EMS_ENG_Capabilities Dec 2015

E-M Solutions - Engineering Capabilities

18th December 2015

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TTM manufacture wide range of products

PCBA

for all sectors

Level 1

Motion Control

Products

Level 4/5

Telecom

Enclosures

Level 3/4

Telecom

Sub-rack

Level 2/3/4

Wind Energy

Products

Level 4/5

BPA

for all sectors

Level 1

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Facilities

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Backplane / Midplane PCBA Integration & Test Custom Metal

SZ E-MS Shenzhen

Location Product Type Specialty

Backplane / Midplane Assembly

Networking & Communications Products

Fully integrated complex products

Industrial/Telecom/Aerospace/ Computer & Datacom Renewable Energy / Motion Control

Design Center

PCBA & System Integration

Automotive /Industrial/Computer & Datacom/Telecom

Facility

Shanghai SH BPA

Shanghai SH E-MS

P P P

P P P P

P P P P

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E-M Solutions Facilities – Shanghai (China)

Core Competency

• Design and Manufacture of Electro

Mechanical & Enclosure Solutions

• Prototyping Center of Excellence

• Precision Metal Fabrication

• Printed Circuit Board Assembly

• Backplane/Midplane Assembly

• Full System Integration & System Test

• Extensive design capability

• Extensive value engineering capability

• Proven NPI Capability/Process

Key Data

• 365,000 square feet

• Around 700 Employees

• Advanced Equipment

• High Performance Coating & Painting

Line

• Customer-tailored Assembly Lines

• Large Format SMT Lines

• High Speed Continuous Flow SMT

Lines

• ICT & FCT Test

• High Voltage Cabinet Burn-In Test

• RoHS Compatible and Compliance

Certifications

• ISO 9001

• ISO 14001

• TL9000 (QMS Telecom)

• ISO 13485 (QMS Medical)

• AS 9100 (QMS Aerospace)

• Nadcap (National Aerospace and Defense

Contractors Accreditation Program)

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Product Mix FY2014

Backplane/Midplane Assembly*

PCBA*

Systems Integration/Custom Metal

10.6%

12.4%

77%

* BPA & PCBA listed does not include those products counted under Systems Integration/Custom Metal

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Core Customers in Diverse Markets - Shanghai

Telecom

Industrial, Instrumentation & Medical

Aerospace

Computer & Datacom

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http://www.gerbertechnology.com/

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E-M Solutions Facilities – Shenzhen (China)

Core Competency

• Design and Manufacture of Electro

mechanical & enclosure solutions

• Prototyping Expertise

• Assembly of Metal Enclosure

• Full System Integration & System Test

• Printed Circuit Board Assembly

• Backplane/Midplane Assembly

• Value Engineering Capabilities

• Proven NPI Capability/Process

Key Data

• 316,000 square feet

• 500 Employees

• Advanced Equipment

• High Performance Coating & Painting

Line

• Customer-tailored Assembly Line

• High Speed Continuous Flow SMT

Lines

• ICT & FCT Test

• RoHS Compatible and Compliance

Certifications

• ISO 9001

• ISO 14001

• TL9000 (QMS Telecom)

• ISO/TS 16949 (QMS Automotive)

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Product Mix FY2014

Backplane/Midplane Assembly*

PCBA*

Systems Integration/Custom Metal

Bus Bars

Will have Growth in 2015

67%

25%

8%

* BPA & PCBA listed does not include those products counted under Systems Integration/Custom Metal

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Core Customers in Diverse Markets - Shenzhen

Telecom

Industrial, Instrumentation & Medical

Computer & Datacom

Automotive

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http://www.huawei.com/en/index.htm

mailto:[email protected]

http://www.ghsp.com/

http://www.sensity.com/

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Strategy and Vision

TTM Strategy:

• To focus on complex low to medium volume products.

• Utilize our full capability, design, VE, DFM

• Engage early and help with product development, influencing: design, material selection,

component selection and process methods

• Work with customers to identify vertical integration opportunities that could drive down their

product costs

• Continually review and update our factory layout to support our customers

• Support an efficient and reactive NPI and sample build process

TTM Vision:

• Increase our integration and testing capabilities

• Optimize and refine our internal processes to deliver the most cost effective products

