This is information on a product in full production.

November 2013 DocID025079 Rev 1 1/16

ECMF02-2HSMX6

ESD protected common mode filter for USB3.0 interface

Datasheet - production data

Features

High common mode attenuation:

– -10 dB @ 300 MHz

– -20 dB @ 2.4 and 5 GHz

– -15 dB from 500 MHz to 6 GHz

Compliant with USB3.0 eye diagram

Small and thin package 1.5 x 1.7 x 0.5 mm

RoHS compliant.

High reduction of parasitic elements through integration.

ESD protection compliant with IEC 61000-4-2 level 4 standards (8 kV contact)

Benefits

Suppress the common mode noise but keep

signal integrity

Low PCB space consumption.

Save components count

Make the application robust against ESD strikes from external environment

Figure 1. Pin out, top view

Description

The ECMF02-2HSMX6 is a highly integrated common mode filter designed to suppress EMI/RFI common mode noise on high speed differential serial buses like the USB3.0 transceiver.

Applications

Consumer and computer electronics featuring USB3.0 such as:

Personal computer

Notebook

Tablet

Set-top boxes

PC graphic cards

Telecom application

µQFN-6L 1.7 x 1.5 mm

1

2

3

6

5

4

D+ connector

D- connector

GND To be left floating

D+ IC

D- IC

www.st.com

Functional description ECMF02-2HSMX6

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1 Functional description

The ECMF02-2HSMX6 is an ESD protected common mode filter especially designed for USB3.0 Tx/Rx differential pair, for host and device. The USB3.0 is actually made of 3 differential pairs. The first differential pair supports the high speed USB mode (also called USB2.0 mode). The 2 other differential pairs are used to support the super speed USB mode in full duplex. Bit rate on super speed USB can reach 5 Gbps. The ECMF02-2HSMX6 is able to filter the common mode noise from 300 MHz to 6 GHz, helping to make the application compliant with the electromagnetic interference emission standard such as CISPR22 or FCC part 15, or EN55022 and avoiding antenna desense on mobile phones, WiFi/Bluetooth, GPS,/GNSS frequencies. At the same time, the ECMF02-2HSMX6 keeps the high speed signal integrity and provides an efficient ESD protection.

Figure 2. Functional diagram

A typical application diagram is shown in Figure 3. ST offers a global approach to USB3.0 interface by providing a comprehensive range of dedicated products.

Figure 3. Typical application diagram

2

1

3

6

4

5

D+ connector

D- connector

GND To be left floating

D+ IC

D- IC

USB 3.0

SuperSpeedDriver

USB 2.0

HighSpeedDriver

VBUS

D+

D-

GND

SSTX+

USB 2.0

HighSpeedDriver

USB 3.0 cable

VBUS

D+

D-

GND

+

+

USB 3.0

SuperSpeedDriver

+

+

Host

SSTX -

SSRX+

SSRX -

CONNECTOR

Hub/device

SSTX+

SSTX -

SSRX+

SSRX -

CONNECTOR

D+

D- D-

GNDVBUS

GND ID

D+ D+

D- D-

GNDVBUS

GNDID

D+

D+

D- D-

GNDID

D+ 2

6 1

34

5

D+

D- D-

GNDID

D+ 2

6 1

34

5

D+

D-D-

GND ID

D+2

1

3

6

4

5

D+

D-D-

GND ID

D+2

1

3

6

4

5

ECMF02-2HSMX6

ECMF02-2HSMX6

ECMF02-2HSMX6

ECMF02-2HSMX6

ECMF02-4CMX8ECMF02-4CMX8

DocID025079 Rev 1 3/16

ECMF02-2HSMX6 Electrical Characteristics

16

2 Electrical Characteristics

Figure 4. Electrical characteristics (definitions)

Table 1. Absolute maximum ratings (limiting values)

Symbol Parameter Test conditions Value. Unit

VPPESD discharge (pins 1 and 2)

IEC 61000-4-2 level 4

Contact discharge ±8 kV

Air discharge ±15 kV

IDC Maximum DC current 100 mA

TOP Operating temperature range -40 to 85 °C

TJ Maximum junction temperature 125 °C

Tstg Storage temperature range -55 to +150 °C

Table 2. Electrical characteristics (Tamb = 25 °C)

