A&R Template 4.4downloads.semi.org/web/wstdsbal.nsf/de4d7939711aeedf882575… · Web viewAlso, it...

1 FROM:

1.1 - Change guide to practice

1.1 The purpose is to establish a guide for reproducible electrostatic measurements on any surface or object, consistent with the scope and limitations set forth below.

3.3 - Change guide to document - 2 places

3.3 This guide does not describe instrumentation and techniques capable of making highly precise measurement of electrostatic charge. No methods of preconditioning the surface prior to measurements and no methods of characterizing the basic electrostatic performance of materials, such as tribocharging, resistance/resistivity, and decay rate are a part of this document. Measurements made using this guide on the same surface or object may differ due to differences in the environment or history of the surface or object between the times any two measurements are made.

7.2.1.1 - Change guide to document

7.2.1.1 The fieldmeter/electrostatic locator/field sensor will henceforth be referred to as “the fieldmeter.” For measurements in the presence of air ionization a chopper stabilized fieldmeter is required. The fieldmeter must be capable of making field measurements at a distance of 2.54 centimeters (cm) = 1 inch or less, from the field source to the sensor for this guide, as written. However, see Section 9.2.4 for fieldmeters that are operated at fixed distance(s), and adjust values in this document where applicable. The handheld fieldmeter is feasible as an electrostatic locator only, precise measurements need a fixed distance between the fieldmeter sensor and the object under investigation.

9.3.3 - Change guide to document

9.3.3 Measurements made to this guide should be taken/reported in units that conform to the customer specifications. Most common fieldmeters manufactured to date have operating instructions that reflect the user doing calibration and taking measurements in English units of Volts/inch or Volts at a fixed distance in inch(es) and in these cases, raw data are reported/listed directly. The international community specifies that units shall be in SI (Standard International).


9.3.4.1 Measurements made to this guide are only valid for surfaces that are flat to a radius of 1.5 times the measurement distance from a point directly below the sensor head. For surfaces that are not flat, measurements should be made by moving the sensor over the surface such that the specified measurement distance is maintained as closely as possible. These measurements may only be stated as a range, with rounding as applicable to the meter's measurement range according to Section 9.3.1.1. See Figure 4, Example of a Survey of a Carrier of Semiconductor Wafers. See Related Information 2 for notes on test methods environment and measurements.

Note 4 - delete Guide - 2 places

NOTE 4: It is anticipated that SEMI will publish an ESD Primer Guide to complement this document. Refer to the ESD Primer Guide for additional information on measurements of charge on insulators.

10.1 - Change guide to document

10.1 It is reasonable to expect that the person chosen to survey production areas for static charge levels has

4241 ECs (submitted to the A&R SC)

been certified to perform that task. The certified person shall be someone qualified by education and/or training to calibrate and make measurements with the equipment called out in this guide. The ESD Association conducts such education programs and certifies individuals as ESD Program Managers. 1 The International Association of Radio and Television Engineers (iNARTE) administers an ESD Engineer and ESD technician certification program. 2

R1-1.1 - Change guide to document

R1-1.1 A charged plate monitor is an instrument typically used to monitor the performance of air ionization equipment. Monitoring is done with an electrically isolated 15 cm 15 cm (6 inches 6 inches) metal plate, henceforth referred to as “the plate.” The instrument typically provides a means to charge the plate to a known voltage (1000 or 5000 Volts of either polarity), a plate sensor to determine the voltage on the plate, and timing circuitry to determine the time required to discharge the plate to a percentage of its initial charge. For the purposes of this guide, the charged plate monitor, or a separate isolated plate assembly, can be used for performance verification purposes as explained in Section 9.


TO:

1.1 - Change guide to practice

1.1 The purpose is to establish a practice for reproducible electrostatic measurements on any surface or object, consistent with the scope and limitations set forth below.

3.3 - Change guide to document - 2 places

3.3 This document does not describe instrumentation and techniques capable of making highly precise measurement of electrostatic charge. No methods of preconditioning the surface prior to measurements and no methods of characterizing the basic electrostatic performance of materials, such as tribocharging, resistance/resistivity, and decay rate are a part of this document. Measurements made using this document on the same surface or object may differ due to differences in the environment or history of the surface or object between the times any two measurements are made.

7.2.1.1 - Change guide to document

7.2.1.1 The fieldmeter/electrostatic locator/field sensor will henceforth be referred to as “the fieldmeter.” For measurements in the presence of air ionization a chopper stabilized fieldmeter is required. The fieldmeter must be capable of making field measurements at a distance of 2.54 centimeters (cm) = 1 inch or less, from the field source to the sensor for this document, as written. However, see Section 9.2.4 for fieldmeters that are operated at fixed distance(s), and adjust values in this document where applicable. The handheld fieldmeter is feasible as an electrostatic locator only, precise measurements need a fixed distance between the fieldmeter sensor and the object under investigation.


9.3.3 Measurements made to this document should be taken/reported in units that conform to the customer specifications. Most common fieldmeters manufactured to date have operating instructions that reflect the user doing calibration and taking measurements in English units of Volts/inch or Volts at a fixed distance in inch(es) and in these cases, raw data are reported/listed directly. The international community specifies that units shall be in SI (Standard International).


9.3.4.1 Measurements made to this document are only valid for surfaces that are flat to a radius of 1.5 times the measurement distance from a point directly below the sensor head. For surfaces that are not flat, measurements should be made by moving the sensor over the surface such that the specified measurement distance is maintained as closely as possible. These measurements may only be stated as a range, with rounding as applicable to the meter's measurement range according to Section 9.3.1.1. See Figure 4, Example of a Survey of a Carrier of Semiconductor Wafers. See Related Information 2 for notes on test methods environment and measurements.

Note 4 - delete Guide - 2 places

NOTE4: It is anticipated that SEMI will publish an ESD Primer document to complement this document. Refer to the ESD Primer document for additional information on measurements of charge on insulators.

10.1 - Change guide to document

10.1 It is reasonable to expect that the person chosen to survey production areas for static charge levels has


been certified to perform that task. The certified person shall be someone qualified by education and/or training to calibrate and make measurements with the equipment called out in this document. The ESD Association conducts such education programs and certifies individuals as ESD Program Managers. 1 The International Association of Radio and Television Engineers (iNARTE) administers an ESD Engineer and ESD technician certification program. 2

R1-1.1 - Change guide to document

R1-1.2 A charged plate monitor is an instrument typically used to monitor the performance of air ionization equipment. Monitoring is done with an electrically isolated 15 cm 15 cm (6 inches 6 inches) metal plate, henceforth referred to as “the plate.” The instrument typically provides a means to charge the plate to a known voltage (1000 or 5000 Volts of either polarity), a plate sensor to determine the voltage on the plate, and timing circuitry to determine the time required to discharge the plate to a percentage of its initial charge. For the purposes of this document, the charged plate monitor, or a separate isolated plate assembly, can be used for performance verification purposes as explained in Section 9.

Justification: This document will be balloted in the future as a test method. In order to prepare this document for the change in type of standard and to stay consistent with the type chosen for this balloting cycle, the general term “document” has been chosen by the ESD Task Force and the NA Metrics Committee.

2 FROM:

2.1, 3.3: Change “instrumentation” to “equipment” to be consistent with terminology used throughout the document.

2.1 The measurement methods described herein can be applied to characterize the general electrostatic charge, voltage, field level(s) and electrostatic discharge on objects and surfaces in semiconductor manufacturing environments. Acceptable instrumentation, calibration, and measurement techniques are described in this document. Appendices include background information on the equipment specified and calibration procedures, as well as information and advice on performing a useful general static survey.

3.3 This guide does not describe instrumentation and techniques capable of making highly precise measurement of electrostatic charge. No methods of preconditioning the surface prior to measurements and no methods of characterizing the basic electrostatic performance of materials, such as tribocharging, resistance/resistivity, and decay rate are a part of this document. Measurements made using this guide on the same surface or object may differ due to differences in the environment or history of the surface or object between the times any two measurements are made.


TO:

2.1, 3.3: Change “instrumentation” to “equipment” to be consistent with terminology used throughout the document.