• Additional investment in to TTM Shenzhen Automotive production lines to further strengthen

its position as a world class Automotive PCBA supplier

• To further expand our TTM Shanghai Aeronautical customer base using our Nadcap Welding

and PCBA approval to help achieve this goal

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Capabilities

Design &

Engineering BPA/PCBA Custom

Metal Busbars Integration/

Test

• Mechanical/Electrical/

Thermal Design

• Specifications

• Verifications

• Work Instructions

• DFM

• Value Engineering

• NPI

• Packaging

• Press Fit

• SMT

• Through Hole

• Large Format

• High Mix

• Low Volume

• Enclosures

• Indoor/Outdoor

• Robotic Welding

• Punch

• Press

• Grinding

• Powder Paint

• Turret Punch

• Bar Punch

• Water Jet

• Deburr

• Hardness Test

• Conductivity

• Subrack &

Enclosure Level

• Backplanes

• PCBA

• Cables/Harness

• Point to Point Wiring

• Busbars

• Power Components

• Heat Exchangers

• Liquid Cooling

Systems

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BPA & PCBA

Busbar Manufacture Design & Value

Engineering

Sheet-metal Manufacture

& Fabrication

Sub-assembly and Test

Integration -“Under One Roof Model” Value Proposition

Low-cost region supply Chain

Power Supply & Thermal

Management Systems

Systems Integration

& Test

One supplier, PN & PO

Reduced margin stack up

Reduced logistic costs

Reduced lead-time

Lowest Cost Model

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Integration – “Vertical Model” Cost Benefits

Complexity

Potential Cost

Saving

Level 1: BPA

or PCBA

Level 5: Metal work

fully integrated and tested

and ready to deliver direct

to site

Level 3: Metal

work integrated with,

cables, BPA, Fan

tray, etc .

Level 2: Metal

work and simple

electro-mechanical

items

Level 4: Metal

work with BPA and

cards fitted and

functional testing

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Printed Circuit Board Assembly

• ISO/TS 16949 programs

• RoHS SMT Process

• Automated Solder Paste

Inspection

• RoHS Wave Solder

• Selective Wave Soldering

• Conformal coating

process

• ICT with Teradyn &

Agilent 3070 & MDA

Test Platforms

• Test Jet

• Boundary Scan

• 3D X-Ray

• AOI

• Functional test

• Aqueous Wash

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SPI (MIRTEC- MS11)

SMT (FUJI XPF-W)

AOI (VCTA-B586)

Wave Solder (Speed Line Electra 24 )

ICT (Agilent 3070)

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Backplane Assembly • Max. size with Press fit:

36"x48"x0.45“

• Max. size with Through Hole Solder: 24"x48"x0.20"

• Smallest component for SMT: 0402

• Largest component for SMT: QFP400S

• RoHS Lead free process

• Placement speed: 1.5sec (Quad)

• Press speed: 9sec (AEP-12T), 12sec (MEP-6T)

• Continuity/isolation test

• TTI tester to support volume production. (Max test nodes 44160)

• ROBAT S1 tester for low volume/Prototype Support

• 3D X-Ray (TR7680) Max. size 24"x40"

• Max. size with SMT 24"x44"x0.40“

• Support latest connector systems: Xcede, VHDM, Power connector, TE Connectivity STRADA Whisper, etc.

• Fixture design and press tooling design

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Reflow (JT AS-1000X-N) Solder Paste (SMT GKG)

Press-Fit (CAPI 6T ) Electrical Testing (RoBAT S1)

X-Ray (TR7680)

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Custom Metal

• Fabrication using wide range of sheet materials (Aluminium, Stainless Steel, Zintec etc.). Typical thickness range 0.75mm to 3.2mm

• Experienced in various jointing techniques (Welding, Riveting and Spot Welding)

• In-house pretreatment and powder painting at all facilities with handling of component up to 2400mm(L) x 1400mm(H) x 800mm(W)

• Busbar fabrication from Copper, Nickel and Mild Steel

• The ability to handle large enclosures/assemblies

• Extensive equipment portfolio including: Robot welding, Laser cutting, CNC Water Jet cutting, NCT punch, MIG/TIG and Spot welding etc.

• Close collaboration with trusted external suppliers for structural steel assemblies

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8 Stage Paint Line

CNC Waterjet Machine

CNC Punching/Cropping

Robot Welding

Finn-Power Turret Punch

Laser Cutting

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Integration

• Electro Mechanical

• Subrack (Shelf) Assembly

• Cabinet Level (Indoor/Outdoor)

• Backplanes

• PCBA

• Cables/Harness

• Point to Point Wiring

• Bus bars (Large/Small/Laminated)

• Power Components/Controls

• Heat Exchangers

• IGBT Modules

• Liquid/Refrigerant Cooling Systems

• Full System Level Integration

• Large format heavy assemblies

• Motion Control equipment

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Wind Energy Down Tower Integration

Motion Control Component Assembly

Wind Turbine Nacelle Assembly

Electrical Panel Integration

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Test

Complete Scope of Testing

• PCBA Testing

• In Circuit Test

• Functional Test

• Systems Level Test to Include

Advanced Burn-In

Special Testing

• IGBT Modules

• Pressure Testing

• Hi Pot Testing

• HALT/HASS/ESS – Shanghai

& Shenzhen

• Helium leakage testing -

Shenzhen

Compliance

• Water Testing Chamber

(IPX5) –Shanghai

• In-house Salt Spray testing –

Shanghai & Shenzhen

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Burn-In Test Functional

test

ESS Test Chamber Cooling systems hydraulic pressure test

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Process tools – Visual Factory

What is Visual Factory?

