Defining The Future Through Partnerships - NatronixDefining The Future Through Partnerships ty...

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Defining The Future Through Partnerships

Transcript of Defining The Future Through Partnerships - NatronixDefining The Future Through Partnerships ty...

  • Defining The Future Through Partnerships

  • Defining The Future Through Partnerships

    Content

    ➢ SPEL Overview

    ➢ Capability & Capacity

    • Technology

    • Equipment

    • Process capability

    • Capacity and expansion plans

    ➢ Quality Systems and procedures

    • Quality Focus

    • SPC

    • PCN Implementation Systems

    • Best Known Methods / Fan-Out

    • Corrective Action System

    ➢ Continuous Improvements

    • Equipment Automation-Investment Plan

    • Auto Recipe of Bonding diagrams

    • Bar code System

    • Continuous Improvements – Cu wire Bonding

    • OCAP

  • Defining The Future Through Partnerships

    The Valingro Group & Natronix

    Valingro builds Businesses that transcends time

    Presence in Semiconductor Packaging & Design, IC Test Engineering, Engineering & Consultancy, Life Sciences, Enterprise IT, Trading-Farming, Leadership Development

    Natronix is an esteemed member of the Valingro Group

    N-Sg Promoters hold 60% of SPEL-India shares, planned further acquisitions of OSAT across APAC, Japan, USA

  • Defining The Future Through Partnerships

    About SPEL

    • First IC Assembly & Test facility in India

    • IPO company listed in Bombay Stock Exchange (BSE), India

    • Commenced commercial production in 1989

    • ISO 9001, ISO 14001 & IATF (TS) 16949 Certified

    • 100% Export Oriented – Tax incentives & Easy logistics

    • Customer covering major application segments which includes Computing,

    Consumer electronics, Communication, Automotive, Aerospace & Industrial

  • Defining The Future Through Partnerships

    OSAT Services

    Full Turnkey Solutions

    • Wafer sort

    • Assembly

    • Testing & Packing

    Value Added Services

    • Package design

    • Lead frame design

    • Failure analysis & Reliability testing

    • Test Program Development & Product Characterization

    • Drop shipments across the globe

  • Defining The Future Through Partnerships

    Infrastructure

    ▪ 8 Acres campus

    ▪ 350+ Employees

    ▪ Daily production capacity of 1Mln units of QFN’s and leaded

    packages

    ▪ Copper wire package capacity – 25% scalable to 50% in 6 weeks

    time

    ▪ 100% Power back up

    ▪ Land area available for future expansion

  • Defining The Future Through Partnerships

    Technical Capability

    • Package & Process capability

    • Equipment capability

    • Technology – Existing

    • Technology – Roadmap

    • Facility Infrastructure

  • Defining The Future Through Partnerships

    QFN

    Cap

    abili

    ty

    ProcessPackage Thickess

    Body Sizein mm

    Lead-Pitch Lead-Count

    Saw SingulatedQFN / DFN

    0.40 mm0.50 mm0.75 mm0.90 mm

    0.6 x 1to

    12 x 12

    0.40 mm0.50 mm 0.65 mm

    4 ~ 156 pins

    Test

    Pla

    tfo

    rms

    PAC

    KA

    GE 150 MIL ; 300 MIL SOIC

    150 MIL QSOP ; VSOP

    173; 240 MIL TSSOP

    300 MIL SSOP

    150 MIL MILLIPAQ

    300 MIL PDIP

    225 MIL SIP

    LEA

    D C

    OU

    NT 7/8/14/16; 16/2016/20/24/28; 40/48

    8/20/24/38; 48/56/64

    48/56

    80

    8/14/16

    8

    JED

    EC

    STA

    ND

    AR

    D MS-012 ; MS-013

    MS-137 ; MS-154

    MO-153

    MO-118

    MO-154

    MS-001

    NA

    Lead

    ed

    TEST PLATFORM

    Credence ASL 1000

    Eagle ETS 364 / 88 Verigy 93K / V50

    DIGITAL

    MIXED SIGNAL

    ANALOG

    Package Portfolio

  • Defining The Future Through Partnerships

    Process Capability▪ Wafer Probing – Max 8 “ Wafers

    ▪ Wafer Back grind – Max 8 “ Wafers

    ▪ Die size handling : 10 Mils square Min

    ▪ 12” wafer assembly capability (Dicing / Die Attach)

