FEE + ROC cooling

S. Popescu CERN, U. Frankenfeld, H.R. Schmidt GSI

12.2.2004 TPC meeting 2

IROC in Thermal Box + 4 FEC (3.1)

Lauda System

PUMP

IROC

Lauda System

T8T9

T10

T12

T13

T11

T7 T6T5

Inside: Sensors on pad plane

T8

FEC

T14T15

Separate cool. circuits for chamber + FEC

Sensors on FEC cool. plates

~10cm ~10cm

12.2.2004 TPC meeting 3

FEC

IN

Thermal Box T=21 ˚C

Chamber cool. T=21˚C

Cooling In

Temp sensors

PS

Cooling Out

12.2.2004 TPC meeting 4

Input Cooling circuit

Output Cooling circuit

Cham

ber

Coolin

g c

ircu

it

4 FEC (3.1)~10.5 W/card(3.2: ~6.9 W/card)

T11

T9 T10

T12

IROC

12.2.2004 TPC meeting 5

ELMB

PT1000 two wire sensors connected

Can Bus port

12.2.2004 TPC meeting 6

Cooling plate

Inner screws

T14

12.2.2004 TPC meeting 7

Single card w/o inner screws

LV OFF LV ON

ΔT ~5.5 ˚C

ΔT c

oolin

g p

late

s

12.2.2004 TPC meeting 8

Card w/o inner screws in set-up

LV ON LV OFF

ΔT ~4 ˚C

ΔT c

oolin

g p

late

s

12.2.2004 TPC meeting 9

Single card with all screws

All screws in

ΔT ~1 ˚C

ΔT c

oolin

g p

late

s

12.2.2004 TPC meeting 10

Chamber cooling

~ 50 minutes

Cc off Cooling circuit on

chamber

Pad

12.2.2004 TPC meeting 11

Chamber cooling

• All circuits 21˚C• Chamber

21 -> 19.5 ˚C

ΔT ~1.5 ˚C

chamber cooling

chamber

pads

12.2.2004 TPC meeting 12

Chamber cooling

• All circuits 21˚C• Gradients on

the pad plane

ΔT ~0.08 ˚C

pad under FEC

pad

12.2.2004 TPC meeting 13

ΔT ~0.18˚C

Δt ~ 30 min

LV OFF LV ON

Heat transfer to pad plane

Pad under FEC

12.2.2004 TPC meeting 14

Heat transfer with cable

• Chamber 21˚C• FEE cooling 19˚C• Thermal box 21˚C

Heat transfer: ~0.19˚C

pad under FEC

pad

LV ON | LV OFF

12.2.2004 TPC meeting 15

Heat transfer without cable

• Chamber 21˚C• FEE cooling 19˚C• Thermal box 21˚C

Heat transfer: ~0.15˚C

pad under FEC

pad

LV ON | LV OFF

12.2.2004 TPC meeting 16

Compensation 19-24 ˚C

LV OFF LV ON LV OFF

FEC cool:T=19 ˚C T=24 ˚C T=19 ˚C T=24 ˚C

12.2.2004 TPC meeting 17

Temperature cooling FEE 19->24 ˚C

ΔT ~ 0.14˚C

pad under FEC

pad

12.2.2004 TPC meeting 18

Compensate: Switching ON

ΔT ~ 0.05˚C

pad under FEC

pad

12.2.2004 TPC meeting 19

Compensate: Switching OFF

pad under FEC

pad

FEC cool. temperature (scaled)

12.2.2004 TPC meeting 20

Compensate: Switching OFF

ΔT ~ 0.06˚C

pad under FEC

pad

12.2.2004 TPC meeting 21

Compensation (16-21˚C)

LV OFF LV ON LV OFF

FEC cool: T=21˚C T=16˚C T=21 ˚C

12.2.2004 TPC meeting 22

Compensation (16-21˚C)

ΔT ~ 0.05˚Cpad under FEC

pad

LV ON LV OFF

12.2.2004 TPC meeting 23

Summary + Conclusion

• Setup with 4 FEC (Ver. 3.1) 10.5 W per Card• Heat transfer between both sides of cooling plates

thru screws: Single sided cooling? • Chamber circuit for stabilization not compensation

– Time constant Δt ~ 50 min

• Heat transfer FEC -> pads– Time constant Δt ~ 30 min– ~0.19 ˚C with cable– ~0.14 ˚C without cable

• Compensation with Cooling temperature per sector– Test setup: Compensation on pads with ΔT ~ 0.05 ˚C