• Visual Factory is a software application that provides real time, Electronic Work Instructions so that products are built right first time every time. These instruction being viewed and interactively followed by operators via work station screens located on assembly line

• Electronic work instructions provide step by step instructions incorporating all the required information: components, tools, checks, warnings, pictures, drawings, videos e.t.c

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What benefits has visual factory provided TTM?

• Ensured process adherence that in turn has driven increased productivity and reduced errors

• Provided real time visibility of current status and issues

• Operators can change work stations quickly and effectively without time consuming training allowing more effective use of resource


What long term benefits will visual factory provide?

• Significantly improve the transfer process of product between our SH, JZ and SZ facilities

• Allow our Customer Focus teams to effectively monitor (Dashboard) production issues and address in a timely manner

• Identify weakness in existing processes by providing detailed manufacturing records

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Design & Engineering

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Design Guidance /Recommendations • Design for Manufacture • Design for Test • Value Engineering • Materials • RoHS/WEEE • Localization

Engineering • Mechanical

(Solidworks/ProE) • Thermal • Industrial • Process • Test • Tried & Tested NPI

process

Detailed Design Concept Design

Before After

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Design & Engineering

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Approvals • Safety (UL/CE/CCC) • EMC • Shock Vibration • Ingress Protection • Global Standards (UL, IEC,

Bellcore, ETSI, IEEE, EN)

FEA Analysis In-House Storm Test

NEMA 3R Ice Test

Zone 4 Earthquake

Design Verification

• Design FMEA

• Process FMEA

• FEA (Pro/Mechanica)

• In-House Verification (IP/Corrosion)

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New Product Introduction (NPI)

• Formal and controlled NPI process ‘Tollgate process’

• Transparent prototype manufacturing processes and tools

• Project teams are assigned to every project

• Every team is lead by an appointed Project Manager and Program Manager. The

Program Manager being the daily key contact point supporting the customer

• Key focuses during project implementations are achieving quality product at or below

target costs

• Deliverables within NPI:

– Project plan complete with timeline

– Tollgates pre-defined for management review

– Customer approval points

• NPI is the TTM differentiator

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New Product Introduction (NPI)

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Process

Start

Key Output Report/Document

Enquiry

Tollgate 0 review

Sales

Customer enquiry

New Business Opportunity

Executive team

Key timescale

Risk analysis

Commercial terms

Sales

BID prepare BU

BU

Sales conditions

Tollgate 1 review

Quality requirement

Price for prototyping

Contract review and appraisal

Technical agreement

Corporate approval

Detail quotation & review

Tollgate 2 review Sales Milestone 1

Project responsibility

Process Key Output Report/Document

Milestone 2

Milestone 3

Tollgate 3 review

Tollgate 4 review

Quality control plan

Kick off meeting

Project develop planning

Product CTQ matrix

Action plan for ISIR

Sample building

Sample evaluation meeting

Localization and cost reduction proposal

Milestone 1

Customer sample approval

Receive PP order

PP technical preparation check list

Approval to proceed to pre-production

Milestone 2

PP evaluation meeting

BOM verified in Oracle

Approval to proceed to mass production

Project completed

PM/Eng

PM/Eng

Project responsibility

Related statements

PM/Eng

PM/Eng

PM/Eng

PM/Eng

PM/Eng

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Cross-functional Teams

Customer

Program Manager

The Leader of “CFT”

Customer Focus Team

Material

Planning

Procurement

Manufacturing Engineering Logistics Customer

Service Quotation

Finance IT

Human

Resource Administration

Supplier Quality

Control

New Product

Introduction

Indirect Support

Direct Support

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Automotive Capability - Shenzhen Our customers see TTM as a key PCBA supplier to the Automotive industry for number of reasons:

• TTM is the 2nd largest Automotive PCB supplier in the world,

• Tremendous knowledge and experience in high reliability and mission critical PCB’s.

• The Shenzhen operation has been TS 16949 certified since May 2003.

• Manufacturing the PCB’s as well as assembling the PCBA facilitates higher quality, improves delivery, and results in a leaner supply chain.

• TTM works with industry leading OEM, Tier I & II Automotive customers.

• Extensive sheet metal and assembly facilities that allow our customers to gain the benefits of additional vertical integration.

• We have invested in the latest PCBA manufacturing and test equipment that will further improve our lead times, costs and quality performance

.

• Implemented a Manufacturing Execution System (MES) that provides full traceability to the component level.

• TTM can also support our customers with the fabrication and supply of Automotive bus bars.

