FEBOctCover 4/10/06 14:42 Page 1 BULLETINdownload.iop.org/Fab2006.pdf · With the increasing...
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BULLETIN FAB EQUIPMENT October 2006 Issue 1 Vacuum equipment ● Abatement ● Management systems P UBLISHED BY C OMPOUND S EMICONDUCTOR MAGAZINE Tropel ® UltraSort ™ Corning Tropel Corporation p6 Cutting and Grinding of Compound Materials myChip Production GmbH p6 Reconditioned Process Equipment ClassOne Equipment p3 Plasma Etch and Deposition Tools Oxford Instruments Plasma Technology p5
Transcript of FEBOctCover 4/10/06 14:42 Page 1 BULLETINdownload.iop.org/Fab2006.pdf · With the increasing...
BULLETINFAB EQUIPMENT
October 2006 Issue 1
Vacuum equ ipment � Abatement � Management sys tems
P U B L I S H E D B Y C O M P O U N D S E M I C O N D U C T O R M A G A Z I N E
Tropel® UltraSort™
Corning Tropel Corporation p6Cutting and Grinding of Compound MaterialsmyChip Production GmbH p6
Reconditioned Process EquipmentClassOne Equipment p3
Plasma Etch and Deposition ToolsOxford Instruments Plasma Technology p5
FEBOctCover 4/10/06 14:42 Page 1
You and Varian:the Winning Team.
• The Varian Patented Macrotorrpumping technology: all of the SEM turbopumpsrequire very small backingpumps, like our
SH110 scroll pump. A performing and costeffective combination.
• A complete offer of drypumps, based on oursuccessful Scroll pumpline. Single scroll, hermetically sealedand quiet, these pumps are the best forSEM tools.
• Dry Scroll Primary Pumpswith variable speed, designed forelectron microscopes.
• 24 hour Service Support available world wide, to maximize yoursystem uptime.
• A pioneer in supplyingvacuum components to SEM and TEM microscopes.
• The exclusive SEM ion pump line, ideal for electron microscope columns, with virtually no leakage current and outstandingpressure stability.
• The exclusive SEM turbo pumps: a line of maintenance free and ruggedturbomolecularpumps with specialvibrations dampingsystems. Better than theMaglev, without theneed of magnets.Low vibrations, no straymagnetic field, nointerferences with the beam.Max uptime.
Varian Vacuumready for theNanotechnologyEra
Interactive catalog on CD
Varian Vacuum Technologiesvia F.lli Varian 54, 10040 Leini, (Torino), Italy
Tel: (39) 011 997 9 111, Fax: (39) 011 997 9 350Toll Free Number: 00 800 234 234 00
Varian Vacuum Technologies121 Hartwell Avenue, Lexington, MA 02421, USA
Tel: (781) 861 7200, Fax: (781) 860 5437Toll Free Number: 800 882 7426
www.varianinc.com/vacuum
NEW
Pagina Varian SEM_2 UF 27-09-2006 9:49 Page 1
3Fab Equipment Bulletin October 2006 compoundsemiconductor.net
Nanoquest I Ion Beam System
The NQI is an ideal R&D platformfor Ion Beam Etch or SputterDeposition in the same system.The unique system and substratestage design allows for high-ratesubstrate cooling during etch ordeposition. The system will etchsingle wafers of 50, 75 and100 mm and can accommodate 3,5 or 8 cm Kaufman gridded ionsources.
www.intlvac.com
Intlvac
Dino DeligiannisTel: +1 905 873 0166E-mail: [email protected]
Fast, Precise, Pressure Control
The Intellysis range of throttling valvesoffer unequalled performance,providing measurable process benefitsthrough higher resolution, speed andreliability. This is due to our uniqueclosed loop motor control technologyand the high speed and fine resolutionof our motor. Direct drive motorseliminate the need for costly andunreliable gears and belts. Availablein butterfly, throttling and sealingpendulum and gate valve types witheither separate panel mount andburied box or IQ controller-on-valveoptions.
