8D Board Test

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8D Report Toolfor Test boards


D1 – Establish the Team

• Projects manager: CHARDON Jean-Philippe (JPC)

• Production director: GHIGLIONE Alain (AGH)

• Quality Manager: BOISSEL Nathalie (NMA)

• Team members:�Studiel CAD�Studiel Assembly�Studiel Sub-contractors


D2 – Describe the Problem : ROTEM Dib

On Rotem boards manufactured in 2010/08, 3 issues found by TJN test team:

• Issue 1: A short between pins 1&2 of a photomos relay AQ7221R2V, connected by solder (red circle on photo), issue on one board

• Issue 2: C24_S0 (1nF 50V Ceramic capacitor) was not assembled on the same board

• Issue 3: The jumper S4_S0 is missing and cause an alarm on VPERI


D2 – Describe the Problem : CALLANGO Probe

On Callango boards manufactured in 2009/11, 3 issues found by TJN test team:

• Issue 1: Jumpers are missing on VDD cause Multiple alarms.

• Issue 2: The 9011 Coto relays are mounted on sockets unlike the 2 working boards manufactured in 2009/03 where the Coto relays were soldered.

• Issue 3: Solder “tips” under the Heat Shield were piercing the Dielectric insulator shorting to the Heat Shield


D2 – Describe the Problem : eVIPER DIB

On eVIPER DIB V2.0, all the relays are mounted on press-fit sockets (not soldered). The manufacturer as mounted these sockets on wrong face, the problem appeared during the control process.

The manufacturer have extracted the socket from the top face (Dut face) to put new sockets on correct face. During this step, some components pads were destroyed and then some connections wee re-created.


D2 – Describe the Problem : PCU09 PIB

On PCU09ESC8 Pib boards manufactured in 2010/09, 2 identified issues:

- Issue 1: On PCU09ESC8 Pib, all the relays shall be mounted on press-fit sockets (not soldered). The manufacturer should soldered the G6K relays directly on the pcb (the other type have been correctly installed) , the problem appeared during the control process.

The manufacturer wanted to extract the relays from the pcb to put sockets on the pcb. As the pcb is very thick, it is necessary to worm it up strongly which resulted of some solder pad have been destroyed.

- Issue 2: A label wasn’t changed from CP_DC90_F/S_S0 to CP_DC90_F/S_S1 on the schematic, so this signal is missing on the Pcb.


D2 – Describe the Problem : MERLOT PIB

On MERLOT Pib boards 1 identified issue on the 2 first boards delivered on 2010/09.

After inserting in the sockets, the relays aren’t parallel at the components face of the pcb.

The 276XAXH-5D relays are mounted on 2 types of socket who haven’t the same hight after mounting on the pcb.


D2 – Describe the Problem : SURGE TRACKER

On Surge Tracker boards delivered on 2010/02, 1 identified issue.

A component was mounted with 180°rotation.

Red circle indicates the component with wrong orientation.


D3 – Interim Containment Action

• Rotem Dib:� Jumper added by Freescale on delivered boards�Short removed by Freescale on delivered boards�Capacitor added by Freescale on delivered boards

• Callango probe:� Jumpers added by Freescale�Solder tips modified by Freescale

• eVIPER DIB:�Boards completely assembled�One board shipped to China to debug the test program.


D3 – Interim Containment Action

• PCU09ESC8 PIB:�Boards completely assembled and delivered to Toulouse to debug

the test program�Only the site 0 have good continuity on the 2 boards.

• MERLOT DIB:�New choice of socket to correct the height default between the 2

rows of each relay�The manufacturer is warmed for the assembly ongoing.

• SURGE TRACKER�Component replaced by Studiel


D3 – Verification & Validation

• Rotem Dib:�Opening a Studiel noncomplience plan to ensure the errors traitment�Double check of the changes to put on the manufacture files

• Callango probe:�Opening a Studiel noncomplience plan to ensure the errors traitment�Double check of the changes to put on the manufacture files

• eVIPER DIB:�Opening a Studiel noncomplience plan to ensure the errors traitment�Check with the manufacturer that the assembly drawing is

understandable.


D3 – Verification & Validation

• PCU09ESC8 PIB:�Studiel is waiting to re-start a manufacturing of 2 board that FSL

has ended the debug.�Opening a Studiel noncomplience plan to ensure the errors

traitment.

• MERLOT DIB:�Opening a Studiel noncomplience plan to ensure the errors

traitment�Double check of the new socket before assembly of the last boards.

• SURGE TRACKER�Check with the manufacturer that the assembly drawing is correct.


D4 – Define & Verify Root Causes

Several types of issues are identified:

• Insufficient communication between Studiel and Freescale:� Calango probe: VDD F/S were added by Toulouse engineering on the first

boards and was no communicate to Studiel� Calango probe: Heat-sink interaction on components solder side: max height

not communicated

• Quality of boards assembly:� Rotem Dib: Human error on components mounting and assembly control.

The stencil had not been correctly cleaned between the manufacture of the 2 boards.

� Calango probe: On the first board, the Coto relays were soldered because some sockets were missing for the assembly. On the third board, maybe a bad socket reference had been mounted for the Coto relay.

� eVIPER DIB: On this board the silkscreen is present on the top and the bottom, the manufacturer mounted the sockets on the wrong face.