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Control Module

Intelligent Key Board

Reversing System Control Board

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Automotive Quality Management System

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TS 5 Core Tools:

• APQP: Advance product quality planning

• PPAP: Production parts approval process

• PFMEA: Process Failure Mode and Effects Analysis

• SPC: Statistical Process Control

• MSA : Measurement System Analysis

APQP PPAP

PFD PFMEA CONTROL PLAN WI

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Automotive Capability – SMT Production Line Overview

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Auto PCB Loader

Solder Paste Dispenser

3D Solder Paste

Inspection Pick and Place

2D AOI Reflow Oven 3D AOI QC

• All equipment and processes controlled to Cpk>1.67

• Each process is linked to MES system for full traceability

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Automotive Capability – Sample Assembly Process Overview

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SMT X-Ray Wave Solder X-Ray

Aqueous Wash ICT Conformal

Coat Assembly

Selective Wave Soldering

Functional Test Packaging Shipping

• All equipment and processes controlled to Cpk>1.67

• Each process is linked to MES system for full traceability

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Top Level Assembly

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• Volume production and

test.

• Minimal operator

handling.

• Each station is connected

to the MES system.

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Automotive Capability – Key Equipment

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NXT Pick and Place Wave Solder Selective Wave

Aqueous Wash HP3070 ICT Conformal

Coating

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Automotive Capability – Key Process Control Equipment

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3D SPI 2D AOI 3D AOI

3D X-Ray Conformal Coat AOI C3 Tester

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Why Work with TTM Shenzhen for your next automotive project?

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• Financially Strong Company.

• Second largest automotive PCB supplier in the world.

• Over 20 Years of leadership and experience in high reliability and mission

critical Automotive PCB’s /Assemblies.

• TTM is both printed circuit board and assembly supplier.

– Leaner Supply Chain.

– Quick resolution to technical issues.

– Simplifies supply chain.

– TTM PCB factory has over 13 years of experience and thousands of

hours of test around CAF and Heavy Copper.

• Higher Level Integration

• TS 16949 Certified since 2003.

• Six Sigma and Lean Sigma Quality Principles in practice.

• Dedicated EMS Program Management team.

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Product Examples

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Industrial Sector (Energy Storage) - Battery Enclosure

Product Description

• Enclosure for housing 1MW of battery backup, including Battery Backup cabinet and Power Interface cabinet

• Battery cabinet size 3.8m(W) x 2.3m (D) x 2.3m (H), fully integrated shipping weight with batteries 16,500kg

• Global product meeting IEEE wind driven rain requirements and Zone 4 Earthquake compliant

Program Highlights

• Original design and manufacture based on customers detailed specifications.

• Design of thermal management systems including hot air exhaust system for safe rejection of 300 oC hot air exhaust from batteries

• In-house pre-verification including IEEE wind driven rain testing and FEA studies.

• Integration of battery electrical system for supporting battery discharge and recharge (Busbars, Heavy duty cabling, communications cabling, monitoring instrumentation and AC/DC power distribution components

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Automotive Sector - Power Control Modules

Product Description

• Battery Management System

• BMS is an important link to connect the vehicle power battery and electric vehicle, its main functions include: battery physical parameters real-time monitoring; battery state estimation; online diagnosis and early warning; charging, discharging and pre charge control

Program Highlights

• There are 3 different variations in mass production.

• Vertical supply chain model. TTM manufactures the PCB, PCBA, Sheet Metal housing , and performs final assembly and test

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Industrial Sector (Monitoring) - Gas Level Monitor

Product Description

• Remote telemetry unit for measuring gas levels in gas storage tanks and communicating this info via M2M to central back office

• Global product UL50E and UL 61010 (Electrical Equipment for Measurement, Control and Laboratory use) approved

Program Highlights

• Value engineering of boxed solution with TTM manufactured PCBA.

• DFM evaluation and recommendations for PCBA

• ICT and Functional testing

• Management of the FCC and UL approval process, opening up the North America Market

• Perpetration of technical construction file to support UL approval

• Logistics management of direct shipping of product to global locations

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Medical Sector (MR Medical Equip) - Enclosures Suite

Product Description

• Suite of enclosures for housing Power, RF Amplifier and control/monitoring equipment for MRI Scanners

• Indoor enclosures meeting IP20 and providing 19” and 30” mounting facility as per EIA-310-D

• Enclosures provide EMI shielding of internal equipment

Program Highlights

• TTM Developing detailed specifications for each enclosure in suite from customers one page high level requirements document, and from these specification Suite of cabinets designed

• Providing guidance to customer on regulatory requirements relating to electronic enclosures

• Additional subassemblies (e.g. fan trays/PDU’s) manufactured and integrated as part of TTM vertical integration model

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Industrial (Renewable Energy) -Wind Conversion

Product Description

• Complete 1.6MW down tower Wind Turbine control system

• Dimensions & Weight = 2.2M (W) x 0.9M (D) x 2.15M (H), weight 1.3T

• Global product meeting all required international specifications.

