ASE/Deca M-Series Fan-Out Process...ASE in partnership with Deca technologies has developed a FO...

©2019 by System Plus Consulting | ASE/Deca M-Series Fan-Out Process | Sample 1

22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr

ASE/Deca M-Series Fan-Out ProcessQualcomm PM1850 PMIC with advanced Wafer Level Packaging

SP19486 - PACKAGING report by Stéphane ELISABETHLaboratory Analysis by Nicolas RADUFFE

September 2019 – Sample

REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT

http://www.systemplus.fr/



Table of Contents

Overview / Introduction 4

o Executive Summary

o Reverse Costing Methodology

Company Profile 8

o Qualcomm

o ASE/Deca technologies Roadmap

o Samsung Galaxy S10 5G US Teardown

Physical Analysis 23

o Summary of the Physical Analysis 24

o M-Series Package Assembly 26

Package Views & Dimensions

Board & Package Cross-Section

o PMIC Die 55

Die View & Dimensions

Delayering & main Blocs

Die Process

Die Cross-Section

Die Process Characteristic

Physical Comparison: eWLB vs. M-Series 69

Manufacturing Process 72

o PMIC Die Front-End Process & Fabrication Unit

o M-Series Packaging Process & Fabrication Unit

Cost Analysis 84

o Summary of the cost analysis 89

o Yields Explanation & Hypotheses 91

o PMIC die 93

Die Front-End Cost

Die Probe Test, Thinning & Dicing

Die Wafer Cost

Die Cost

o M-Series Packging 97

Wafer Cost

Packaging steps cost

Component Cost

Selling price 99

Cost Comparison: eWLB vs. M-Series 103

Feedbacks 104

SystemPlus Consulting services 106




Overview / Introductiono Executive Summaryo Reverse Costing Methodologyo Glossary

Company Profile & Supply Chain

Market Analysis

Physical Analysis

Physical Comparison

Manufacturing Process Flow

Cost Analysis

Selling Price Analysis

Cost Comparison

Related Reports

About System Plus

Executive Summary

This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling priceof the Qualcomm PM8150 PMIC with Deca M-Series.

Back in 2015, Outsourced Semiconductor Assembly and Test (OSATs) were the only players who were involved in Fan-Out (FO)packaging. But in 2016, TSMC has led the entry of foundries on this market. By proposing its integrated FO (inFO) packagingtechnology, TSMC and Apple introduced the first high Density Fan-Out packaging in mobile segment.

Now, Integrated Device Manufacturers (IDM) like Samsung have joined the race with a new in-house technology at panel level.The result is that in 2019, OSATs gained only a third part of the market. Even with this reduce share, they still develop andenhanced their portfolio on this segment. ASE in partnership with Deca technologies has developed a FO technology targetingthe core market. Formerly user of eWLB, ASE has decided to move to M-series packaging technology for its advanced Waferlevel packaging (aWLP).

With production maturity, fabless company like Qualcomm are seeking for yield loss improvement in dicing. In the past,Qualcomm has used enhanced Wafer Level Ball grid array (eWLB) for side wall protection for this purpose.

But now with the maturity of the M-series technology from Deca Technologies , ASE, who is the current OSAT supplier forQualcomm, switch the packaging production.

One of the main advantages of the technology is that at a similar price to the eWLB technology, the M-series offers betterquality and board level reliability (BLR). Indeed, one of the key enablers is the use of epoxy molding compound (EMC) betweenthe die and the redistribution layers (RDLs).

This report includes a full investigation of the component, featuring a detailed study of the PMIC including packaging, diedesign and cross-sections. It contains a complete cost analysis and a selling price estimation of the component. Finally, itfeatures a comparison with the Qualcomm WCD9335 Audio Codec, featuring eWLB packaging.




