DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005 ITRS Factory Integration TWG1 ITRS...
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Transcript of DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005 ITRS Factory Integration TWG1 ITRS...
ITRS Factory Integration TWG 1DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005
ITRS Factory Integration Presentation
Mani Janakiram & Junji Iwasaki
July 2005
Global Co-Chairs:Europe: Arieh GreenbergJapan: Shige Kobayashi, Michio HonmaKorea: TBDTaiwan: Thomas ChenUS: Mani Janakiram
ITRS Factory Integration TWG 2DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005
Agenda1. Scope and Difficult Challenges
2. FI Current Status
3. Technology Requirements
4. Manufacturing Strategy Evolution
5. Top Factory Integration Focus Areas
6. Summary
Factory Integration Scope and Drivers
WaferMfg
ChipMfg
ProductMfg
Dis
trib
uti
on
• FEOL• BEOL
• Probe/Test• Singulation
• Packaging• Test
Si SubstrateMfg
ReticleMfg
Increasing cost &Cycle time implications
Factory is driven by Cost, Quality, Productivity, and Speed:Reduce factory capital and operating costs per functionFaster delivery of new and volume products to the end customerEfficient/Effective high volume production, high reliability, & high equipment reuseEnable rapid process technology shrinks and wafer size changes
FactoryOperations
ProductionEquipment AMHS Factory Information
& Control Systems Facilities
UI
DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005
ITRS Factory Integration TWG 4DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005
Key Technologies that will Impact Factory Design 2005 and future years are targeted to meet productivity and capture
technology requirements Key process and device technology intercepts that will impact the factory
design are Extreme Ultraviolet Litho (EUVL), New Device Structures, new materials and the next wafer size conversion
Year 2005 2006 2007 2008 2009
Technology trend (nm)
80 70 65 55 50
Wafer Size (mm) 300 300 300 300 300
Near Term Years
Long Term Years
Year 2010 2011 2012 2013 2014 2015 2016 2017 2018
Technology trend (nm) 45 40 35 32 28 25 22 20 18
Wafer Size (mm) 300 300 450 450 450 450 450 450 450
Next Wafer Size in Production?
New Device Structures?
Start Planning for 450mmStarted discussions
EUVL in Production?
Difficult Challenges Summary
Near Term: 2005 to 2009 >45nm1. Responding to rapidly changing and complex business requirements [E]2. Meeting growth targets while margins are declining [E]3. Managing ever increasing factory complexity [M]4. Meeting factory and equipment reliability, capability or productivity
requirements per the roadmap [M]5. Meeting the Flexibility, Extendibility, and Scalability needs of a cost
effective, leading edge factory [M]6. Meeting process requirements at 65nm and 45nm nodes running
production volumes [P]7. Increasing global restrictions on environmental issues [E]
Long Term: 2012 to 2018 <45nm1. Post conventional CMOS manufacturing uncertainty [P]2. Next Wafer Size and Emerging factory paradigm changes [M] [E]
Economic and business challenges are equal to our manufacturing and process technology challenges in scope and breadth for both efficiency and effectiveness
E=Economic/BusinessP=Process TechnologyM=Manufacturing
DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005
6DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005
Some Projected Attributes of a 300mm < 45nm Fab
SECS Control Line
Equipment Data Acquisition (EDA) Standards to get Rich Equipment Data
Manufacturing Execution Systems
Factory SchedulerAnd Material Control
Full Wafer Level Tracking &Recipe/Parameter Changes
100% Direct Tool Delivery AMHS
Ubiquitous APC; Rapid Process Matching & New Product Qualification
Standard, Detailed EquipmentPerformance Tracking (EPT) Data
Systems Scaled for > 50k wspm
Data standards and Systems for RapidMask Set Creation
Aggressive NPW Reduction & Efficient Spares Mgmt
Very Fast Cycle time Fabs for Hot & Normal lots
Wafer Data Standard For Packaging
Offline tools to test schedule rules and rapidly put in MfgPervasive
E-Diagnostics
SPCAPC FDC
Yield PCS EPT
Equipment Engineering Capabilities
Recipes
E-Diag
EquipmentControl Systems
Partner, Customer
Or Supplier
Equipment & Systems designed for High Mix operation
Equipment &Process Data
FI Sub team – July 2005 StatusSubteam July 2005
1 Factory Operations (FO)
Focus: 1) Reduce mfg cycle time, 2) Improve Equipment Utilization, 3) Reduce Losses from High Mix
Completed Technology Requirements table and potential solutions tables. No major changes to the technology table anticipated. Working on the summary.
