A systems approach to buildingA systems approach to building · PDF fileA systems approach to...

77
A systems approach to building A systems approach to building modern high-speed links Vladimir Stojanović Integrated Systems Group Massachusetts Institute of Technology

Transcript of A systems approach to buildingA systems approach to building · PDF fileA systems approach to...

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A systems approach to buildingA systems approach to building modern high-speed links

Vladimir Stojanović

Integrated Systems GroupMassachusetts Institute of Technology

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Course Map

Show modern, systems approach to link design

Day 1Link environment as communication channelLinks as bandlimited communication systems

Day 2Link implementations (signal processing, synchronization)Lab 1

Day 3System modeling (noise sources, ISI)L b 2

Integrated Systems Group 2

Lab 2

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Link System Implementations

Signal processing – Tx, RxEqualizationM d l tiModulation

SynchronizationCDRCDRCDR and Eq interaction

Integrated Systems Group 3

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Modern Link Architecture

Equalization, Multi-level signaling, Partial-responseSophisticated timing recovery

Integrated Systems Group 4

Multi-level, second-order

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Signaling: Current vs. Voltage Mode

Current mode Voltage mode

Hatamkhani 2004Palmer 2007

Voltage mode reduces supply current by a factor of 4

Integrated Systems Group 5

Not as clear when pre-driver and regulator power added

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Transmitter: Output Drivers

On-chip clock speed limited to 6-8FO4p pNeed to send more bits/clock – multiplex data

Integrated Systems Group 6

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Transmitter : Time-Interleaved DACs

CurrentlkSt t0data0

50

CurrentlkSt t0data0

50

CurrentDAC

••

clkStart0clkEnd0

CurrentDAC

••

clkStart0clkEnd0

CurrentDAC

••

clkStart7data7 Current

DAC

••

clkStart7data7

DACs enabled by overlap of two clocks

DACclkEnd7 DACclkEnd7

DACs enabled by overlap of two clocksNeed precise clocksFast clocks limit interleaving

Integrated Systems Group 7

Capacitance DACs loads output

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DAC Output Circuitry

7 thermometer coded size 32 outputs

RCout = 25Ω * 4.3pF −> 1.5 GHz bandwidth

32

7 thermometer-coded size 32 outputs

32

16

16

8

8

4

4

21

VddReg

clkStart42data 1

low-fanout output 3 bit

clkEnd

symbol timepre-driver output

driver

5-bit binary

3-bit thermometer

Integrated Systems Group 8

Predriver VddReg controls output current

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Transmit Equalizers : Analog FIR

TNTP

TNTP

A[2] A[0]

TNTP

W/L

W/L

A[1]1/z

1/z

B[0]W/L

W/L

A[0]

...

1/z

E[0]

W/L

W/L

Simple PAM2/PAM4 Tx Equalizing 5-Tap 2P/4P Tx

E[0]

Integrated Systems Group 9

Simple PAM2/PAM4 Tx q g p

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Transmit Equalizers : Analog FIR

hare

deg

men

ts (7

)Sh

Driv

er S

ped

icat

ed T

apD

river

s (5

)

Original 5-Tap PAM2/PAM4 equalizing transmitter

De

Integrated Systems Group 10

Shared equalizing transmitter[Zerbe 2003]

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Linear CT receiver equalizer – analog high-pass

Tunable RC tail degenerationSensitive to common mode

Integrated Systems Group 11

Sensitive to common-mode[Farjad-Rad 2003]

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Rx Continuous Time Linear Equalizer

At HF

Source-connected RC-poleCapacitor becomes a short at high-frequencies, increasing gain

NOTE M i till li it d b G i *BW d t f l dNOTE: Max gain still limited by Gain*BW product of source-coupled differential pair

Integrated Systems Group 12

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Variable Cap Rx CTLE Implementation

|H||H||H|(dB)|H|(dB)

f

Zero FrequencyAdjustment

f

Zero FrequencyAdjustment

D l ith i ti b t i C &

f(log)f(log)

Deal with process variation by tuning C & therefore tuning zero location

Integrated Systems Group 13

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Rx CTLE Implementation Getting More Gain

Using L canboost gain

significantly

Build peaking amplifier by use of inductorsArea intensiveArea intensive [Partovi 2003]

Integrated Systems Group 14

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Banwidth peaking, Tx and Rx

dj tadjustadjust

adc

dj tadjustadjust adc

adcd

dacdac

adjust

4 stagePLL

dac

Transmit memory

adjustadjust

4 stagePLL

Rx memoryTiming Recovery

adjust adc dac

[Ellersick 2001]

Insert inductors between interleaved stagesApproximate lumped LC transmission linePhase adjustment compensates delay

Integrated Systems Group 15

Phase adjustment compensates delayNice-idea – hard to do

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Rx CTLE Implementation Issues

Linearity a challengeEspecially when input swings vary greatly in amplitude

Limited by gain bw of diff pair stageLimited by gain-bw of diff-pair stageTuned to a data rate with limited range; channel matchSensitive to PVT variationsSensitive to device mismatch linearitySensitive to device mismatch, linearityDifficult to offset cancel, calibrate