Symbol Parameter Test conditions Min. Typ. Max. Unit

VBR Breakdown voltage IR = 1 mA 6 V

IRM Reverse leakage VRM = 3 V 100 nA

RDC DC serial resistance 7 9 Ω

Symbol ParameterV = Breakdown voltage

I = Leakage current @ V

V = Stand-off voltage

V = Clamping voltage at IPP

I = Peak pulse current

BR

RM RM

RM

CL

PP V

I

VCL VBR VRM

IF

VF

II

RM

R

IPP

I = Forward currentF

V = Forward voltageF

Electrical Characteristics ECMF02-2HSMX6

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Figure 5 shows that USB3.0 devices and cables can interfere with radio frequency devices operating between 700 MHz and 5 GHz.

Figure 5. USB3.0 frequency radiation measured with current loop

Figure 6. Differential attenuation versus frequency

-100

-95

-90

-85

-80

-75

-70

0 0,5 1 1,5 2 2,5 3 3,5 4 4,5 5 5,5 6

Frequency (GHz)

Skew

dB

10M 30M 100M 300M 1G 3G

-5

-4

-3

-2

-1

0SDD21 (dB)

F0 @-3 dB = 3.2 GHz

F (Hz)

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ECMF02-2HSMX6 Electrical Characteristics

16

Figure 7. Common mode attenuation versus frequency

Note: STMicroelectronics has defined the USB3.0 SCC21 template to prevent antenna desense between 700 MHz and 5 GHz.

Figure 8. Return loss versus frequency (Z0 COM = 50 Ω - SDD11)

10M 30M 100M 300M 1G 3G

-40

-35

-30

-25

-20

-15

-10

-5

0

SCC21 (dB)

F (Hz)

USB3.0 S21CC template

10M 30M 100M 300M 1G 3G

-40

-35

-30

-25

-20

-15

-10

-5

0

SDD11 (dB)

F (Hz)

Electrical Characteristics ECMF02-2HSMX6

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Figure 9. Return loss versus frequency (Z0 COM = 50 Ω - SDD22)

10M 30M 100M 300M 1G 3G

-40

-35

-30

-25

-20

-15

-10

-5

0

SDD22 (dB)

F (Hz)

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ECMF02-2HSMX6 Electrical Characteristics

16

Figure 10. Typical ESD response to IEC 61000-4-2 +8kV contact

Figure 11. Typical ESD response to IEC 61000-4-2 -8kV contact

10 V/div

20 ns/div

V : ESD peak voltagePP

V :clamping voltage @ 30 nsCL

V :clamping voltage @ 60 nsCL

V :clamping voltage @ 100 nsCL

1234

56.4 V

26.8 V19.0 V

12.5 V

1

24

3

10 V/div

-60.2 V

-16.0 V

-9.9 V -6.4 V

20 ns/div

1

2

4

V : ESD peak voltagePP

V :clamping voltage @ 30 nsCL

V :clamping voltage @ 60 nsCL

V :clamping voltage @ 100 nsCL

1234

3

Electrical Characteristics ECMF02-2HSMX6

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Figure 12. USB2.0 (480 Mbps) eye diagram without device

Figure 13. USB2.0 (480 Mbps) eye diagram with device

Figure 14. USB3.0 (5 Gbps) eye diagram without device

Figure 15. USB3.0 (5 Gbps) eye diagram with device

Figure 16. USB3.1 (10 Gbps) eye diagram without device

Figure 17. USB3.1 (10 Gbps) eye diagram with device

DocID025079 Rev 1 9/16

ECMF02-2HSMX6 Electrical Characteristics

16

Figure 18. MHL (4.5 Gbps) eye diagram without device

Figure 19. MHL (4.5 Gbps) eye diagram with device

Figure 20. MHL (6 Gbps) eye diagram without device

Figure 21. MHL (6 Gbps) eye diagram with device

Figure 22. Display Port HBR2 (5.4 Gbps) eye diagram without device

Figure 23. Display Port HBR2 (5.4 Gbps) eye diagram with device

Package information ECMF02-2HSMX6

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3 Package information

Epoxy meets UL94, V0

Lead-free package

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.

Figure 24. µQFN-6L dimension definitions

Table 3. µQFN-6L dimension values

Ref.