2.1 The measurement methods described herein can be applied to characterize the general electrostatic charge, voltage, field level(s) and electrostatic discharge on objects and surfaces in semiconductor manufacturing environments. Acceptable equipment, calibration, and measurement techniques are described in this document. Appendices include background information on the equipment specified and calibration procedures, as well as information and advice on performing a useful general static survey.

3.3 This guide does not describe equipment and techniques capable of making highly precise measurement of electrostatic charge. No methods of preconditioning the surface prior to measurements and no methods of characterizing the basic electrostatic performance of materials, such as tribocharging, resistance/resistivity, and decay rate are a part of this document. Measurements made using this guide on the same surface or object may differ due to differences in the environment or history of the surface or object between the times any two measurements are made.

Justification: Add clarification and consistency of terminology used.

3

FROM:

5.1-5.3: Italicize the terms being defined per SEMI Standard Style Manual (SM) 5-39.6.

5.1 electrostatic discharge (ESD) — the rapid spontaneous transfer of electrostatic charge induced by a high electrostatic field. Also referred to as an “ESD event”. 5.2 grounded — connected to earth or some other conducting body that serves in the place of earth.5.3 ground — a conducting connection between an object, electrical equipment, and earth, such as the portion of an electrical circuit of the same electrical potential as earth.

TO:

5.1-5.3: Italicize the terms being defined per SEMI Standard Style Manual (SM) 5-39.6.

5.1 electrostatic discharge (ESD) — the rapid spontaneous transfer of electrostatic charge induced by a high electrostatic field. Also referred to as an “ESD event”. 5.2 grounded — connected to earth or some other conducting body that serves in the place of earth.5.3 ground — a conducting connection between an object, electrical equipment, and earth, such as the portion of an electrical circuit of the same electrical potential as earth.

Justification: Comply with the Editorial Guidelines


4 FROM: 5.4.1-5.4.14: Italicize the acronyms being defined and replace the en dashes with em dashes per SM 5-39.6. Insert new acronyms for direct current (DC), COG, LSR, SI, EMC, iNARTE, EIA, IC, etc. used later in the document.

5.4.1 ANSI – American National Standards Institute5.4.2 CDM – Charged Device Model5.4.3 EIA – Electronic Industries Association5.4.4 EMI – Electromagnetic Interference5.4.5 ESD – Electrostatic Discharge5.4.6 HBM – Human Body Model5.4.7 EC – International Electrotechnical Commission5.4.8 ITRS – International Technology Roadmap for Semiconductors5.4.9 JEDEC – Joint Electron Devices Engineering Council5.4.10 MIL-STD – U. S. Military Standard5.4.11 MM – Machine Model5.4.12 RMS – root mean square5.4.13 SED – static event detector5.4.14 MOSFET – metal oxide semiconductor field effect transistor

TO: 5.4.1-5.4.14: Italicize the acronyms being defined and replace the en dashes with em dashes per SM 5-39.6. Insert new acronyms for direct current (DC), C0G, LSR, SI, EMC, iNARTE, EIA, IC, etc. used later in the document.

5.4.1 ANSI — American National Standards Institute5.4.2 CDM — Charged Device Model5.4.3 DC — Direct Current5.4.4 EIA — Electronic Industries Association5.4.5 EMC — Electromagnetic Compatibility5.4.6 EMI — Electromagnetic Interference5.4.7 ESD — Electrostatic Discharge5.4.8 HBM — Human Body Model5.4.9 EC — International Electrotechnical Commission5.4.10 IC — Integrated Circuit5.4.11 iNARTE — International Association of Radio, Telecommunications, and Electromagnetics5.4.12 ITRS — International Technology Roadmap for Semiconductors5.4.13 JEDEC — Joint Electron Devices Engineering Council5.4.14 LSR — Low Series Resistance5.4.15 MIL-STD — U. S. Military Standard5.4.16 MM — Machine Model5.4.17 RMS — root mean square5.4.18 SED — static event detector5.4.19 SI — International System of Units5.4.20 MOSFET — metal-oxide-semiconductor field-effect-transistor


Justification: Comply with the Editorial Guidelines

5

FROM: 6: Capitalize the “p” in “precautions”.

6 Safety precautions

TO:

6: Capitalize the “p” in “precautions”.

6 Safety Precautions

Justification: Should be title case.

6 FROM: 7.1.1: Change “instrument” to “equipment”. Lowercase the “O” in “Ohm” to be consistent with how it is defined elsewhere in the document (e.g., R3-1.2).

7.1.1 An electrometer is defined as an electrical instrument for measuring electric charge, electric current and/or electrical potential difference (voltage). Measurements of electric current with an electrometer are not discussed in this document. An electrometer that measures electric charge only is called a coulombmeter. One of the typical features of an electrometer used in the charge or the voltage measurement mode is very high input impedance. That high impedance is needed to prevent or to minimize the transfer of electric charges between the measured object and electrometer. Ideally, the input impedance would be infinite. In practice, it is limited by intrinsic physical materials properties of insulators and by stray leakage paths between the input terminals. Low voltage electrometers (below 200 Volt) have typical input resistances of 1014 Ohms or higher and accuracies better than 0.1%. In the voltmeter mode, an electrometer can resolve microvolt potentials. High voltage electrometers (kilovolts range) usually rely on resistive voltage dividers and have typical input impedances in the 1011 Ohms range with accuracies in the 1% range. It is important to evaluate and understand the burden that the input impedance of an electrometer represents when measuring charge or voltage on charged objects.


TO:

7.1.1: Change “instrument” to “equipment”. Lowercase the “O” in “Ohm” to be consistent with how it is defined elsewhere in the document (e.g., R3-1.2).

7.1.1 An electrometer is defined as an electrical equipment for measuring electric charge, electric current and/or electrical potential difference (voltage). Measurements of electric current with an electrometer are not discussed in this document. An electrometer that measures electric charge only is called a coulombmeter. One of the typical features of an electrometer used in the charge or the voltage measurement mode is very high input impedance. That high impedance is needed to prevent or to minimize the transfer of electric charges between the measured object and electrometer. Ideally, the input impedance would be infinite. In practice, it is limited by intrinsic physical materials properties of insulators and by stray leakage paths between the input terminals. Low voltage electrometers (below 200 Volt) have typical input resistances of 1014 ohms or higher and accuracies better than 0.1%. In the voltmeter mode, an electrometer can resolve microvolt potentials. High voltage electrometers (kilovolts range) usually rely on resistive voltage dividers and have typical input impedances in the 1011 ohms range with accuracies in the 1% range. It is important to evaluate and understand the burden that the input impedance of an electrometer represents when measuring charge or voltage on charged objects.

Justification: Clarification and consistency throughout the document.

7

FROM: 7.2: Delete the extra “/”.

7.2 Fieldmeter/ /Field Sensor

TO: 7.2: Delete the extra “/”.

7.2 Fieldmeter/ Field Sensor

Justification: Typo

8 FROM:

7.2.1.1: Insert a comma after “ionization”. 7.2.1.1 The fieldmeter/electrostatic locator/field sensor will henceforth be referred to as “the fieldmeter.” For measurements in the presence of air ionization a chopper stabilized fieldmeter is required. The fieldmeter must be capable of making field measurements at a distance of 2.54 centimeters (cm) = 1 inch or less, from the field source to the sensor for this guide, as written. However, see Section 9.2.4 for fieldmeters that are operated at fixed distance(s), and adjust values in this document where applicable. The handheld fieldmeter is feasible as an electrostatic locator only, precise measurements need a fixed distance between the fieldmeter sensor and the object under investigation.


TO: 7.2.1.1: Insert a comma after “ionization”.

7.2.1.1 The fieldmeter/electrostatic locator/field sensor will henceforth be referred to as “the fieldmeter.” For measurements in the presence of air ionization, a chopper stabilized fieldmeter is required. The fieldmeter must be capable of making field measurements at a distance of 2.54 centimeters (cm) = 1 inch or less, from the field source to the sensor for this guide, as written. However, see Section 9.2.4 for fieldmeters that are operated at fixed distance(s), and adjust values in this document where applicable. The handheld fieldmeter is feasible as an electrostatic locator only, precise measurements need a fixed distance between the fieldmeter sensor and the object under investigation.