Multi-stage issuesHigh gain can lead to clipping in multi-stage designHigh gain can lead to clipping in multi-stage designOriginal design issues become even more difficultTuning is tricky

Performance resultsPerformance resultsIn 90nm, can generally get ~4-6dB of gain/stage at 10Gb/s if you do things rightNot a lot of gain – leads to multi-stage & inductively peaked d i

Slide 16

designs

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Receiver with Analog FIR DFE

Loop latency an issue [Zerbe 2003]

Integrated Systems Group 17

Loop latency an issueUse for tap 2 and more, sometimes just for reflections

[ ]

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DFE Feedback Timing :Splitting Edge & Data Gives Some Relief

FF

Data Output

Data Input

E0 D0 E1 D1 E2 D2 E3 D3 …

D3

Normal DFEP Q

Data clk

D0 D1 D2S

FF FFD0 D1 D2

RS

FF

Tran clk

Trans Output

E3

Ta c

XDFE

Separate data & edge feedback & summers helpStill need to make 1UI data timing – still very tightStill need to make 1UI data timing still very tightAllows separate coefficients & ‘edge-DFE’

Courtesy E.Chen, K. Yang UCLAIntegrated Systems Group 18

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Complete Di-Bit (Half-rate) DFE

S L

α2

VO LS L

α2

VO LdO

SR

Vin

Lclk

α

Lclk

SR

Vin

Lclk

αα1 3

Lclk

dClkO

Vin

α3α

VdClkO

Vin

αα1

V dESR

dClkO

dClkE

Lclk

α2

VE Lclk

SR

dClkO

dClkE

Lclk

α2

VE Lclk

Combine prDFE and fully split even and odd pathsImproved tolerance to DCD errorsCan potentially use separate even/odd coefficents

Courtesy J. Zerbe, Rambus19Integrated Systems Group

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One phase of double-data rate Rx

+- +

½

dE'½w2

+wePEdO'

dE' DFE(Taps 3-10)

+- +

eClkE

eClkEdE'

w2

½w2+w1e

0eZE

+

DFE3-10

w3-w10

dfeClkE/O

vin

DFE(Tap 2)

dClkEVin E1 O1 E2

+-

+

+dClkEw2

dE

dPE

aP dE'

sel0

l1 1

+w1

PrDFE(Tap 1)

eClkEdClkOeClkO

+-

+-

+

+

w2 aClkE

dEaP

dNE

SR Latch

dClkO

dEsel1

To / From

10

-w1

±w1+δ

dClkE Odd Data Pathw1

Even PathOdd PathDFE

First tap unrolled [Leibowitz 2007]

Integrated Systems Group

Second – current-mode (still a speed issue)Third – current-mode DAC

20

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Reducing the critical path: Merge sampler & mux

dClkE dClkESel0 Sel0b

Data SamplerPMOS Domino

Multiplexer

dClkEbb dClkEbb

NMOS DominoMultiplexer

Sel0 Sel0b

i i

dPE+

dPE-SR

dClkEbdClkE

in+ in-

dClkEbb dO- dO+ dE- dE+dClkEb dClkEbb

PrDFE selectto Odd path

PrDFE selectfrom Odd pathSampler +

lti l SRmultiplexerlogic from

Figure 12.4.1:

StrongArm samper directly drives domino

Integrated Systems Group

StrongArm samper directly drives domino mux to reduce critical path on first tap

21

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Receiver front-end is becoming complicatedVTTVTT

2

RTERM

CHANNELIN +/-

DATA(0) AFE Slice

DATA(+) AFE Slice

DATA( ) AFE Slice

Dat

aD

ata

DATA( )

DATA(0)

DATA(+)

+

+

2

RTERM

CHANNELIN +/-

DATA(0) AFE SliceDATA(0) AFE Slice

DATA(+) AFE SliceDATA(+) AFE Slice

DATA( ) AFE SliceDATA( ) AFE Slice

Dat

aD

ata

Dat

aD

ata

DATA( )

DATA(0)

DATA(+)

+++

+++

DATA(-) AFE Slice

A-AFE Slice

Cur

rent

dCLK

aCLK

Dat

a

Dat

a

A-DATA

DATA(-)

EDGE(+)

Dat

a

+

+1:14CurrentS it hV

DATA(-) AFE SliceDATA(-) AFE Slice

A-AFE SliceA-AFE Slice

Cur

rent

Cur

rent

dCLK

aCLK

Dat

aD

ata

Dat

aD

ata

A-DATA

DATA(-)

EDGE(+)

Dat

aD

ata

+++

++1:14CurrentS it hV

EDGE(0) AFE Slice

EDGE(+) AFE Slice

EDGE(-) AFE Slice

EDGE(0)

EDGE(-)

DD

ata

Dat

a

9-bit Delta DAC

+

+

SwitchVTT

EDGE(0) AFE SliceEDGE(0) AFE Slice

EDGE(+) AFE SliceEDGE(+) AFE Slice

EDGE(-) AFE SliceEDGE(-) AFE Slice

EDGE(0)

EDGE(-)