www.norcaluk.com
Nor-Cal UK
Kemble Airfield Ent ParkKemble GL7 6BA, UKTel: +44 (0)1285 771252E-mail: [email protected]
Advanced Endpoint Detector
Hiden Analytical introduce the newIMP Series Endpoint Probes for ionbeam etch processing, enablingetch endpoint determinations to astate-of-the-art 2.5 Angstrom formultiple species – in real time.Endpoints are routinely andrepetitively identified for layers to10 Angstrom – just 4 atoms – thick,and layers masked to 99%. Inter-layer diffusivity is positivelyestablished.
www.HidenAnalytical.com
Coming Soon – VapourPhase Ω
VapourPhase Ω is a new advancedmounting system for resistiveevaporation providing a real, low-cost alternative to electron beamtechnology. A high current, in vacuoswitch allows evaporation of up tofour materials while individualsource baffles reduce crosscontamination, and water coolingreduces surface degassing, bothimproving efficiency. Mounted on anISO100 flange (other sizes/types onrequest) with on-board 3 KW supply(12 A/270 V remote feed PSU), thesystem has 400 A/8 V and800 A/4 V output ranges.
www.oxford-vacuum.com
Oxford Vacuum Science
39 South Street, Middle BartonOxfordshire OX7 7BU, UKTel: +44 (0)1869 349161E-mail: [email protected]
Quality Reconditioned Process Equipment
ClassOne Equipment is a leadingsupplier of reconditionedsemiconductor process equipmentfor applications ranging fromresearch to high volumemanufacturing. We specialize infabrication and metrology equipmentincluding wet benches, maskaligners, photoresist coaters,lithography tracks, etchers, polishers,and more. Our reconditioningprocess delivers a warranted andapproved system to your facility whileachieving up to 65% cost savings. Tobrowse equipment or find out moreabout us visit our website.
www.ClassOneEquipment.com
ClassOne Equipment
Tel: +1 770 808 8708Fax: +1 770 808 8308E-mail:[email protected]
Bench-Top Furnaces
Hitech Furnaces offers an extensiverange of Diffusion Furnace Systemsfor laboratory, pilot plant and fullproduction applications, coveringwafer sizes from 2" to 200mm.Models range from bench-top singletube units as shown in thephotograph to four-stack productionunits. We also specialise in qualityreplacement elements, tubeadaptors etc for existing plant.
www.hitechfurnaces.co.uk
Hitech Furnaces Ltd
Sutton Coldfield B74 2DY, UKTel: +44 (0)121 352 1404E-mail:[email protected]
Hiden Analytical Ltd
420 Europa BoulevardWarrington WA5 7UN, UKTel: +44 (0)1925 445225Fax: +44 (0)1925 416518E-mail: [email protected]
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Spectra-G: Abatement for Nitride MOCVD
The Spectra-G system providesreliable, high-performance and cost-effective abatement of hazardousgases produced from nitride-basedMOCVD processes that use metalorganics (TmGa, TmAl and TmIn)and high flows of hydrogen (H2) andammonia (NH3). Spectra-G displaysa 4-stage combustion, an effectivepowder handling system and anintuitive control display panel.
BOC Edwards
Tel: +1 978 658 5410 orToll free 1 800 848 9800E-mail: info@ bocedwards.com
www.bocedwards.com/compsemi
Nanoquest II Load Lock Ion Beam Etch
The NQII is designed for clean roomoperation and is SEMI S2 certified.The etch module locates behind aclean room wall for ease ofservicing. The NQII is designed for100 and 150mm single wafer etchand can accommodate 14, 16, or22 cm Kaufman R.F. gridded ionsources.
