Defining The Future Through Partnerships · Process Package Thickess Body Size in mm Lead-Pitch...
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v4 May 10, 2018 Defining The Future Through Partnerships
Transcript of Defining The Future Through Partnerships · Process Package Thickess Body Size in mm Lead-Pitch...
v4 May 10, 2018
Defining The Future Through Partnerships
1. About Us
2. Business Units
3. Customers
4. Quality
5. Markets & Applications
6. Team
7. Value Proposition
Agenda
Defining The Future Through Partnerships
The Valingro Group
Defining The Future Through Partnerships
Valingro builds Businesses that transcends time
Presence in Semiconductor Packaging & Design, IC Test Engineering, Engineering & Consultancy, Life Sciences, Enterprise IT, Trading-Farming, Leadership Development
Valingro’s Mission is “Perfecting & Growing global deliveries while promoting a Values’ based Society”
Natronix is an esteemed member of the Valingro Group
▪ Headquartered in Singapore ; Privately held
▪ Promoted by experienced Semiconductor Professionals
▪ Providing OSAT (Outsourced Semiconductor Assembly & Test) & Design services
focusing on complex solutions to global Semiconductor companies
▪ Resounding Vision to be one-stop solution for Customers’
Semiconductor needs from Design to Package Assembly & Test
▪ N-Sg Promoters hold 60% of SPEL-India shares, planned further
acquisitions of OSATs across APAC, Japan & USA
About Natronix
Defining The Future Through Partnerships
Vision
To be the Natural Destination for Global Customers
seeking cost-effective OSAT & Design services.
Mission
Achieve Zero defect, Just-in-time, Cost-effective solutions with Service that is
uncompromised.
Our Partners ➔ Customers, Suppliers, Employees & Shareholders are
confident in the knowledge that we are consistently meeting and exceeding
their expectations.
Vision & Mission
Defining The Future Through Partnerships
Values & CO’s
Values
1. Business Ethics - defines us as a Company
2. Professionalism - defines us as Individuals
3. Citizenship - defines our contribution to Society
Corporate Objectives
1. Profit - earnings that enable achieving our other 4 objectives
2. Client satisfaction
3. Competence
4. Employee satisfaction
5. Growth
Defining The Future Through Partnerships
• Introduction
• Business Units
1. OSAT
a. SPEL-India
b. Acquisitions – APAC, Japan, USA
2. D&V
Business Units
Defining The Future Through Partnerships
Natronix has 2 Business Units – OSAT and D&V
Natronix
OSAT
SPEL-India
APAC, Japan, USA
D&V
Singapore India
OSAT
• 28 years experience in OSAT Industry
• Acquired 56% shares in SPEL-India, a
major OSAT Company in India
• Planning strategic OSAT acquisitions in
APAC, Japan, USA to have a global
footprint & presence in all major
Semiconductor Ecosystems
D&V
• Natronix planned to provide Design &
Verification services – Offshore & Onsite
• Singapore Design centre to cater to
Global Chip Companies demand on
Design
• Strategic Acquisition of existing Design
Companies planned
Business Units
Defining The Future Through Partnerships
▪ SPEL-India is a IC Assembly & Test Company located in Chennai, India
▪ India’s first OSAT company & 100% export oriented
▪ Global Customers across US, Europe, India & APAC inclusive of Companies within
Top 10 Semiconductor ranking
▪ Established Customers serving wide range of application segments like 3Cs,
Automotive, Medical, Industrial, Military & Aerospace
▪ ISO 9001, ISO 14001, IATF 16949 & SONY Green Partner Certified
0000000
SPEL-India
Defining The Future Through Partnerships
SPEL-India Services
Full Turnkey• Wafer Sort
• 8inch capability
• Assembly• Leaded SMD & QFN
• Testing• Digital, Analog, Power & Mixed Signal
• Packing• Tube, Reel & Tray
Value Added• Package Design
• Custom QFN packages
• Lead frame design• QFN & Leaded etch tools
• FA & Reliability
• Test Program Development
• Product Characterization
• Drop shipments
Defining The Future Through Partnerships
• Bonding Diagram creation
• In-house etch lead-frame
Design capability
• New Package Tooling
• Assembly & Test Yield
reporting
• DOE / Wire-bond
Characterization
• Die Bank (N2 purged)
• 12inch wafer capability
from Wafer Dicing
• ROHS Compliant & Green
Packages
• Smallest Package –0.6 x 1.0 x 0.4
• Consigned Testers option
QFN
Cap
abili
ty ProcessPackage Thickess