DDD

ata

Dat

aD

ata

Dat

a

9-bit Delta DAC

9-bit Delta DAC

+++

+++

SwitchVTT

EDGE( ) AFE Slice

eCLK

dCLKeaCLKe

8-bit Thresh

dCLKoaCLKo

I_0 [5:0]I_+ [5:0]

[5 0]

“Even” (e) Clock Phase Ckts

“Odd” (o) Clock Phase Ckts

+

VTT

EDGE( ) AFE SliceEDGE( ) AFE Slice

eCLK

dCLKeaCLKe

8-bit Thresh

8-bit Thresh

dCLKoaCLKo

I_0 [5:0]I_+ [5:0]

[5 0]

“Even” (e) Clock Phase Ckts

“Odd” (o) Clock Phase Ckts

+++

VTT

Lots of samplersData even, odd – multi-levelEdge even odd multi level

Lots of DACsMulti-level thresholdsOffset calibration

aCLKeeCLKe

esDAC

aCLKoeCLKo

I_- [5:0] aCLKeeCLKe

esDAC

esDAC

aCLKoeCLKo

I_- [5:0]

Integrated Systems Group 22

Edge even, odd – multi-levelAdaptive sampler

Offset calibrationAdaptation, on-chip scope

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Hardware re-use: Dual-mode receiver

th h(+)D QD Q

thresh (+)lsb(+)

prDFE enable

D Q0

thresh(+)

0 D Q D Qin0

msb

prDFE enabledClk

dClk

D Q

D Q0

1

thresh(-)

D Qthresh (-)

dClk

prDFE enable

D Q

D Q1

0

1

PAM4

lsb(-)D QdClkD Q

0

1

Integrated Systems Group 23

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Hardware re-use: Dual-mode receiver

D QD Qthresh (+)

lsb(+)

prDFE enable

D Q0

th h(+)

D Q D Qin0

msb

prDFE enabledClk

dClk

D Q

D Q0

1thresh(+)

0

D Qthresh (-)

dClk

prDFE enable

D Q

D Q1

0

1

outN

clkclk

Q

thresh(-)

lsb(-)D QdClkD Q

0

1inP

inNinP

outNoutP

outP outN

Q

PAM4 inNclkthreshII

+2 threshII

−2 Q

Integrated Systems Group 24

pre-amp with offset comparator

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Hardware re-use: Dual-mode receiver

D QD Qthresh (+)

lsb(+)

prDFE enable

D Q0

0 D Q D Qin0

msb

prDFE enabledClk

dClk

D Q

D Q0

1

D Qthresh (-)

dClk

prDFE enable

D Q

D Q1

0

1

lsb(-)D QdClkD Q

0

1

PAM2

Integrated Systems Group 25

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Hardware re-use: Dual-mode receiver

D QD Qthresh (+)

lsb(+)

prDFE enable

D Q0

D Q D Qin0

msb

prDFE enabledClk

dClk

D Q

D Q0

1

D Qthresh (-)

dClk

prDFE enable

D Q

D Q1

0

1

lsb(-)D QdClkD Q

0

1

PAM2 with loop-unrolled DFE tap

Integrated Systems Group 26

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Hardware re-use: Dual-mode receiver

D QD Qthresh (+)

lsb(+)

prDFE enable

D Q0

thresh(+)D Q D Qin

0

msb

prDFE enabledClk

dClk

D Q

D Q0

1

thresh(-)

D Qthresh (-)

dClk

prDFE enable

D Q

D Q1

0

1

lsb(-)D QdClkD Q

0

1

PAM2 with loop-unrolled DFE tapLeverage multi-level properties of signals in loop-unrollingRe-use PAM4 receiver hardware (slicers and CDR)

Integrated Systems Group 27

Re-use PAM4 receiver hardware (slicers and CDR)

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Adaptation with minimum overheaddLev

Tx Data

dLev

adaptivesampler

error

Adaptivemacro

aClk

Channel

Rx data macro

thresholds

d

dClk

tapupdates

t d t

CDRedge

aClk dClk eClkeClk

Adaptive sampler Generates the error signal at reference level

Monitors the link

tap updates

Monitors the linkAdjustable voltage and time referenceOn-chip sampling scope

Can replace any other sampler - calibration

Integrated Systems Group 28

Can replace any other sampler - calibrationV. Stojanović et al. “Adaptive Equalization and Data Recovery in Dual-Mode (PAM2/4) Serial Link Transceiver,” IEEE Symposium on VLSI Circuits, June 2004.

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Dual-loop adaptive algorithmD l l f lData level reference loop

0ˆ),(1 >−=+ nndataLevnn xesignstepdLevdLev

dLevinit dLevmid dLevenderrorinitp-p

nx̂

)(Si

… … )ˆ( nxSign

)( neSign

Initial eye Mid-way equalized Equalized

Equalizer loop)ˆ()(1 nnwnn xsignesignstepww +=+

Integrated Systems Group 29

Scale the equalizer - output Tx constraint

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Dual loop convergence – 4 tap example

1000100

PAM2, 5Gb/s, 4taps Tx Equalization

400

600

800

ht [m

V] main tap

60

80

[mV]