Program Highlights

• Metal fabrication / high level integration including IGBT’s, Transformers , Capacitors, bus-bars (in-house manufacture), electrical controls, electrical components, liquid and air to air cooling systems

• Total cost reduction from initial samples to volume production 25%

• Enabled the design to incorporate 3 different parts of down tower control system into a single product

• Product ramped to volume production within 4 months of initial sample delivery

• Full testing in-house including 14 hour burn in testing

• Ships direct to installation site from TTM Shanghai

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Product Description

• Electronic enclosures to control, monitor and distribute power generated by the turbine system

• Global applications to all UL and environmental legislation

• Nacelle assembly inclusive of generator, hydraulics, pitch and break systems

Program Highlights

• Helped developed the electronic enclosures with customer

• Assisted with UL certification and approval process.

• Manufactured the key electronic modules, PCBA’s, etc.

• Developed a process to assembly and test the Nacelle Assembly

• Introduced full functional and burn in testing inclusive of system run-in

• Helped develop the packaging and logistical process.

• Ran DFM and CR programs to reduce enclosure price by 30%

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Industrial (Power Generation) – Turbine Control Panel

Product Description

• Major part of control system for Aero engine derivative power station

• Dimensions & Weight = 2.5M (W) x 0.9M (D) x 2.15M (H), weight 1T

Program Highlights

• Metal fabrication and high level system integration including controllers

• 300 to 400 integration man hours per unit, assembled by skilled assembly technicians

• Assembled from Customer wiring diagrams as configuration is different for each unit

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Industrial (Power Generation) – Turbine Control Panel

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Aerospace (Land based Enclosures) – Equip Consoles

Product Description

• Ground based test system suites for testing parts and assemblies for the new China C919 commercial aircraft.

• Dimensions = 2.2M (H) x 1.0M (D) x up to 1.6M (W)

Program Highlights

• Manufactured in our AS 9100 compliant Shanghai operation

• Designed from testing and test equipment requirements to house both test equipment and units under test

• Metal fabrication, power distribution, 19” equipment mounting, cable management, LED lighting

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Industrial(Motion Control)-CNC Fabric Cutter/Spreader

Product Description

• Cutter :Dimensions / Weight = Max 2.2M (W) x 0.8M (H) x Max 4.2M (D), Max weight 4T

• Cutter: High ply (up to 150 layers of fabric) and Low ply (up to 20 layers of fabric) variants in 3 different machine widths.

• Spreader: Dimensions / Weight = Max 2.6M (W) x Max 1.2M (H) x 1.2M (D), weight Max 800kg

• Spreader: 2 size variants to take 125kg and 50kg rolls of fabric and 5 width variants from 1.6M to 2.6M wide

Program Highlights

• Cutter is high level integrated product including vacuum conveyor table, X & Y axis control, 45HP motor driving vacuum, multipurpose cutting head, complete control system

• Cutter has more than 100 additional options including drills, dust collection systems, large format display screens, lateral drive systems

• Helped customer to implement complete system re-design and update to standardize parts across a range of machines

• Complete localization of product reducing cost by ~20%

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Product Description

• Make to print Outdoor Enclosure for housing various wireline equipment and battery backup, that enables

digital services to be provided to business and residential subscribers

• Enclosure Size: 1000mm (W) x 550mm (D) x 1200mm (H)

Program Highlights

• Welded aluminum cabinet with powder paint

• Integration of fan modules, heat exchanger, cabling, power distribution, batteries, MDF and ISAM subrack

• 22 items of electrical testing and random sample water testing

• ISAM subrack metalwork made by TTM Shanghai

• ISAM PCBA’s made by TTM Shanghai 53

Telecom (Wireline) – Outdoor Enclosure

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In-Depth Equipment Review

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PCBA – Typical Process Flow

Solder paste printing

Solder paste Inspection

Pick & place

Reflow AOI/X-ray Wave soldering

ICT/X-ray Conformal

Coating Functional Test

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PCBA – Capacity

Description SH SZ

In-Line SMT lines 3 6

Max Board Size 600mmx600mm(23”x23”) 686mmx508mm(27”x20”)

Min Board Size 80mmx85mm(3.1”x3.3”) 51mmx51mm(2”x2”)

Min Component Size 01005 01005

Max Component Size 50mmx50mmx25.4mm 150mmx45mmx25.4mm

PCB Thickness 6.5mm 6.5mm

BGA Placement 0.3mm 0.3mm

Lead Free Compatible Yes Yes

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NOTE: In-Line SMT lines can also be used for smaller format BPA