    ▪ Epoxy screen print capability (Wafer backside coating – Max 8” Wafers)

    ▪ Copper wire bonding (Bare Cu & Pd Coated) – 0.8 mil to 2.0 mil

    ▪ Wire Bond Pad Pitch : 40 microns

    ▪ Low loop bonding : 4 mils

    ▪ Ultra Thin packages : 0.4mm

    ▪ Fan in type QFN : 156L 12x12

    ▪ Wafer mapping at Die Attach

    ▪ Multi-die package assembly

    ▪ Saw QFN

    ▪ 100% Pure tin and 85%:15% Tin:Lead plating

    ▪ Multi-site Test capability (up to Octal site)

    ▪ Strip Testing feasibility for QFN

    ▪ Die bank capability with N2

  • Defining The Future Through Partnerships

    Minimum Wafer Thickness• 8 Mils for 8-inch wafers

    • 6 Mils for 6-inch wafers

    Wafer Diameter• 4 inches ~ 8 inches

    • 12 inch – Capability by Q1”2016

    Material & Ink Thickness• Wafers – Silicon, SOI (silicon on insulator)

    • Wafers with bumps, ink can be processed

    Wafer Back-grind

  • Defining The Future Through Partnerships

    Minimum Wafer Thickness

    • 10 Mils for 12-inch wafers

    • 8 Mils for 8-inch wafers

    • 6 Mils for 6-inch wafers

    Wafer Diameter

    • 4 inches ~ 12 inches

    Material & Surfactant

    • Wafers – Silicon, SOI (Silicon on Insulator)

    • Surfactant mixing capability as per Customer requirements

    Wafer Saw

    Minimum scribe line –

    50µm

    Shuttle Wafer with multi-

    dies / multi-index

    Wafers with Au/Ag Back

    metal

    Wafers with polish back

    and TTV < 10µm preferred

    Minimum die size – 10 x 10

    mils

    UV irradiation capability

  • Defining The Future Through Partnerships

    • Wafer backside coating capability

    • Used for COL (Chip on Lead) QFN

    • Conductive and Non-Conductive screen print adhesive options

    • Wafer size capability – 4” ~ 8” wafers

    • Customer to provide wafer flat / notch dimension particulars

    Wafer Backside Coating

  • Defining The Future Through Partnerships

    • In-house leadframe design capability

    • Open tool leadframes

    • Semi-closed tool for leaded packages subject to Customer investment

    • Closed tool for Leadless packages (NRE charges payable by Customer)

    • All existing leadframes for QFN’s are of etched type.

    • Plating options – NiPdAu Preplated finish (PPF) or Ag plated Copper

    leadframe (Spot silver / Selective Ring plating etc.,)

    • Leadframe material – A194, C7025 & EFTEC

    Lead-frames

  • Defining The Future Through Partnerships

    • Wafer diameter – 4” ~ 12”

    • Inked wafers & Inkless die attach (Preferred format is ASCII)

    • Conductive / Non conductive epoxy, Dispense / B-stage epoxy.

    • Minimum die size – 10 * 10 mils & Maximum die size – 300 mils sq

    • Wafers with back metal can be processed

    • Shuttle Wafers ( with multiple devices ) can be handled.

    • Multiple dies in single die pad

    Die Attach

  • Defining The Future Through Partnerships

    Die edge to Package edge – 10 Mils min clearance

    Chip on Lead

  • Defining The Future Through Partnerships

    • Used for MCM

    • Encapsulant material FP4451 for Damming

    • Encapsulant material FP4450 for Filling

    • Package Singulation using Saw

    DIE ATTACH

    WIRE BONDING

    DAMMING FILLER CURING SINGULATION

    Dam & Fill

  • Defining The Future Through Partnerships

    • Wire dia handling capability – 0.8 mils to 2.0 mils in both Au & Cu wire

    • Bond pad pitch – 40 Microns

    • Min metallization thickness – 0.8 Microns (TiW barrier layer)

    • Maximum pin count handled in Cu wire – 64 wires for leaded and 72 wires for QFN packages.