0

200

tap

wei

g

post2

20

40dLev

0 50 100 150 200-400

-200

number of updates

post1 pre1

0 50 100 150 2000

20

number of updates

Hard to estimate analyticallyExperimental results show

number of updatesnumber of updates

Integrated Systems Group 30

Both loops are stable within wide range 0.1 – 10x of relative speeds

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Partial response adaptation - start

Extend data filter by one bit (msbn,msbn-1)

(a) Update loops only on (msbn,msbn-1)=(1,1)Finds dLev(1,1) - “1+α”

(b) Update loops only on (msb msb )=(0 1)

Integrated Systems Group 31

(b) Update loops only on (msbn,msbn-1)=(0,1)Finds dLev(0,1) – “1-α”

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Partial response adaptation - end

2α=dLev(1,1)-dLev(0,1)Iterate α finding and equalization loops

msb msb filter tolerates one tap post cursor ISI α

Integrated Systems Group 32

msbn,msbn-1 filter tolerates one tap post-cursor ISI α

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Continuous adaptation with unknown data

DeSer

10

dE'dO'

d d d d

Data Snapshot

dn-10…dn+3

dssClk

dn-10dn-9 dn-8 dn+2dn-9

dn-8

d

dssReset

dn-7

dn+3Abs(x)

U/D!9-bit Acc

n+3( )

Stop adaptation when data not random enough

Integrated Systems Group

Stop adaptation when data not random enoughUse a cross-correlator circuit

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Spectral gating results

6

8

DFE adaptation without spectral gating

0

2

4

6

Tap

Wei

ght

w3w4w9

-20 20 40 60 80 100 120 140

DFE adaptation with spectral gating

6

8

ight w3

0

2

4

0 20 40 60 80 100 120 140

Tap

We

w4w9

PRBS-31Static DataPRBS-31

Integrated Systems Group

-20 20 40 60 80 100 120 140

Adaptation Iteration

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Noise detection

Tx Induced Noise

VTTImpedance

VDDVDD Induced

Sampler Noise

Tx Induced Noise

VTTImpedance

VDDVDD Induced

Sampler Noise

60

80

100Threshold

Setting

hres

hold

0

5

1 0

CDR LogicClock Period

Sam

plin

g a

1 (%

)

AFE

Thr

esho

ld (m

V)

60

80

100Threshold

Setting

hres

hold

0

5

1 0

CDR LogicClock Period

Sam

plin

g a

1 (%

)

AFE

Thr

esho

ld (m

V)

VTTR+

-

Noise

M M 11

CLK

-

+

Data

Input CM Noise

Noise

VTTR+

-

Noise

M M 11

CLK

-

+

Data

Input CM Noise

Noise

-20 -10 0 100

20

40

Vin (mV)

OffsetCancellation

100

Zero

Th

0 1 0 2 0 3 0 4 0- 1 0

- 5

0

U I

old

(mV

)

1 (%

)P

roba

bilit

y of

S

@ 9UI

424

Mea

sure

d m

ean

A

(a) (c)

-20 -10 0 100

20

40

Vin (mV)

OffsetCancellation

100

Zero

Th

0 1 0 2 0 3 0 4 0- 1 0

- 5

0

U I

old

(mV

)

1 (%

)P

roba

bilit

y of

S

@ 9UI

424

Mea

sure

d m

ean

A

(a) (c)

TX RXCurrentDACs

M > 1

VDD

VDD InducedDAC Noise

TX RXCurrentDACs

M > 1

VDD

VDD InducedDAC Noise

400 410 420 4300

20

40

60

80

Vin (mV)

Larg

e Th

resh

old

0 1 0 2 0 3 0 4 0U IM

easu

red

mea

n A

FE T

hres

ho

Pro

babi

lity

of S

ampl

ing

a 1

@ 9UI

414

419

409

404400 410 420 4300

20

40

60

80

Vin (mV)

Larg

e Th

resh

old

0 1 0 2 0 3 0 4 0U IM

easu

red

mea

n A

FE T

hres

ho

Pro

babi

lity

of S

ampl

ing

a 1

@ 9UI

414

419

409

404

TX RXTX RX(b) (d)(b) (d)

On chip scope can analyze system noiseOn-chip scope can analyze system noiseMulti-level samplers especially vulnerable

Differential properties degrade with threshold offset

Integrated Systems Group 35

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Link System Implementations

Signal processing – Tx, RxEqualizationM d l tiModulation

SynchronizationCDRCDRCDR and Eq interaction

Integrated Systems Group 36

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Clocking : Terminology

Can do with orCan do with orwithout CDR

Needs CDR!