D4 – Define & Verify Root Causes

• Quality of boards assembly:�PCU09ESC8 Pib: Human error on sockets mounting, mismatch

between bom and assembly drawing.�SURGE TRACKER: Human error on components mounting and

assembly control due to assembly drawing is not clear enough.

• Cad and manufacture files:�An error on the schematic was detected during the layout (some net

were missing on a component: CP_DC75_F/S & VCCCAN2_DC75_F/S). The net name were copied from site0 and one was not renamed.

�MERLOT Dib: Bad choice on new socket for relays 276XAXH-5D, one of the 2 sockets reference is higher. The reference RAM 1603 exceeds more than the reference RAM 1442-2 from the pcb and the relay isn’t mounted parallel to the board.


D5 – Choose & Verify Permanent Corrective Actions (PCA)

• Rotem Issues PCA:� Issue 1: To prevent the short between components pins, the stencil must be

correctly cleaned and the components correctly positioned on those pads.

� Issue 2: To prevent missing components, the exact number of components will be prepared before mounting, it should not remain components after assembly.

� Issue 3: To prevent missing jumper, we will use 2 different symbols on the schematic (1 normally open or 1 normally closed), so the jumper will appear closed in the layout and on assembly drawing for a NC symbol.



• Calango probe PCA:� Issue 1 et 3: After prototypes debugging by Freescale a reporting will be send

to Studiel to modify the manufacture drawing (nota added) and the bom.

� Issue 2: Bom modification to change the socket reference for coto relays mounting, correct reference is Keystone RAM 1442-2, this socket is a press-fit component (solderless mounted).

The manufacturer will be informed that all the through hole relay shall be mounted with sockets.

ISSUE 3

ISSUE 1



• eVIPER DIB PCA:� The manufacture drawing shall be analyzed before starting the assembly to

identify the correct layer where each type of components shall be mounted.

The silkscreen will be modified to differentiate the correct mounting layer when the test engineer requests the marking on the 2 faces of the board.The relays will be represented by dotted line on the opposite side where they are mounted.



• PCU09ESC8 PIB PCA:� Issue 1: The manufacture drawing shall be analyzed before starting

the assembly to identify how the components shall be mounted.The manufacturer will be informed that no through hole relay shall be mounted without sockets.

� Issue 2 : All schematic modifications requested by Freescale during the project course shall be verified by an another technician before manufacturing and should be recorded in the action list.



• MERLOT DIB PCA:� Issue 1: For relays using several types of sockets, we need to check

the sockets height above the pcb after sockets inserting.This choice shall be checked by another technician.

Socket Keystone 1442&1603 used for the 2 first boards, 1603 replaced by Harwin H3191-1 for the last 2, so the height above the pcb is around 0,5mm.



• SURGE TRACKER PCA:�To prevent the wrong mounting of the polarized components, the

manufacture drawing will be analyzed and checked by the manufacturer before the assembly to verify that the mounting direction is correctly indicated:� Polarized capacitor� IC� All semi-conductor� Connector

The manufacturer shall identify any Risk on the manufacture files and creates a methodology of assembly for each type of boards.


D6 – Implement, Validate & Plan Permanent Corrective Actions (PCA)

• Rotem Dib:

� Schematic & Drawing modifications to identify the mounting of the jumper, transition to higher revision on 2011/01, Checked by JPC.

� Manufacture instruction will be delivered to the manufacturers on 2011/01, Checked by JPC.

• Callango Probe:

� Drawing modification to identify the mounting of the jumper , Cotorelays & soldering requirement of through hole components, transition to higher revision on 2010/11, Checked by JPC.




• eVIPER Dib:

� Drawing & relays symbols modification to differentiate the silkscreen on each board layer, transition to higher revision on 2011/01, Checked by JPC.


• PCU09ESC8 PIB:

� Drawing modification to identify the mounting of the G6K relays, transition to higher revision on 2011/11, Checked by JPC.

� Schematic modification to correct the wrong signame, new version will be created on 2011/11, Checked by JPC.




• MERLOT Dib:

� Drawing, bom & relays symbols modifications to change socket 1603 to H3191-1, transition to higher revision on 2011/01, Checked by JPC.

• SURGE TRACKER:

� Symbols modification to clearer the mounting drawing, new version will be created on 2011/11, Checked by JPC.

� Process verification with the manufacturers on 2011/02, Checked by JPC.

� The next manufacture will be realized by CORAD (Pcb, components & assembly).


D6 - Problem Prevention

• Problem prevention for future projects (new or duplication):• Anticipation by clearly drawing&bom delivered to the manufacturers• More working with the manufacturer (process, schedule…)• List all issues in a file “guideline & checklist” to design & manufacture, do not manufacture any project without validation with this file.• Freescale shall provide all changes on the files after prototype validation• More involved technicians and manufacturers in improving the process.• Don’t work in urgency• When some boards are ordered, begin the manufacturing of only one board that will validate the file before starting the next manufacturing.

• What needs to be done if it happens anyway?• The manufacturers shall ask Studiel on what to do.• Early reporting to the customer.


D7 – Prevent Recurrence

• A meeting will be organize before every project:

�To check the documentation delivered

�To validate the planning

• A meeting will be organize after every project:

�To modify the file after prototype validation

�To check the actions defined.

�To adjust the checklist

�To modify the manufacturer process


D8 – Recognize Team & Individual Contributions

• All these actions will be measured during the next production.

8D Board Test

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