    • Maximum dies per package handled in Cu wire – 4 dies

    • Die to Die bonding (Bond stitch on Ball)

    • Leadframes – Both Ag/Cu and PPF leadframes

    • Capable of handling Low K and Devices with CUP

    • Staggered bonding

    • Plasma cleaning capability with Ar-H2 Mix gas

    Technical CapabilitiesWire Bonding

  • Defining The Future Through Partnerships

    WB Process Characterization

    Pro

    cess

    Ch

    ara

    cte

    rizati

    on

    Wire pull monitor

    Stitch pull monitor

    Ball shear monitor

    No bond pad crater & Pad peeling

    Ball diameter, height, aspect ratio

    Minimize Aluminium splash

    Visual criteria monitoring

    Minimum Aluminium Thickness

    Ball flatness

    Output Target ResponsesInput variables

    Bond parameters

    Efo Parameters

    Process gas flow

    Bond tool

    Bond wire

    Aux Parameters

    Special features

  • Defining The Future Through Partnerships

    • Two stage Build Sheet verification

    • Colour coded Traveller & Build sheet for Cu wire

    • Shelf / Floor life tracking system for bond wire to prevent oxidation

    • Tool life monitoring for bonding tool (Capillary) & used capillary retained by

    QC for future reference

    • Assembly Traveller lot # ends with suffix ‘C’ to denote Cu wire lot.

    • No rework is permissible at Wire bond

    • No capillary cleaning and re-use is permissible

    • Wire sweep at molding controlled less than 10%

    In-Process Checks

  • Defining The Future Through Partnerships

    WB In-Process Controls

    Material

    Preparation

    WB Machine

    Set upProcess

    Monitor

    Production

    Run

    Gas flow

    control

    Bond wire life

    tracking

    Bond tool

    selection &

    Tool life

    tracking

    Colour coding for Assy.

    Traveller and build sheet

    Bond parameter window

    control

    Wire

    Pull

    Ball

    Shear

    SPC

    monitor

    Bond Quality

    monitoring

    Online Inspection

    Pad Crater

    monitor

    Defects – Pareto

    Analysis and Yield

    improvement

  • Defining The Future Through Partnerships

    Existing

    CU

    Leaded Package QFN / DFN

    Planned

    2019-20BGAWLCSP

    Package Roadmap

    MEMSFC-QFN

    Package Type Capacity/Month Remarks

    Leaded 10 20 lead Equivalent

    Leadless (QFN / DFN) 30 3 mm Equivalent

  • Defining The Future Through Partnerships

    Process / Technology Road Map

    2019

    • High Density QFN Frame

    • QFN Lead-frame Taping

    • 12” Wafer Back-grinding

    • Flip Chip Die Attach

    2020

    • DBG Process

    • Punch QFN

    • DAF

    • Stacked Die

    • Copper Clip Attach

    2021

    • Wafer Bumping

    • Stud Bumping

    • Low K Wafers

    • BGA Ball Attach

  • Defining The Future Through Partnerships

    Capacity Expansion

    QFN/Gullwing Packages

    350Mln Annual Capacity

    25% capacity for Cu Wire scalable to 50% in 4weeks time

    Expansion in QFN, Flip-chip TDFN & BGA

    $15Mln Investment

    WB BGA & FC BGS Capability

    Expansion in WLCSP, MEMS & BGA

    Target 2Bln Annual Capacity

    2018

    2019

    2020-21

    More than 500M units of Copper wire shipped until Dec 2017

  • Defining The Future Through Partnerships

    Quality Focus

    • Quality methodologies are guided by International standards

    • Quality endeavour is to deliver best in high-class, defect-free solutions

    and services

    • Standardizing development activities to align with Customers

    requirements

    • Process robustness are built through ISO 9001:2008 standards

    accreditation

    • Zero Customer Return

    • Continuous Improvements through Industry Benchmarking

    • Effectively Implement PPAP, APQP, MSA, SPC & FMEA to ensure

    Outgoing Product Quality

  • Defining The Future Through Partnerships

    • Wafer back grind thickness

    • Saw kerf width

    • Die shear strength & Bond line

    • thickness

    • Wire pull & Ball shear (Au & Cu)

    • Wire Sweep

    • Co-planarity

    • Plating thickness

    SPC Monitoring

    • Mean – Range charts plotted

    • CpK Min – 1.67

    • CpK calculations done monthly

    • Review of UCL and LCL for

    continuous improvement

    • Auto alert system for abnormal

    trends

    • Data grouping done based on

    Customer / Machine / Package

    Process Characteristics Monitoring

  • Defining The Future Through Partnerships

    Engineering Controls

    • Tool life monitoring & Control: Wafer saw – Cut wheel Die attach – Ejector needle Wire bond – Capillary Trim & Form – Cutting &