Integrated Systems Group 37Poulton’99

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Clock and Data Recovery

Recovering clock from the dataCan recover clock completely, or just phaseJust phase: need a reference clock

Why?Allows separate xtals on different boardsAllows separate xtals on different boardsDon’t have to match trace lengths, delaysEasier system design / clock distribution

Why NotExpensive: takes area, powerRequires coding or transition density or at a minimum aRequires coding or transition density or at a minimum a training sequence

8b10b coding uses 10b to xfer 8b of info; 20% BW loss

Integrated Systems Group 38

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Example CDR : PLL Technique

Simple bang-bang PLLObserve data with phase detector Incoming DataFilter Early/Late & drive VCO

AdvantagesGood frequency range

Incoming Data

Low JitterChallenges

Phase offsetLock time - startup sequenceLoss of lock - coding dependantHow to integrate multiple PLLs? g p

Harmonic locking problems

Integrated Systems Group 39

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Dual PLL Problem: Harmonic Locking

Potentially serious in highly integrated plesiochronous t h id l h i l t i

Integrated Systems Group 40

systems where residual phase error is close to noise injection in magnitude

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2-PAM Eye With Density

Integrated Systems Group 41

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Dual-Loop CDR

Combination ofCore PLL provides multiple phases at frequencyphases at frequencyPeriphery DLL mixes and make desired phase

Advantages PDLow Pass

Filter VCO

÷ N

gAvoids harmonic locking

Easy to integrate manyRapid CDR lock time

PD FilterRefClk

Phase MixersCDRRXp

CDR very stable Digital = flexible filtering, controlCan even ‘hold’ phase state

Phase MixersCDRLogic

Data

RClk

ChallengesLimited Freq offset from PLLJitter not as low as PLL

Integrated Systems Group 42

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CDR Issues : Transitions & Tracking

CDRs require transition densityCDRs require transition densityPLL based CDRs require to keep lock even in mesochronousDLL based require for plesiochronous tracking

Often coding is used to guaranteeCan alternately use a scrambler + XOR

Integrated Systems Group 43

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CDR Issues : Jitter

dither

locklock

CDR Jitter starts out worse than PLL jitterAlso can have ‘dither jitter’ : phase wander when locked

Integrated Systems Group 44

Also can have dither jitter : phase wander when locked

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CDR Dither Jitter

Caused by need to track plesiochronous differences Dither jitter set byDither jitter set by

Latency of the loop usually 10-20 cyclesStep size usually 1% TsymbolStep s e usua y % sy bo# of averages usually 16+

The last two along with transition density set the tracking rate – (CDR loop is first order)

Conflicting requirements between tracking and jitter

Integrated Systems Group 45

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2x Oversampling

Slicer

deserializerdataOut

dn

PD

deserializer

Phasecontrol

dn

en

PLLref Clk

control

Phasemixeredge Clk

data Clk

dn-1

en (late)

Generate early/late from dn,dn-1,enSi l 1st d l l i t ti

n-1

Simple 1st order loop, cancels receiver setup time

Jitter on data Clk ≠ PLL outputBase is linear PLL jitter

Integrated Systems Group 46

jCan add non-linear phase selector noise from CDR

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Baud-Rate CDR

dlev

dn

dlev

Use information from data level samplerUse information from data-level sampler(already there for adaptation)

Eliminate edge sampler, eclkCurvature to waveform here

Use a comparator to differentiate between dlev & signalDecide later if 0 or 1 from comparitor means early or late

Integrated Systems Group 47

p yEven more transition-like level behavior in 4-PAM mid-data levels

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PAM4 : Multiple Transitions

Integrated Systems Group 48

Many transition types → PAM2 CDR unusable

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4-PAM Eye With Density

Offset transitions clearly visibleBut good transitions exist

Integrated Systems Group 49

But good transitions exist…

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PAM4 Edges & CDR Approach #1Mid-level

00

11

01MSB threshold

MSB

10

MSBData levels

Offset edge sampler to data level to get mid-levels

Best available edge-rate in FSE systemR i d l l d t l

Integrated Systems Group 50

Requires edge samplers placed accurately on data level

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PAM4 Edges & CDR Approach #2Minor Major

00

11

01MSB threshold

10

LSBthresholds

Use all minor transitions and one major transition

More transitions to choose from, no voltage offset required

Integrated Systems Group 51

requiredPoorer edge-rate from minor transitions

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Measured 4-PAM CDR Performance

2 PAM CDR2-PAM CDR on 4-PAM data

60ps p-p @ 8Gb/s

Phase

p p p @

4-PAM CDR uses only minor transitions

Phase

Lower dither jitter35ps p-p @ 8Gb/s

Integrated Systems Group 52Cycle

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Partial response CDR

+1+α+1-α(0,1) (0,1)

-1-α

-1+α(1,0) (1,0)

1 α

F i l l lFour signal levels

Integrated Systems Group 53

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Partial response CDR

+1+α+1-α(0,1) (0,1)

-1-α

-1+α(1,0) (1,0)

1 α(1,1)

(0,1)+α

F i l l l(0,0)

(1,0)-α

Four signal levels Offset edge samplers for transitions with ISI

Otherwise timing error

Integrated Systems Group 54

gNeed to filter edges – similar to PAM4

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Dual-mode CDR

D Qthresh (+) edgen (+)

lsbn(+), lsbn-1(+)

D Qx0 eClk

eClk

edgen (0)PAM4

msbn , msbn-1 , msbn-2

D Qthresh (-)

eClk

edgen (-)PAM2prDFE lsbn(-), lsbn-1(-)

PAM4

( )eClk

filteredearly/late

Integrated Systems Group 55

J. Zerbe et al, "Design, Equalization and Clock Recovery for a 2.5-10Gb/s 2-PAM/4-PAM Backplane Transceiver Cell," IEEE Journal Solid-State Circuits, Dec. 2003.

