ABCN&HCC Status
description
Transcript of ABCN&HCC Status
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ABCN&HCC Status
• Joel de Witt, University of Santa Cruz, California.• M. Newcomer, N. Dressnandt, University of Pennsylvania.• Matt Warren, Samer Kilani, UCL.• Michelle Key-Charriere, RAL.• D. La Marra, University of Geneva.• F. Anghinolfi, J. Kaplon, CERN.• W. Dabrowski, K. Swientek, Akademia Górniczno-Hutnicza, Krakow.
AUW 2011 CERNABCN&HCC 130 nm Development
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iTK-SC Stave or Module
CERN AUW Week 2
Actual Stavelet Status (4 detectors, 8 hybrids, 160 ABCN)
128 ch ABCN 250 FE ASIC Back-end Tail (Signals, Power)
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iTK-SC Stave or Module
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Develop 256 ch.130nm CMOS FE chip (ABCN 130)
Develop 130nm CMOS Hybrid Controller chip (HCC)
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HCC Controller Chip 1.2V operation 130nm Process
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R3
Hybrid Controller
PLL
ABC Cmd
LCL CmdSR / SetupDCS RO
Data Concentrator
FiFo
Dat
a/C
LK E
ncod
e
DCS
BC/L1 phaseD
ata
II
L0_L1
Xon/off
Xon/off
Data Loop
Data Loop
BC ABC Beam Clock
R3s_L1
CMD_L0
St_Clk
CMD_BC
DRC Data Readout Clock
Hybrid @ bits V(temp), V(analog)
Hybrid (ABC130) side
Serv
ice
side
Bussed Signals o
n Hybrid
One serial Loop
Data I and Data II are separately enabled redundant outputs to the same Stave bus data pair.
Dat
a I
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Hybrid Controller Chip
R3
Hybrid Controller
DLL
ABC Cmd
LCL Cmd
SR / Setup
DCS RO
Dat
a/C
LK E
ncod
e
DCS
BC/L1 phase
Dat
a II
L0_L1
Xon/off
Xon/off
Data Loop
Data Loop
BC (Beam Clock 40MHz)
R3s_L1
CMD_L0St_Clk
DRC (Data Readout Clock 160MHz)
Hybrid bits One serial
Loop
Dat
a I
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ABC130 Chip
Direction (1-bit)
BidirectionalTransceivers160MHz
ReceiversDelay~2.5ns
DriversDelay ~1ns
HCC – ABC130 chip LVS communication 10 ABCN IN A ROW
Programmable current drive (4-bits)
Programmable current drive (4-bits)
Direction (1-bit)
Programmable current drive (4-bits)
CMD_BC
ABC130 Chip
inout
Receivers
BC
CMD_L0
R3s_L1
DRC
inoutinoutinoutinout
inoutinoutinout
inoutinoutinoutinout
CO
RE
Enable (1-bit)
Enable (1-bit)
Xon / Xoff
Data: 160Mbits/s)
Prog
ram
mab
le
dela
y ad
just
FIFO
/ D
ata
Con
cent
rato
r320 MHz
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ABCN 130 nm – Simplified block Diagram
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ABCN level block diagram.