Justification: Grammatical

9 FROM:

7.2.1.1, 9.3.1.4, 9.3.1.5, NOTE 2, etc.: Replace “Section” with the appropriate ¶ or § symbols throughout the document per SM Table A4-1.

7.2.1.1 The fieldmeter/electrostatic locator/field sensor will henceforth be referred to as “the fieldmeter.” For measurements in the presence of air ionization a chopper stabilized fieldmeter is required. The fieldmeter must be capable of making field measurements at a distance of 2.54 centimeters (cm) = 1 inch or less, from the field source to the sensor for this guide, as written. However, see Section 9.2.4 for fieldmeters that are operated at fixed distance(s), and adjust values in this document where applicable. The handheld fieldmeter is feasible as an electrostatic locator only, precise measurements need a fixed distance between the fieldmeter sensor and the object under investigation.

9.3.1.4 Directing or Pointing the Sense Head — Direct or point the sense head of the fieldmeter or voltmeter at the center and parallel to the surface of the plate at a distance at least twice of that recommended by the manufacturer. Slowly move the sense head toward the surface of the charged plate until a reading equal to the voltage applied to the plate in Section 9.3.1.1 above is displayed by the meter. Measure and record the distance from the sense head to the surface to the plate. Using the plate voltage from Section 9.3.1.1 above and the recorded distance, compute the field strength for the fieldmeter. See Figure 3, Fieldmeter and Voltmeter Verification Check.

9.3.1.5 Alternative to Section 9.3.1.2 — Take measurements at a specified/fixed distance per manufacturer's instructions. Locate the sense head of the fieldmeter or voltmeter as in Section 9.3.1.4, but, at specified distance; reading displayed (on meter) should be within 5% of applied voltage to plate.

NOTE 2: Section 9.3.1.4 or 9.3.1.5 should be applicable to most meters. However, in every case, the electrostatic fieldmeter or voltmeter manufacturer's instructions should be read, understood, and followed.


TO:

7.2.1.1, 9.3.1.4, 9.3.1.5, NOTE 2, etc.: Replace “Section” with the appropriate ¶ or § symbols throughout the document per SM Table A4-1.

7.2.1.1 The fieldmeter/electrostatic locator/field sensor will henceforth be referred to as “the fieldmeter.” For measurements in the presence of air ionization a chopper stabilized fieldmeter is required. The fieldmeter must be capable of making field measurements at a distance of 2.54 centimeters (cm) = 1 inch or less, from the field source to the sensor for this guide, as written. However, see ¶ 9.2.4 for fieldmeters that are operated at fixed distance(s), and adjust values in this document where applicable. The handheld fieldmeter is feasible as an electrostatic locator only, precise measurements need a fixed distance between the fieldmeter sensor and the object under investigation.

9.3.1.4 Directing or Pointing the Sense Head — Direct or point the sense head of the fieldmeter or voltmeter at the center and parallel to the surface of the plate at a distance at least twice of that recommended by the manufacturer. Slowly move the sense head toward the surface of the charged plate until a reading equal to the voltage applied to the plate in ¶ 9.3.1.1 above is displayed by the meter. Measure and record the distance from the sense head to the surface to the plate. Using the plate voltage from ¶ 9.3.1.1 above and the recorded distance, compute the field strength for the fieldmeter. See Figure 3, Fieldmeter and Voltmeter Verification Check.

9.3.1.5 Alternative to ¶ 9.3.1.2 — Take measurements at a specified/fixed distance per manufacturer's instructions. Locate the sense head of the fieldmeter or voltmeter as in ¶ 9.3.1.4, but, at specified distance; reading displayed (on meter) should be within 5% of applied voltage to plate.

NOTE 2: ¶ 9.3.1.4 or ¶ 9.3.1.5 should be applicable to most meters. However, in every case, the electrostatic fieldmeter or voltmeter manufacturer's instructions should be read, understood, and followed.

Justification: Comply with Style Manual

10

FROM: 7.4.1: Delete the hyphen in “pre-conditioned”.

7.4.1 All previously mentioned measurement devices should be turned on and pre-conditioned for as long a warm-up period as recommended by the manufacturer

TO:

7.4.1: Delete the hyphen in “pre-conditioned”.

7.4.1 All previously mentioned measurement devices should be turned on and preconditioned for as long a warm-up period as recommended by the manufacturer



11

FROM: 7.5.1: Lowercase the “E” in “ESD Events” in 2nd sentence. In the last sentence, insert “(DC)” after “di-rect current” and delete the hyphen in “in-situ” and replace with a space.

7.5.1 An electrostatic discharge, or ESD event, is a source of damage to the devices and reticles. Measurements of ESD events are the only direct way of assessing the actual ESD exposure. ESD Events can be measured directly or indirectly. Direct measurements are possible by inserting a current probe into the discharge path and measuring the discharge current. Such measurements, though providing the maximum accuracy, are largely limited to laboratories as it is impractical to do in an operating factory. A more practical way of detecting and measuring ESD events is by measuring a specific electromagnetic field that is generated by an ESD event. Though this method may not offer the precision of the direct current measurements, it does offer a practical way of assessing ESD exposure in-situ.

TO:

7.5.1: Lowercase the “E” in “ESD Events” in 2nd sentence. In the last sentence, insert “(DC)” after “di-rect current” and delete the hyphen in “in-situ” and replace with a space.

7.5.1 An electrostatic discharge, or ESD event, is a source of damage to the devices and reticles. Measurements of ESD events are the only direct way of assessing the actual ESD exposure. ESD events can be measured directly or indirectly. Direct measurements are possible by inserting a current probe into the discharge path and measuring the discharge current. Such measurements, though providing the maximum accuracy, are largely limited to laboratories as it is impractical to do in an operating factory. A more practical way of detecting and measuring ESD events is by measuring a specific electromagnetic field that is generated by an ESD event. Though this method may not offer the precision of the direct current (DC) measurements, it does offer a practical way of assessing ESD exposure insitu.

Justification: Grammatical and introducing acronym when first mentioned.

12

FROM: 8: Capitalize the initial letter in “number” and “measurements”.

8 Sufficient number of measurements

TO: 8: Capitalize the initial letter in “number” and “measurements”.

8 Sufficient Number of Measurements

Justification: Title case

13 FROM: 9: Delete the “d” at the end of “Performanced”.

9 Test Methods, Measurements and Performanced Verification Methods


TO: 9: Delete the “d” at the end of “Performanced”.

9 Test Methods, Measurements and Performance Verification Methods

Justification: Misspelling

14

FROM: 9.1.2: Italicize “Performance … mode)” and insert an em dash before “Refer”.

9.1.2 Performance Verification of a Coulombmeter (or an Electrometer used in the charge measurement mode) Refer to Figure 1.

TO: 9.1.2: Italicize “Performance … mode)” and insert an em dash before “Refer”.

9.1.2 Performance Verification of a Coulombmeter (or an Electrometer used in the charge measurement mode) — Refer to Figure 1.


15

FROM:

9.1.2.1: Change “instrument” to “equipment”.

9.1.2.1 Reset (zero) the instrument prior to each measurement.

TO:

9.1.2.1: Change “instrument” to “equipment”.

9.1.2.1 Reset (zero) the equipment prior to each measurement.

Justification: Clarification and consistency throughout the document

16

FROM: 9.1.2.3: Replace the lowercase “x” with the multiplication symbol per SM Table A4-1.

9.1.2.3 Charge the reference calibration capacitor to 1 volt with a charging source (power supply). Calculate the amount of charge on the capacitor by multiplying the voltage by the value of the capacitor. Example: 1V x 10 nF = 10 nC of charge.


TO: 9.1.2.3: Replace the lowercase “x” with the multiplication symbol per SM Table A4-1.

9.1.2.3 Charge the reference calibration capacitor to 1 volt with a charging source (power supply). Calculate the amount of charge on the capacitor by multiplying the voltage by the value of the capacitor. Example: 1V × 10 nF = 10 nC of charge.


17

FROM: 9.2.1: Capitalize initial character in “selection”.