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Dual-mode CDR

D Qthresh (+) edgen (+)

lsbn(+), lsbn-1(+)

D Qx0 eClk

eClk

edgen (0)PAM4

msbn , msbn-1 , msbn-2

D Qthresh (-)

eClk

edgen (-)PAM2prDFE lsbn(-), lsbn-1(-)

( )eClk

filteredearly/late

PAM2 with loop-unrolled DFE tapLeverage multi-level properties of signals in loop-unrollingRe-use PAM4 receiver hardware (slicers and CDR)

Integrated Systems Group 56

Re-use PAM4 receiver hardware (slicers and CDR)

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CDR In a Plesiochronous System

Encode Serializer FIFODeserializerTx Rx Decode

CHIP 1 CHIP 2

8b/10b

ElasticBuffer

10b/8b

PLL CDR f2f1

8 bits@ f1

10 bits@ f1

10 bits@ f1

10 bits@ f2

8 bits@ f2

Goal is to transfer 8bits @ f1 on chip 1 to 8bits @ f2 on chip2First encode and transfer data based on local clock f1Then recover data and clock (f1) on chip 2Elastic buffer (FIFO) used to transfer data from f1 to f2

Integrated Systems Group 57

Elastic buffer (FIFO) used to transfer data from f1 to f2Finally, decode to get 8 bits @ f2

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Plesiochronous System Impact

Packets must have appropriate slack timeHow else to recover timing difference?Idle characters must be recognized for slack

Need FIFOs deep enoughNeed FIFOs deep enoughSet by maximum frequency difference & maximum data length

CDR track rateMust be able to track maximum difference including dither

Frequency difference, protocol, maximum data packet size different system componentssize different system components

Integrated Systems Group 58

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Second-order loops – PI control

Solves frequency tracking vs. jitter problem

[Lee04]

I branch tracks the constant frequency difference Very low tracking rate & bandwidth (thus low jitter)Sub-1ppm tracking capability

P branch tracks normal phase shifts

Integrated Systems Group 59

P branch tracks normal phase shiftsSmall step size & dither

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CDR : Coding & Transition Density

CDR requires transition density to keep lockAC - coupling requires DC-balancep g qPlesiochronous operation requires packets & null characters…..Coding as solutionTypical code : 8b10b from IBM

8 bits into the link => 10 bits on the wires8 bits into the link => 10 bits on the wiresRaw data rate must be 25% faster than effective data rate

6.25Gb raw for 5Gb effective8b10b d t8b10b code guarantees

DC balanceTransition density : 2 transitions every 10 bitsR d d l h

Integrated Systems Group 60

Reserved codes, control characters

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8b10b Code Overview

• DC Balanced within everycode word

Integrated Systems Group 61

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64/66 Code Overview

Much lower overheadP DC b l & t iti ti

Integrated Systems Group 62Walker IEEE 802.3HSSG

Poorer DC balance & transition properties

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Link System Implementations

Signal processing – Tx, RxEqualizationM d l tiModulation

SynchronizationCDRCDRCDR and Eq interaction

Integrated Systems Group 63

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CDR & EQ – General Issues

T

DFE

SampledD t

Tx D t Tx

Linear EqChannel

dClk

Data

Sampled Edge

Data

CDR

eClk

Fundamental issue – conditioning signal edges affects CDR edge-position…CDR edge-position effects observed ISI

Can affect both Tx & Rx coefficientsWh t i b t l ti f l t BER???What is best solution for lowest BER???

Courtesy J. Zerbe, RambusIntegrated Systems Group 64

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TxEQ Pulse-Shaping Effects on CDR Lock Position

Blue: Rawsingle bit

Initial LockingFinal Locking

single bit response

Purple :Purple :Final result

with adaptation& CDR locking

PostISI & CDR locking

PreISI

Eff t d d T EQ t[Ren 2007]

Effect depends on TxEQ taps1 pre-cursor taps, 1 main, 2 post-cursor taps

Courtesy J. Zerbe, RambusIntegrated Systems Group 65

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TxEQ Pulse-Shaping & CDR: Precursors Only

3 pre-cursor taps, 1 main, 0 post-cursor tapsSignificant phase-shift in lock position

Courtesy J. Zerbe, RambusIntegrated Systems Group 66

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CDR & DFE : Feedback Pulse Timing

)(tϕchannel single bitresponse )(tϕchannel single bitresponse )(ϕresponse )(ϕresponse

1dfe

2/1dfe 2/)( 21 dfedfe +

2dfe1dfe

2/1dfe 2/)( 21 dfedfe +

2dfe

Edge/DFE interaction with first post-cursor tap ; will move lock pointProper prDFE implementation can avoid this entirely

Unlike TxEq, since taps 2-N are not convolved with channelthey do not interact with CDR

Courtesy J. Zerbe, RambusIntegrated Systems Group 67

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ConclusionsBackplane links limited by the channelISI is large in baseband links

C ’t l t l tCan’t completely compensate(At least not with reasonable area/power)

Residual ISI also increases CDR jitterjGenerally have low BER requirements

Accurate noise statistic important Many of large noise source are bounded

Power constrained transmitterPAM4 and PAM2 with simple DFE are attractivePAM4 and PAM2 with simple DFE are attractive solutions

What to do above 10Gb/s?