Overview / Introduction

Company Profile & Supply Chain o Qualcommo ASE/Deca technologieso Samsung Galaxy S10 Teardown

Market Analysis

Physical Analysis

Physical Comparison


Cost Analysis


Cost Comparison

Related Reports

About System Plus

Samsung Galaxy S10 5G US Teardown

Samsung Galaxy S10 5G USA Opening©2019 by System Plus Consulting

Main Board – Top PCB Substrate – Top and Bottom View©2019 by System Plus Consulting

Main Board – Bottom PCB Substrate – Top View©2019 by System Plus Consulting

Main Board – Bottom PCB Substrate – Bottom View©2019 by System Plus Consulting

IDT’s Wireless Power Receiver

Qualcomm’s Main PMIC

Maxim’s Interface PMIC

Qualcomm’s 5G PMIC

• All the power IC are sandwiched between the twoPCB substrate.

• Both main PMIC from Qualcomm are using M-series packaging technology for Side WallProtection.






Market Analysis

Physical Analysis o Synthesiso Package Assembly

o Views & Dimensionso Cross-Sectiono Synthesis

o PMIC Dieo Views & Dimensionso Delayeringo Die Processo Die Cross-section

Physical Comparison


Cost Analysis


Cost Comparison

Related Reports

About System Plus

Summary of the Physical Analysis






Market Analysis




Physical Comparison


Cost Analysis


Cost Comparison

Related Reports

About System Plus

Package View & Dimensions






Market Analysis




Physical Comparison


Cost Analysis


Cost Comparison

Related Reports

About System Plus

M-series Package Overview






Market Analysis




Physical Comparison


Cost Analysis


Cost Comparison

Related Reports

About System Plus

Board Cross-Section






Market Analysis




Physical Comparison


Cost Analysis


Cost Comparison

Related Reports

About System Plus

M-Series Cross-Section






Market Analysis




Physical Comparison


Cost Analysis


Cost Comparison

Related Reports

About System Plus

M-Series Cross-Section – RDLs






Market Analysis




Physical Comparison


Cost Analysis


Cost Comparison

Related Reports

About System Plus

Die Dimensions






Market Analysis

Physical Analysis

Physical Comparisono eWLB vs. M-Series


Cost Analysis


Cost Comparison

Related Reports

About System Plus

Side-Wall Protection – eWLB vs. M-series – Process






Market Analysis

Physical Analysis

Physical Comparison

Manufacturing Process Flowo PMIC Die Front-End Processo PMIC Fabrication Unito M-Series Process Flowo M-Series Assembly Unit

Cost Analysis


Cost Comparison

Related Reports

About System Plus

Packaging Process Flow (3/6)






Market Analysis

Physical Analysis

Physical Comparison


Cost Analysiso Cost Analysis Summaryo Yields Explanation &

Hypotheseso PMIC Wafer & Die Costo M-Series Package Costo Component Cost


Cost Comparison

Related Reports

About System Plus

M-Series Packaging Cost






Market Analysis

Physical Analysis

Physical Comparison


Cost Analysis

Selling Price Analysiso Definition of Priceso Manufacturer Financialso Component Price

Cost Comparison

Related Reports

About System Plus

Estimated Selling Price






Market Analysis

Physical Analysis

Physical Comparison


Cost Analysis


Cost Comparisono eWLB vs. M-Series

Related Reports

About System Plus

Fan-Out technology – eWLB vs. M-series – Cost






Market Analysis

Physical Analysis

Physical Comparison


Cost Analysis


Cost Comparison

Related Reports

About System Pluso Company serviceso Contact

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

Related Reports

MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT

ADVANCED PACKAGING• Fan-Out Packaging: Technologies and Market Trends 2019• Equipment and Materials for Fan-Out Packaging 2019• Status of Advanced Substrates 2019

REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING

PACKAGING• Advanced packaging technology in the Apple Watch

Series 4’s SiP• Samsung Exynos 9110 with ePLP: First Generation of

Samsung’s FO-PLP• Intel’s Embedded Multi-Die Interconnect Bridge (EMIB)



https://www.i-micronews.com/products/status-of-advanced-substrates-2019/


https://www.i-micronews.com/products/equipment-and-materials-for-fan-out-packaging-2019/


https://www.systemplus.fr/reverse-costing-reports/intels-embedded-multi-die-interconnect-bridge-emib/


https://www.systemplus.fr/reverse-costing-reports/exynos-9110-first-generation-of-samsung-fo-plp/


https://www.i-micronews.com/products/fan-out-packaging-technologies-and-market-trends-2019/



https://www.systemplus.fr/reverse-costing-reports/advanced-packaging-technology-in-the-apple-watch-series-4s-system-in-package/