www.intlvac.com
Intlvac
Dino DeligiannisTel: +1 905 873 0166E-mail: [email protected]
InfinitiCell 2000 for MBE
The InfinitiCell 2000 is the world’s firstself-calibrating metal flux evaporationsource for Molecular Beam Epitaxy(MBE) and related vacuum metaldeposition. The new patent-pendingInfinitiCell design providesreproducible growth rates and alloycompositions with ±0.1% accuracyusing our exclusive liquid metal pumpwith level sensor feedback control. Thelow mass evaporator also enablesrapid thermal flux ramping (up to±20 °C/min) for precision gradedalloy profiles or step changes in alloycompositions.
www.rjmsemi.com
Non-Contact Resistivity Measurements
The COREMA-WT from SemiMapScientific Instruments GmbHprovides non-destructive resistivitymapping of semi-insulating SiC,GaN, GaAs, InP and Cd(Zn)Tesubstrates. The system measureswafers from 50mm – 200mm indiameter with resistivities of 1E5 –1E12 Ωcm. It quickly outputs a highresolution topographic resistivityimage which contains thousands ofabsolute data points. The full wafertopogram graphically showsfluctuations in the per cent rangewith a lateral resolution better than1 mm.
www.hologenix.com
Hologenix, Inc
15301 Connector LaneHuntington BeachCA 92649, USATel: +1 714 903 5999E-mail: [email protected]
Gentle Laser Dicing System: LDS 300
The LDS 300 is Synova’s newestlaser dicing system based on itsinnovative Laser MicroJet®technology. Designed to providechipmakers with a high-speed toolusing a large working area (up to300-mm wafers), the LDS 300allows damage- and contamination-free dicing of silicon and compoundsemiconductor material. Combiningwater and laser providesoutstanding results, especially inprocessing brittle materials such asGaAs. No toxic product is emittedduring machining and chips showhigh fracture strength.
www.synova.ch
Synova SA
Tel: +41 21 694 3500E-mail: [email protected]
LEM: Laser Interferometric Camera
HORIBA Jobin Yvon has released thenew LEM camera to replace itsprevious SOFIE DigiLem. The LEMallows accurate in-situ trench depthmonitoring of a wide range ofapplications on any plasma etcherwith direct top view. The LEMincludes a state-of-the-artWindows™-based analysis softwareand provides a real-time digitalimage of the sample.
www.jobinyvon.com
HORIBA Jobin Yvon Inc
3880 Park Avenue, EdisonNJ 08820-3012, USATel: +1 732 494 8660E-mail: [email protected]
RJM Semiconductor, LLC
10 Summit Avenue, Bldg 3Berkeley Heights, NJ 07922USA (contact: Roger Malik)Tel: +1 908 790 9000Fax: +1 908 790 0800E-mail: [email protected]
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5Fab Equipment Bulletin October 2006 compoundsemiconductor.net
Oxford Instruments has developed its etching processes for key processpoints within HB LED production, available for both batch and single-wafer approaches.
Recognising the need for high-throughput processes matched by highdevice yield, the increased etch batch sizes now run to an industry-leading twenty 2" wafers for GaN, AlGaN and related materials etching.For production companies making the transition to larger diameterwafers, these equate to eight 3" or four 4" wafers. The processes run onthe Plasmalab®System133 tool, and offer superb etch uniformity andrepeatability within wafer, within batch and across batches. The samelarge batch sizes are also realised in substrate preparation etchprocesses, particularly for sapphire and SiC.
With the increasing availability of 4" substrate material for HB LEDs,alternative single-wafer cassette-to-cassette approaches are beingexplored by a number of manufacturers, and Oxford Instruments’
processes equally support these on the PlasmalabSystem100 platform.The Plasmalab process tools offer these capabilities in a format
which can be stand-alone, cassette-loading for multiple repeat waferoperations or clustered with multiples of the same or other tools.
The GaN-related and substrate etch processes are complemented byhard mask and passivation processes on the Plasmalab800Plusprocess tool, with batch capacity of forty 2" wafers (or equivalent 3" or4") for silicon dioxide and nitride deposition and etching.
