Dektak 150 Brochure

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Dektak 150 Surface Profiler High-Performance, Versatility and Value • Exceptional Performance • Enhanced Ease of Use and Analysis • Vast Application Versatility think forward

Transcript of Dektak 150 Brochure

Page 1: Dektak 150 Brochure

Dektak 150 Surface Profiler High-Performance, Versatility and Value • Exceptional Performance

• Enhanced Ease of Use and Analysis

• Vast Application Versatility

think forward

Page 2: Dektak 150 Brochure

The Dektak® 150 Surface Profiler is the culmination of four decades of stylus profiler technology innovations. It provides repeatable, accurate measurements on varied surfaces, from traditional 2D roughness surface characterization and step height measurements to advanced 3D mapping and film stress analyses. With its small footprint, latest generation technology and extensive add-on capabilities, the Dektak 150 enables superior performance, versatility and value for industry and research engineers.

The Industry Standard■ StandardZrangeof1millimeter

enableslargerstepmeasurements

■ OptionalD150+low-noiseelectronicsprovidesindustry-best4-angstromrepeatability

■ OptionalX-Yautomatedstagedeliversprogrammabilityofover200locations

■ Optionalchucksaccommodatediversesamplerequirements,eg.,squaresolarcells

■ Castaluminumframeandrigidsupportelementsdrasticallyimproverepeatabilityandlowernoisefloor

Dektak 150 with 200mm Wafer SupportUnmatched Performance and Versatility

3DimagingwithMicroForm™revealsdetailsofhybridglassreplicas.ImagecourtesyofINO.

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EXCEPTIONAL PERFORMANCE

TheinnovativedesignoftheDektak150accommodatessamplesupto90millimetersthick,performssinglescansupto55millimeters,andprovidesalargeX-Ytranslationtocoverfull6-inchwafers.Withthescan-stitchingpackage,thesystemcanperformlongerscans,upto150millimeters,forstressmeasurementsonwafersandflatsurfaces.

TheLow-InertiaSensor3(LIS3)headincorporateskeytechnologyadvancestodeliverextremelyaccuratemeasurementswithunprecedentedsensitivity.Thesystem’s1-millimeterstandardverticalrange,coupledwithupto120,000datapointsperscan,deliverexceptionalcapability.Theresultofallthesefeaturesisunsurpassedhorizontalandverticalresolution,enablingpreciseplanarityscansformeasuringradiusofcurvature,flatness,waviness,andthin-filmstressonwafers.

TheDektak150alsohasacompletesuiteofhardwareandsoftwareoptionstosuitspecialscanningrequirements:

■ Forsteepslopes,thenewMicroForm™technologyrevealsdifficultshapesandimprovesaccuracytowithin0.25degrees

■ Alow-forceN-Liteoptionwithstylussensitivityto0.03milligramsenablesnon-destructivecharacterizationofdelicatesurfaces

ENHANCED EASE OF USE AND ANALYSIS

TheWindows®XPsoftwareinterfaceallowstheoperatortoquicklybecomeaDektakexpert.Analysisfunctionsarebothcomprehensiveandintuitive,fromsimpleone-buttonload-and-gotestingtoautomaticcomparisonsofanalyticalresultsfrommultiplescans.Additionalanalysiscapabilitieshavebeenadded,suchashistogramandadvancedautomationprogramsummaryforpass/failanalysis.Bruker’sVision®analysissoftwarefurtherextendstheusefulnessofthedata,enablingtrue3Dmapping,bearingratio,andover200additionalanalyses.

High-resolutionlongscansupto55mm(150mmwithstitching)enablecurveandpost-processstressmeasurements.

TheexclusiveStepDetectionfeatureautomaticallylevels,detectsandmeasuresmultiplestepsinasinglescan,aswellasprovidesanaverageofallthesteps.