SystemPlusConsultingSERVI CES




Market Analysis

Physical Analysis

Physical Comparison


Cost Analysis


Cost Comparison

Related Reports


Business Models Fields of Expertise

Custom Analyses(>130 analyses per year)

Reports(>60 reports per year)

Costing Tools

Trainings






Market Analysis

Physical Analysis

Physical Comparison


Cost Analysis


Cost Comparison

Related Reports


Contact

www.systemplus.fr

NANTESHeadquarter

FRANKFURT/MAINEurope Sales Office

LYONYOLE HQ

TOKYOYOLE KK

GREATER CHINAYOLE

PHOENIXYOLE Inc.

KOREAYOLE

Headquarters22 bd Benoni Goullin44200 NantesFRANCE+33 2 40 18 09 [email protected]

Europe Sales OfficeLizzie LEVENEZFrankfurt am MainGERMANY+49 151 23 54 41 [email protected]

Asia Sales OfficeTakashi ONOZAWATokyoJAPANT : +81 804 371 [email protected]

Mavis WANGTAIWANT :+886 979 336 [email protected]

America Sales OfficeSteve LAFERRIEREPhoenix, AZWESTERN UST : +1 310 600 [email protected]

Chris YOUMANEASTERN US & CANADAT : +1 919 607 9839 [email protected]



mailto:[email protected]



ORDER FORMPlease process my order for ASE/Deca M-Series Fan-Out Process,Reverse Costing® – Structure, Process & Cost Report Ref: SP19486

Full Structure, Process & Cost Report : EUR 3,990* Annual Subscription offers possible from 3 reports, including this

report as the first of the year. Contact us for more information.

SHIP TO

Name (Mr/Ms/Dr/Pr): .............................................................

Job Title: …….............................................................................

Company: ….............................................................................

Address: …….............................................................................

City: ………………………………… State: ..........................................

Postcode/Zip: ..........................................................................

Country: ……............................................................................

VAT ID Number for EU members: ..........................................

Tel: ……………….........................................................................

Email: .....................................................................................

Date: ......................................................................................

Signature: ..............................................................................

BILLING CONTACT

First Name : ............................................................................

Last Name: …….......................................................................

Email: …..................................................................................

Phone: ……..............................................................................

PAYMENT

By credit card:

Number: |__|__|__|__| |__|__|__|__| |__|__|__|__|

|__|__|__|__|

Expiration date: |__|__|/|__|__|

Card Verification Value: |__|__|__|

By bank transfer:HSBC - CAE- Le Terminal -2 rue du Charron - 44800 St Herblain FranceBIC code: CCFRFRPP• In EUR

Bank code : 30056 - Branch code : 00955 - Account : 09550003234 IBAN: FR76 3005 6009 5509 5500 0323 439

• In USDBank code : 30056 - Branch code : 00955 - Account : 09550003247 IBAN: FR76 3005 6009 5509 5500 0324 797

REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORTASE/DECA M-SERIES FAN-OUT PROCESS

Each year System Plus Consultingreleases a comprehensive collectionof new reverse engineering andcosting analyses in various domains.You can choose to buy over 12months a set of 3, 4, 5, 7, 10 or 15Reverse Costing® reports.

Up to 47% discount!

