their optical
transparencies. However, these values of optical transparency are still acceptable in
optoelectronic applications.
The performance of ITO-based thin film coatings was examined through fabricating OSCs with
ITO, AgO\ITO and ITO\AgO\ITO electrodes. The resultant OSCS have the configuration:
glass\electrode\PEDOT:PSS\P3HT:PCBM\Al. The power conversion efficiencies of 4.9%, 4.2%
and 3.8% were obtained for ITO\AgO\ITO, AgO\ITO and ITO thin film coatings, respectively.
Increasing demands for the next generations of optoelectronic devices inspires researchers in the
field of TCMs to develop new low-cost materials or use simple and low-cost techniques to
fabricate these kinds of thin films. The sol-gel spin-coating process adopted in this research work
has proven itself to compete with other, more expensive and more complicated methods in
synthesizing high performance ITO-based transparent and conductive films.
Table 8.1 A comparison of the best achieved results of ITO-based TCOs thin films fabricated in
this study
Coating ρ ×10-4
(Ω.cm) n ×1020
(cm-3
) T% Hardness
ITO 2.2 7.0 90.5 6
Ti-doped ITO 1.6 8.6 92 6.8
Ag-doped ITO 2.4 6.8 92 6.8
SWCNTs/ITO 4.6 3.3 88 28.0
Au/ITO 3.1 6.8 80 -
AgO /ITO 3.8 5.6 85 -
ITO/Au/ITO 1.2 11.4 80 -
ITO/AgO/ITO 1.6 9.4 88 -
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216
8.2. Recommendations
The scientific works embodied in this thesis have led to an intriguing opportunity for further
investigations in improving the optoelectronic and mechanical properties of ITO-based thin film
coatings. The next paragraphs discuss a few suggestions for potential future works.
Since the ITO properties have been improved by doping with Ti and Ag in this dissertation and
annealing, co-doping of ITO thin films can be an efficient new strategy to further improve its
optoelectronic characteristics. Investigation of alternative elements with suitable concentrations
to dope ITO thin films without altering their crystallite structure will be beneficial for this
purpose.
Mechanical properties are very important aspects in determining favorable performance from
ITO-based thin films, especially for flexible applications. The surface of an ITO film is brittle,
weak, and seems to be susceptible to delamination and cracking under an applied strain. In this
study, CNTs incorporated with ITO showed good mechanical characteristics despite the
reduction of the optical transparency. Therefore, developing new materials and/or elements to
improve the mechanical properties of a brittle ITO while maintaining its optoelectronic
properties, is important to commercialize ITO for the next generation of flexible optoelectronic
devices.
Stacked thin films including ITO/metal/ITO have been investigated previously. However, a
metal oxide layer encapsulated between two ITO layers adopted in this research study exhibited
improved optical properties compared to pure metal layer. Further investigation is still needed to
replace a metal layer which has high reflectivity with other metal oxide layers. Another
suggestion is to fabricate ITO with other TCO thin films such as ZnO, SnO2, TiO2, etc.
Graphene and metal nanowires including Ag-, Cu-, and Ni- nanowires are of great interest in the
field of transparent conducting materials. But, they still have some drawbacks related to high
absorption by graphene in the visible region, and the oxidation issue of metal nanowires.
Combining ITO thin films with graphene and metal nanowires can overcome their shortcomings.
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