Advanced 4-socket design for cloud and VMs
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inspursystems.com [email protected] 1-800-697-5893 Product Flyer NF8260M6 Advanced 4-socket design for cloud and VMs Cloud-optimized high-density computing platform delivering advanced performance for cloud applications and virtual machines. NF8260M6 is powered by four 3rd Generation Intel Xeon Scalable processors each with 12 DIMMs in a compact 2U form factor, offering high-density performance and Intel Optane PMem 200 memory in several flexible configurations for a variety of cloud computing and data-intensive applications. 4-Socket Design Optimized for Cloud Applications 4-socket design enables double the virtual machine connections and higher virtualization integration ratio compared to previous 2-socket iteration More VMs are integrated on a single physical machine, and information can be exchanged directly through UPI, effectively reducing virtual access latency and increasing access bandwidth Reduces Capex by ~13%, TCO by ~7% Compute Density 2U 4-socket design doubles space efficiency and rack utilization vs 4U 4-socket Flexible Scalability Multiple storage configurations in 2U with 25/24 drive design and 24 NVMe all-flash 12 PCIe 3.0 slots increase expansion capacity by 50% 6 onboard vertical slots eliminates need for a riser, lowering capex FPGA and Intelligent Network Card Adaptation Reliable Performance BMC/BIOS Dual chip redundancy Multiple RAS and security features
Transcript of Advanced 4-socket design for cloud and VMs
inspursystems.com [email protected] 1-800-697-5893
Product Flyer
NF8260M6
Advanced 4-socket design for cloud and VMsCloud-optimized high-density computing
platform delivering advanced performance
for cloud applications and virtual machines.
NF8260M6 is powered by four 3rd Generation Intel
Xeon Scalable processors each with 12 DIMMs in a
compact 2U form factor, offering high-density
performance and Intel Optane PMem 200 memory in
several flexible configurations for a variety of cloud
computing and data-intensive applications.
4-Socket Design Optimized for Cloud
Applications
4-socket design enables double the virtual
machine connections and higher virtualization
integration ratio compared to previous 2-socket
iteration
More VMs are integrated on a single physical
machine, and information can be exchanged
directly through UPI, effectively reducing virtual
access latency and increasing access bandwidth
Reduces Capex by ~13%, TCO by ~7%
Compute Density
2U 4-socket design doubles space efficiency
and rack utilization vs 4U 4-socket
Flexible Scalability
Multiple storage configurations in 2U with
25/24 drive design and 24 NVMe all-flash
12 PCIe 3.0 slots increase expansion
capacity by 50%
6 onboard vertical slots eliminates need for a
riser, lowering capex
FPGA and Intelligent Network Card Adaptation
Reliable Performance
BMC/BIOS Dual chip redundancy
Multiple RAS and security features
inspursystems.com [email protected] 1-800-697-5893
Specifications
Item Description
Processor
Memory
SKUs LFF SKU SFF SKU SFF Expander SKU GPU SKU
2 x Intel® Scalable 3rd Generation Processors (Whitley-ICX)up to 38 / 40 Cores per socket (TDP up to 270W)
32 x DDR4 DIMM (8ch)Support RDIMM/LRDMM/BPS
Front: Up to 12x LFF SATA/SAS/NVMe
Internal: (Opt.)Up to 4 x LFF SATA
Rear: (Opt.)2 / 4x LFF2 / 4x SFF2x SATA M.22x PCIe E1.S (9.5mm)
Up to 13x standard PCIe G4, incl. 1x OCP 3.0 SFF G4 NIC, 1x Internal Mezzanine Card4 (Opt.)
2 x Integrated LOM 10G X710 Dual port (Opt.)
1x TPM SPI 2.0
(1+1) 500W/800W/1200W/1600W/2000W7 Platinum(1+1) 800W/1300W Titanium
(4) 8056 Dual Rotor Fans (7+1 Redundant) (Default) or(4) 8038 Single Rotor Fans1
435mm (W) x 87mm (H) x 780mm (D)
Up to 13x standard PCIe G4, incl. 1x OCP 3.0 SFF G4 NIC, 1x Internal Mezzanine Card4 (Opt.)
Up to 13x standard PCIe G4, incl. 1x OCP 3.0 SFF G4 NIC, 1x Internal Mezzanine Card4 (Opt.)
Up to 4x Dual Width GPU and 1x OCP 3.0 SFF G4 NIC and 1x Internal Mezzanine Card4 (Opt.)
Rear: (Opt.)2 / 4x LFF2 / 4x SFF2x SATA M.2
Rear: (Opt.)2 / 4x LFF10x SFF2x SATA M.2
N/A
N/A
Front: Up to 24x SFF SATA/SAS/NVMe
Front: Up to 25x SFF SATA/SAS EXP
Front: Up to 16x SFF SATA/SAS/NVMe
(TDP up to 165W)
Storage
PICe I/O
Network Controller
Other
PSU
Fan
Dimensions
Rear ConfigurationsFront Configurations
12x LFF SATA/SAS/NVMe
12x LFF SATA/SAS/NVMe
24 drives: 24* SAS/SATA/NVME (3*8 2.5″ Backplane)
12x LFF SATA/SAS/NVMe