Detector pads: 256 input pads
Front End x256
R3L1_Buffer
L1_DCL
R3_DCL
ReadOutBlock
Serial interface
L0_Buffer
Comparators
Adjacent chip
Command Decoder
COM/L0 R3/L1
Top_Logic
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Serves 2 rows of128 x 2cm strips
2 Levels of bufferingR3 (local readout, fast)L1 (full readout, slow)
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Buffer Size
• Buffers sizingL0 Latency“L0 Buffer (Pipeline)” 256 time slots = 6.4us max
L1 (R3) Latency“R3L1 Buffer” 256 events (768 Time slots) @ 1MHz Write rate = 256 us max
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ABCN130 Read Out Module
DCLR3
DCLL1
ThruDataIn
ControlStatusDCS
51
51
Local FiFO
Local FiFO
READOUT
1
Local MUX & Priority setting
Thru MUX & Priority setting
SERIALIZER ThruDataOut
(59 bits DataPacket)
1x118 bits
51
51
+ Typ(4) + ChipID(4) + Header(1) + Last bit (1)
nn Local FiFO
nn
thruFIFO
51
Priority Reg
nn Local FiFO
nn
Prio
rity
orde
r
High
Low
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Data Packet from adjacent chip
Data Packet To next chip
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ABCN 130nm : 59-bit data packet per chip
L0_3BC Packet L0_1BC Packet R3 Packet
Start Bit Start Bit Start Bit
Chip_ID[3:0] Chip_ID[3:0] Chip_ID[3:0]
Type [3:0] Type [3:0] Type [3:0]
L0ID [7:0] L0ID [7:0] L0ID [7:0]
BCID [7:0] BCID [7:0] BCID [7:0]
clst1_ch[7:0] clst1_ch[7:0] clst1_pos[7:0]
clst1_hit0[2:0] nxtch[2:0] clst2_pos[7:0]
clst1_hit1[2:0] clst2_ch[7:0] clst3_pos[7:0]
clst1_hit2[2:0] nxtch[2:0] clst4_pos[7:0]
clst1_hit3[2:0] clst3_ch2[7:0] OvlF
SPARE[12:0] nxtch[2:0] STOP bit
STOP bit STOP bit
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4 clusters central hit position
3 clusters geom. patterns
Even
t ID
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Functional Code & Simulation Test Bench:SVN Repository Structure
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SVN | ----------------------------------------------------------------------------------------------------------------- | | | ABCN HCC TRIPLICATION --------------------|------------------------------------------------------------------------------ | |trunk branches | | -------------------------------------------------------------------------------- USC development branch | | | rtl scripts test ------- --------- ----------------------------------------- | | | |L0_L1_Buffer simulation scripts matlab TEST_BENCH R3_DCL | L1_DCL ------------------------------------ReadOut | |Top_Logic Post Processing v3commandController | | |integration DCL ReadOut Test vector generation
CERN AUW WeekSlide Courtesy : Michelle Key-Charriere/RAL16/11/2011
Simulation test benches
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//`include "timescale.inc"`timescale 1ns/1psmodule ABCN13 (//bottom edge signals CLK_padP, CLK_padN, BC_padP, BC_padN, COM_LZERO_padP, COM_LZERO_padN, LONERTHREE_padP, LONERTHREE_padN, RST_padP, RST_padN, ID,//data from the detector DIN,//left edge signals XOFFL, XOFFLB, DATL, DATLB,//right edge signals XOFFR, XOFFRB, DATR, DATRB);
#SIM_OPTS = +define+logThruFIFODEPTH=4 +define+logLocalFIFODEPTH=5 +define+logCSRFIFODEPTH=3 +define+PACKETWIDTH=54 +define+PW=53 #customer didn't like this approach???#for vcs sim, no gui#VERILOG = vcs #for ncverilog sim, simvision#add +ncsimargs+-gui +gui_sync to COMMON_DEFINES if gui-driven simulation is desired#change +access+r to +access+w to COMMON_DEFINES if SEU test scripts has to be runVERILOG = ncverilogCOMMON_DEFINES = +define+TEST=test +define+TB=tb +access+rVLOG_OPS = +v2k +libext+.v VLOG_LIBS = -y ../rtl/ABCNmodules -y ../rtl/TBmodules -y ../../trunk/rtl/Pipeline_InReg -y ../rtl/Top_Logic -y ../../trunk/rtl/L1_DCL -y ../../trunk/rtl/R3_DCL -y ../../trunk/rtl/L0_L1 -y $IBM_PDK/ibm_cmos8rf/std_cell/relDM/verilog -y $IBM_PDK/ibm_cmos8rf/short_io/relDM/verilog -y ../../trunk/rtl/WatchDogTOP_MODULES = ../rtl/ABCNmodules/ABCN13.v ../../trunk/rtl/L0_L1/veri_globals_v2.v ../../trunk/rtl/L0_L1/pipecontrollerandL0ID.v ../../trunk/rtl/L0_L1/ROAddressSelect.v#GATE_LEVEL_MODULES = commandControl.vg readOut.vg readReg.vg#GATE_LEVEL_MODULES = ../rtl/synthesized_rtl/reg32.vgTEST_COMPONENTS = $VERILOG $VLOG_OPS $VLOG_LIBS $COMMON_DEFINES $TOP_MODULES $GATE_LEVEL_MODULES