Integrated Systems Group 68

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Next Challenges

More efficient spectral usageMulti level multi tone modulationsMulti-level, multi-tone modulations

Need improved PSR of all circuits in the pathControl/calibrate offset and mismatch

CodingDensity issues

Improve energy-efficiencyImprove energy-efficiency

Control of complex architecturesDeal with crosstalk

Lots of opportunity for design!

Integrated Systems Group 69

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Bridging the gap: Multi-tone link

10

Multi-tone data rates with thermal noise

6

8 Nelco 64Gb/sFR4 38Gb/s

Hz

4

6

#bits

/H

0

2

0 2 4 6 8 10 12 140

frequency [GHz]

Integrated Systems Group 70

A. Amirkhany, V. Stojanovic, M.A. Horowitz, “Multi-tone Signaling for High-speed Backplane Electrical Links,” IEEE Global Telecommunications Conference, November 2004.

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Bridging the gap: Multi-tone link

6

8

10

Multi-tone data rates with thermal noise

Nelco 64Gb/sFR4 38Gb/s

/Hz

data0

d t 10

2

4

#bits

/

LPF LPFdata0

data1

ls

data10 2 4 6 8 10 12 140

frequency [GHz]BPF BPF

ejw1t ejw1t

data1LPF LPF

# le

vel

dataNBPF

e e

BPFLPFdataN

LPF

f

Challenge – balancing the inter-symbol and inter-channel interference

ejwNtejwNt

Integrated Systems Group 71

inter channel interferenceMicrowave filter techniquesCustom signal processing

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Works well on channels with notchesPackagePackage

PackagPackag

PackagePackage

PackagPackag

PackagePackage

PackagPackag

PackagePackage

PackagPackag

PackagePackage

PackagPackag

PackagePackage

PackagPackag

PackagePackage

PackagPackag

PackagePackage

PackagPackag

PackagePackage

PackagPackag

PackagePackage

PackagPackag

PackagePackage

PackagPackag

PackagePackage

PackagPackag

PackagePackage

PackagPackag

PackagePackage

PackagPackag

PackagePackage

PackagPackag

PackagePackage

PackagPackag

PackagePackage

PackagPackag

PackagePackage

PackagPackag

PackagePackage

PackagPackag

PackagePackage

PackagPackag

PackagePackage

PackagPackag

PackagePackage

PackagPackag

PackagePackage

PackagPackag

PackagePackage

PackagPackag r

card

PackagePackage

PackagPackag

PackagePackage

PackagPackag

PackagePackage

PackagPackag

PackagePackage

PackagPackag

PackagePackage

PackagPackag

PackagePackage

PackagPackag

PackagePackage

PackagPackag

PackagePackage

PackagPackag

PackagePackage

PackagPackag

PackagePackage

PackagPackag

PackagePackage

PackagPackag

PackagePackage

PackagPackag

PackagePackage

PackagPackag

PackagePackage

PackagPackag

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PackagPackag

PackagePackage

PackagPackag

PackagePackage

PackagPackag

PackagePackage

PackagPackag

PackagePackage

PackagPackag

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PackagPackag r

card-10

0Frequency Response

Chip to Chip

gegegegegegegege gegegegegegegege gegegege gegegegegegegege gegegege gegegege gegegegegegegege gegegege

Dau

ghte

r gegegegegegegege gegegegegegegege gegegege gegegegegegegege gegegege gegegege gegegegegegegege gegegege

Dau

ghte

r

-40

-30

-20

dB Multi-Drop(Memory)

BackplaneBackplaneBackplane

M M

0 5 10 15 20-50

Frequency (GHz)

p

Chip A

PCB

Chip B

Package Package

Chip A

PCB

Chip B

Package PackagePackage

Memory controller

PCBDRA

M

Memory cards

Package

Memory controller

PCBDRA

M

Memory cards

Return to bus architectureReturn to bus architectureCan arrange stubs to create controlled notches

Integrated Systems Group 72

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Digital Implementation

Phase 1 6GHz

3GHz - I

1

DAC

2 12

EqualizerPattern Generator

PN 1&2

Phase 3

Phase 2

Ph 4

6GS/sDAC

6GS/sDAC

6G

1

0

3GHz - Q0

1

0

PN 5&6

PN 3&4

PN 7&8

2

2

2

12

12

12 12GS/s

Oversampled Tx filter controls the whole

Phase 4 0PN 7&8 2 12GS/s

3GHz3GHz (4PAM)

[Amirkhany 08]

channel band while shaping sub-channelsIntegrated Systems Group 73

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Digital Tx FIR implementation

∑=

16

1kkkWx

As technology scalesDi i l FIR bDigital FIRs become more attractive

Integrated Systems Group 74

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Multi-Tone Measured Eye DiagramsBaseband Modes 4-Channel AMT Mode

2PAM 2PAM 4PAM Ch1 Ch2 Ch3 Ch42PAM 2PAM 4PAM Ch1 Ch2 Ch3 Ch4Un-Equalized Equalized Equalized Equalized – Post Processed

