HALLENGES AND SOLUTIONS RUGGED APPLICATIONS · Intelligent Completions Permanent Monitoring...
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CHALLENGES AND SOLUTIONS FOR RUGGED APPLICATIONS Ryan Roush – Lead Electrical Engineer
Transcript of HALLENGES AND SOLUTIONS RUGGED APPLICATIONS · Intelligent Completions Permanent Monitoring...
CHALLENGES AND SOLUTIONS FOR RUGGED APPLICATIONS
Ryan Roush – Lead Electrical Engineer
AGENDA
Quartzdyne Background & Applications
Circuit Reliability
Evolution & Future of the QD Circuit
Interconnects
Hershey Bar Hybrid
BOM
Height
Magnetics
Thermal Slug
QUARTZDYNE BACKGROUND
Since 1990 Quartzdyne has been the world leader in designing, developing, and manufacturing the industry-standard resonating quartz pressure transducer for the downhole oil and gas industry
QUARTZDYNE APPLICATIONS
Intelligent Completions
Permanent Monitoring
Flowmeters
High Temperature
QUARTZDYNE APPLICATIONS
Intelligent Completions
Permanent Monitoring
Flowmeters
High Temperature
Memory Tools
Repeat Formation Testers
Production Logging Tools
QUARTZDYNE APPLICATIONS
Intelligent Completions
Permanent Monitoring
Flowmeters
High Temperature
Memory Tools
Repeat Formation Testers
Production Logging Tools
Pressure Control (ECD)
Formation Test While Drilling
QUARTZDYNE APPLICATIONS
Intelligent Completions
Permanent Monitoring
Flowmeters
High Temperature
Memory Tools
Repeat Formation Testers
Production Logging Tools
Pressure Control (ECD)
Formation Test While Drilling
QUARTZDYNE APPLICATIONS
TRANSDUCER COMPONENTS
QUARTZDYNE CIRCUIT RELIABILITY
Manufacturing & Process Updates
Introduction of Oscillator and
Voltage Regulator ASICs
Discrete Improvements
EVOLUTION OF QUARTZDYNE’S CIRCUIT
D11315 *Circa 1995
R&D Only
D11454 A0 Circa 2000
D11454 B3 Circa 2004
D11603 A1 Circa 2005
D11616 B0 Circa 2006
D11648 A0 Circa 2007
D11648 C0 Circa 2009
D11648 F2 Circa 2010
D11648 G0 Circa 2011
D11988 A1 Circa 2014
INCREASE IN CIRCUIT RELIABILITY
FUTURE OF QUARTZDYNE’S CIRCUIT
Integration
Advantages of Integration
Reduced Component Count
Reduced Size
Less Variability
Predictable Aging
Reduced Wire bond Count
Obsolesce Protection
Increased Reliability and Yields
ELECTRONIC INTERCONNECTS
Solder #1 Failure Mode in Internal Reliability Testing
Disadvantages of HMP Solder
Limited HT Alloys
High Lead Content RoHS Compliance
Difficult to Solder
Difficult to Clean
HMP Solder – No Cleaning or Rinse 15 Days at 280°C
Welding
Creates a Reliable Electrical/Mechanical Attach
Eliminates Flux & HMP Solder
Longer Life
ELECTRONIC INTERCONNECTS
HERSHEY BAR HYBRID
HERSHEY BAR HYBRID
Components: 4
Components: 28
Components: 84
Components: 87
Components: 167
HERSHEY BAR HYBRID HEIGHT
Challenge #2 – All components required to be inside hermetic package, including large magnetics.
THERMAL DISSIPATION
Challenge #4 – Power Components dissipate > 1W
Al2O3 AlN
Without Thermal Slug
Tamb = 150°C
Power = 5W
Without the slug (Thermal Coefficient Al2O3 = 20.3W/(m*K)) Tmax = 165°C
HERSHEY BAR HYBRID THERMAL SLUG
