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Accelerating Manufacturing Productivity

Copyright ©2009 SEMATECH, Inc. SEMATECH, and the SEMATECH logo are registered servicemarks of SEMATECH, Inc. International SEMATECH Manufacturing Initiative, ISMI, Advanced Materials Research Center and AMRC are servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.

450mm Transition Update

SEMICON JapanDecember 1, 2010

SEMICON Japan 2010



Opening Remarks

Scott KramerVice President of Manufacturing Technology



Briefing Agenda and Program Overview

Tom JeffersonISMI 450mm Program Manager

1 December 2010 4

Meeting Agenda

• 450mm Background, Landscape and ISMI 450mm Program Overview

• 450mm Transition Current Status– Silicon– Equipment– Factory Infrastructure

• Summary and Discussion

1 December 2010 5

Coordinating Industry Convergence towards 450mm

Equipmentreadiness

Interoperability Test Bed (ITB)

RequirementsGuidelines

Early design

Mechanical Wafer Bank

Single Crystal Wafer Bank

Carrier & loadport interoperability

EquipmentDemonstrations

Equipment Performance Metrics (EPMs)

Test plansEquipmentprototypes

Metrology & process equipment development

25 wafer FOUP

Early prototypes

Test Wafer Generation

2007

2008

2009

2010+

Technology intercept node defined

Global Equipment Guidelines

EHS Guidelines

1 December 2010 6

450mm: Global Activity

450mm wafer handling evaluations

ITG-J(Interoperability Test Group –

Japan)

2008

450mm Standards initiated -

most finished by 2010

2007

European Commission Funding for 450mm

development

2010

2006

2008

450mm cleanroom announcement

2010

Funding for ISMI 450mm Program Announced

1 December 2010 7

450mm Supplier Engagement

ISMI thanks all suppliers who have helped to realize 450mm progress to date.

0

5

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15

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25

30

Jul'09 Oct'09 Dec'09 Jul'10 Dec'10

# CompaniesEngaged with ISMI450mm Program

~3X increase in 16 months

* Engaged = providing equipment, materials, or services to ISMI 450mm Program

1 December 2010 8

ISMI’s 450mm mission statement• Enable a cost-effective 450mm transition through coordination

and development of infrastructure, guidance, and industry readiness

Supplier engagement

Test wafer operations

Vacuum platform development

450mm transition program

Equipment test methods and metrics

Factory integration readiness

Starting materials

2010 ISMI 450mm organization

ISMI 450mm Program Mission and Organization

1 December 2010 9

“Cost Effective Transition” – Examples

Integrating metrology modules onto existing EFEMs reduced handling costs 50%

ISMI’s Test Bed helps enable a 60% reduction in time to Standards v. 300mm

2007 2008 2009

FI Prelim Stds Avail

450mm

Approved FI Stds Published

1996 1997 1998 1999 2000 2001

300mm

1995

2010

Sintered and Hybrid wafers reduce early development costs450mm Wafer Bank Loans

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Num

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# of Wafers # Wafers Loaned

ISMI’s Wafer Bank has loaned >550 wafers –

at no cost to suppliers

1 December 2010 10

ISMI 450mm Operations Increasing

Expansion and transition of ISMI to CNSE/Albany in 2011– $20M from New York accelerates ISMI’s 450mm program

• Increased supply of 450mm silicon• Increased equipment to generate additional 450mm test wafers• Factory infrastructure to support increased operational scope

ISMI/CNSE Transition Announcement –

10/12 2010



Silicon Readiness Update

Mike GoldsteinStarting Materials Project Manager

1 December 2010 12

2010 - 450mm Silicon Wafers Achievements• The major silicon suppliers are manufacturing

developmental test wafers, improving the wafer quality

• Improved hybrid wafers have been developed.• Supplier benchmarking has been completed

using wafer geometry inspection tools (Kuroda and Kobelco), LLS (NanoPhotonics), metal contamination (Balasz Lab), and SIRD (Jena Wave)

• SEMI developmental silicon wafer spec M76 has been published

• Wafer shipping methodology is in development. MAC specification E159 approved

300mm single crystal

Unidirectional cast poly

Nikko concentric hybrid wafer

12

1 December 2010 13

450mm Wafers Quality

• Suppliers are continuously improving the wafer quality, for some parameters already achieving the specification requirements:– Polishing process have been improved. Scratches have been

eliminated. Good achievements on SORI, GBIR and SFQR.– Particle levels have been reduced dramatically. Suppliers are able

to manufacture wafers with LLS (

90nm*) of 0.3-0.4 per cm2 and are working to improve wafer shipping. (a 10x improvement in ~6month).