9.2.1 Equipment selection

TO: 9.2.1: Capitalize initial character in “selection”.

9.2.1 Equipment Selection


18

FROM: 9.2.2: Capitalize initial characters in “used”, “voltage”, and “mode”.

9.2.3: Capitalize initial characters in “used”, “voltage”, and “mode”.

9.2.2 Performance Verification of an Electrometer used in the voltage mode9.2.3 Zeroing an Electrometer used in the voltage mode

TO: 9.2.2: Capitalize initial characters in “used”, “voltage”, and “mode”.

9.2.3: Capitalize initial characters in “used”, “voltage”, and “mode”.

9.2.2 Performance Verification of an Electrometer Used in the Voltage Mode9.2.3 Zeroing an Electrometer Used in the Voltage Mode


19 FROM: 9.3.1: Replace the hyphen with an em dash before “Refer”.9.3.1 Performance Verification of Fieldmeters and Voltmeters - Refer to Figure 3.


TO: 9.3.1: Replace the hyphen with an em dash before “Refer”.9.3.1 Performance Verification of Fieldmeters and Voltmeters — Refer to Figure 3.


20

FROM: Table 1: Format table caption per SM Table 3 4-32. In Table Note 1, insert “a” between “as” and “guide.”

#1 If fieldmeter or voltmeter performance verification is needed above 5,000 Volts, it is left to the user to select values using the table as guide.

TO:

Table 1: Format table caption per SM Table 3 4-32. In Table Note 1, insert “a” between “as” and “guide.”

#1 If fieldmeter or voltmeter performance verification is needed above 5,000 Volts, it is left to the user to select values using the table as a guide.

Justification: Grammatical and table notation formatting per the Editorial Guidelines

21

FROM: 9.3.1.2: Change “Instrument” to “Equipment”.

9.3.1.2 Instrument Performance Verification — Charge a conductive, isolated test plate to the desired verification voltage. Use of a suitable power supply or a charged plate monitor for test purposes is recommended.

TO: 9.3.1.2: Change “Instrument” to “Equipment”.

9.3.1.2 Equipment Performance Verification — Charge a conductive, isolated test plate to the desired verification voltage. Use of a suitable power supply or a charged plate monitor for test purposes is recommended.

Justification: Consistent use of term throughout document

22

FROM:

9.3.2: Delete the hyphen in “re-verify”.

9.3.2 Check the zero on the fieldmeter or voltmeter as specified by the manufacturer. Usually this is done while the probe is positioned to view a grounded surface. If the zero of the meter has drifted by more than 5% of the test voltage for any range contained in Table 1, the meter is not suitable for use for measurements over that range. It may be suitable for use over other ranges contained in Table 1, using other test voltages. Re-verify the meter’s calibration at the selected test voltage.


TO: 9.3.2: Delete the hyphen in “re-verify”.

9.3.2 Check the zero on the fieldmeter or voltmeter as specified by the manufacturer. Usually this is done while the probe is positioned to view a grounded surface. If the zero of the meter has drifted by more than 5% of the test voltage for any range contained in Table 1, the meter is not suitable for use for measurements over that range. It may be suitable for use over other ranges contained in Table 1, using other test voltages. Reverify the meter’s calibration at the selected test voltage.


23

FROM: 9.3.4.1: Make last sentence starting with “See Related Information” a NOTE 3: (renumbering the remain-ing NOTES accordingly) since the official standard content cannot refer to unofficial content in a Related Information section, but an unofficial NOTE can.

9.3.4.1 Measurements made to this guide are only valid for surfaces that are flat to a radius of 1.5 times the measurement distance from a point directly below the sensor head. For surfaces that are not flat, measurements should be made by moving the sensor over the surface such that the specified measurement distance is maintained as closely as possible. These measurements may only be stated as a range, with rounding as applicable to the meter's measurement range according to Section 9.3.1.1. See Figure 4, Example of a Survey of a Carrier of Semiconductor Wafers. See Related Information 2 for notes on test methods environment and measurements.

TO: 9.3.4.1: Make last sentence starting with “See Related Information” a NOTE 3: (renumbering the remain-ing NOTES accordingly) since the official standard content cannot refer to unofficial content in a Related Information section, but an unofficial NOTE can.

9.3.4.1 Measurements made to this guide are only valid for surfaces that are flat to a radius of 1.5 times the measurement distance from a point directly below the sensor head. For surfaces that are not flat, measurements should be made by moving the sensor over the surface such that the specified measurement distance is maintained as closely as possible. These measurements may only be stated as a range, with rounding as applicable to the meter's measurement range according to Section 9.3.1.1. See Figure 4, Example of a Survey of a Carrier of Semiconductor Wafers.

NOTE 3: See Related Information 2 for notes on test methods environment and measurements.

Justification: Referring to unofficial part of the document. Notes are considered an unofficial part of the document as well, so the reference is more appropriate in this area of content.


24 FROM: Figure 4: Delete the space before the hyphens in “C)” and “D)”.


TO: Figure 4: Delete the space before the hyphens in “C)” and “D)”.

Justification: Typo

25

FROM:

NOTE 3: Insert 2 spaces after the colon per SM 4-14.3.

NOTE 3:See Figure 3.

TO: NOTE 3: Insert 2 spaces after the colon per SM 4-14.3.

NOTE 3: See Figure 3.

Justification: Typo


26

FROM:

9.4.1: Insert “a” before “specific”.

9.4.1.1 An ESD event generates an electromagnetic field with specific signature characterized by:

TO: 9.4.1: Insert “a” before “specific”.

9.4.1.1 An ESD event generates an electromagnetic field with a specific signature characterized by:

Justification: Grammatical / typo

27

FROM: 9.4.1.2: Lowercase the initial character in “Event”, “Detectors”, and “Simulators”.

9.4.1.2 Studies published by Intel (ESD Symposium 2005) and others provide correlations between measurements of electromagnetic field generated by ESD events and their magnitude. Verification of the performance of ESD Event Detectors can also be done using the various industry ESD Simulators.

TO: 9.4.1.2: Lowercase the initial character in “Event”, “Detectors”, and “Simulators”.

9.4.1.2 Studies published by Intel (ESD Symposium 2005) and others provide correlations between measurements of electromagnetic field generated by ESD events and their magnitude. Verification of the performance of ESD event detectors can also be done using the various industry ESD simulators.

Justification: Should not have been in title case – grammatical

28

FROM: 9.4.2: Change “Tools” to “Equipment”.9.4.2 Measurement Tools for ESD Events

TO:

9.4.2: Change “Tools” to “Equipment”.

9.4.2 Measurement Equipment for ESD Events

Justification: Consistency of use of terms throughout document

29 FROM: 9.4.2.2.2: Change “Instruments” to “Equipment”.

9.4.2.2.2 Instruments with lesser performance specifications would either miss or misinterpret important parameters of ESD events.


TO: 9.4.2.2.2: Change “Instruments” to “Equipment”.

9.4.2.2.2 Equipment with lesser performance specifications would either miss or misinterpret important parameters of ESD events.

Justification: Consistent use of terminology throughout document

30

FROM: 9.4.2.2.3: Insert a hyphen between “time” and “domain” in two places.

9.4.2.2.3 The use of a high-speed oscilloscope must be accompanied by the use of a proper antenna for receiving the electromagnetic fields. For time domain measurements it is important to use an antenna with a flat frequency response since frequency correction that is common in the frequency domain is not possible for time domain measurements. Also, it is important to note that a typical oscilloscope captures only one event (first or last one, depending on trigger setting), missing multiple ESD events that are common.

TO: 9.4.2.2.3: Insert a hyphen between “time” and “domain” in two places.

9.4.2.2.3 The use of a high-speed oscilloscope must be accompanied by the use of a proper antenna for receiving the electromagnetic fields. For time-domain measurements it is important to use an antenna with a flat frequency response since frequency correction that is common in the frequency domain is not possible for time-domain measurements. Also, it is important to note that a typical oscilloscope captures only one event (first or last one, depending on trigger setting), missing multiple ESD events that are common.


31

FROM:

9.4.2.2.4: Define acronym EMC here as first time used.

