Dl tfBttDevelopment of Battery Manufacturing ......2013/10/02  · rocess apa y o onoce ap Sample N...

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KEMET Electronics Italia D l t fB tt D l t fB tt Development of Battery Development of Battery Manufacturing Technologies Manufacturing Technologies Manufacturing Technologies Manufacturing Technologies December 7 2011 Joint EC / European Green Cars Initiative Workshop 2011 Joint EC / European Green Cars Initiative Workshop 2011 1 December 7, 2011 Joint EC / European Green Cars Initiative Workshop 2011 Joint EC / European Green Cars Initiative Workshop 2011 Bruxelles 7 December 2011 Bruxelles 7 December 2011

Transcript of Dl tfBttDevelopment of Battery Manufacturing ......2013/10/02  · rocess apa y o onoce ap Sample N...

Page 1: Dl tfBttDevelopment of Battery Manufacturing ......2013/10/02  · rocess apa y o onoce ap Sample N 419 StDev(Between) 0,06756 StDev(Within) 0,00000 StDev(B/W) 0,06756 StDev(Overall)

KEMET Electronics Italia

D l t f B ttD l t f B ttDevelopment of Battery Development of Battery Manufacturing TechnologiesManufacturing TechnologiesManufacturing TechnologiesManufacturing Technologies

December 7 2011Joint EC / European Green Cars Initiative Workshop 2011Joint EC / European Green Cars Initiative Workshop 20111

December 7, 2011Joint EC / European Green Cars Initiative Workshop 2011Joint EC / European Green Cars Initiative Workshop 2011

Bruxelles 7 December 2011Bruxelles 7 December 2011

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KEMET Electronics Italia

Headquarters: Simpsonville SC

Corporate Statistics

Headquarters: Simpsonville, SC Manufacturing: 23 facilities worldwideSquare feet: 3 millionEmployees: 10 000Employees: 10,000Revenue: ~$1 billion

Kemet Electronics Italia /Arcotronics (Machinery) Statistics

Headquarters: Sasso Marconi, Italy Manufacturing: Sasso Marconi, ItalySquare feet: 200 000Square feet: 200,000Employees: ~100

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KEMET Electronics ItaliaKEMET Electronics Italia

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KEMET Electronics Italia

EQUIPMENT KEY FACTORS

High Flexibility for different cell foot print and thickness

Six Sigma process with In-line process control and data collection

Yield optimisation

Ultimate state of the technologygy

Each machine is provided with the following main features: Ethernet connection for remote control / data collection and batch handling with bar code reader

from a supervisor Host

Maintenance counters for each wearing movable part for preventive maintenanceg

Large and movable HMI color pannel for easy operation

Process parameters recipe handling to facilitate size changeover

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KEMET Electronics ItaliaTYPICAL AUTOMOTIVE

POUCH CELL PRODUCT RANGEMin

(mm)Max (mm)(mm) (mm)

Cell Lenght (without tabs)

115 250

Cell Width 70 150

Cell Thickness

3 13

Tab 6 20extension

Tab config Axial Radial

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KEMET Electronics ItaliaASSEMBLY PROCESS FLOW

TABS TRIMMING& CURRENT COLLECTORS

MONOCELL ASSEMBLING LAMINATION & FOLDING

WELDING

SOFT PACK HALF-SHELLS FORMING

CELL INSERTION &

FORMING

ELECTRODE NOTCHING GENERAL LAYOUT

SOFT PACK SEALING

ELECTROLYTESOFT PACK DEGASSING ELECTROLYTEFILLING & SEALING

SOFT PACK DEGASSINGAND FINAL SEALING

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KEMET Electronics Italia

In line SPCELECTRODE NOTCHINGELECTRODE NOTCHING

Quality dataQuality dataOverall performancesOverall performances

Rewinding

Notching Dust collection

Electrode unwinding

Protection film

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KEMET Electronics ItaliaMONOCELL ASSEMBLY AND FOLDINGMONOCELL ASSEMBLY AND FOLDING