2 Production Equipment (PE)
Focus: 1) NPW reduction, 2) Reliability Improvement, 3) Run rate (throughput) improvement
Completed Technology Requirements table and potential solutions tables. Few changes to the technology table is made. Completed rev0 write-up and impact of focus area on PE
3 Automated Matl Handling Systems (AMHS) Focus: 1) Increase throughput, 2) Reduce Average Delivery times, 3) Improve Reliability
Completed Technology Requirements table and potential solutions tables. Updating the values for peak MPH specific to high thr’put bay. Working on the summary.
4 Factory Information & Control Systems (FICS)
Focus: 1) Increase Reliability, 2) Increase Factory Throughput, 3) Handle data explosion,
4) Reduce or Maintain Mask Shop Cycle Time
Completed Technology Requirements table and potential solutions tables. Small changes to the technology table are made. Working on the summary.
5 Facilities
Focus: 1) Reduce Costs 2) Utility 3) Footprint 4) Reduce equipment installation time
Completed Technology Requirements table and potential solutions tables. Few changes to the technology requirements table are made. Working on the summary.
6 Other – Focus area & Cross-cut items 2005 FI chapter will include sections on 1) Focus areas 2) Text on AMC, EMI, ESD and cross-TWG issues.
Completed technology requirements, potential solutions, focus area and cross-cut challenges
DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005
8DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005
Factory Operations Technical Requirements
Key Objectives: 1) Reduce mfg cycle times, 2) Improve Equipment Utilization, 3) Reduce Losses from High Mix
Solution exists Solution being developed Solution required
9DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005
Production Equipment Technical Requirements
Key Objectives: 1) NPW reduction, 2) Reliability Improvement, 3) Run rate (throughput) improvement
Solution exists Solution being developed Solution required
10DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005
Key Objectives: 1) Increase throughput for Traditional and Unified Transport, 2) Reduce Average Delivery times, 3) Improve Reliability
Material Handling Technical Requirements
Solution exists Solution being developed Solution required
11DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005
FICS Technical Requirements
Key Objectives: 1) Increase Reliability, 2) Increase Factory Throughput,3) Reduce or Maintain Mask Shop Cycle Time, 4) Reduce Costs
Solution exists Solution being developed Solution required
12DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005
Facilities Technical Requirements
Key Objectives: 1) Factory Extendibility, 2) AMC,3) Rapid Install/Qualification, 4) Reduce Costs
Solution exists Solution being developed Solution required
13DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005
2005 FI Focus Area
Focus Areas July 2005 Status
1 Airborne Molecular Contamination (AMC) Implications at < 45nm process technologies (Now -> 2006)
AMC tables will be in YE and the reference text will be in PE and Facilities.
2 Rapid Equipment Install and Qualification (Now ->)
Rapid equipment install and adaptor plate ideas being formed by Facilities. Adaptor plate per tool type. Need a standard among the suppliers.
3 “Proactive Visual” manufacturing (Now ->) Need more clarity; Minifab versus Megafab; STRJ needs help to promote visualization; This can be treated as a solution.
4 Next Wafer Size (NWS) Transition (2005 -> 2012)
FI will work with International Sematech and will continue to define technology requirements for NWS FI
Factory Integration focus areas: AMC, NWS, and Proactive Visualization
14DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005
AMC Requirements - Current status
AMC limits are currently addressed in the Yield Enhancement YE TWG, and the Wafer Environmental Contamination Control WECC subTWG
Fab environment requirements have not been defined yet in the FI TWG
Wafer Environment Control such as Cleanroom, SMIF POD, FOUP, etc….not necessarily the cleanroom itself but wafer environment.