9.4.2.2.4 Spectrum analyzers commonly used in EMC test and wireless communication are not practical for detecting eletromagnetic signals from ESD events due to their unacceptably low acquisition speed.

TO: 9.4.2.2.4: Define acronym EMC here as first time used.

9.4.2.2.4 Spectrum analyzers commonly used in electromagnetic compatibility (EMC) test and wireless communication are not practical for detecting eletromagnetic signals from ESD events due to their unacceptably low acquisition speed.

Justification: First time acronym was introduced and need clarification / defining of letters


32

FROM: 9.4.2.3.2: Lowercase the “E” in “Event”.

9.4.2.3.2 ESD Event monitors may range from a simple device with only an indication of the occurrence of ESD event, to a more complex device that can measure the strength of each individual event and provide correlation to the strength of the electrostatic discharge based on the distance from the location of the discharge and other parameters.

TO: 9.4.2.3.2: Lowercase the “E” in “Event”.

9.4.2.3.2 ESD event monitors may range from a simple device with only an indication of the occurrence of ESD event, to a more complex device that can measure the strength of each individual event and provide correlation to the strength of the electrostatic discharge based on the distance from the location of the discharge and other parameters.

Justification: Should not be capitalized

33 FROM: A1-1.1: Change “Instrument” to “Equipment”.

A1-1.2: Change “instruments” to “equipment”.

A1-1.1 Tables A1-1 and A1-2 are intended to assist in the selection of an appropriate instrument for making electrostatic measurements. Users should note that a variety of measurement methods is available for any given situation. Consult manufacturers of the equipment for additional information concerning its proper use and applicability.

A1-1.2 Some instruments are used for making measurements of electric charge, voltage or field indirectly. This means that the desired property can be calculated from the measurement of another physical quantity. For example, electric charge deposited on an object can be calculated from electrostatic field or electrostatic voltage (potential) associated with that object.

TO: A1-1.1: Change “Instrument” to “Equipment”.

A1-1.2: Change “instruments” to “equipment”.

A1-1.3 Tables A1-1 and A1-2 are intended to assist in the selection of an appropriate equipment for making electrostatic measurements. Users should note that a variety of measurement methods is available for any given situation. Consult manufacturers of the equipment for additional information concerning its proper use and applicability.

A1-1.4 Some equipment are used for making measurements of electric charge, voltage or field indirectly. This means that the desired property can be calculated from the measurement of another physical quantity. For example, electric charge deposited on an object can be calculated from electrostatic field or electrostatic voltage (potential) associated with that object.


Justification: Consistency of terms used throughout the document. Deletion of “an” for grammatical purposes.

34

FROM: Table A1-1: Change “Instruments” to “Equipment Types” in table caption and header. Italicize the names of the different equipment types in second row as they are also column headers. Need to correct the placement of the header row and entry row on p. 13 due to the table breaking across the pages.

Table A1-1 Recommended Instruments for Electrostatic Measurements

TO: Table A1-1: Change “Instruments” to “Equipment Types” in table caption and header. Italicize the names of the different equipment types in second row as they are also column headers. Need to correct the placement of the header row and entry row on p. 13 due to the table breaking across the pages.

Table A1-1 Recommended Equipment Types for Electrostatic Measurements

Justification: Need to re-apply the styles in the table for the italicizing and format the row to not break across the page. The word change is for consistency of the use of the term throughout the entire document.

35

FROM: R1-2.1, R1-2.2: Define “RMS” the first time it is used in R1-2.1, not in R1-2.2.

R1-2.1 The verification procedure is intended to ensure that the meter used does not drift excessively (less than 5% in 5 minutes) and can repeatedly measure a known field to within 5%. When actually using the meter to do a field survey, maintaining the correct distance from the sensor head to the surface or object being measured becomes the greatest source of error. If the ability of the meter operator to maintain the correct distance is within 10%, then the total error of the measurement would be within about 12% using this calibration procedure (RMS of the 5% drift, 5% repeatability, and 10% distance errors).

TO: R1-2.1, R1-2.2: Define “RMS” the first time it is used in R1-2.1, not in R1-2.2.

R1-2.1 The verification procedure is intended to ensure that the meter used does not drift excessively (less than 5% in 5 minutes) and can repeatedly measure a known field to within 5%. When actually using the meter to do a field survey, maintaining the correct distance from the sensor head to the surface or object being measured becomes the greatest source of error. If the ability of the meter operator to maintain the correct distance is within 10%, then the total error of the measurement would be within about 12% using this calibration procedure (root mean square [RMS] of the 5% drift, 5% repeatability, and 10% distance errors).

Justification: Introduction of an acronym


36

FROM: R3-1.1: Delete the periods at the end of the first two bullets.

R3-1.1 ESD Simulators are used to replicate ESD events. Common types used to characterize semiconductor devices and equipment include: Component Level HBM ESD Simulator. Component Level MM ESD Simulator. Component Level CDM ESD Simulator System Level HBM/metal ESD Simulator

TO:

R3-1.1: Delete the periods at the end of the first two bullets.

R3-1.1 ESD Simulators are used to replicate ESD events. Common types used to characterize semiconductor devices and equipment include: Component Level HBM ESD Simulator Component Level MM ESD Simulator Component Level CDM ESD Simulator System Level HBM/metal ESD Simulator

Justification: Grammatical – adhere to the Style Manual

37

FROM: R3-1.3: Insert a comma after “handler” and a period after “etc”.

R3-1.3 The component level MM (Machine Model) ESD Simulator represents the parameters agreed upon for a standard, which represents the discharge from a charged metallic part of a machine (automatic handler etc). These parameters are 200 pF and zero resistance for the representative capacitance and DC resistance respectively of the machine part. We note here that the resulting waveform is highly dependent on the impedance of the measurement circuitry.

TO: R3-1.3: Insert a comma after “handler” and a period after “etc”.

R3-1.3 The component level MM (Machine Model) ESD Simulator represents the parameters agreed upon for a standard, which represents the discharge from a charged metallic part of a machine (automatic handler, etc.). These parameters are 200 pF and zero resistance for the representative capacitance and DC resistance respectively of the machine part. We note here that the resulting waveform is highly dependent on the impedance of the measurement circuitry.



38

FROM: R3-1.5: Insert a hyphen between “system” and “level”.

R3-1.5 The system level HBM/metal ESD Simulator represents the parameters agreed upon for a standard, which represents the discharge from a human holding a metallic instrument. These parameters are the lower resistance 350 ohms and 150 pF for the representative resistance and capacitance respectively of the human holding a metallic instrument. Note here that the waveform is greatly affected by the measuring equipment parasitics.

TO: R3-1.5: Insert a hyphen between “system” and “level”.

R3-1.5 The system-level HBM/metal ESD Simulator represents the parameters agreed upon for a standard, which represents the discharge from a human holding a metallic instrument. These parameters are the lower resistance 350 ohms and 150 pF for the representative resistance and capacitance respectively of the human holding a metallic instrument. Note here that the waveform is greatly affected by the measuring equipment parasitics.


39

FROM: RI 3 NOTE 1: Number NOTES sequentially (i.e., don’t restart numbering at 1) throughout the main body, appendices, and RIs per SM 4-14.4.

TO: RI 3 NOTE 1: Number NOTES sequentially (i.e., don’t restart numbering at 1) throughout the main body, appendices, and RIs per SM 4-14.4.

Justification: To adhere to the Style Manual

40 FROM: R3-2.1: Insert a hyphen between “Pin” and “to”, “to” and “Ground”, “high” and “bandpass”, “500” and “ohm”, and “high” and “bandwidth”. Change “band width” to “bandwidth” throughout the document.

R3-2.1 HBM ESD Simulator-component level — The procedure for using this simulator to stress test devices or wafers is based upon the standard requirements. ANSI and the ESD Association approved the HBM standard, ANSI/ESD STM5.1-2007, which contains a specific device pin combination sequence for stress testing. 1 This test procedure is generally referred to as a Pin to Ground test since one pin is always grounded while the selected second pin is stressed. Calibration before use requires added equipment components like a current probe, high bandpass cable, a short wire, a 500 ohm resistor and a very high band width waveform recorder/digitizer. A similar test method is available from JEDEC, JESD22-A114 — Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM). 2


TO: R3-2.1: Insert a hyphen between “Pin” and “to”, “to” and “Ground”, “high” and “bandpass”, “500” and “ohm”, and “high” and “bandwidth”. Change “band width” to “bandwidth” throughout the document.