WindingIn line SPC

MONOCELL ASSEMBLY AND FOLDING MONOCELL ASSEMBLY AND FOLDING Quality dataQuality data

In line SPC

U th d

Overall performancesOverall performances

LaminationUpper cathode cutting and feeding

Cell extraction and sealing

Monocell assembly

Lower cathode cutting Anode electrode cutting and

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and feedingcutting and feeding

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KEMET Electronics ItaliaTAB TRIMMING & WELDINGTAB TRIMMING & WELDINGTAB TRIMMING & WELDING TAB TRIMMING & WELDING

Quality dataQuality dataOverall performancesOverall performances

Cell loading Tab Tape protection

Electrical testElectrical testTab trimming

1Cathode Tab Welding

Anode Tab Welding

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KEMET Electronics ItaliaSOFT PACK FORMING d SEALING MACHINESOFT PACK FORMING d SEALING MACHINESOFT PACK FORMING and SEALING MACHINE SOFT PACK FORMING and SEALING MACHINE

Quality dataQuality dataOverall performancesOverall performances

Inkjet printing

Cell unloading

Cell trimming

Tab side Half shell trimming

g

Cold forming unit

Lateral side sealing

Cell insertion

Multilayer material unwinding

Tab side and bottom side sealing

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KEMET Electronics ItaliaELECTROLYTE FILLING MACHINE ELECTROLYTE FILLING MACHINE

Quality dataQuality dataOverall performancesOverall performances

C ll l di

Cell Unloadingin trays

Cell loadingfrom trays

Post weight & bar code reading

Cell pre-weight

code reading

Filling cycleVacuum chamber

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KEMET Electronics ItaliaCELL DEGASSING AND FINAL SEALINGCELL DEGASSING AND FINAL SEALINGCELL DEGASSING AND FINAL SEALING CELL DEGASSING AND FINAL SEALING

Quality dataQuality dataOverall performancesOverall performances

Cell loadingCell Unloading

g

Electrical test -

Degassing chamber

ect ca test

D i

v+

Final sealing and trimming

Degassing cycle

Vacuum

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KEMET Electronics ItaliaASSEMBLY PROCESS FLOWELECTRODE NOTCHING

• From reel to reel• From reel to magazine for notched an cutted electrodes• Electrodes vacuum cleaning after cuttingg g• Flexible notching tool• In line SPC• Incoming material Bar Code reader DIE CUTTING TECHNOLOGY - BURS CONTROL

<10 µm

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KEMET Electronics ItaliaASSEMBLY PROCESS FLOWMONOCELL ASSEMBLY LAMINATION & FOLDING

• Flexible assembly process (for different foor print and thickness)• High electrode placement accuracy (Cpk > 2)

M i i d P i ld• Maximised Process yield • In Line SPC• Stack wound assembly process• Minimum size parts required• Minimum size parts required• Incoming material Bar Code reader

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KEMET Electronics ItaliaASSEMBLY PROCESS FLOW

Target of our Wound Stack assembly processTarget of our Wound Stack assembly processLaminate lithium battery electrodes to standard separators utilizing surface activation treatments (SAT) on the separators.

ValueEnable implementation of “wound stack assembly process” with “standard” separators providing higherEnable implementation of wound stack assembly process with standard separators providing higher precision, higher throughput assembly capabilities compared to a standard stack or z-folding assembly.

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KEMET Electronics Italia

WOUND STACK / LAMINATED ADVANTAGES GREATER PERFORMANCE GREATER SAFETY

•Creates a strong bond between the active materialsin the cell. This intimate connection between anodeand cathode maximizes cycling efficiency and

•The physical bonding of the electrodes ensure a fixing oftheir relative position over the lifetime of the cell. Constantexpansion and contraction of the electrode due to the Liy g y

reduces fade.