– Surface metals levels requirements have been achieved by some suppliers

– The crystal quality of 450mm wafers is in better shape than the 300mm wafers were at the same development stage.

* Note: (Test wafers requirement is for LLS size 45nm, however inspection tools for these particle size is still in development)

13

1 December 2010 14

LLS Trends Nanophotonics measurements

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1 December 2010 15

Surface Metals Contamination Balasz Analytical Services measurements

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1 December 2010 16

SFQR Kuroda Precision Industries measurements

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1 December 2010 17

Wafer Geometry Kuroda Precision Industries measurements

SORI 12.1um GBIR 0.686um

ERO -

Start -0.108m Cross PV 0.540um

1 December 2010 18

Wafer Geometry Kobelco Measurements

1 December 2010 19

Edge Shape Kobelco Measurements

1 December 2010 20

SIRD Evaluation Jena Wave measurements

• SIRD is a photoelastic measurement which creates a full wafer stress image and reveals local stress related defects.

• Frozen-in stress from crystal pulling and cooling

• Local stress from abrasive manufacturing and laser mark

• Crystal voids and BMD stress monopoles

• Defects created by handling and transportation

notch stress field edge defects

SIRIS45 - Scanning InfraRed Inspection System

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1 December 2010 21

450mm vs. 300mm Stress Evaluation Jena Wave measurements

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Early 300mm DSP wafer (1999)

She

ar s

tress

[P

a]

450mm Wafer (2009)

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300mm State-of-the-art Wafer

Lorentzian Fit

1 December 2010 22

SEMI Specs

• Silicon wafers:– M76: Specification for developmental 450mm diameter polished single crystal

silicon wafers• Three different kind of wafers have been defined to assist manufacturers in choosing the most

cost effective wafers for a given application:– Particle monitors – Lithography monitors – Other monitors for general applications

• M74: Specifications for 450 mm diameter mechanical handling polished wafer

• Wafer carriers: – E158: Mechanical Specification for Fab Wafer Carrier Used to Transport and

Store 450mm Wafers (450 FOUP) and Kinematic Coupling– E159: Mechanical Specification for Multi Application Carrier (MAC) Used to

Transport and Ship 450mm Wafers

We would like to thank the SEMI standards members for their contribution

1 December 2010 23

Summary

• Silicon supply line is in good shape, with some suppliers able to achieve already test wafer quality, with the exception of LLS requirements

• ISMI starting materials working group ongoing activities include:– Support ISMI process test wafer generation activities– Benchmark silicon suppliers “state of the art”– Work with suppliers to improve wafer quality – Engage with wafer inspection OEMs– Work with SEMI silicon wafer committee to generate 450mm prime

wafer spec (M1 revision) – We plan to continue the loan program. In 2011 we will have a very

significant increase in the number of developmental test wafers available.

23



450mm Equipment Readiness

Tom AbellSupplier Engagement Project Manager

1 December 2010 25

ISMI Equipment Development and Demonstration Strategy

Better Wafers

Larger Equipment

Set

+

Basic Test Wafers

Advanced Test Wafers

-Higher quality

- Higher quantity

- More types

Equipment capable of meaningful

demonstration

Demonstration Test Methodology (DTM)

Equipment Development

Initial Wafers

Initial toolset

+

Equipment Performance Metrics

EHS Guidelines

Global Equipment Requirements

1 December 2010 26

ISMI Test Wafer Management

Test Wafer Operations

Equipment Suppliers

Starting Materials (silicon, etc.)

Supplier Engagement

ISMI Silicon Bank

Test Wafer Planning and Equipment Readiness

Supplier Processing and Measurement

Bare silicon

In-house Processing and Measurement

1 December 2010 27

Cost-Sharing Overview

• ISMI recognizes that the historical financial risk model for wafer-size transition funding is no longer relevant

• Risk-sharing with tool suppliers is expected to realize the 450mm transition– Cost-sharing is the planned mechanism to lower the financial risk; may not be

necessary for tool development

• ISMI is prepared to engage in discussions and negotiations concerning resources for funding of development and plan scope

– Realistic costs for building tools are needed to help determine which projects will be supported and assess levels of support

• Cost-sharing program is structured to allow suppliers maximum flexibility for consideration

– Cost-effective transition is the program goal– It is expected that suppliers will have different approaches for different business

plan objectives– There are several decisions to consider in the context of tool development plans

and ISMI involvement– ISMI requires certain information to evaluate supplier plans

1 December 2010 28

Example Cost- Sharing Scenarios

Alpha/prototype At ISMI

Beta tool

Alpha/prototype At supplier

[ Test Wafer Tool ]

[ Provides Test Wafer support remotely ]

At Supplier [ Remote Test Wafer Tool ]