Body Sizein mm
Lead-Pitch Lead-Count
Saw SingulatedQFN / DFN
0.40 mm0.50 mm0.75 mm0.90 mm
0.6 x 1to
12 x 12
0.40 mm0.50 mm 0.65 mm
4 ~ 156 pins
Test
Pla
tfo
rms
PAC
KA
GE 150 MIL ; 300 MIL SOIC
150 MIL QSOP ; VSOP
173; 240 MIL TSSOP
300 MIL SSOP
150 MIL MILLIPAQ
300 MIL PDIP
225 MIL SIPLE
AD
CO
UN
T 7/8/14/16; 16/20
16/20/24/28; 40/48
8/20/24/38; 48/56/64
48/56
80
8/14/16
8
JED
EC
STA
ND
AR
D MS-012 ; MS-013
MS-137 ; MS-154
MO-153
MO-118
MO-154
MS-001
NA
Lead
ed
TEST PLATFORM
Credence ASL 1000
Eagle ETS 364 / 88 Verigy 93K / V50
DIGITAL
MIXED SIGNAL
ANALOG
Package Portfolio
Defining The Future Through Partnerships
Package Roadmap / Capacity
Existing
CU
Leaded Package QFN / DFN
Planned
2018-21
FC-QFN
Package Category
Leaded
QFN / DFN
Capacity / Month
(Mln Units)
10
30
Remarks
20 lead Equivalent
3 mm Equivalent
26% of Total Capacity
is available for Copper
Bonding
Defining The Future Through Partnerships
High Density QFN BGA
OSAT Acquisition
Management Vision
Complementing Package
Capability
Inorganic Revenue
Growth Plan
Low Cost Funding
Natronix – Global OSAT Company
Natronix expects to achieve the
following through Acquisition of
existing OSAT Companies in APAC,
Japan, USA
1. New Packaging Technologies
like Wafer Bumping, WLCSP,
BGA & MEMS
2. Quick Revenue Scaling
3. New Customer wins
4. Existence in Major
Semiconductor Ecosystems
OSAT Acquisition
Defining The Future Through Partnerships
WLCSP• Wafer Bumping with
Technology Licensing
• WLCSP Backend
MEMS
• Access to New Technologies
• Market presence in Handheld Consumer Electronics & Automotive
Gullwing/QFN
• New Customer engagement
• Complementing Packaging/Testing Capability
OSAT Acquisition Goals
Defining The Future Through Partnerships
Package Roadmap
Defining The Future Through Partnerships
2018-19
2019-20
2020-21
Design & Verification
• Analog behavioral model generation, validation
• Analog IP deliverable management (Functional, logical, physical, power intent, reliability and packaging)
• Functional, reliability and electrical analysis
Analog
• RTL design & development
• Functional verification (GLS)
• Power intent & low power (power managed) implementation
• Clock and reset handling
• Timing and functional analysis (STA, SSTA)
• Physical Design
• DFT
Digital
• Mixed signal IP and SoC integration
• Multiple power and voltage domains
• Analog Mixed Signal co-simulation and verification
• Digital Mixed Signal verification for fast and early functional sign-off
Mixed Signal
Defining The Future Through Partnerships
Design & Verification
Front End Design
Methodology and flows for
DSM nano scale challenges
• Synthesis for Performance, Power & Area closure
• Gate-Level Verification & Equivalence Check
• SP&R for Performance, Power & Area closure (Physical D&V,
• DFM, DFT, STA)
• Post-P&R Verification & Equivalence Check
• Custom analog layout
Back End Design
Methodology and flows for
SoC & ASIC design
• Digital Design & Consulting
System Verilog RTL
development
• System Verilog & UVM
based functional verification
• Formal Verification
Defining The Future Through Partnerships
Customers
Defining The Future Through Partnerships
Quality
• Our Quality consciousness starts from incoming material and follows through
process until device reliability in final application
• The robust in-house Quality control procedures ensures excellent Assembly
Yield and no field failures
• Have the following Quality Certifications :
✓ ISO 9001:2015
✓ IATF 16949:2016
Defining The Future Through Partnerships
Customers By Region
India – 1%
APAC/Japan–19%
Europe – 30%
USA – 50%
`
Singapore HQ / India Factory / US Sales Office
Sales Reps
Defining The Future Through Partnerships
Customers by Application
Defining The Future Through Partnerships
0
10
20
30
40
50
60
70
80
90
2014-15 2015-16 2016-17 2019-20
90
80
70
30
10
20
30
70
3Cs
Non 3C
Target
3Cs – Computing, Communications & Consumer Electronics
0.9 2.8 3.4
7.9
84.9
Military &Aerospace
Automotive
Medical
Industrial
3Cs
Current
Team
▪ Design Engineers with wide Domain expertise & experience
▪ Technically qualified Operators & Technicians
▪ Skilled engineers & experienced Management
▪ Low attrition rate (< 6%). Developed second-in-line in all Functions starting from
Supervisor levels
▪ Strong engineering database ensures that any attrition will not affect any process
