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    Chapter 3

    EGRE 427 Advanced Digital Design Figures from Application-Specific Integrated Circuits, Michael John SebastianSmith, Addison Wesley, 1997

     ASIC Library Design

     Application-Specific Integrated CircuitsMichael John Sebastian Smith

     Addison Wesley, 1997

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     ASIC Library Design

     ASIC design is usually performed using a predefined and

    precharacterized library of cells

    In designing this library, the original designer had to optimize

    speed and area without knowing the actual application that

    the cells will be used for - i.e., how large a load they will be

     

    EGRE 427 Advanced Digital Design Figures from Application-Specific Integrated Circuits, Michael John SebastianSmith, Addison Wesley, 1997

     

    wire load

    fanout load

    Being aware of the source and effect of these trade-offs will

    make it easier to understand how to optimally design usingthe library cells

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    Model of CMOS Inverter with ParasiticResistances and Capacitances

    EGRE 427 Advanced Digital Design Figures from Application-Specific Integrated Circuits, Michael John SebastianSmith, Addison Wesley, 1997

    Figure 3.1 A model for CMOS logic delay. (a) A CMOS inverter with load capacitance. (b) Input and output waveforms

    showing the definition of falling propagation delay tPDF. (c) The switch model of the inverter showing parasitic

    resistances and capacitances.

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    Effect of Load Capacitance on Inverter Performance

    Figure 3.3 Simulation of an inverter driving a variable number of 

    gates on its output

    EGRE 427 Advanced Digital Design Figures from Application-Specific Integrated Circuits, Michael John SebastianSmith, Addison Wesley, 1997

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    Parasitic Capacitances of a CMOSTransistor 

    Figure 3.4 Transistor parasiticcapacitance. (a) An N-

    channel MOS transistor 

    with gate length L and

    width W. (b) The

    components of the gate

    capacitance. (c)

     Approximating

    capacitances with planar 

    components. (d) The

    components of the diffusion

    capacitance. (e)-(h) The

     

    EGRE 427 Advanced Digital Design Figures from Application-Specific Integrated Circuits, Michael John SebastianSmith, Addison Wesley, 1997

     

    dimensions of the gate,

    overlap, and sidewall

    capacitances.

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    VDD VDD

    RPon

    VOH = VDD

    CMOS Inverter: Steady State Response

    EGRE 427 Advanced Digital Design Figures from Application-Specific Integrated Circuits, Michael John SebastianSmith, Addison Wesley, 1997

    Vout

    Vout

    Vin = VDD Vin = 0

    RNon

    VOL= 0

    VM = RPon

    )f(RNon

    ,

    RNon 1/WN

    RPon 1/WP

    Figures from material provided with Digital Integrated Circuits, A DesignPerspective, by Jan Rabaey, Prentice Hall, 1996

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    Vout

            4

            5

     

    NMOS off 

    PMOS lin

    NMOS sat

    PMOS lin

     

    CMOS Inverter VTC

    EGRE 427 Advanced Digital Design Figures from Application-Specific Integrated Circuits, Michael John SebastianSmith, Addison Wesley, 1997

    Vin1 2 3 4 5

            1

            2

            3

    NMOS lin

    PMOS off 

    NMOS sat

    PMOS sat

     

    NMOS lin

    PMOS sat

    Figures from material provided with Digital Integrated Circuits, A DesignPerspective, by Jan Rabaey, Prentice Hall, 1996

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    The Ideal Gate

    V out 

    =  

     

    EGRE 427 Advanced Digital Design Figures from Application-Specific Integrated Circuits, Michael John SebastianSmith, Addison Wesley, 1997

    V in

    g=

    Ro = 0

    Vm = Vdd/2

    Figures from material provided with Digital Integrated Circuits, A DesignPerspective, by Jan Rabaey, Prentice Hall, 1996

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    VDD

    Balanced CMOS Inverter 

     Assume that due to differences in µp and  µn, for a minimum

    sized transistor, Rp = 2RnFor a balanced inverter we want RP = RN, so in this case, WPmust be 2WN

     

    EGRE 427 Advanced Digital Design Figures from Application-Specific Integrated Circuits, Michael John SebastianSmith, Addison Wesley, 1997

    Vin Vout

    CL

    P P =

    WN/LN = 2/1

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    Logical Effort

    EGRE 427 Advanced Digital Design Figures from Application-Specific Integrated Circuits, Michael John SebastianSmith, Addison Wesley, 1997

    Figure 3.8 Logical effort. (a) The input capacitance looking into the input capacitance of a minimum size inverter. (b) Sizing a

    logic cell’s transistors to have the same delay as a minimum size inverter. (c) The logical effort of a cell is Cin/Cinv.

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    Logical Effort Of a Complex Gate

    EGRE 427 Advanced Digital Design Figures from Application-Specific Integrated Circuits, Michael John SebastianSmith, Addison Wesley, 1997

    Figure 3.10 An AOI221 cell with logical effort vector g=(8/3, 8/3, 7/3).

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    The Basic Trade-off 

    to other gates (fanout)

    to other gates (fanout)

    EGRE 427 Advanced Digital Design Figures from Application-Specific Integrated Circuits, Michael John SebastianSmith, Addison Wesley, 1997

    to other gates (fanout)

    to other gates (fanout)

    buffer Which is faster?