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VAST APPLICATION VERSATILITY

TheDektak150isavailablewiththreeconfigurationstopermitthebestpossiblematchtoyourresearchorindustryapplication:

■ Thestandardmodelutilizesarobust100x100-millimeterX-Ystagewithmanualthetaforstraight-forward,simplemeasurements

■ Thesystemcanbeequippedalsowitha150-millimeterX-Ymotorizedstagethatfacilitates3Dmapping,automationandprogrammabilityofover200samplesites

■ Anoptional6-inchsquare,porouschuckenablescomprehensivesamplecharacterizationforphotovoltaicapplications

Otherfeaturesthatenhancethesystemforspecificapplicationneedsincludewaferalignmentpinsforeaseofuse,three-pointsuspensionforstress,lateralcalibrationfor99.9%accuracy,andalargescanblockforimprovedbaselinestability.

Whateveryourapplication,wecanconfigureasystemtomeetyourspecificrequirements:

■ Metaletchuniformityonwafers

■ Solarcellfingerwidthandheight

■ Thin-filmstresscalculations

■ Transparentfilms/photoresistthickness,thin-andthick-filmmeasurements

■ Large-stepMEMScharacterization

■ Microlensheight/curvatureandV-groovedepthanalyses

■ Roughnessstudiesonmachinedparts

■ Asphericlenscharacterization

■ Surfacequalityanddefectreview

■ Highaspectratiotrenchdepthmeasurements

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DEKTAK 150 SpEcificATionS

Note:Performancespecificationsaresubjecttochangewithoutnotice.VisittheBrukerwebsiteformostup-to-datespecifications.*ConsultFactoryfordetails.

Frontcoverimages:Dektak150providesdetailedmeasurementformanymaterials,including(fromtoptobottom)aC-Sisolarcell,amicrolens,andapcbboard.

SYSTEMMeasurement Capability Two-dimensional, contact surface profile measurementsSample Viewing 640x480-pixel (1/3in.-format) camera, USB; Fixed magnification, 3mm HFOV (180X with 23in. monitor); Optional manual zoom, variable 0.67 to 4.29mm HFOV. (720X to 120X with 23in. monitor)Stylus Sensor Low-Inertia Sensor (LIS 3)Stylus Force 1 to 15mg with LIS 3 sensor; 0.03 to 15mg with N-Lite sensor optionStylus Options Stylus radius options from 50nm to 25µm; High Aspect Ratio (HAR) tips 10µm x 2µm and 200µm x 20µmSample Stage Manual X/Y/�, 100 x 100mm X-Y translation, 360° rotation, manual leveling; Optional X-Y auto stage, 150mm travel, 1µm repeatability; Optional 200mm wafer vacuum chuck; Optional 6-inch square porous vacuum chuck for photovoltaic applicationsComputer System Bruker-qualified Dell workstation with 24/7 support lineSoftware Dektak software running under Windows® XP; Step Detection software (std.); Optional Stress Measurement software; Optional 3D Mapping with Vision analysis software; Optional Stitching softwareVibration Isolation Optional vibration isolation table; Optional table-top vibration isolation systemPERFORMANCEScan Length Range 55mm standard; up to 150mm with stitching optionData Points Per Scan 120,000 maximumMax. Sample Thickness Up to 90mm, depending on configurationMax. Wafer Size 150mm (200mm with Advanced Automation Package)Step Height Repeatability ≤6Å (D150); ≤4Å (D150+ option); 1 sigma on 0.1µm stepVertical Range 524um (1mm optional)Vertical Resolution 1Å max. (at 6.55µm range)ENVIRONMENTTemperature Range Between 20 and 25°C (68 to 77°F)Humidity Range ≤50% ±20°C, non-condensingFACILITY REQUIREMENTSInput Voltage 100 to 120VAC/200 to 240VAC, 50 to 60HzDimensions 292mm W x 508mm D x 527mm H Weight 34kg (75lbs.)Certification CE, NRTL, S2, S8*, China RoHS, EU RoHS*

WorlDWiDE cuSTomEr SupporT from ThE inDuSTry lEADErBruker Corporation is a leading provider of high-performance scientific instruments and solutions for molecular and materials research, as well as for industrial and applied analysis. For more information, visit www.bruker.com, email [email protected], or call +1.520.741.1044/800.366.9956.

© 2010 Bruker Corporation. All rights reserved. MicroForm is a trademark of Bruker Corporation. Dektak and Vision are registered trademarks of Bruker Corporation. All other trademarks are the property of their respective companies.

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