▪ Over 55% of the Employees have over 15 years of service
▪ Low direct labor cost & Management provides various Employee welfare schemes as a
motivational activity through Employee Welfare Committee
▪ Training Cell providing comprehensive training (including Customer Loyalty & Soft-skills)
to all levels, at regular intervals & conducts tests to ensure capability
▪ Talent pool available from Local universities with electronics/semiconductor background
Defining The Future Through Partnerships
• Procedures & processes ensure recruitment & deployment of people right mix
• We are an equal opportunity Employer
• All recruitment decisions are made on basis of merit only
Hiring
• Aligning skills of people with current job needs
• Developing people for enhanced future roles through training
• Aim to enable our people to acquire right skills & attributes
Training & Development
• Policies at our organization aim to attract, motivate, recognize and retainprofessional staff members
• Internal equity, market competitiveness and high performance are 3 fundamentalprinciples of our remuneration policies
• Performance management system helps individuals in investing their efforts in rightdirection
Retaining / Career growth
Hiring, Training & Career Growth
Defining The Future Through Partnerships
• The organization constantly reviews the environmental policy, environmental
management programs, adheres to various environmental regulations and
works toward continual improvement of the Environment Management system
in all its manufacturing locations.
• The management and employees are committed to prevent and abate pollution
and adopt various control measures in conserving energy and all natural
resources.
• SPEL’s manufacturing location is surrounded by more than 1,000 trees,
abundant greenery including plants, lawns, vegetation area for in-house
consumption.
• ROHS (Restriction of Hazardous Substances) compliance as per EU directive,
effective from July 01, 2006
• Molding - using Green Compounds
• Plating of Terminals - 100% Pb-Free matte Sn plating or NiPdAu finish
Environmental Care & ROHS
Defining The Future Through Partnerships
S-E-C is primarily done by One-to-One Mentoring as each person encourages &
motivates the other, towards a more purposeful & effective lifestyle. Towards this,
there are 3 areas that each of us can assist by making these a part of our day to
day approach :
1. Following discipline in any and everything we do
2. Providing a helping hand to people around us in any way we possibly can
3. Showing the right path forward to people around
Socio Economic Contribution
Defining The Future Through Partnerships
1. Growth established in Lead-frame based OSAT
a. Continuous increase in Revenue and Volume
b. Instrumental in bringing Technology driven products like QFN
c. Instrumental in bringing Kaizen, 5S, Lean Manufacturing Concept
2. Competing Globally
Company has spread their service beyond USA. Customers are spread in
APAC, Europe and Japan
3. Track record
Track record has been established with all.
• Customer Satisfaction
• Vendors
• Employees
• Bank
• QCDS factors
4. Having required Base to Grow Beyond
With the relationship that been established with Stakeholders – Customers,
Vendors, Investors & Employee, Promoter can take the company to greater
heights
Proven Track record
Defining The Future Through Partnerships
Value Proposition
▪ Focused Customer solutions and partnerships
▪ Excellence in Time to market & Low cost products
▪ Absolute Quality assurance
▪ Streamlined manufacturing process
▪ Work per Customer’s needs
▪ Hard working & talented work force
▪ Established Infrastructure & proven track record
▪ 100% Customer Satisfaction
▪ More than 2 decades experience in OSAT business
▪ Global Company provides complete solution in Package
Assembly/Test & Chip Design
▪ Uncompromised assistance to Customers in various avenues
Defining The Future Through Partnerships
Contacts
Defining The Future Through Partnerships
Singapore USA Europe India
Address
23-12 Tong Eng Bldg., 3101 Cecil Street
4030 Moorpark Ave #236
Alfonsstrasse12, Kirchcheimm
5 CMDA Industrial Estate
Singapore San Jose Germany MM Nagar (Chennai)
069533 CA 95054 D-85551 603209
eMail [email protected] [email protected] [email protected] [email protected]