As with all its processes and tools, Oxford Instruments offers service andprocess support through its ProServe™ global customer support network.
Oxford Instruments Plasma TechnologyNorth End, Yatton, Bristol BS49 4AP, UK Tel: +44 (0)1934 837000Toll free USA & Canada: +1 800 447 4717
E-mail: [email protected] � Website: www.oxford-instruments.com
Molecular Beam Epitaxy
The proven MBE technology of VGSemicon has been enhanced withthe continued development andworldwide support of OxfordInstruments. Unrivalled stability andcomposition control for III-V, II-VIand nitride MBE are assured byindustry-leading soft-action shutterdesign, ThermaCell™ sourcetechnology and the new ECell™valved effusion source.
Solutions range from the V80H for R&D, through the V90 reactor forresearch, device development and small-scale production, to theV100 fully-qualified production MBE system.
www.oxford-instruments.com
Plasma Etch and Deposition Tools
Oxford Instruments’ Plasmalab®process tools offer flexible,configurable solutions and leading-edge processes for plasma etch anddeposition in a wide range ofcompound semiconductor andsubstrate materials. Products rangefrom compact R&D systems,through batch tools and up toclustered cassette-to-cassetteplatforms for production processing.
Key processes are offered for HB LED processing in sapphire andSiC substrate preparation, through GaN, AlGaN, etc. etching to devicepassivation, with large batch and single 4” wafer solutions. Leadingprocesses are delivered for InP, InGaAsP, etc. photonic crystals, GaAsand AlGaAs VCSELs, and other key III-V applications.
www.oxford-instruments.com
Failure Analysis Dry Etch Tools
The Plasmalab®μEtch series offailure analysis tools offer dryplasma etch de-processingcapability from packaged chips upto 300 mm wafers, with selectableisotropic or anisotropic etching, highuniformity and high selectivity.
By offering dual-mode RIE and PEde-processing in a single compactsystem, the PlasmalabμEtch300 isthe process tool of choice for
300 mm failure analysis, performing multiple failure analysis stepsincluding polyimide removal, depassivation, IMD etch including low-koxides and decoration/delineation.
www.oxford-instruments.com
FlexAL™ Atomic Layer Deposition
Oxford Instruments’ FlexAL productfamily offers a unique new range offlexibility and capability in theengineering of nanoscalesemiconductor structures anddevices by combining remoteplasma ALD processes with thermalALD in a single system.
Load-locked wafer entry and full200 mm single-wafer capability addto the FlexAL tool’s ability to
support the widest range of applications via the widest availablerange of precursors and materials.
Click onto www.oxford-instruments.com/flexal for more information.
www.oxford-instruments.com
High-throughput Etch Processes for HB LEDs
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Electroluminescence Mapping on Epiwafer
MaxMile Technologies, LLC atLexington provides EpiEL mappingsystems that can performelectroluminescence mapping onany type of light-emitting epiwafer(EpiEL) without any devicefabrication. MaxMile EpiEL mappingsystems combine superiorproductivity, versatility andreliability with ease of learning andoperation. They provide theoptoelectronic research anddevelopment community andindustry with new capabilities andbetter efficiencies.
MaxMile Technologies, LLC
Lexington, SC 29072, USATel: +1 803 996 0672Fax: +1 803 996 0576E-mail: [email protected]
www.maxmiletech.com
Wafer ECV Profiler CVP21
The complete solution to measuredoping profiles in semiconductorstructures by Photo-ElectrochemicalCapacitance Voltage (ECV) profiling.Complete system: HiRel, self-calibrating, camera controlled.Complete sample range: 2*4mm –8" – only local destruction 1 or10mm2, any substrate, stackedlayers – pn. Complete resolutionrange: <1E12 – >1E21 /cm3,1nm–100μm. Complete mat range:Si, Ge, SiC, …., III/V as GaAs, InP,…, AlGaAs, InGaP, …, AlGaInP, …,Nitrides: GaN, AlGaN, AlInN, GaInN,…, II/VI as ZnO, CdTe, CdHgTe.
