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Transcript of asic lecture 9~10 chapter_3
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Chapter 3
EGRE 427 Advanced Digital Design Figures from Application-Specific Integrated Circuits, Michael John SebastianSmith, Addison Wesley, 1997
ASIC Library Design
Application-Specific Integrated CircuitsMichael John Sebastian Smith
Addison Wesley, 1997
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ASIC Library Design
ASIC design is usually performed using a predefined and
precharacterized library of cells
In designing this library, the original designer had to optimize
speed and area without knowing the actual application that
the cells will be used for - i.e., how large a load they will be
EGRE 427 Advanced Digital Design Figures from Application-Specific Integrated Circuits, Michael John SebastianSmith, Addison Wesley, 1997
wire load
fanout load
Being aware of the source and effect of these trade-offs will
make it easier to understand how to optimally design usingthe library cells
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Model of CMOS Inverter with ParasiticResistances and Capacitances
EGRE 427 Advanced Digital Design Figures from Application-Specific Integrated Circuits, Michael John SebastianSmith, Addison Wesley, 1997
Figure 3.1 A model for CMOS logic delay. (a) A CMOS inverter with load capacitance. (b) Input and output waveforms
showing the definition of falling propagation delay tPDF. (c) The switch model of the inverter showing parasitic
resistances and capacitances.
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Effect of Load Capacitance on Inverter Performance
Figure 3.3 Simulation of an inverter driving a variable number of
gates on its output
EGRE 427 Advanced Digital Design Figures from Application-Specific Integrated Circuits, Michael John SebastianSmith, Addison Wesley, 1997
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Parasitic Capacitances of a CMOSTransistor
Figure 3.4 Transistor parasiticcapacitance. (a) An N-
channel MOS transistor
with gate length L and
width W. (b) The
components of the gate
capacitance. (c)
Approximating
capacitances with planar
components. (d) The
components of the diffusion
capacitance. (e)-(h) The
EGRE 427 Advanced Digital Design Figures from Application-Specific Integrated Circuits, Michael John SebastianSmith, Addison Wesley, 1997
dimensions of the gate,
overlap, and sidewall
capacitances.
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VDD VDD
RPon
VOH = VDD
CMOS Inverter: Steady State Response
EGRE 427 Advanced Digital Design Figures from Application-Specific Integrated Circuits, Michael John SebastianSmith, Addison Wesley, 1997
Vout
Vout
Vin = VDD Vin = 0
RNon
VOL= 0
VM = RPon
)f(RNon
,
RNon 1/WN
RPon 1/WP
Figures from material provided with Digital Integrated Circuits, A DesignPerspective, by Jan Rabaey, Prentice Hall, 1996
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Vout
4
5
NMOS off
PMOS lin
NMOS sat
PMOS lin
CMOS Inverter VTC
EGRE 427 Advanced Digital Design Figures from Application-Specific Integrated Circuits, Michael John SebastianSmith, Addison Wesley, 1997
Vin1 2 3 4 5
1
2
3
NMOS lin
PMOS off
NMOS sat
PMOS sat
NMOS lin
PMOS sat
Figures from material provided with Digital Integrated Circuits, A DesignPerspective, by Jan Rabaey, Prentice Hall, 1996
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The Ideal Gate
V out
=
EGRE 427 Advanced Digital Design Figures from Application-Specific Integrated Circuits, Michael John SebastianSmith, Addison Wesley, 1997
V in
g=
Ro = 0
Vm = Vdd/2
Figures from material provided with Digital Integrated Circuits, A DesignPerspective, by Jan Rabaey, Prentice Hall, 1996
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VDD
Balanced CMOS Inverter
Assume that due to differences in µp and µn, for a minimum
sized transistor, Rp = 2RnFor a balanced inverter we want RP = RN, so in this case, WPmust be 2WN
EGRE 427 Advanced Digital Design Figures from Application-Specific Integrated Circuits, Michael John SebastianSmith, Addison Wesley, 1997
Vin Vout
CL
P P =
WN/LN = 2/1
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Logical Effort
EGRE 427 Advanced Digital Design Figures from Application-Specific Integrated Circuits, Michael John SebastianSmith, Addison Wesley, 1997
Figure 3.8 Logical effort. (a) The input capacitance looking into the input capacitance of a minimum size inverter. (b) Sizing a
logic cell’s transistors to have the same delay as a minimum size inverter. (c) The logical effort of a cell is Cin/Cinv.
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Logical Effort Of a Complex Gate
EGRE 427 Advanced Digital Design Figures from Application-Specific Integrated Circuits, Michael John SebastianSmith, Addison Wesley, 1997
Figure 3.10 An AOI221 cell with logical effort vector g=(8/3, 8/3, 7/3).
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The Basic Trade-off
to other gates (fanout)
to other gates (fanout)
EGRE 427 Advanced Digital Design Figures from Application-Specific Integrated Circuits, Michael John SebastianSmith, Addison Wesley, 1997
to other gates (fanout)
to other gates (fanout)
buffer Which is faster?