    • QFN saw – Cut wheel

    • Design of Experiments – Bond Parameter validation

    • Equipment set up buy-off

    • Preventive & Predictive maintenance

    • Gage repeatability & reproducibility studies

    • Calibration control

    • Statistical Process control

    • FMEA – Design & Process

    • Pareto analysis

    Quality Controls

    • Shelf life monitoring (Epoxy,mold compound, Cu wire,Adhesive tapes – Wafer backgrind, saw, QFN singulationtape, cover tape)

    • 8D problem solving approach

    • Vendor ranking

    • Corrective action procedure

    • Material board review

    • Process change notification

    • Engineering change notification

    • Internal audit

    • ESD Checks & Controls

    • Environmental monitoring &control

    • Vendor / Material /Machinequalification

    Operational Controls

    • Thawing control (Silver epoxyand Mold compound)

    • Floor life monitoring (Silverepoxy, Cu wire, Moldcompound)

    • Error Proofing Techniques

    • Color coding for traveler – Goldwire bonding & Copper wirebonding ; Lead Vs Leadfreelots

    • Lot identification punch @ dieattach

    • QFN Leadframe map – Tosegregate process rejects

    • Test lot – tally summary

    • FIFO Monitoring

    • Operator certification

    Best Known Method / Fan Out

  • Defining The Future Through Partnerships

    The following are considered as Major changes and without Customerapproval no changes will be implemented with respect to copper wire bondprocess.

    • Change in Cu wire type or Cu wire manufacturer

    • Introduction of New model of wire bonder

    • Introduction of New wire bonding techniques

    • Changes in Forming gas nozzle design

    • Change in Leadframe supplier

    • Changes in Capillary profile or material

    • Change in die attach curing process

    • Change in Forming gas specification tolerance

    • Change in Process monitor specs or monitoring frequency (Wire pull, ball shear or bond pad crater)

    Process Change Notification

  • Defining The Future Through Partnerships

    PCN Flow - Major

    Drop the proposal

    Submit to Customer

    Yes

    Customer

    Approval

    No

    Revise the relevant

    documents and Train the

    operators

    Implement actual

    change

    Inform customer on Lot

    no, work week after

    implementing the change

    Run engineering

    lot by ED/QC

    Engineering Change

    proposal by

    ED/QC/Customer

    Prepare internal quality/

    reliability data and

    submit to QA for

    approval

  • Defining The Future Through Partnerships

    Prepare and submit

    internal quality/ reliability

    data for QA for approval

    Yes

    No

    Drop the proposal

    QA approval

    Engineering Change

    proposal by ED

    Run Engineering

    lot by ED

    Revise the relevant

    documents and Train

    the Operators

    Implement actual

    change

    Record the Lot no,

    work week after

    implementation

    PCN Flow - Minor

  • Defining The Future Through Partnerships

    FA Flow

    Start

    Visual Inspection Optical/SEMDecapsulation

    Bench confirmation on the test result

    Device Test @ Die level using micro probe

    Visual Inspection @ High Magnification

    CSAM Inspection (If required))

    X-Ray Inspection

    External Inspection

    Internal Inspection

    (Non –destructive)

    Internal Inspection

    (destructive)

    A B

    AA

    Failure confirmation in Tester & Bench

  • Defining The Future Through Partnerships

    SEM Inspection on the failure

    area (if required) Fix the root causes of the problem

    Issue CAR (Corrective Action Report) to

    Process Assembly / Test

    Prepare FA report

    Internal

    Inspection

    (destructive)

    C

    CB

    Wire pull test (if required)

    Ball shear test (if required)

    Implement the Internal & External

    containment actions

    Implement the error proof

    permanent corrective actions

    Verify the Implementation of the

    implemented corrective action

    Update FA Log

    Close the CAR

    End

    FA Flow (Cont..)

  • Defining The Future Through Partnerships

    CAS Flow

    Acceptance of complaint /

    feedback to the customer

    A

    No

    Yes

    Validity?

    B

    Form a Team & classify the nature

    of the complaint (Product / Process

    related or Documentation related)

    Do initial FAR (Visual inspection, X-

    ray inspection, electrical test if any,

    decapping etc. for products related).

    B

    A

    No

    Yes

    If the FAR results

    revealed the valid

    complaint?

    Raise internal CAR & log the details

    in the customer complaint status

    log.