R3-2.1 HBM ESD Simulator-component level — The procedure for using this simulator to stress test devices or wafers is based upon the standard requirements. ANSI and the ESD Association approved the HBM standard, ANSI/ESD STM5.1-2007, which contains a specific device pin combination sequence for stress testing. 1 This test procedure is generally referred to as a Pin-to-Ground test since one pin is always grounded while the selected second pin is stressed. Calibration before use requires added equipment components like a current probe, high-bandpass cable, a short wire, a 500-ohm resistor and a very high-bandwidth waveform recorder/digitizer. A similar test method is available from JEDEC, JESD22-A114 — Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM). 2


41

FROM: R3-2.2: Insert a hyphen between “Pin” and “to”, “to” and “Ground”, “high” and “bandpass”, “500” and “ohm”, and “high” and “bandwidth”.

R3-2.2 MM ESD Simulator-component level — The procedure for using this simulator to stress test devices or wafers is based upon the standard requirements. The ANSI/ESD STM5.2-1999 approved MM standard specifies a specific device pin combination sequence for stress testing. 1 This test procedure is also generally referred to as a Pin to Ground test since one pin is always grounded while the selected second pin is stressed. This procedure is exactly the same as for HBM. Calibration before use requires added equipment components like a current probe, high bandpass cable, short wire, a 500 ohm resistor and a very high band width waveform recorder/digitizer. A similar test method is available from JEDEC, JESD22-A115 — Electrostatic Discharge (ESD) Sensitivity Testing Machine Model (MM). 2

TO: R3-2.2: Insert a hyphen between “Pin” and “to”, “to” and “Ground”, “high” and “bandpass”, “500” and “ohm”, and “high” and “bandwidth”.

R3-2.2 MM ESD Simulator-component level — The procedure for using this simulator to stress test devices or wafers is based upon the standard requirements. The ANSI/ESD STM5.2-1999 approved MM standard specifies a specific device pin combination sequence for stress testing. 1 This test procedure is also generally referred to as a Pin-to-Ground test since one pin is always grounded while the selected second pin is stressed. This procedure is exactly the same as for HBM. Calibration before use requires added equipment components like a current probe, high-bandpass cable, short wire, a 500-ohm resistor and a very high-bandwidth waveform recorder/digitizer. A similar test method is available from JEDEC, JESD22-A115 — Electrostatic Discharge (ESD) Sensitivity Testing Machine Model (MM). 2



42

FROM: R3-2.4: Insert a comma after “Simulators” and a period after “etc”. Add missing SI units for “4 ft by 4 ft”.

R3-2.4 HBM-metal Simulator- system level — The procedure for using this hand-held simulator for testing systems (ATE testers, Automatic handlers, computers, printers, ESD Simulators etc) is based upon the standard requirements. The IEC 61000-4-2, 1996 (formerly 801-2, 1992) standard uses direct contact or air discharge to the system under test and is a different procedure from the other three procedures mentioned above. 3 Calibration before use requires the use of a very large vertical ground plane (at least 4 ft by 4 ft square), a high bandwidth current probe, cables and high bandwidth waveform recorder/digitizer.

TO: R3-2.4: Insert a comma after “Simulators” and a period after “etc”. Add missing SI units for “4 ft by 4 ft”.

R3-2.4 HBM-metal Simulator- system level — The procedure for using this hand-held simulator for testing systems (ATE testers, Automatic handlers, computers, printers, ESD Simulators, etc.) is based upon the standard requirements. The IEC 61000-4-2, 1996 (formerly 801-2, 1992) standard uses direct contact or air discharge to the system under test and is a different procedure from the other three procedures mentioned above. 3 Calibration before use requires the use of a very large vertical ground plane (at least 1.2 m by 1.2 m [4 ft by 4 ft] square), a high bandwidth current probe, cables and high bandwidth waveform recorder/digitizer.

Justification: Grammatical and to adhere to Style Manual

43

FROM: R3-3.1: Add missing classifications for the seven levels (similar to how MM and CDM are done) if they are supposed to be there.

R3-3.1 HBM classification1. < 250 Volts 2. 250 to < 500 3. 500 to < 1000 4. 1000 to < 2000 5. 2000 to < 4000 6. 4000 to < 8000 7. = or > 8000

TO: R3-3.1: Add missing classifications for the seven levels (similar to how MM and CDM are done) if they are supposed to be there.

R3-3.1 HBM classificationClass 0 - < 250 volts Class 1A - 250 to < 500 volts Class 1B - 500 to < 1000 volts Class 1C - 1000 to < 2000 voltsClass 2 - 2000 to < 4000 volts Class 3A - 4000 to < 8000 volts Class 3B - ≥ 8000 volts

Justification: Data was copied from tables contained in E78, but did not include column headings—this change affects the Related Information section, which is unofficial content.


44

FROM: R3-3.2: Add missing units.

R3-3.2 MM classification1. M1 < 100 2. M2 100 to < 200 3. M3 200 to < 400 4. M4 400 to < 800 5. M5 = or > 800

TO: R3-3.2: Add missing units.

R3-3.2 MM classificationClass M1 - < 100 volts Class M2 - 100 to < 200 volts Class M3 - 200 to < 400 volts Class M4 - 400 to < 800 volts Class M5 - ≥ 800 volts


45

FROM: R3-3.3: Add missing units.

R3-3.3 CDM classification6. C1 < 125 7. C2 125 to < 250 8. C3 250 to < 500 9. C4 500 to < 1000 10. C5 1000 to < 2000 11. C6 = or > 2000

TO: R3-3.3: Add missing units.

R3-3.3 CDM classificationClass C1 - < 125 volts Class C2 - 125 to < 250 volts Class C3 - 250 to < 500 volts Class C4 - 500 to < 1000 volts Class C5 - 1000 to < 2000 volts Class C6 - ≥ 2000 volts



46

FROM:

R4-1.1: Insert missing hyphen between “Static” and “charge” in first sentence and between “static” and “control” in second sentence. Define acronym “ICs”.

R4-1.1 Static charge generation is unavoidable whenever materials come in contact. Without a static control program, the problems caused by static charge are also unavoidable. The most common problem caused by static charge is electrostatic discharge (ESD). ESD results in damaged semiconductor ICs, photomask defects, magneto-resistive (MR) read head defects in disk drives, and failures of the drive circuits for flat panel displays (FPD). ESD also creates a significant amount of electromagnetic interference (EMI). Often mistaken for software errors, EMI resulting from ESD interrupts the operation of production equipment. This is particularly true of equipment depending on high-speed microprocessors for control. Results include unscheduled downtime, increased maintenance requirements, and frequently, product scrap. Technology trends to smaller device geometries, faster operating speeds, and increased circuit density make ESD problems worse.1

TO:

R4-1.1: Insert missing hyphen between “Static” and “charge” in first sentence and between “static” and “control” in second sentence. Define acronym “ICs”.

R4-1.1 Static-charge generation is unavoidable whenever materials come in contact. Without a static- control program, the problems caused by static charge are also unavoidable. The most common problem caused by static charge is electrostatic discharge (ESD). ESD results in damaged semiconductor integrated circuits (ICs), photomask defects, magneto-resistive (MR) read head defects in disk drives, and failures of the drive circuits for flat panel displays (FPD). ESD also creates a significant amount of electromagnetic interference (EMI). Often mistaken for software errors, EMI resulting from ESD interrupts the operation of production equipment. This is particularly true of equipment depending on high-speed microprocessors for control. Results include unscheduled downtime, increased maintenance requirements, and frequently, product scrap. Technology trends to smaller device geometries, faster operating speeds, and increased circuit density make ESD problems worse.2

Justification: Grammatical / introduction of acronym—this change affects the Related Information section, which is unofficial content

47 FROM:

R4-1.2: Insert missing hyphen between “static” and “control” in two places.