FUJICP6-

Shanghai FUJI NXT - Shenzhen

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PCBA – Solder Paste

CAPABILITY SH SZ

Solder Paste Machines (In-Line) 2 6

Max Board Size 600mm x 600mm (24”x24”)

609mm x508mm

(24”x20”)

Min Board Size 80mmx85mm

(3.1”x3.3”)

50.8mm x 50.8mm

(2” x 2”)

DESEN168 - Shanghai MPM Momentum - Shenzhen

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PCBA – SPI

CAPABILITY SZ

Solder Paste inspect (In-Line) MIRTEC- MS11

Max Board Size 510mm x460mm

(20”x18”)

Min Board Size 50.8mm x 50.8mm

(2” x 2”)

MIRTEC MS11 - Shenzhen

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PCBA – Pick & Place CAPABILITY SH SZ



Min Board Size 50mmx50mm(1.96”x1.96”) 51mmx51mm(2”x2”)

Min Component Size 01005 01005

Max Component Size 150mmx45mmx25.4mm 150mmx45mmx25.4mm

PCB Thickness 6.5mm 6.5mm

BGA Placement 0.3mm 0.3mm

NOTE: In-Line SMT lines can also be used for smaller format BPA

JUKI FX-3RAXL -Shanghai

FUJI XPF-W –

Shenzhen

–

Shanghai 59

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PCBA – Reflow

CAPABILITY SH SZ

Reflow Machines 2 6

Max Board width 600mm 457mm(18”)

Transmission speed 0.3to 2m/min 0.25 to 1.5m/min

JT AS-1000X-N- Shanghai BTU-P150 -

Shenzhen

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PCBA – AOI

CAPABILITY SH SZ

Equipment TR-7500EL & VCTA A480 Orbotech VT9300 & VCTA-586

Max Board Size 1030mmx610mm(40.5”x24”) 550mmx450mm(22”x18”)

VCTA-586 - Shenzhen TR-7500EL - Shanghai

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PCBA – X-Ray

OMRON X-700 - Shenzhen

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CAPABILITY SH SZ

Equipment TR1 TR-7680 OMRON X-700

Max Board Size 1000mm x 610mm 330mmx255mm(12”x10”)

Resolution 10/15/20um 10/15/20/25/30um

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PCBA – Wave Soldering

CAPABILITYE SH SZ

Wave Soldering Machines 2 5

Selective Wave Solder Machine 1 2

ROHs compatible (lead free) Yes Yes

Non-ROHs compatible (SnPb Solder) Yes Yes

Flux Type Yes Yes


Speed Line Electra 24 -

Shanghai

JT 610W/S -

Shenzhen

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PCBA – ICT

CAPABILITY SH SZ

TTI 3400 Yes Yes

Agilent 3070 Yes Yes

Teradyne Spectrum 8852 Yes no

SPEA 4040 Flying Probe no Yes

GenRad 2286i no Yes

Max number of test points Unlimited 44,160

SPEA 4040 - Shenzhen 3070 Agilent-Shanghai

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PCBA – Conformal Coating

CAPABILITY SH SZ

Conformal Coating Machines 1 1

Inline Yes Yes

Cure Type UV Hot Air

Max Board Size 600mmx440mm 459mmx459mm

PVA - Shenzhen SL-940E - Shanghai

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BPA – Typical Process Flow

Solder Paste Printing

Pick & place Reflow

ICT Pre-loading Auto press

Electrical Test X-ray inspection AOI

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BPA – Solder Paste

CAPABILITY SH SZ

Solder Paste Machines 1 6

Max Board Size 1200mmX800mm (47”X31”) 609mm x508mm

(24”x20”)

Min Board Size 50mm x 170mm

(2” x 7”)

50.8mm x 50.8mm

(2” x 2”)

SMT GKG-Shanghai

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MPM Momentum - Shenzhen

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BPA – Pick & Place CAPABILITY SH SZ

Batch SMT Lines 1 N/A


Max Board Size (Batch SMT Lines) 914mmx609mm 686mmx508mm(27”x20”)

Min Board Size 70mmx50mm 51mmx51mm(2”x2”)

Min Component Size (In-Line SMT Lines) 01005 01005

Max Component Size 156mmx56mmx15mm 150mmx45mmx25.4mm

PCB Thickness 0.8 -12.5mm 6.5mm

BGA Placement 0.16mm(pitch) 0.3mm

MY100e -14 T6 Placer -

Shanghai

NOTE: Batch processing is used for large oversized backplanes

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BPA – Reflow

CAPABILITY SH SZ

Reflow Machines 1 6

Max Board width 600mm(23.6”) 457mm(18”)

Transmission speed 0.35 to 1.5m/min 0.25 to 1.5m/min

Reflow Oven - Shanghai

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BPA – ICT

CAPABILITY SH SZ

Agilent 3070 Yes Yes

Teradyne Spectrum 8852 Yes No

Max number of test points 44,160 53,248

Spectrum 8852 - Shanghai Agilent 3070 - Shanghai

70

71

BPA – Press

CAPABILITY SH SZ

Number of 12 Ton Presses 2 0

Number of 6 Ton Presses 2 3 (CAPI *1 + MEP * 2)

