Datasheet MiniLab E
2
IBL-Löttechnik GmbH - Leading in Vapour Phase T echnology Messerschmittring 61-63 D-86343 Königsbrunn T el: +49-(0)8231-95889-0 Fax: +49-(0)8231-95889-30 [email protected] www.ibl-tech.com MiniLab Features • Ideal for prototyping laboratory tests and rework • Low operating costs and compact design • Easy handling with solder automatic and heater level adjustment • Designed for lowest fluid consumption incl. integrated heat exchanger to prevent drag out of liquid agent • Variable energy level set-up • Automa tic fluid level indicator • Stand by-mod e • Maintenance free tr ansport system (Patented) Modes of operation A simple variation of vapour phases soldering, generates different, nearly linear temperature profiles. Energy transfer is controlled by adjustable heating power. Heat Level Mode (HL-Mode) Overview The machine can operate in a time controlled sequence programmed by the user. It also can operate completely automatically. Then the time in the vapour chamber is shortened or extended automatically according to the mass to be soldered. Solder Automatic Economy Vapour Phase Soldering Machine for Laboratory / Small Scale Production Although the MiniLab requires a low footprint to install only, it has all features required to operate the system as a fully functional vapour phase soldering machine. The MiniLab was developed for small scale operation time and space. It is ideal for laboratory applications, prototyping and small production, as well as rework and quality tasks Standard Equipment / Specification •! Automatic loading and unloading of the carriers •! Observation window to the process chamber •! Integrated illumination of the soldering area •! Controlled heating chamber, no overheating (thermocouple checked) •! Integrated vapour level check •! Automatic fluid level check •! Integrated fluid recovery system •! Variable energy level control •! Maintenance free high-grade steel transportation system. (Patented). •! Automatic and time controlled soldering Options • Adapter for double sided PCB boards. • ReSy, a device for repair of QFP's and BGA's, (patented) • Stainless steel grid for the workpiece carrier • Chiller with closed loop machine cooling system Width 730mm Depth 600 mm Height 600 mm Weight 70 kg Maximum PCB size 300 x 275 x 80 mm Liquid agent filling (min) 2 kg Water connection 1/2” Max. heating capacity 1,8 kW Ø power consumption 0,8 kWh Power supply / main fuse 230 VAC, 2 kW / 16 A, Type “gL” or “C” Technical Data MiniLab Time Timer 1 Timer 2 Timer 3 Timer 4 Heating Power D1E122-Datasheet MiniLab E-120116 - T echnical changes reserved -
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Transcript of Datasheet MiniLab E
8/2/2019 Datasheet MiniLab E
http://slidepdf.com/reader/full/datasheet-minilab-e 1/1
IBL-Löttechnik GmbH - Leading in Vapour Phase Technology
Messerschmittring 61-63 D-86343 Königsbrunn Tel: +49-(0)8231-95889-0 Fax: +49-(0)8231-95889-30
MiniLab
Features
• Ideal for prototyping laboratory tests and rework
• Low operating costs and compact design
• Easy handling with solder automatic and heater leveladjustment
• Designed for lowest fluid consumption incl. integrated
heat exchanger to prevent drag out of liquid agent• Variable energy level set-up
• Automatic fluid level indicator • Standby-mode
• Maintenance free transport system (Patented)
Modes of operation
A simple variation of vapour phases soldering, generatesdifferent, nearly linear temperature profiles. Energy transfer is controlled by adjustable heating power.
Heat Level Mode (HL-Mode)
Overview
The machine can operate in a time controlled sequenceprogrammed by the user. It also can operate completelyautomatically. Then the time in the vapour chamber isshortened or extended automatically according to the massto be soldered.
Solder Automatic
Economy Vapour Phase Soldering Machine
for Laboratory / Small Scale Production
Although the MiniLab requires a low footprint to install only, ithas all features required to operate the system as a fullyfunctional vapour phase soldering machine.
The MiniLab was developed for small scale operation timeand space. It is ideal for laboratory applications, prototypingand small production, as well as rework and quality tasks
Standard Equipment / Specification
•! Automatic loading and unloading of the carriers
•! Observation window to the process chamber
•! Integrated illumination of the soldering area•! Controlled heating chamber, no overheating
(thermocouple checked)
•! Integrated vapour level check•! Automatic fluid level check
•! Integrated fluid recovery system•! Variable energy level control
•! Maintenance free high-grade steel transportation system.
(Patented).
•! Automatic and time controlled soldering
Options • Adapter for double sided PCB boards.
• ReSy, a device for repair of QFP's and BGA's, (patented)
• Stainless steel grid for the workpiece carrier • Chiller with closed loop machine cooling system
Width 730mm
Depth 600 mm
Height 600 mm
Weight 70 kg
Maximum PCB size 300 x 275 x 80 mm
Liquid agent filling (min) 2 kg
Water connection 1/2”
Max. heating capacity 1,8 kW
Ø power consumption 0,8 kWh
Power supply /
main fuse
230 VAC, 2 kW /
16 A, Type “gL” or “C”
Technical Data MiniLab
TimeTimer 1 Timer 2 Timer 3 Timer 4
Heating
Power
D1E122-Datasheet MiniLab E-120116
- Technical changes reserved -