R4-1.2 For many years static control programs concentrated on protecting components from the charge generated on the personnel that handled them. Many static control methods were devised to control the charge on people including wrist and heel straps, dissipative shoes and flooring, and garments. Increasingly, however, the production of electronic components is done by automated equipment, and personnel never come into contact with the static-sensitive devices. Solving the ESD problem means assuring that ESD events do not occur in the equipment used to manufacture and test electronic components.

1 Levit, L. et al, “It’s the Hardware. No, Software. No, It’s ESD!”, Solid State Technology, May 1999, Pennwell Publishing Company, 98 Spit Brook Road, Nashua NH 03062.2 Levit, L. et al, “It’s the Hardware. No, Software. No, It’s ESD!”, Solid State Technology, May 1999, Pennwell Publishing Company, 98 Spit Brook Road, Nashua NH 03062.


TO: R4-1.2: Insert missing hyphen between “static” and “control” in two places.

R4-1.2 For many years static-control programs concentrated on protecting components from the charge generated on the personnel that handled them. Many static-control methods were devised to control the charge on people including wrist and heel straps, dissipative shoes and flooring, and garments. Increasingly, however, the production of electronic components is done by automated equipment, and personnel never come into contact with the static-sensitive devices. Solving the ESD problem means assuring that ESD events do not occur in the equipment used to manufacture and test electronic components.


48

FROM: R4-2.1: Insert missing hyphen between “static” and “control”, “static” and “sensitive”, “charge” and “creating”, and “static” and “dissipative” in two places.

R4-2.1 An effective static control program in equipment starts with grounding all materials that might come close to, or in contact with the static sensitive components. This prevents the generation of static charge on machine components and eliminates them as a source of the charge creating ESD events. Care must be taken in a grounding program to assure that moving equipment parts remain grounded when they are in motion. In some cases, static dissipative materials may be substituted for conductive materials where flexibility, thermal insulation, or other properties not available in conductive materials are needed. If charging of components is unavoidable, static dissipative materials may be used to slow the resulting discharges and prevent component damage.

TO: R4-2.1: Insert missing hyphen between “static” and “control”, “static” and “sensitive”, “charge” and “creating”, and “static” and “dissipative” in two places.

R4-2.1 An effective static-control program in equipment starts with grounding all materials that might come close to, or in contact with the static-sensitive components. This prevents the generation of static charge on machine components and eliminates them as a source of the charge-creating ESD events. Care must be taken in a grounding program to assure that moving equipment parts remain grounded when they are in motion. In some cases, static-dissipative materials may be substituted for conductive materials where flexibility, thermal insulation, or other properties not available in conductive materials are needed. If charging of components is unavoidable, static-dissipative materials may be used to slow the resulting discharges and prevent component damage.



49

FROM: R4-3.1: Insert missing hyphen “static” and “control” in first sentence.

R4-3.1 A static control program begins when the automated equipment is designed by the OEM, and then continues throughout the lifetime of the equipment. Two basic issues need to be demonstrated. First, are all components in the product-handling path connected to ground? Second, as the product passes through the equipment, is it handled in a way that does not generate static charge above an acceptable level on the component? ESD Association Standard Practice, EOS/ESD SP 10.1-20003. This document contains test methods to verify the integrity of the ground path to equipment parts, as well as to determine if the product is being charged during its passage through the equipment. The test methods are applicable during the original design of the equipment and during acceptance testing by the end user.

TO: R4-3.1: Insert missing hyphen “static” and “control” in first sentence.

R4-3.1 A static-control program begins when the automated equipment is designed by the OEM, and then continues throughout the lifetime of the equipment. Two basic issues need to be demonstrated. First, are all components in the product-handling path connected to ground? Second, as the product passes through the equipment, is it handled in a way that does not generate static charge above an acceptable level on the component? ESD Association Standard Practice, EOS/ESD SP 10.1-20004. This document contains test methods to verify the integrity of the ground path to equipment parts, as well as to determine if the product is being charged during its passage through the equipment. The test methods are applicable during the original design of the equipment and during acceptance testing by the end user.


50

FROM: R4-3.2: Delete the hyphen in “on-line”.

R4-3.2 While the test methods of EOS/ESD SP 10.1-2000 can also be used for periodic verification of the equipment performance, they have one drawback. The automated equipment must be taken off-line to do the testing. This means that there is lost production time, and often the periodic testing is eliminated to maintain product throughput. Other test methods are available that can be performed with the equipment operating on-line, without altering or disturbing its operation.

TO: R4-3.2: Delete the hyphen in “on-line”.

R4-3.2 While the test methods of EOS/ESD SP 10.1-2000 can also be used for periodic verification of the equipment performance, they have one drawback. The automated equipment must be taken off-line to do the testing. This means that there is lost production time, and often the periodic testing is eliminated to maintain product throughput. Other test methods are available that can be performed with the equipment operating online, without altering or disturbing its operation.


3 EOS/ESD SP10.1 - 2000 “Automated Handling Equipment (AHA)”, ESD Association, 700 Turin Road, Rome NY 13440.4 EOS/ESD SP10.1 - 2000 “Automated Handling Equipment (AHA)”, ESD Association, 700 Turin Road, Rome NY 13440.


51

FROM: R4-4.2, R4-4.3: Replace the hyphens with em dashes.

R4-4.2 EMI Locators - When component damage or equipment problems due to ESD are suspected, it may be useful to detect the EMI generated by the ESD event. This type of testing is both a starting point for determining that static charge has been generated, and it is a measurement point to ascertain that any static control methods have been successful. EMI locators measure dynamic operating conditions, as it is usually not necessary to interrupt equipment operations to make measurements.

R4-4.3 Types of EMI Locators - EMI locators are available in a number of different forms. In its simplest form, it consists of an AM radio tuned off station. A popping noise will be heard when an ESD event occurs. At the most complex it consists of a wideband (greater than 1 GHz) digital storage oscilloscope with a set of appropriate antennas, probes, and software. Measurements of radiated interference can be made using antennas while probes can be connected to equipment parts or electronics and power lines.

TO: R4-4.2, R4-4.3: Replace the hyphens with em dashes.

R4-4.2 EMI Locators — When component damage or equipment problems due to ESD are suspected, it may be useful to detect the EMI generated by the ESD event. This type of testing is both a starting point for determining that static charge has been generated, and it is a measurement point to ascertain that any static control methods have been successful. EMI locators measure dynamic operating conditions, as it is usually not necessary to interrupt equipment operations to make measurements.

R4-4.3 Types of EMI Locators — EMI locators are available in a number of different forms. In its simplest form, it consists of an AM radio tuned off station. A popping noise will be heard when an ESD event occurs. At the most complex it consists of a wideband (greater than 1 GHz) digital storage oscilloscope with a set of appropriate antennas, probes, and software. Measurements of radiated interference can be made using antennas while probes can be connected to equipment parts or electronics and power lines.

Justification: Adhere to the Style Manual

52 FROM: R4-4.3.2: Insert missing hyphen between “high” and “frequency” in two places.

R4-4.3.2 Several other types of EMI locating equipment are currently in use. Most consist of high frequency receiving circuitry followed by level detectors to determine the magnitude of the signal. For the purpose of detecting EMI from ESD events, the equipment should have some way of differentiating the short impulse of EMI from the ESD event from the continuous high frequency radiation of other EMI sources. Some instruments contain a counter to total the number of ESD events above the threshold, or alarms to indicate when the number of ESD events exceeds a preset number. This type of instrument can be placed near a piece of equipment that is suspected of causing ESD events and left in place to monitor.


TO: R4-4.3.3: Insert missing hyphen between “high” and “frequency” in two places.

R4-4.3.2 Several other types of EMI locating equipment are currently in use. Most consist of high- frequency receiving circuitry followed by level detectors to determine the magnitude of the signal. For the purpose of detecting EMI from ESD events, the equipment should have some way of differentiating the short impulse of EMI from the ESD event from the continuous high-frequency radiation of other EMI sources. Some instruments contain a counter to total the number of ESD events above the threshold, or alarms to indicate when the number of ESD events exceeds a preset number. This type of instrument can be placed near a piece of equipment that is suspected of causing ESD events and left in place to monitor.