Number of particles (/m3) [B] ISO CL 2 ISO CL 2 ISO CL 2 ISO CL 2
Airborne Molecular Contaminants in gas phase (pptM)) [C] [H] [R]
Lithography—bases (as amine, amide, and NH3) 750 750 750 500
Gate—metals (as Cu, E=2×10–5
) [I] 0.15 0.1 0.1 0.07
Organics (molecular weight ≥ to C7H16) normalized to
hexadecane (C16H34) equivalent5000 4500 4000 3500
Salicidation contact—acids (as Cl–, E=1×10–5
) 100 100 100 10
Salicidation contact—bases (as NH3, E=1×10–6
) 1000 1000 1000 100
Dopants [E] 10 10 10 10
Airborne Molecular Contaminants, Surface Deposition Limits (for Si Witness Wafer, 24-hour Exposure to Closed FOUP, Pod, Mini-environment or Air)SMC (surface molecular condensable) organics on
wafers, ASTM 1982–99, ng/cm2 [O]
4 2 2 2
Front-end processes, bare Si, total dopants added to 24-
hour witness wafer, atoms/cm2 [E] [P]
2.00E+12 2.00E+12 2.00E+12 1.00E+12
Front-end processes, bare Si, total metals added to
witness wafer, atoms/cm2 [G] [Q]
2.00E+10 2.00E+10 2.00E+10 2.00E+10
Wafer
Wafer/Tool environment
Fabenvironment
FactoryIntegrationRoadmap
Yield Enhancement Roadmap
TechnologyRequirements
15DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005
Rapid Tool Install - Adapter Plate Concept
Facility Utilities Into Adapter Plate (water, gasses, etc.)
Supplier Utilities Into Process Tool
Exhaust From Tool
Exhaust To Facility
Facility Power Into Adapter Plate
Proactive Visualization Comprehensive structured P/V matrix be developed for SoC manufacturing Strategic issues be broken down and mapped into P/V matrix Solutions and needs bilaterally be traceable through P/V matrix
LMHVNew
Production Methods
Design &Manufacturing
Integration
Small order sizeShort product cycle
Varying product volume
New Foundry Business
Combinations of Solutions
solutions
New IDM
Cost DeliveryQuality Energy
Products
Factory Operation
Factory Resource Metrics Development
and Proper Targeting Needed
Pro
acti
veV
isu
aliz
atio
nP
roac
tive
Vis
ual
izat
ion
HMLV
Strategic Issues
DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005
ITRS Factory Integration TWG 17DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005
Cycle Time as a function of Lot Size
25 12 6 2
25Current R/M
(Non Hot Lot)Current R/M
(Super Hot Lot)
12 Next R/M
6 Next R/M
2 Next R/M
ObjectiveLot SizeNominal
Lot Size
2005 2018
Cycle time per mask layer (days)Short cycle time will be driven by smaller lot size and
more single wafer processingSetup time reduction
ITRS Factory Integration TWG 18DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005
We started discussions for next wafer size transition
9 yrs + 2 yrs delay* 9 yrs? + 2 yrs delay? 9 yrs + ?yrs delay
675mm/2021?450mm/2012?300mm/2001200mm/1990 (125/150mm - 1981)
We are here When does this happen?
ITRS Factory Integration TWG 19DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005
Examples of next wafer size (NWS) technology decisions that are needed
Attribute Key Technology Decisions
Wafer Material, Size, Thickness, ID, Registration, Edge Exclusion
WaferCarrier
Number of Wafers, Size, Door Type, AMHS Strategy, ID
ProductionEquipment
Single wafer vs. mini-batch, cleanliness, interface standards, productivity targets relative to 300mm (NPW usage, etc.)
Factory Factory Size, Egress, Cleanliness, Sub-Fab attributes, Clean-room height
AutomatedMaterial HandlingSystems
Direct transport concepts, carrier/wafer delivery time, overall throughput, efficient storage concepts
ManufacturingSystems
Process Control & Yield Data Standards, Carrier delivery time, Decision Making Time, Data Flow
ITRS Factory Integration TWG 20DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005
2004 2005 2006 2007 2008 2009 2010 2011 2012
2004 2005 2006 2007 2008 2009 2010 2011 2012
Carrier & lot-sizedetermination
Direct TransportStandards
Production EquipmentStandards
Factory Control System Standards
Interoperability Testing& Reliability Verification
450mm waferStandards
Proposed next wafer size (NWS) transition timeline
Not final.Need Further discussions
Many technology issues in NWS need to be addressed!
FI has started to work on NWS technology challenges
ITRS Factory Integration TWG 21DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005
Key Messages1. Business strategies, market demands, and process technology changes
continue to make factories difficult to integrate
2. Factory’s speed and flexibility are vital to accommodate various production technologies
High Mix, Cycle time improvement, equipment utilization, direct transport AMHS, etc.
3. Gaps in Production Equipment performance, Setup time, AMHS, Facilities and Factory operations must be improved
Metrics needed to cover versatility, productivity, agility, quality, environment compatibility
4. Key cross-TWG issues need to be addressed
Abatement, Energy requirement,
5. New technology demands tighter AMC control
6. Proactive visualization/usage of factory data is required
Delivery time, Quality, and Reliability
7. Next wafer size technical requirements need to addressed