#these are verilog simulation targets for development/experimental tests.#log files are produced but self-checking does not occur.#f(CLK)/f(BCCLK)=4TB1_DEV_TESTS = tb1test0 tb1test1 tb1RegTest tb1InputRegTest tb1PipeLineL1 tb1PipeLineR3
ABCN13.v Makefile (run simulation)
CERN AUW WeekTop Level and Makefile by Joel de Witt/UCSC16/11/2011
Cadence IC6 Simulation Environment
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Packets transmitted
Serial data logged to file for post processing
CERN AUW WeekSlide Courtesy : Michelle Key-Charriere/RAL16/11/2011
Matlab Post Processing Scripts• To check the accuracy of the data transmission, run the post processing script:
.\abcnasic\abcn\trunk\test\Matlab\PostProcessing\ReadOut\packet_analyser.m
>> packet_analyserAll of the loop 1 packets were recovered successfully.Percentage packet loss (%):0All of the loop 2 packets were recovered successfully.Percentage packet loss (%):0
• A bit level verification script for the Data Compression Logic (DCL) is available:.\abcnasic\abcn\trunk\test\Matlab\PostProcessing\DCL\DCL_verification.m
• This requires the matlab models L1_DCL.m and R3_DCL.m to be ‘bit true’ relative to the verilog implementations of the L1_DCL and R3_DCL blocks
More work is required to complete this verification tool.
13CERN AUW WeekSlide Courtesy : Michelle Key-Charriere/RAL16/11/2011
Chip 2 Packet-Type=1000 SEU-Flag=0 Register-Address=20 CSR=00000f01Chip 2 Packet-Type=1000 SEU-Flag=0 Register-Address=23 CSR=00000005Chip 2 Packet-Type=1000 SEU-Flag=0 Register-Address=22 CSR=00000002Chip 2 Packet-Type=0010 Trigger-ID= 0 Bunch-ID= 89 C1: add= 0 C2: add= 0 C3: add= 0 C4: add= 0 Ovfl=0Chip 2 Packet-Type=0011 Trigger-ID= 1 Bunch-ID=169 C1: add=254 C2: add= 0 C3: add= 0 C4: add= 0 Ovfl=0Chip 2 Packet-Type=0011 Trigger-ID= 2 Bunch-ID=181 C1: add=253 C2: add= 0 C3: add= 0 C4: add= 0 Ovfl=0Chip 2 Packet-Type=0011 Trigger-ID= 3 Bunch-ID=193 C1: add=252 C2: add= 0 C3: add= 0 C4: add= 0 Ovfl=0Chip 2 Packet-Type=0110 Trigger-ID= 1 Bunch-ID=169 C1: add=255 bits=000 C2: add=255 bits=000 C3: add=255 bits=000Chip 2 Packet-Type=0110 Trigger-ID= 2 Bunch-ID=181 C1: add=254 bits=000 C2: add=254 bits=000 C3: add=254 bits=000Chip 2 Packet-Type=0110 Trigger-ID= 5 Bunch-ID=217 C1: add=248 bits=000 C2: add=248 bits=000 C3: add=248 bits=000
Data Packet Analyzer
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1 event empty2nd event 1 hit @ channel 255 3rd event 1 hit @ channel 2544th event 1 hit @ channel 2525th event 1 hit @ channel 248
R3
L1
Register Read
Read R3 Events 0 1 2 Read L1 Events 1 2 5Read R3 Event 3
Commands
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Overall layout• Max width 7.5 mm• FE pads
• Only and no GND pads alongside• Span as wide as chip
• Data/Token• Chip-to-chip on air• Return pair underneath• 4 pairs of traces to MCC
• Clock, command, etc. on side– Bus traces underneath– Maximizing spacing between pairs,
no redunancy• Ground, power and chip ID on
bottom
• In the next pages, discuss the FE pads and pads to hybrid…
7.5 mm
FE bonds only (4 rows of 64)
Token and
Data (2 pairs)
Token and
Data (2 pairs)
BCO, L1, Com
, Clk, Reset (5 pairs)
Ground, Power, Chip ID
15CERN AUW WeekSlide Courtesy : Y. UNNO/KEK16/11/2011
Front End • Would like FE bond
pads to take full width of ASIC– Ground pads if needed
below FE connections• Ground pads would
have to bond to the side, use same pad shape as for BE
• Would like ~50x200 mm pads with 100 mm spacing between rows
200
mm
100
mm
Ground (if needed)
1100
mm
16CERN AUW WeekSlide Courtesy : A. Greenhall/Liverpool16/11/2011
“ABCN 130” SEU strategies
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• Simple ideas and proposals
• Assumptions based on :
• Tentative to limit the triplications where strictly needed
• In criticality order
Criticality Method Example
Very critical triplication Critical Commands
Very critical ECC (Hamming)
Sequencers
Less Tricks FIFO controls
Low DICE Baseline every where else (?)