•The strong bonding maintains a constant ESR withless degradation due to cycling.

pshuttle will not cause the electrodes to shift, therebyeliminating potential shorts.

•Since the melting temperature of PVDF coating is greaterg y g

•The higher surface tension of the PVDF coating canassist in wetting the cell with electrolyte.

g p g gthen that of the polyethylene membrane, there is an addedstructural integrity of the separator during a thermal shut-down situation.

•Stress releaving of the electrodes over time isdimensionally contained

• Separator shrinkage in the „feeding direction“ is

GREATER OUTPUT

• The wound stack process provide a troughput atl t 2 ti f t th t diti l t k Separator shrinkage in the „feeding direction is

intrinsecally overcome by the cell design.least 2 times faster than any traditional stack process

• Continuous product flow vs the intermittent flow willprovide more stable and capable output

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KEMET Electronics ItaliaASSEMBLY PROCESS FLOWTABS TRIMMING & CURRENT COLLECTORS WELDING

• Flexible assembly process (for different foor print and thickness)• High cell placement accuracy (Cpk > 2)• Robots & visual inspection features for cell alignment• Robots & visual inspection features for cell alignment• Ultrasonic welding process for tab to current collector welding• Machine designed uptime = 100%• In Line SPCe S C• Incoming material Bar Code reader

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KEMET Electronics ItaliaASSEMBLY PROCESS FLOWSOFT PACK HALF-SHELLS FORMING, CELL INSERTION AND SOFT PACK SEALINGAND SOFT PACK SEALING

• Flexible assembly process (for different foor print and thickness)• High cell placement accuracy (Cpk > 2)• Robots & visual inspection features for cell alignment• Robots & visual inspection features for cell alignment

• “Deep Drawing” Cold forming process• Soft pack sealing based on “Fixed Gap” sealing processSo t pac sea g based o ed Gap sea g p ocess• In Line SPC• Bar code printing• Incoming material Bar Code reader

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KEMET Electronics ItaliaASSEMBLY PROCESS FLOWELECTROLYTE FILLING & SEALING

• Electrolyte filling in vacuum chamber• Different dispensing cycles available for customisation (recipes for

process aparameters recording)process aparameters recording)• Multiple cell filling station• Pre-post filling cell weight control• Different cell handling (from trays, in-line,…)e e t ce a d g ( o t ays, e, )• In Line SPC• Bar code reader for data traceability & Batch control

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KEMET Electronics ItaliaASSEMBLY PROCESS FLOWSOFT PACK DEGASSING AND FINAL SEALING

• Degassing in vacuum chamber• Multiple cell degassing station• Sealing process based on fixed Gap method• Sealing process based on fixed Gap method• Different cell handling (from trays, in-line,…)• In Line SPC• Bar code reader for data traceability & Batch controla code eade o data t aceab ty & atc co t o

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KEMET Electronics Italia

ELECTRODE NOTCHINGELECTRODE NOTCHINGELECTRODE UNWINDINGELECTRODE UNWINDING•• Electrode unwinding from reel with adjustable tension controlElectrode unwinding from reel with adjustable tension control•• Maximum reel weight of 100 KgMaximum reel weight of 100 Kg•• Electrode edge alignmentElectrode edge alignment

M l l t d li iM l l t d li i•• Manual electrodes splicingManual electrodes splicing•• Splicing detection & flag detection systemSplicing detection & flag detection system

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BACKElectrode unwinding

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KEMET Electronics ItaliaNOTCHING TOOL NOTCHING TOOL

•• Single side notching die and single rewindingSingle side notching die and single rewindingR i t i t f d / th dR i t i t f d / th d

ELECTRODE NOTCHINGELECTRODE NOTCHING

•• Recipe storing system for anode / cathode Recipe storing system for anode / cathode handling on single machinehandling on single machine•• Easy tool changeoverEasy tool changeover