www.wepcontrol.com/cv-profiler
WEP – Dage EEV – Mediken
Tel: +49 7723 9197 0E-mail: [email protected]
Nanoquest III Multi-Wafer Etch System
The NQIII Ion Beam Etch System willperform automated etch of wafersusing a water-cooled planetarystage. High cooling rates areachieved by bonding wafers directlyto rotating, cooled substrateholders. The system will etch3 × 100 mm, or 3 × 150 mm wafersusing a 22cm Kaufman, R.F.gridded ion source.
www.intlvac.com
Intlvac
Dino DeligiannisTel: +1 905 873 0166E-mail: [email protected]
Cutting & Grinding of Compound Materials
Advanced diamond wire cutting andprecision grinding technologiesHigh-speed smooth cutting withDiamond-Multi-Micro-Wire-Saw,DMMWS. A multi-wire-grid ofdiamond wire results in highthroughput and smooth surfaces.Precision ultrathin grinding down to20 microns with TTV 1 my.Service contracting and sales ofmachines and clusters for Si, SiC,Al2O3, GaAs, GaN, quartz, piezo andmany other compound materials.
Exhibiting at Semicon Japan, booth of Matsubo.
www.german-my-chip.com
my-Chip Production GmbH
Prof.-Hermann-Klare-Str. 607407 Rudolstadt, GermanyTel: +49 (0)3672 478260E-mail: [email protected]
Tropel® Grazing Incidence Interferometers
Fast, accurate, easy to use. TheTropel® FlatMaster® and UltraSort™are ideal for surface form and siteanalysis for Si, SiC, GaAs, GaN, InP, LiNb and other wafers. 2" to 200 mm diameters, up to230,000 data points, 50 nmaccuracy in seconds. Manual andfully automated systems available.
www.corning.com/tropel
Corning Tropel Corporation
60 O’Connor Road, FairportNew York 14450, USATel: +1 (585) 388 3612E-mail:[email protected]
Liquid Nitrogen Transfer Equipment
SEMIFLEX® cryogenic piping forclean LN2 transfer to your use pointfor on demand supply in allSemiconductor applications.Flexible for versatile routing fromsingle or multiple use points. AllVBC vacuum jacketed pipingachieves the lowest heat loss, whilefrost and moisture problemsassociated with foam-insulated orsoft-vacuum lines are eliminated.
For information about our entirecryogenic product line visit ourwebsite.
Vacuum Barrier Corporation hasprovided 48 years of service!
www.vacuumbarrier.com
Vacuum Barrier Corporation
4 Barten Lane, WoburnMA 01801, USATel: +1 781 933 3570Fax: +1 781 932 9428E-mail:[email protected]
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7Fab Equipment Bulletin October 2006 compoundsemiconductor.net
EpiCurve® TT
EpiCurve® TT is the first in situ sensorthat combines wafer bowingmeasurements with reflectance andemissivity-corrected pyrometry,allowing an accurate online surfacetemperature measurement andgrowth rate analysis! EpiCurve® TT
can be used in single- and multi-waferreactors and even with planetaryrotation, as well as on transparentand low-reflectance substrates. Itprovides all the parameters necessaryto optimise yield and minimisebowing-related inhomogeneities inGaN LED production and many otherapplications.
www.laytec.de
LayTec GmbH
Helmholtzstr. 13–14D-10587 Berlin, GermanyTel: +49 30 39 800 80-0Fax: +49 30 39 800 80-80E-mail: [email protected]
Etch Processes for Volume Production
Surface Technology Systems offersplasma etch and depositiontechnologies including ICP etchingof compound semiconductors forboth low damage frontside and highrate backside via processing. STS’market-leading plasma sources areavailable on a full range of reliablewafer handling platforms from singlewafer systems for R&D to multi-chamber cluster tools for volumeproduction. STS has a largeinstalled base throughout America,Europe and Asia, supported by anexperienced network of regionaloffices and agents.