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Dice Cell
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S. BonaciniCERN
Double DFF with interleaved subblocks to separate redundant nodes(IBM standard cell type layout currently under development, Filipe Sousa)
4.5um
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The DICE cell may be an “easy” and power effective way to protect efficiently against SEU most part of the circuit
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IRRADIATIONS PLANS
• Front-End Prototype– Xray at low temperature– Low dose rate irradiation– “Beam” hit test vs. special ESD protection (P)
• RAM block SEU cross section (P)
• SEU standard Logic cross section (with and w/o TRM) (Going on)
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ABCN Front-End Prototype
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Jan Kaplon (Design)/Matt Noy (Measurements)Full set of measurements in backup slides
32 channelsLayout
10 channelsaccess
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Noise performance
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Markers show measured data points, lines are theoretical calculationsNo excess noise visible (Γ excess noise factor equal to 1).
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Fast Track Trigger Optionin ABCN
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Slides by Mitch Newcomer
16/11/2011
Trigger Primitives for Commissioning & Innovation
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Event Time
BC Syncronous L0
fixed Latency ~6-10µS
Challenge: Provide cluster information within a few BC of Event Time to seed first level trigger beam syncronous trigger with
high PT track enhanced triggers.
This kind of prompt trigger wasquite useful during commissioning of the TRT and for triggering the Inner Detector after the LHC accident.
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IT-SC Fast Clustering Conceptual Block Diagram
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Pipeline Data out
BC
• Store Data as two banks of 128 strips at BC time. One buffer register per bank.• Perform clustering algorithm in multiple steps @ 160Mhz using tightly restricted acceptance rules (next page) • Send Fixed Length Cluster information at a fixed #BC (4) after
the event to each dedicated LVDS output.• Due to low strip occupancy it is allowable to allocate several BC
each time a cluster is located.
256 Channel Analog
Front End Data
128
Stri
ps
128
Stri
ps
Bank 1 Data Bank 2 Data
Cluster ? Cluster ?
Pipeline
Separately enabled block
Data from Pipeline Input
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CERN AUW Week 25
Proposed ABC130 Powering Options
ABC130
Analog 1.2V LDO
Digital Variable LDO
Analog Front End
Digital CoreRC filter
RC filterAn LDO In Dig LDO InVref Dig
(1)
(1)
(2)(2)
Power Loss Direct connection LDO DCDC
1.3 to .9 47% (Dig @ 1.3V) 30% 10-15%
1.2 to .9 37% 25% 10-15%
• 1 single power domain for hybrid
• No DC/DC on chip
16/11/2011
ABCN 130 Status• Progress on specs• Functional model and simulation test bench on going• Digital Synthesis has started• FloorPlan will start soon, incl RAM block developed by
CERN/PH/ME• SEU protections to be finalized• Issues on STD CELLS (Dice?)
