Compensation for Measurement Errors Due to Mechanical

Misalignments in PCB Testing

Anura P. Jayasumana, Yashwant K. Malaiya, Xin He,

Colorado State University

Kenneth P. Parker and Stephen Hird

Agilent Technologies

Objective

2

• Identification of outlier boards using Capacitive Lead Frame Testing data

• Improve the accuracy of outlier detection by compensating for systematic errors such as mechanical misalignment and fixture-to-fixture variations

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Outline

PCA Based Outlier Detection Test Data for Mechanical Misalignments

PCA Based Compensation Summary

3BTW 2010

Capacitive Lead Frame Testing

4

SenseplateBuffer

Signal(to Tester)

PC board

Ball connections

In-Circuit access

Tester AC Source stimulates one pin, all others are grounded

Test access pad

Vacant Connector

(internal conductors)

Ref: Parker & Hird, ITC 2007 BTW 2010

Example: Capacitance vs. Pin Number (for a J245)

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1st Principal Component contains largest variance from the data projection

2nd Principal Component, orthogonal to the 1st one, contains second largest projected variance

Useful for analyzing multi-dimensional interrelated data

Mea

sure

men

t 2

2nd PC

1st PC

0Measurement 1

Principal Component Analysis (PCA)

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PCA for PCB Outlier DetectionSingular Value Decomposition

Mc = USVT

where,

Umxn A scaled version of PC scores

Snxn Diagonal matrix with square roots of Eigen values in descending order

VTnxn Eigen vectors (PCs).

V Transformation Matrix

Z = McV Matrix with z-score values of boards

Z-scores of a board are linear combination of all corresponding measurements for that board 8BTW 2010

Test Statistic for Outlier Detection

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Ek

iki zd 21

zik : Value of the kth PC for ith board

E : a subset of PCs - most significant PCs are used here

Sort the boards with respect to d1

Plot cumulative distribution function (CDF) of d1

Outliers clearly identifiable on right side of plot, typically separated from others by a clear margin

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Board run numbers on CDF plot from left to right: 52,51,50,53,49,32,73,24,48,25,74,72,83,71,57,47,1,42,56,70,6,68,38,37,58,43,59,41,39,55,40,2,23,78,33,35,44,69,79,54,75,36,64,80,76,31,77,65,60,29,81,63,61,62,3,67,66,82,27,45,28,46,26,30,34,12,8,7,10,9,16,11,13,14,15,4,5,17,22,19,18,20,21

PCA Based Outlier Detection

ITC 2009

• Treats data holistically• Outlier detection as

opposed to threshold based detection

Capacitive Lead Frame Testing

11

SenseplateBuffer

Signal(to Tester)

PC board

Ball connections

In-Circuit access

Tester AC Source stimulates one pin, all others are grounded

Test access pad

Vacant Connector

(internal conductors)

Ref: Parker & Hird, ITC 2007

• Capacitance < 100fF (<10fF with opens faults) • Systematic variations, e.g., variations in connector height,

co-planarity of ball connections, sense plate, … • Relatively small mechanical variations can lead to larger

measurement variability(Ex. 18fF variation across shift test cases vs. std deviation of <1fF)

• Test values and test limits set now may fail if mechanical variations appear later

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Mechanical Misalignments

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Vacant Connector

Senseplate

Buffer

Spacers placed between plate and connector at one end. Again, the spacers have a different dielectric constant from air.

Vacant Connector

SenseplateBuffer

Spacers placed between plate and connector. Most connector pin tips see an air gap to the sense plate, but at the ends, the gap has a different dielectric constant.

Setup Left or right End Tilt Height (mils) Setup Vertical Shift

Height (mils)

Tilt_0 0 Shift_0 0

Tilt_1 8 Shift _1 8

Tilt_2 16 Shift_2 16

Tilt_3 24 Shift_3 24

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Raw measurements for B1 with one normal and three left tilted sense plates

35

55

75

95

115

Mea

sure

d C

apac

itan

ce (

fF)

Pin Number

Tilt_0

Tilt_1

Tilt_2

Tilt_3

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Raw measurements with normal and verticalshifted sense plate for board B5 connector J3

45

65

85

105

125

145

Mea

sure

d C

apac

itan

ce

(fF

)

Pin Number

Shift_0

Shift_1

Shift_2Shift_3

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Compensating for Tilt

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Raw measurements with normal and verticalshifted sense plate for board B5 connector J3

45

65

85

105

125

145

Mea

sure

d C

apac

itan

ce

(fF

)

Pin Number

Shift_0

Shift_1

Shift_2Shift_3

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Plot of PC values for Shift Data

Note:• PC-1 can be used to identify the amount of shift or tilt in sense plate• Unlike visual inspection, PCA can identify complex but systematic

patterns• If the same board is tested in multiple fixtures, it may be possible

to identify differences and compensate for themBTW 2010

Adjusted capacitances by setting all but 1st PCequal to 0 for data B1

• PC-1 captures the tilt information as well as other common information

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Data set including two synthetic traces, Def_1 and Def_2 simulating open faults on pins 121 and 165

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Adjusted capacitances by setting only 1st PCs to 0

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Data set including two synthetic traces, Def_1 and Def_2 simulating open faults on pins 75 and 165

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Adjusted capacitance by setting all but 1st PC to zero

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Adjusted data based on setting only 1st PC to 0

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A PCA based technique presented for identification and compensation for measurement errors introduced due to sense-plate variations

Method can be used to separate misalignment related information from defect related information in test data

Approach is NOT sensitive to the order of the pins, and thus shows promise for complex but systematic errors introduced by sense plate misalignments

Method applicable to other kinds of test data

Summary

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Overcome variations caused by measurement errors, mechanical and electrical tolerances

Adaptive and learning techniques for detection and diagnosis

Future Work

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