53

FROM: R4-4.4.1: Insert missing hyphen between “radio” and “frequency” and “static” and “control”.

R4-4.4.1 One caution needs to be observed when using EMI locators to detect ESD events that cause component damage. The signal received by these devices is generated in areas usually surrounded by grounded metal components. It may have to pass through equipment panels and travel some distance through the air before it reaches the detector. There maybe other radio frequency sources and reflecting or absorbing materials in the area. The actual location of the ESD event may be a considerable distance from the EMI locator. It will be difficult to establish any correlation between the amplitude of the signal received by the EMI locator and the energy in the ESD event that produced the signal. The EMI locator primarily indicates the occurrence of an ESD event and can be used to illustrate that a particular static control method has eliminated it. It should not be assumed that every ESD event detected results in damage to components or equipment problems. Additional testing will be needed to establish that connection.

TO: R4-4.4.1: Insert missing hyphen between “radio” and “frequency” and “static” and “control”.

R4-4.4.1 One caution needs to be observed when using EMI locators to detect ESD events that cause component damage. The signal received by these devices is generated in areas usually surrounded by grounded metal components. It may have to pass through equipment panels and travel some distance through the air before it reaches the detector. There maybe other radio-frequency sources and reflecting or absorbing materials in the area. The actual location of the ESD event may be a considerable distance from the EMI locator. It will be difficult to establish any correlation between the amplitude of the signal received by the EMI locator and the energy in the ESD event that produced the signal. The EMI locator primarily indicates the occurrence of an ESD event and can be used to illustrate that a particular static-control method has eliminated it. It should not be assumed that every ESD event detected results in damage to components or equipment problems. Additional testing will be needed to establish that connection.


54

FROM: R4-6.1: Lowercase the initial characters in “Liquid Crystal Display”.

R4-6.1 In some SED devices, the signal is amplified and processed to produce a reflectance change in the built-in Liquid Crystal Display (LCD). The SED is designed to trip at a predetermined threshold voltage, detecting ESD transients above the selected amplitude. Some devices can be reset magnetically or optically making them reusable.


TO: R4-6.1: Lowercase the initial characters in “Liquid Crystal Display”.

R4-6.1 In some SED devices, the signal is amplified and processed to produce a reflectance change in the built-in liquid crystal display (LCD). The SED is designed to trip at a predetermined threshold voltage, detecting ESD transients above the selected amplitude. Some devices can be reset magnetically or optically making them reusable.


55

FROM: R4-6.2: Insert missing hyphen between “ESD” and “damage”, “metal” and “oxide”, “oxide” and “semi-conductor” (two places), “field” and “effect”.

R4-6.2 Other devices use the controllable ESD damage threshold of metal oxide semiconductor field effect transistors (MOSFET). The test methodology is to amplify an ESD transient to create sufficient energy to destroy the gate oxide. The device may be used until the specified ESD level is achieved, and then the SED fails. A similar device is based on the metal oxide semiconductor capacitor (MOSCAP). The current leakage through the device significantly increases if the ESD amplitude is sufficient to damage the MOS structure. Both of these types of SED must be removed from where they are installed and require additional instrumentation to determine their status.

TO: R4-6.2: Insert missing hyphen between “ESD” and “damage”, “metal” and “oxide”, “oxide” and “semi-conductor” (two places), “field” and “effect”.

R4-6.2 Other devices use the controllable ESD-damage threshold of metal-oxide-semiconductor field-effect transistors (MOSFET). The test methodology is to amplify an ESD transient to create sufficient energy to destroy the gate oxide. The device may be used until the specified ESD level is achieved, and then the SED fails. A similar device is based on the metal-oxide-semiconductor capacitor (MOSCAP). The current leakage through the device significantly increases if the ESD amplitude is sufficient to damage the MOS structure. Both of these types of SED must be removed from where they are installed and require additional instrumentation to determine their status.


56 FROM: R4-7: Insert missing hyphen between “static” and “charge”, “high” and “technology”, and “static” and “control”.

There is little question that static charge problems continue to result in significant losses in high technology manufacturing. Increasingly, static control methods must be applied in the equipment that produces the product. It will be important to develop and utilize a range of diagnostic methods and measurement equipment for ESD in equipment.


TO: R4-7: Insert missing hyphen between “static” and “charge”, “high” and “technology”, and “static” and “control”.

There is little question that static-charge problems continue to result in significant losses in high-technology manufacturing. Increasingly, static-control methods must be applied in the equipment that produces the product. It will be important to develop and utilize a range of diagnostic methods and measurement equipment for ESD in equipment.


57

FROM: 9.1.2.2 Maintain a reference calibration capacitor. It should be a polystyrene or polypropylene 10 nF capacitor (class COG, low series resistance - LSR). Measure the value of the capacitor to better than 1%. It is important to handle the reference calibration capacitor very carefully. Do not touch or hold the capacitor by its body or discharge it by touching both leads with the fingers. Hold the capacitor by one lead only. Use a clip lead connected between ground and this lead of the capacitor to maneuver the other lead of the capacitor between the “hot” side of the charging source and the input terminal of the coulombmeter.

TO: 9.1.2.2 Maintain a reference calibration capacitor. It should be a polystyrene or polypropylene 10 nF capacitor (class C0G, low series resistance - LSR). Measure the value of the capacitor to better than 1%. It is important to handle the reference calibration capacitor very carefully. Do not touch or hold the capacitor by its body or discharge it by touching both leads with the fingers. Hold the capacitor by one lead only. Use a clip lead connected between ground and this lead of the capacitor to maneuver the other lead of the capacitor between the “hot” side of the charging source and the input terminal of the coulombmeter.

Justification: Typo and was missing related acronym—clarification

58

FROM: Remove definition of acronym since introduced in previous section:

R1-2.2 If two operators using two different meters follow the verification procedure, and they both are able to maintain the correct distance to within 10% as above, then they both would be within 12% of the true field strength when measuring the same surface or object. Taking the root mean square (RMS) of these errors, the two operators using two meters should be within 17% of each other.

TO: R1-2.2 If two operators using two different meters follow the verification procedure, and they both are able to maintain the correct distance to within 10% as above, then they both would be within 12% of the true field strength when measuring the same surface or object. Taking the root mean square (RMS) of these errors, the two operators using two meters should be within 17% of each other.

Justification: Mistakenly defined in section after its first introduction. Definition was moved to the section R1-2.1.


59

FROM:

Update organization name and contact information in section 10.1 and footnote 2:

10.1 It is reasonable to expect that the person chosen to survey production areas for static charge levels has been certified to perform that task. The certified person shall be someone qualified by education and/or training to calibrate and make measurements with the equipment called out in this guide. The ESD Association conducts such education programs and certifies individuals as ESD Program Managers. 1 The International Association of Radio and Television Engineers (iNARTE) administers an ESD Engineer and ESD technician certification program. TO:

10 Certification

10.1 It is reasonable to expect that the person chosen to survey production areas for static charge levels has been certified to perform that task. The certified person shall be someone qualified by education and/or training to calibrate and make measurements with the equipment called out in this guide. The ESD Association conducts such education programs and certifies individuals as ESD Program Managers. 1 The International Association for Radio, Telecommunications, and Electromagnetics (iNARTE) administers an ESD Engineer and ESD technician certification program. 2 2 International Association for Radio, Telecommunications, and Electromagnetics (iNARTE), 840 Queen Street, New Bern NC 28560, www.narte.org

5.4.8 iNARTE — International Association for Radio, Telecommunications, and Electromagnetics (iNARTE)Justification: They changed name in 2007 and moved in 2008.

60

FROM:

Add iNARTE to acronyms: 5.4.8 and renumber the remaining acronyms. TO:

5.4.8 iNARTE — International Association for Radio, Telecommunications, and Electromagnetics (iNARTE)

Justification: Used acronym but didn’t define


A&R Template 4.4downloads.semi.org/web/wstdsbal.nsf/de4d7939711aeedf882575… · Web viewAlso, it...

Documents

Transcript of A&R Template 4.4downloads.semi.org/web/wstdsbal.nsf/de4d7939711aeedf882575… · Web viewAlso, it...