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HCC Status
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• Specifications on going• Resources for code development are well defined for the
coming year• Resources for Floorplan/Final Layout have still to be defined
• Co-submission with ABCN 130 planned for End Q3-2012
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Backup Slides
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Matching of the front end gains
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Mean 83 – 88mV/fCRMS 3 – 4mV/fC
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Matching of discriminator offsets
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Mean ~ 0mVRMS 8 – 13mV
Pk-Pk value < 80mVWith 5 bit DAC the step will be 1.5 – 2 mV (gain 85 mV/fC)
CERN AUW Week16/11/2011
AC parameters of the input stage
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Intrinsic
transistor gain
Open loop gain
Gain Bandwi
dth Produc
t
Input impedance for frequencies
<1MHz
Input impedance at
25 MHz
Phase
margin
PSRR at low
frequencies
PSRR worst
case (at 25MHz
)
30 V/V 80 dB 2 GHz 30 Ω 330 Ω 90⁰ 78 dB 3 dB
Input transistor bias 80uA Cross talk signal is less than 3% for detector capacitance 1.5 pF to bulk + 2x
1.6 pF to neighbor
CERN AUW Week16/11/2011
Parameters of the full chain
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Detector capacitance range
Current/power consumption per channel
Pulse gain
Peaking
time
Dynamic range/ Linear range
Time walk
0 to 10pF 160 to 240uA190 to 290uW
85 mV/fC
22 ns 6.5/4.5fC 12.5 ns
Time walk defined for signals 1.2 and 10fC with discriminator threshold set to 1fC.
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Command Decoder
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Command Packet
Class Header4 bits
TYP 3b +Parity
ChipID4 bits
Mode/Address8 bits
R/W
Data 32 bits
RESET 1010 000P to 101P
0000 $00 0 `5h000
MODE 1010 1100 aaaa $00 to $FF
0 `5h000
ACSR (Read)
1010 1111 aaaa $00 to $FF
0 `5hxxx
ACSR (Write)
1010 1111 aaaa $00 to $FF
1 `5h00 to `5h1FF
53 bitsCERN AUW Week16/11/2011
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ABCN 130 nm – Block Diagram
Event Address
Pipeline(SRAM)
L1 buffer (SRAM)
DCLL1
RR
Data Flow Control
BC
WA RA WA RA
At L0: RA=WA-L0Lat
WAgen RAgen
At BC : WA=WA+1
L0 latency (6.4us) L1 latency (up to 500us ?)
R3W
R3L0ID
R
L0ID
Event AddressL1
W
L1L0ID
R
256 256
DCLR3
256
25620
20
Local FiFO
Local FiFO
Readout
RR
Command DecoderCLK
L0-COM
R3-L1BC
CERN AUW Week16/11/2011
ABCN Design Picture
Expected 264 bw x 256 al will translate into 5 times 64 bw (320 bits) and 2 times al (256 depth)Size : 5 x 150um in Y and 900um in X : 0.9mm x 0.75mm
(L0Buffer, pipeline)
Unit size : 450x 150 um 128 addresses in X and 64 word bits in Y
L0 pipeline :
320 bits word by 256 addresses
82Kbits memory
0.9 mm
0.75mm
35CERN AUW Week16/11/2011
ABCN Design Picture(L0ID Buffer)
L0ID Buffer :
320 bits word by 728 addresses 233Kb memory
2.7 mm
0.75mm
Expected 272 bw x 728 al will translate into 5 times 64 bw (320 bits) and 6 times al (728 depth)Size : 5 x 150um in Y and 2700um in X : 2.7mm x 0.75mm
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Hybrid readout through the GBT system
HCC 1 HCC 6 HCC 12
HCC 13 HCC 18 HCC 24
E-link 1 – 80-160MHz-clkE-link 2 – RXDATA : COME-link 3 – RXDATA : L0/L1
E-link 1 – TXDATA (80MHz)
E-link 6 – TXDATA (80MHz)
E-link 12 –TXDATA (80MHz)
E-link 1 – 80-160MHz-clkE-link 2 – RXDATA : COME-link 3 – RXDATA : L0/L1
E-link 13 – TXDATA
E-link 18 – TXDATA
E-link 24 – TXDATA
GBTX
E-link 4 – RXDATA : R3
E-link 4 – RXDATA : R3
1 pe
r hyb
rid
CERN AUW Week16/11/2011