www.stsystems.com
Surface Technology
Systems plc
Imperial ParkNewport NP10 8UJ, UKTel: +44 (0)1633 652 400E-mail:[email protected]
NGS – Next Generation Systems
NGS lapping systems providesignificant throughputenhancements for III-V compoundsemiconductor back-thinningoperations. NGS (Next GenerationSystems) are highly automatedlapping machine systems designedspecifically to provide the increasedyields and faster throughputrequired when production volumesof especially brittle and delicatematerials such as III-V compoundsemiconductors are beingprocessed. NGS – a highly precise,fully automated production lappingsolution.
www.logitech.uk.com
Logitech Limited
Erskine Ferry RoadOld Kilpatrick, Glasgow G60 5EU, Scotland, UKTel: +44 (0)1389 875 444E-mail: [email protected]
Goodfellow for Metals and Materials
Goodfellow supplies metals andmaterials for research,development, prototyping andspecialised manufacturingoperations. Our Web Catalogue listsa comprehensive range of materialsin many forms including rods, wires,tubes and foils. There is nominimum order quantity and itemsare in stock for immediate shipmentworldwide. Custom-made items areavailable to special order.
www.goodfellow.com
Goodfellow Cambridge Ltd
Ermine Business ParkHuntingdon PE29 6WR, UKTel: +44 (0)1480 424800Fax: +44 (0)1480 424900E-mail: [email protected]
FAB EQUIPMENT BULLETINPublished as a supplement toCompound SemiconductorDirac House, Temple Back Bristol BS1 6BE, UK Tel: +44 (0)117 929 7481 Editorial fax: +44 (0)117 925 1942 Advertising fax: +44 (0)117 920 0977 Internet: compoundsemiconductor.net
ADVERTISINGAll enquiries to:Senior sales executiveDavid IddonTel: +44 (0)117 930 [email protected]
Business development managerRosemarie GuardinoTel: +1 215 627 [email protected]
© 2006 IOP Publishing Ltd
BOC Edwardswww.bocedwards.com/
compsemi 4ClassOne Equipmentwww.ClassOneEquipment.com 3
Corning Tropel Corporationwww.corning.com/tropel 6
Goodfellow Cambridge Limitedwww.goodfellow.com 7, OBC
Hiden Analytical Ltdwww.HidenAnalytical.com 3
Hitech Furnaces Ltdwww.hitechfurnaces.co.uk 3
Hologenix, Inc www.hologenix.com 4
HORIBA Jobin Yvon Inc
www.jobinyvon.com 4Intlvacwww.intlvac.com 3, 4, 6
LayTec GmbHwww.laytec.de 7
Logitech Limitedwww.logitech.uk.com 7
MaxMile Technologies, LLCwww.maxmiletech.com 6
my-Chip Production GmbHwww.german-my-chip.com 6
Nor-Cal UKwww.norcaluk.com 3
Oxford Instruments PlasmaTechnologywww.oxford-instruments.com 5
Oxford Vacuum Sciencewww.oxford-vacuum.com 3
RJM Semiconductor, LLCwww.rjmsemi.com 4
Surface Technology Systems plcwww.stsystems.com 7
Synova SAwww.synova.ch 4
Vacuum Barrier Corporationwww.vacuumbarrier.com 6
Varian Vacuum Technologieswww.varianinc.com/
vacuum IFCWEP – Dage EEV – Medikenwww.wepcontrol.com/
cv-profiler 6
Advertisers’ index
The products included in this supplement are advertised by the named companies and Fab Equipment Bulletin accepts no liability for anydamage or loss suffered by any person relating to, or resulting from, any use of any of the products. The information provided is not in any way aninvitation or recommendation by Fab Equipment Bulletin to buy any products featured.
FEBOct06Main 4/10/06 15:10 Page 7
Standard and custom made products in
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as well as many Composites and
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Tel: 0800 731 4653
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