    Customer

    C

    Quality Incident

    CAS Flow

  • Defining The Future Through Partnerships

    Implement the internal & external

    containment actions and Submit 3D

    report within 24 Hrs.

    Fix the root causes of the problem

    Implement the permanent corrective

    and preventive actions

    Verify the effectiveness of

    implemented corrective &

    preventive actions.

    Customer

    accepts

    8D report?

    Yes

    STOP

    Update Complaint Status Log

    C

    No

    Translate the findings of CAR in to

    8D report and submit 8D corrective

    action report to the customer within

    10 working days.

    CAS Flow

  • Defining The Future Through Partnerships

    Manpower

    • Technically qualified operators & technicians

    • Skilled engineers & experienced Management

    • Low attrition rate (< 6%). Developed second-in-line in all functions starting from

    Supervisor level

    • Strong engineering database ensures that any attrition will not affect any process

    • Over 55% of the employees have over 15 years of service with SPEL

    • Low direct labor cost & management provides various Employee welfare schemes

    as a motivational activity through Employee Welfare Committee

    • Training cell providing comprehensive training (including soft skill & Customer

    focus) to all level at regular interval & conducts test to ensure the capability

    • Talent pool available from Local universities with electronics/semiconductor

    background

  • Defining The Future Through Partnerships

    Logistics

    ▪ One Stop Turnkey Destination :

    Probe → B/G → Assembly → Test → T&R → Drop shipment

    ▪ Turnaround time

    ➢ Assembly 5 days with Linear Loading

    ➢ Testing : 2 days

    ➢ Fast Track Assembly in 2 days with Premium Charge

    ▪ Factory Schedule : 24 x 7

    ▪ Drop Ship to End-Customers

    ▪ Daily Direct Flights to US, Europe & Asia Pacific :

    ➢ 2 days Transit (Inbound / Outbound)

    ▪ STAR eWIP - an online Semiconductor Tracking And Resourcing Software for

    regular Customer WIP update

  • Defining The Future Through Partnerships

    Continuous Improvement

    • Periodic review and update Quality objectives of all functions

    • Internal audit review and focus on improvements

    • Customer audit review and implement appropriate improvements

    • Corrective and Preventive measures

    • Implementation of actions discussed during Management reviews.

    • Adopting Error proofing techniques (Poka-Yoke) in all Processes

    • More Focus on Quality, Cost, Cycle time & Customer service

  • Defining The Future Through Partnerships

    • In-house forming gas mixer plant

    • Barcode system for auto-download of WB recipe

    • Procurement of Wire bonders with advanced features (bond

    accuracy, lower wire dia handling, etc.) dedicated exclusively for Cu

    wire

    • In-house leadframe taping machine for QFN

    • High density leadframes for QFN packages

    Improvement plans

  • Defining The Future Through Partnerships

    Customers

    http://www.silabs.com/pages/default.aspxhttp://www.vishay.com/http://www.holtic.com/http://www.syrmatech.com/index.htmhttp://www.meticom.com/http://www.google.co.in/imgres?q=idt&um=1&hl=en&sa=N&tbo=d&biw=1366&bih=674&tbm=isch&tbnid=MVuQO7rWiUWT8M:&imgrefurl=http://www.ncomm.com/new_site/IDT/idt_drivers.htm&docid=6lnqlyJ1C9soYM&imgurl=http://www.ncomm.com/new_site/images/idt_logo_c.jpg&w=1200&h=600&ei=OnsgUeGQNInUrQeuw4GoBg&zoom=1&ved=1t:3588,r:15,s:0,i:141&iact=rc&dur=1559&sig=104375703950772084557&page=1&tbnh=154&tbnw=289&start=0&ndsp=16&tx=71&ty=60http://www.militaryaerospace.com/articles/2014/10/te-american-acquisition.html

  • Defining The Future Through Partnerships

    End Customers

    Customers

    Customer Audits

    http://www.google.co.in/url?sa=i&rct=j&q=sony&source=images&cd=&cad=rja&docid=EJAA6exDksRv_M&tbnid=r0taLRrSD6PhFM:&ved=0CAUQjRw&url=http://blogs.sonymobile.com/press-resources/&ei=taVbUd-EKI6zrAfzw4GgBA&psig=AFQjCNGwi3X94WFF1MbJeMHM4U3XEaaVsw&ust=1365047073693184http://www.pericom.com/index.phphttp://www.silego.com/http://www.bourns.com/Default.aspx

  • Defining The Future Through Partnerships