More than 60 reports released eachyear on the following topics(considered for 2018):• MEMS & Sensors: Accelerometer

– Environment - Fingerprint - Gas - Gyroscope - IMU/Combo -Microphone - Optics - Oscillator -Pressure

• Power: GaN - IGBT - MOSFET - Si Diode - SiC

• Imaging: Camera - Spectrometer• LED and Laser: UV LED – VCSEL -

White/blue LED• Packaging: 3D Packaging -

Embedded - SIP - WLP• Integrated Circuits: IPD –

Memories – PMIC - SoC• RF: FEM - Duplexer• Systems: Automotive - Consumer

- Energy - Telecom

ANNUAL SUBSCRIPTIONS

Return order by: FAX: +33 2 53 55 10 59MAIL: SYSTEM PLUS CONSULTING

22, bd Benoni GoullinNantes Biotech44200 Nantes – France

EMAIL: [email protected]

*For price in dollars please use the day’s exchange rate *All reports are delivered electronically in pdf format*For French customer, add 20 % for VAT*Our prices are subject to change. Please check our new releases and price changes on www.systemplus.fr. The present document is valid 6 months after its publishing date: September 2019



1.INTRODUCTIONThe present terms and conditions apply to the offers, sales and deliveries of services managed by System PlusConsulting except in the case of a particular written agreement.Buyer must note that placing an order means an agreement without any restriction with these terms and conditions.

2.PRICESPrices of the purchased services are those which are in force on the date the order is placed. Prices are in Euros andworked out without taxes. Consequently, the taxes and possible added costs agreed when the order is placed will becharged on these initial prices.System Plus Consulting may change its prices whenever the company thinks it necessary. However, the companycommits itself in invoicing at the prices in force on the date the order is placed.

3.REBATES and DISCOUNTSThe quoted prices already include the rebates and discounts that System Plus Consulting could have granted accordingto the number of orders placed by the Buyer, or other specific conditions. No discount is granted in case of earlypayment.

4.TERMS OF PAYMENTSystem Plus Consulting delivered services are to be paid within 30 days end of month by bank transfer except in thecase of a particular written agreement.If the payment does not reach System Plus Consulting on the deadline, the Buyer has to pay System Plus Consulting apenalty for late payment the amount of which is three times the legal interest rate. The legal interest rate is thecurrent one on the delivery date. This penalty is worked out on the unpaid invoice amount, starting from the invoicedeadline. This penalty is sent without previous notice.When payment terms are over 30 days end of month, the Buyer has to pay a deposit which amount is 10% of the

total invoice amount when placing his order.

5. OWNERSHIPSystem Plus Consulting remains sole owner of the delivered services until total payment of the invoice.

6.DELIVERIESThe delivery schedule on the purchase order is given for information only and cannot be strictly guaranteed.Consequently any reasonable delay in the delivery of services will not allow the buyer to claim for damages or tocancel the order.

7.ENTRUSTED GOODS SHIPMENTThe transport costs and risks are fully born by the Buyer. Should the customer wish to ensure the goods against lost ordamage on the base of their real value, he must imperatively point it out to System Plus Consulting when theshipment takes place. Without any specific requirement, insurance terms for the return of goods will be the carriercurrent ones (reimbursement based on good weight instead of the real value).

8.FORCE MAJEURESystem Plus Consulting responsibility will not be involved in non execution or late delivery of one of its dutiesdescribed in the current terms and conditions if these are the result of a force majeure case. Therefore, the forcemajeure includes all external event unpredictable and irresistible as defined by the article 1148 of the French CodeCivil?

9.CONFIDENTIALITYAs a rule, all information handed by customers to system Plus Consulting are considered as strictly confidential.A non-disclosure agreement can be signed on demand.

10.RESPONSABILITY LIMITATIONThe Buyer is responsible for the use and interpretations he makes of the reports delivered by System Plus Consulting.Consequently, System Plus Consulting responsibility can in no case be called into question for any direct or indirectdamage, financial or otherwise, that may result from the use of the results of our analysis or results obtained usingone of our costing tools.

11.APPLICABLE LAWAny dispute that may arise about the interpretation or execution of the current terms and conditions shall be resolvedapplying the French law.It the dispute cannot be settled out-of-court, the competent Court will be the Tribunal de Commerce de Nantes.

TERMS AND CONDITIONS OF SALES

ASE/Deca M-Series Fan-Out Process...ASE in partnership with Deca technologies has developed a FO...

Documents

Transcript of ASE/Deca M-Series Fan-Out Process...ASE in partnership with Deca technologies has developed a FO...