Demo toolAt ISMI

Demo and Advanced Test Wafers at ISMI

At supplier Demo at supplier and remote Advanced Test Wafers

At ISMI [ Test Wafer Tool ]

Alpha/prototype At supplier [ Provides Test Wafer support remotely ]

Demo toolAt ISMI Demo and Advanced

Test Wafers at ISMI

At supplier Demo at supplier and Remote Advanced Test Wafers

1 December 2010 29

ISMI’s 450mm Cleanroom Operations

Lot Sorter

Wet Cleans

Particle Inspection / Wafer Edge Inspection

Ellipsometer

FOUP Washer (Dec. Install)

1 December 2010 30

450mm PECVD Oxide Depositions and Ellipsometry Measurements

-200

-100

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Y

-200 -100 0 100 200

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Contour Plot for Wafer 1

Wafer 1

<= 4800

<= 4900

<= 5000

<= 5100

<= 5200

> 5200

• Very good uniformity for 1st depositions by Oxford Instruments Plasma Technology

• Ellipsometry measurements provided by SOPRALAB

• Etch testing planned on blanket films

1 December 2010 31

Building Test Wafer Infrastructure

• Q4’09: Initial 3 step process flows executed

• Q4’10: 8 step flows are presently in fabrication– Looped flows have been designed to accelerate tool development

(Processing, measurement, processing, reclaim, etc.)

∞ Loop

Oxidation Thk/Unif Wet etch Thk/UnifParticles Wet Clean∞

Particles Wet Clean Particles Metals Measurement*

* Full wafer VPD

Example Test Wafer Flows

Particles PECVD Oxide

Thk/Unif

Particles

Plasma Etch

Thk/UnifWet Clean Particles

1 December 2010 32

Equipment Performance Metrics - Update

• Equipment Performance Metrics (EPMs) were published in 2009 as guidance for determination of requirements for ISMI equipment demonstrations

• 2010 Updates to EPMs– EHS expectations and Factory Integration metrics added to EPM– LPCVD temperature revised.

• ISMI will continue to update and revise EPMs in 2011 based on supplier and device maker inputs– Currently 6 updates and 4 new applications are in process. – Additional updates planned for 2011

1 December 2010 33

Demonstration Test Methods/Metrics 2010 Status and 2011 Plan

Demonstration

PerformanceMetrics

Standards &Guidelines

Test & AssessmentMethods

Demonstration Test InfrastructureTesting of select DTM Elements

DTM Training 2H 2011

2011+

1H 2011



ISMI 450mm Factory Infrastructure

Eddy BassFactory Integration Project Manager

1 December 2010 35

Interoperability Test Bed (ITB) Objectives – Established 2008

• Engage with suppliers for feedback and joint development for faster learning cycles

• Lead/facilitate rapid development of factory integration elements through demonstration and testing of equipment

• Feedback technical data and information into the semi standards and guideline development process

• Assess conformance of equipment to SEMI Standards and ISMI guidelines

• Measure equipment performance against targets

• Assess interoperability of factory integration elements

1 December 2010 36

ITB Progress – Mission Accomplished

2010SEMICON

Japan

Final revisions of carriers and

loadports developed for

testing and standards confirmed

in a cleanroom

Testing: • Standard

compliance and interoperability testing of final/functional prototype components

Q4 2010Standards Demonstrations and

Cleanroom OperationsPhase

Q1 2011Support Any Final FI Component Testing

Wrapping up: • Return

prototype equipment and publish final reports

• Particle Testing of ITB elements remains important

ISMI will continue to monitor Factory Integration progress

1 December 2010 37

ITB Accomplishments: 2008->2010• ITB has tested and provided results to member companies and SEMI Task

Forces for:– 18 versions of wafer carriers and shipping boxes– 11 versions of load ports– 5 wafer handling robotic systems– 4 versions of PGVs (Person Guided Vehicles)– 2 AMHS stockers and OHT (Overhead Hoist

Transport) systems– Wafer wands, vibration and displacement sensors

• Provided five FI guideline clarifications• Enabled the development of FOUP, Loadport, MAC, and Stocker interface

standards

1 December 2010 38

Cumulative Total Robot & LP Cycles11/05/2010

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ITB Robots and Load Port Cycle History

>5.0 M Robotic handling moves to date. >1 M Load Port cycles with FOUPs and MACs.