12Gb/s 12Gb/s 24Gb/s 18Gb/s

Tx sampled with oscilloscopeWith Rx mixing and integration in MatlabOscilloscope measurements

Integrated Systems Group 75

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Some cited referencesEqualization and clock recovery for a 2.5-10-Gb/s 2-PAM/4-PAM backplane transceiver cellZerbe, J.L.; Werner, C.W.; Stojanovic, V.; Chen, F.; Wei, J.; Tsang, G.; Kim, D.; Stonecypher, W.F.; Ho, A.; Thrush, T.P.; Kollipara, R.T.; Horowitz, M.A.; Donnelly, K.S.;IEEE Journal of Solid-State CircuitsVolume 38, Issue 12, Dec 2003 Page(s):2121 - 2130 A second-order semidigital clock recovery circuit based on injection lockingHiok-Tiaq Ng; Farjad-Rad, R.; Lee, M.-J.E.; Dally, W.J.; Greer, T.; Poulton, J.; Edmondson, J.H.; Rathi, R.; Senthinathan, R.;IEEE Journal of Solid-State Circuits Volume 38, Issue 12, Dec 2003 Page(s):2101 - 2110 0.622-8.0 Gbps 150 mW serial IO macrocell with fully flexible preemphasis and equalizationFarjad-Rad, R.; Hiok-Taiq Ng; Edward Lee, M.-J.; Senthinathan, R.; Dally, W.J.; Nguyen, A.; Rathi, R.; Poulton, J.; Edmondson, J.; Tran, J.; Yazdanmehr, H.;VLSI Circuits Symposium, 2003. 12-14 June 2003 Page(s):63 - 66 A serial-link transceiver based on 8-GSamples/s A/D and D/A converters in 0.25-μm CMOSYang, C.-K.K.; Stojanovic, V.; Modjtahedi, S.; Horowitz, M.A.; Ellersick, W.F.;IEEE Journal of Solid-State Circuits Volume 36, Issue 11, Nov. 2001 Page(s):1684 - 1692 A 62.5 Gb/s multi-standard SerDes ICP t i H E B Wil T Sh lt S N i k E S j i E W Y G l k i h KPartovi, H.; Evans, B.; Wilson, T.; Shelton, S.; Naviasky, E.; Sanjeevi, E.; Wen, Y.; Gopalakrishnan, K.; Chokkalingam, S.; Thompson, H.; Casas, M.; Lingting Ye; Hufford, M.; Yujing Qiu; Williams, M.; James, J.; Baldiserotto, A.; White, S.; Williams, S.; Georgantas, D.; Gray, T.;Custom Integrated Circuits Conference, 2003. Proceedings of the IEEE 200321-24 Sept. 2003 Page(s):585 - 588 G Sheets J D’Ambrosia “The Impact of Environmental Conditions on Channel Performance "

Integrated Systems Group 76

G. Sheets, J. D’Ambrosia The Impact of Environmental Conditions on Channel Performance, DesignCon 2004

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To probe furtherB Widrow et al “Stationary and nonstationary learning characteristics of the LMSB. Widrow et al,, Stationary and nonstationary learning characteristics of the LMS adaptive filter,” Proc. IEEE, vol. 64, no. 8, pp. 1151-1162, 1976.V. Stojanović, G. Ginis and M. A. Horowitz, "Transmit Pre-emphasis for High-Speed Time-Division-Multiplexed Serial Link Transceiver," IEEE International Conference on Communications, pp. 1934 -1939, May 2002.

S G / C OSJ.T. Stonick et al, "An adaptive pam-4 5-Gb/s backplane transceiver in 0.25-μm CMOS," IEEE J. Solid-State Circuits, vol. 38, no. 3, March 2003, pp. 436-443. C-C. Yeh and J. R. Barry, “Adaptive Minimum Bit-Error Rate Equalization for Binary Signaling,” IEEE Transactions on Communications, vol. 48, no. 7, July 2000A Amirkhany V Stojanovic and M A Horowitz "Multi-tone signaling for high-speedA. Amirkhany, V. Stojanovic and M.A. Horowitz Multi-tone signaling for high-speed backplane electrical links," GLOBECOM '04. IEEE vol. 2,, pp. 1111-1117 Vol.2, 2004.E. Alon, V. Stojanovic and M.A. Horowitz "Circuits and techniques for high-resolution measurement of on-chip power supply noise," IEEE Journal of Solid-State Circuits, vol. 40, no. 4 SN - 0018-9200, pp. 820-828, 2005.V St j i A H B W G l F Ch J W i G T E Al R T K lliV. Stojanovic, A. Ho, B.W. Garlepp, F. Chen, J. Wei, G. Tsang, E. Alon, R.T. Kollipara, C.W. Werner, J.L. Zerbe and M.A. Horowitz "Autonomous dual-mode (PAM2/4) serial link transceiver with adaptive equalization and data recovery," IEEE Journal of Solid-State Circuits, vol. 40, no. 4, pp. 1012-1026, 2005.

If you have any questions send me mailvlada@mit edu

Integrated Systems Group 77

[email protected]