Dimensions

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

A 0.45 0.50 0.55 0.018 0.020 0.022

A1 0.00 0.02 0.05 0.000 0.001 0.002

b 0.15 0.20 0.25 0.006 0.008 0.010

D 1.55 1.60 1.65 0.061 0.063 0.065

E 1.30 1.35 1.40 0.051 0.053 0.055

e 0.45 0.50 0.55 0.018 0.020 0.022

L1 0.35 0.45 0.55 0.014 0.018 0.022

L2 0.65 0.75 0.85 0.026 0.030 0.034

D

Index area

Top view

Side view

Bottom view

E

A

e

L2

L1

b

A1

PIN # 1 ID

1

6

3

4

DocID025079 Rev 1 11/16

ECMF02-2HSMX6 Package information

16

Figure 27. Tape and reel specifications

Figure 25. Footprint, dimensions in mm (inches)

Figure 26. Marking

0.25(0.0098)

0.50(0.0197)

0.3

0(0

.0118)

0.9

5(0

.0374)

0.6

5(0

.0256)

x

y

x

w

z

w

Dot,

xx = markingz = manufacturing locationyww = datecode

(y = yearww = week)

Dot identifying Pin A1 location

User direction of unreelingAll dimensions are typical values in mm

4.0

4.0

2.0

8.0

1.7

53.5

Ø 1.55

0.75 1.63

0.22

1.8

5

xxxyww

xxxyww

xxxyww

Recommendation on PCB assembly ECMF02-2HSMX6

12/16 DocID025079 Rev 1

4 Recommendation on PCB assembly

4.1 Stencil opening design

1. General recommendation on stencil opening design

a) Stencil opening dimensions: L (Length), W (Width), T (Thickness).

Figure 28. Stencil opening dimensions

b) General design rule

Stencil thickness (T) = 75 ~ 125 µm

2. Reference design

a) Stencil opening thickness: 100 µm

b) Stencil opening for leads: Opening to footprint ratio is 90%.

4.2 Solder paste

1. Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004.

2. “No clean” solder paste recommended.

3. Offers a high tack force to resist component displacement during PCB movement.

4. Use solder paste with fine particles: powder particle size 20-45 µm.

L

TW

Aspect Ratio WT----- 1,5=

Aspect AreaL W

2T L W+ ---------------------------- 0,66=

DocID025079 Rev 1 13/16

ECMF02-2HSMX6 Recommendation on PCB assembly

16

Figure 29. Recommended stencil window position

4.3 Placement

1. Manual positioning is not recommended.

2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering.

3. Standard tolerance of ± 0.05 mm is recommended.

4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short. Too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages.

5. To improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool.

6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools.

4.4 PCB design preference

1. To control the solder paste amount, the closed via is recommended instead of open vias.

2. The position of tracks and open vias in the solder area should be well balanced. The symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away.

0.25(0.0098)

0.50(0.0197)

0.3

0(0

.0118)

0.9

5(0

.0374)

0.6

5(0

.0256)

0.3

4(0

.0134)

0.9

0(0

.0354)

0.6

2(0

.0244)

0.24(0.0095)

0.50(0.0197)

mm(inches)

Stencil window

Footprint

Recommendation on PCB assembly ECMF02-2HSMX6

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4.5 Reflow profile

Figure 30. ST ECOPACK® recommended soldering reflow profile for PCB mounting

Note: Minimize air convection currents in the reflow oven to avoid component movement.

4.6 PCB layout recommendation

Figure 31. PCB footprint recommendation

250

0

50

100

150

200

240210180150120906030 300270

-6 °C/s

240-245 °C

2 - 3 °C/s

Temperature (°C)-2 °C/s

-3 °C/s

Time (s)

0.9 °C/s

60 sec(90 max)

Zdiff according to the application

Via to GND plane

DocID025079 Rev 1 15/16

ECMF02-2HSMX6 Ordering information

16

5 Ordering information

Figure 32. Ordering information scheme

6 Revision history

Table 4. Ordering information

Order code Marking Package Weight Base qty Delivery mode

ECMF02-2HSMX6 KR µQFN-6L 3.4 mg 3000 Tape and reel

ECMF 02 - 2 HS MX6

FunctionESD common mode filter

Number of lines02 = 2 lines

Number of ESD protected lines

2 = 2 ESD protected lines

VersionHS = High speed lines

PackageMx6 = µQFN-6L

Table 5. Document revision history

Date Revision Changes

13-Nov-2013 1 Initial release.

ECMF02-2HSMX6

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