Focus Shifted to Load Ports

& MAC10 to 12 mm Pitch Change

MAC cycling

1 December 2010 39

New Strategy - Reusable Silicon Shipping Crate (RSSC)• Purpose: Force shipping companies to treat wafer

shipments as freight and improve carrier protectionToo small and light to use standard pallet jack

Shipping crates better fit freight handling equipment

Secondary package fits securely inside surrounded by cushions

1 December 2010 40

450mm AMHS

• Evaluation of 2 stockers and 1 OHT completed• 300mm AMHS model scales to 450mm with no significant problems• 450mm Carrier standards maturity is enabling suppliers’ progress• PGVs are demonstrated as ready for safe manual handling of 450mm

carriers

450mm Overhead Hoist Transport 450mm PGV

1 December 2010 41

1st 450mm Vacuum Platform

Successfully Integrated EFEM and Loadports with Platform

450mm Vacuum Platform Available Now

1 December 2010 42

Key ISMI 450mm EQ Software Guidelines (First Published @ SEMICON JAPAN 2009)

-#18 Equipment shall be capable of providing (near) real-time data of high quality and integrity to enable external monitoring of equipment status such as process conditions, health, and reliability.

-Equipment software shall support cost effective programmable or configurable interfaces for easy integration with factory systems

-Equipment software shall support standardized inter/intra tool data communication approach

-#17 There shall be a Single Point of Control for factory system command and control of equipment with standard messages and state models. All other data and file communication shall be handled via standardized supplemental communications port(s).

-Equipment software shall provide cost effective communication supplemental ports, if the port(s) isn’t standardized

-Equipment software shall consider security management features to protect key recipe and equipment configuration

-#8 Equipment shall be designed to minimize unscheduled downtime through fundamental improvements and information-based predictive performance.

-Equipment software design shall support to minimize unscheduled downtime .Cost effective applications are required to manage equipment health and performance

-# 19 Equipment shall be capable of material carrier slot integrity or redirecting material to any carrier/slot available to the equipment.

-High throughput equipment shall support dynamic wafer redirecting capability and support to release idle empty FOUP to AMHS systems

MESMESFactoryFactorySystemsSystemsNo new updates at this time

Key Message

Intelligent 300mm Scale-Up with no new software standards = Minimizing Costs and Risks

1 December 2010 43

ITB Remaining Activities in 2010 / early 2011

• MAC testing– Actively shipping wafers all over the world in MACs

• All damaged wafers to date were caused by rough or improper handling by shippers

• Adjustments in 3rd level (tertiary) packaging has been implemented to force shippers to handle wafer shipments as freight

– MAC interoperability testing on load ports, AMHS OHT and Stockers complete - no open issues

• AMHS testing– Complete initial testing of AMHS systems; including OHT and

Stockers – no roadblocks to scale up discovered– AMHS suppliers continue on track to deliver systems/components

by 2012

1 December 2010 4444

Summary

450mm ITB• > 1M load port cycles completed in the ITB with prototype carriers

– > 73k load port cycles with MACs• ITB key focus is demonstration of MAC compliance, performance and interoperability

– Completed initial evaluations with Stockers and Overhead Hoist Transport in September 2010• Shipping test show chronic problems with handling of wafer carriers and secondary packaging by

freight companies– Reusable Silicon Shipping Crate (RSSC) proposal to be tested in November with initial results available in

December• Sun-setting ITB after completion of MAC, MAC load port (i.e., new standard load ports), and

interoperability with FOUPs and MACs testing at end of 2010

Platform• 450mm vacuum platforms are available now• Successful integration of 450mm EFEM and Platform has been demonstrated• ISMI will continue to evaluate the feasibility of platform:chamber standardization

Software guideline• There are no updates on 450mm Software guideline at this time



Summary and Key Messages

1 December 2010 46

Summary - 450mm readiness – October 2010• Test wafer development has started for multiple process and

metrology equipment• Supplier interest in development of equipment for test wafer generation

and/or demonstration is increasing - in all geographies• Silicon suppliers are positioned to provide additional quantities of

450mm wafers - with improved quality– ISMI’s wafer loan program has provided >550 wafers for industry

development

• SEMI Standards are completed for 450mm FOUPS and loadports, and 450mm Mechanical and Developmental grade wafers

• Initial evaluations of AMHS prototype pilot lines are completed• 450mm equipment platforms are available now

1 December 2010 47

450mm Key Messages – October 2010

• ISMI continues to drive the activities required to enable the needs of its members towards the realization of a cost- effective 450mm transition

• ISMI expects to realize multiple new capabilities and increased wafer inventory in 2011

• Challenges remain to realize a comprehensive 450mm infrastructure at advanced technology nodes

• Wanted - constructive discussion with entities interested in contributing towards ISMI’s 450mm transition goals

1 December 2010 48

For Further Information …

http://ismi.sematech.org/meetings/archives/450mm/

-or-

Tom Jefferson, ISMI 450mm Program [email protected]

THANK YOU !!!

.

1 December 2010 49

Questions and Discussion

ISMI – Accelerating Manufacturing Productivity

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