•• Flexibility of the electrode notching process. No Flexibility of the electrode notching process. No tool changeover is required for settled product tool changeover is required for settled product rangerange•• Notching tool stroke setteable on the HMI, no Notching tool stroke setteable on the HMI, no g ,g ,manual adjustmentmanual adjustment

•• Lubricant system for Aluminum foil cutting Lubricant system for Aluminum foil cutting availableavailable

Notching

availableavailable

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BACK

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KEMET Electronics Italia

Anode electrode

tti dDuring anode insertion is

t ti ll t d th

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cutting and feeding

automatically generated the increased gap between consecutive monocells.

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KEMET Electronics ItaliaExternal electrodes are placed on the inner electrode. High resolution encoders are used to control the

Upper cathode cutting and feeding

placement accuracy

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KEMET Electronics Italia

Monocell assembly

The increase gap lenght ist ll d d i th t l

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controlled during the centralelectrode introduction, andcan be set from the HMI

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KEMET Electronics Italia

LaminationLamination

Parameters can be adjusted:

Temperature

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- Temperature- Pressure- Gap

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KEMET Electronics Italia

In line SPC

A5A5

A2 A3

Gap2

W Cathode W Anode

p

• For each monocell different parameters aremeasured• All the measured value are stored into an Excel file

A1 A4

Gap1• Image saving option available (to save the scrapproduct images)• If one parameter fail, the strip is sorted out

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A1 A4

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KEMET Electronics ItaliaKEMET Electronics Italia

Winding

Strip alignment based onVision System inspection

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Vision System inspectionand servo driven frictionedroller

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KEMET Electronics Italia

A KEMET Company

Progressive Gaps

P C bilit f M ll G

Single GapLSL USL

Process DataLSL 2,60000Target *USL 3,20000 B/W C apability

B/WOverall

Process Capability of Monocell Gap

Sample N 419StDev (Between) 0,06756StDev (Within) 0,00000StDev (B/W) 0,06756StDev (O v erall) 0,06584

USL 3,20000Sample Mean 2,87874

C C pk 1,48

O v erall C apability

Pp 1,52PPL 1 41

C p 1,48C PL 1,38C PU 1,58C pk 1,38

5 0

Progressive Gaps

3,203,123,042,962,882,802,722,64

PPL 1,41PPU 1,63Ppk 1,41C pm *

5,0

4,5

4,0

3,5

3,0

O bserv ed PerformancePPM < LSL 0,00PPM > USL 0,00PPM Total 0,00

Exp. B/W PerformancePPM < LSL 18,50PPM > USL 0,99PPM Total 19,49

Exp. O v erall PerformancePPM < LSL 11,51PPM > USL 0,53PPM Total 12,05

mm

3,0

2,5

2,0

1,5

1,0

Progressive Gaps

29 Gap 8Gap 7Gap 6Gap 5Gap 4Gap 3Gap 2Gap 1

1,0

0,5

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KEMET Electronics Italia

A KEMET Company

TAB TRIMMING & WELDINGTAB TRIMMING & WELDING R b tTAB TRIMMING & WELDING TAB TRIMMING & WELDING Robot

Back

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KEMET Electronics Italia

A KEMET Company

SOFT PACK FORMING d SEALING MACHINESOFT PACK FORMING d SEALING MACHINESOFT PACK FORMING and SEALING MACHINE SOFT PACK FORMING and SEALING MACHINE

Cell trimming

Side Sealing

Ink Jet PrintingPrinting (Bar code)

Cell Unloading in trays

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KEMET Electronics Italia

KEMET El t i It li S lKEMET Electronics Italia S.r.l.A Kemet Company

Via San Lorenzo, 19

I - 40037 Sasso Marconi (BO) Italy

Claudio Lanciotti

R&D Product Manager

Phone (+39) 051 939111

Fax (+39) 051 842890

[email protected]

Phone (+39) 051 939460

32www.kemet.com