Number of Manual Arbor Presses 3 3

MEP 6T -

Shanghai

NOTE: The attached XL details connector experience

CAPI 6T -

Shenzhen

71

72

BPA – Electrical Test

CAPABILITY SH SZ

Robat S1 (flying probe + AOI) Yes No

TTI 3400 Yes No

Testronics 402LV No Yes

Teradyne Spectrum 8852 Yes No

Max number of test points Unlimited 44,160

RoBAT S1 - Shanghai 72

Testronics 402LV -

Shenzhen

73

BPA – X-Ray CAPABILITY SH SZ

Equipment TRI TR -7680 N/A

Backplane X ray Capability Full 3D capability N/A

Max Board Size 1000mm x 610mm N/A

Max Board Thickness Over 10mm with Optional clamp N/A

Max Board Weight 15Kg N/A

Top Clearance 50mm @ 20um N/A

Bottom Clearance 70mm N/A

Resolution 20um, 15um, 10um N/A

TR7680 - Shanghai

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74

BPA – AOI

CAPABILITY SH SZ

Equipment TR7500EL HOLLY LX1200


TR7500 EL AOI - Shanghai

74

HOLLY LX1200 - Shenzhen

75

Custom Metal – Typical Process Flow

Sheet Metal Punch/Cut using CNC Turret

Punch Machines, Laser & Water Cut and

Shearing Equipment

Stamping/Pressing and Roller Leveling

Bending using Press Brakes

Insertion, Drilling & tapping and Stud

Welding

Spot Welding, TiG and MiG welding and

Riveting Grinding and Deburring

Masking and Painting of sub-assembles

Final Assembly and Integration

Test and Inspection

75

76

Custom Metal – Punch/Cut

Amada Turret Punch - max

throat depth 1.5m (59”)

Laser Cutting Machine:

effective in the processing of

sheet metal of thicknesses

between 0.5mm(0.2”) to

12mm (0.5”)

Matr’l Max Thickness SH SZ

CNC Turret Punch - Amada 3.2mm (0.125”) 8 0

CNC Turret Punch – Finn-Power 3.2mm (0.125”) 2 7

Water Cut Machine 20mm (0.80”) 1 0

Laser Cut Machine 12mm (0.50”) 1 0

Materials processed

including:

• Plated Steels (Zintec,

Galvanized, Aluzinc)

• Cold Rolled Steel (CRS)

• Aluminium

• Stainless Steel

• Copper

• Polycarbonate

Finn-Power Turret Punch - max

throat depth 1.2m (48”)

76

77

Custom Metal – Bend/Press/Insert

Amada Bending machine 10 ~ 200T Press machines

Haeger Insert machines

Finn-Power Bending machine

Capability SH SZ

Bending Machines Up to 250 tons 13 9

Stamping/Press Machines Up to 200 tons 4 9

Insertion Machines 15 tons or 8 tons of tam

force;

installs up to

3/8”(M10)hardware

5 5

77

78

Custom Metal – Welding

Robot Welding

Stainless, CRS, AL Spot

Welding Machines

MIG and TIG Welding

SITE Capability SH SZ

Mig/Tig Welders Arc welding 500A 23 13

Spot Welding Machines Max Thickness: 6+6 7 3

Stud Welding Machines Up to M12 hardware 6 2

Robot Welding Machine 6 axis,Max.working

length:1800mm

1 0

78

79

Custom Metal - Busbar

CNC Punching/Cropping

Max bar: Thickness 15mm, Width 200mm,

Length 6000mm

CNC Waterjet Machine

Max Sheet: Thickness 30mm, Width 1600mm, Length 2600 mm

TTM manufactures a wide range of Busbars for our Telecommunication, Industrial, Automotive

and Computer & Data-communication products:

SITE SH SZ

Turret Punch/Cut Machines 10 7

Bending Machines 13 9

CNC Punch/Crop Machine 1 0

CNC Water-jet Machine 1 0

Hardness Tester 1 1

Conductivity Tester 1 1 TTM integrated Busbars

79

80

Custom Metal – Painting (Shanghai)

Powder Paint System:

• Process: 8 Stage Washer and Pretreatment，DI Water Generation and Cleaning

• Closed mask room and wind shower plus air conditioning system to reduce dust to minimum

• Pretreatment specs: Zinc Phosphate and Surtec Cr3

• Paint Booth system: ITW GEMA Powder Application System

• Color Change system: Included in GEMA Powder Application System

• After each color change: Gloss level, Color, Adhesion, Hardness and Paint Thickness are all measured

• Max part size: Length = 2400mm(94”), Height = 1400mm(55”), Width = 800mm(31”)

Pretreatment Line Paint Booth Paint Line

80

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Custom Metal – Painting (Shenzhen)

Powder Paint System:

• Process: 9 Stage Washer and Pretreatment (Total 14 tanks for various processes)

• Pretreatment specs: Zinc Phosphate

• Paint Booth system: ITW GEMA Powder Application System

• Color Change system: 2 sets manual systems

• After each color change: Gloss level, Color, Adhesion, Hardness and Paint Thickness are all measured

• Max part size: Length = 2200mm(87”), Height = 1500mm(59”), Width = 800mm(31”)

Pretreatment line Painting bath Painting room

81

Thank you!

83

Shanghai-Industrial (Motion Control/CNC Spreader)

83

84

Shanghai – Industrial (Energy Storage/Modular Battery Enclosure System)

84

85

Shanghai – Industrial (Renewable Energy/Wind Conversion Enclosure)

85

86

Shanghai – Industrial (Renewable Energy/Wind Conversion Enclosure)

86

87

Shanghai – Industrial (Renewable Energy/Electrical Control Enclosures)

87

88

Shanghai – Industrial (Renewable Energy/Nacelle Assembly)

88

89


89

90


90

91

Shanghai – Industrial (Renewable Energy/Transformer Monitoring Cabinet)

91

92

Shanghai – Industrial (Power Generation/Turbine Control Enclosure)

92

93

Shanghai – Industrial (Power Generation/Turbine Control Enclosure)

93

94

Shanghai – Industrial (Orthogonal Backplane Connector Test Platform)

94

95

Shanghai – Industrial (Mining/Onboard Control Cabinet)

95

96

Shanghai – Industrial (Mining/Onboard Control Cabinet)

96

97

Shanghai – Industrial (Transportation/ Locomotive Control Consoles)

97

98


98

99


99

100


100

101

Shanghai – Industrial (Transportation/ Subway Signal Control Cabinets)

101

102

Shanghai – Industrial (Transportation/Loco Audio Speed Interface incl. PCBA)

102

103

Shanghai-Industrial (Transportation/Locomotive signal control module)

103

104

Shanghai – Industrial (Transportation/Luggage X-ray Machine)

104

105

Shanghai – Medical (Motion Control/Bone Density Scanner)

105

106

Shanghai – Medical (Imaging/Switching Amplifier for MR System)

106

107

Shanghai – Medical (Imaging/CT Scanner Backplane)

107

108

Shanghai – Telecom (Subrack incl. BPA & Fan Modules)

108

109

Shanghai – Telecom (TTM Parameterized Outdoor Enclosure)

109

110

Shanghai – Telecom (Wireless/Pole Mount Base Station)

110

111

Shanghai – Aerospace (Ground Based/Equipment Testing Rack)

111

112

Shanghai – Aerospace (Ground Based/Equipment Testing Rack)

112

113

Shanghai – Aerospace (Ground Based/Mobile Testing Rack)

113

114

Shanghai – Aerospace (Ground Based/Test Equipment Switch Box)

114

115

Shanghai – Aerospace (Ground Based/Diagnostic Testing PCBA)

115

116

Shanghai – Aerospace (Aircraft/Cockpit Metal Work Components)

116

117

Shanghai - Backplane Products All Sectors

118 118

Product Examples Shenzhen

119

Shenzhen – Industrial (Monitoring/Gas Level Remote Telemetry Unit)

119

120

Shenzhen – Industrial (Transportation/Elevator Controls PCBA’s)

120

121 121

Shenzhen – Industrial (Renewable Energy/ Wind Pitch System Boxes)

122 122

Shenzhen – Industrial (Renewable Energy/ Wind Pitch System Boxes)

123

Shenzhen – Industrial (Power/AC-DC Conversion Cabinet)

123

124

Shenzhen – Telecom (Control/Fan Control PCBA)

124

125 125

Shenzhen – Telecom (Backplane Products)

126 126

Shenzhen – Telecom (Outdoor Enclosure)

127 127

Shenzhen – Comp/Datacom (1U Switch System incl. PCBA)

128 128

Shenzhen – Comp/Datacom (5U, 10U and 29U Integrated Router Systems)

129

Shenzhen – Comp/Datacom (Computing/Blade Computer PCBA’s)

129

130

Shenzhen - Automotive (Monitoring System)

13

0

131 131

Shenzhen – Automotive (Shift Control Boards)

132 132

Shenzhen – Automotive (Control Module)

133

Shenzhen - Automotive (Power Control)

133

134

Shenzhen – Automotive (Electric Vehicle/Charging Station)

134

135

Shenzhen – Automotive (Electric Vehicle/Busbars)

135

Thank you!

EMS_ENG_Capabilities Dec 2015

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