402.2 Test Systems and QC · § 402.2.4.2 Test Systems ... More details in backup slide Overview of...

402.2 Test Systems and QC

Anadi Canepa, Yuri Gershtein CD1 Director’s ReviewMarch 20, 2019

OverviewoftechnicalprogresssincetheJune2018IPRreview§  402.2.4.2TestSystems

§  Hybrids§  Modules§  MaPSA

§  TestingCampaigns§  Summary

Outline

March20,2019A.Canepa402.2.2OuterTrackerElectronicsCD1Director'sReview p2

Test Systems: Hybrids (1)


§  USCMShasagreedtocontributetothetestingoftheprototypehybridsshippedtoCERNpriortodistributiontotheassemblysites

§  Thetaskincludesthedevelopmentofthetestsystem,thedevelopmentoftheQCSW,thedevelopmentoftheQCprotocol,andthequalificationofdevices§  8CBC2hybridshavebeenqualified(electricallyandthermally)anddistributedinearlyJanuary2018

§  Utilizedbythevariousmoduleassemblycenterstobuildthefirstfunctional8CBC2modules(outsideCERN)

§  8CBC3hybridsarebeingqualifiednow§  Tobedistributedsoon

Test Systems: Hybrids (2)


§  10Test8CBC3hybridsweredeliveredtoCERNinlate2018§  BasedontheFR4stiffenersinsteadofCFstiffeners

§  ThetestsetupwasupgradefromtheGLIBtotheFC7technologyandtheUIB(universalinterfaceboard)tested

§  Electricalcharacterizationincludes:monitoringofpowerconsumption,I2CcommunicationwithASICs,registerread/writetests,inspectionforshorts,inspectionforopenchannelwithantenna,calibration,measurementofoccupancyaftercalibration,countofread-backerrors

•  Currentbatchdoesnotexhibitanyproblem •  ExceptforChip6oneachhybrid(issueatvendor,understood)

Test Systems: Modules (1)


§  USCMSisresponsiblefordesigningthemoduleburn-instationforlongtermtests

§  10moduleswillbecycledthroughroom-andtheoperating-temperatureandelectricallytested

§  Assumptions:power,max100W;operatingtemperature,-35deg;modulesoncarriers;finalconfigurationofLV/HV/Opticalreadout;systemrunsun-attended

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•  ThemonitoringSWrunsontheBeagleBoneBlackboardcommunicatingwithsensorsthroughdedicatedinterfacecard(designedbyUSCMS,shownontheright)

•  ThecontrolSWisinterfacedtoOTSDAQ.Itcanalsorunstandalone

Test Systems: Modules (2)


§  TheprototypeburninsystemwasbuiltbytheJune2018reviewandusedtooptimizethedesigninviewofthefinalversion

§  Thefinalsystemisinplace(available:thermallyinsulatedenclosure,chiller,coolingsystem,modulesupportstructure,beagleboneblackandinterfacecard,controlSW)

§  Thesystemhasbeentestedwithaloadof80W:performancemeetsrequirementwithamplemargin

Test Systems: MPA/SSA Overview


§  USCMSisresponsibleforthedesignofthetestsystemforMaPSA(includingR&DonMPA/SSAtestsystems)

§  USCMSdesignedtheprobeandinterfacecardstotesttheMPA/MaPSAandtheSSA

§  MPA/MaPSA,productioncomplete;cardsinuse§  SSAprobecardsproductioncomplete;shippedtoothercenters

Test Systems: MPA (1)


§  ThefirstMPAWaferprobingtookplaceatCERNwithUSCMSpersonnelcarryingoutthetesting§  CategorizationofindividualMPAsonthe12inchwafer

§  Identificationoffaultychips(formultiplefailuremodes)

§  Collectionofinformationabouteachchip

§  Comparisontoperformanceofbump-bondedchips

Test Systems: MPA (2)


§  Results(from~10waferstested)§  Highefficiencyforgoodchips

Test Systems: MaPSA


§  AtestsetupisbeingassembledatFermilab§  FunctionalMaPSAsareexpectedtobedeliveredshortly

Characterization of Prototypes

§  SincetheJune2018review(whenresultsfromthe2CBC2,MaPSA-Liteand8CBC2moduleswherepresented),USCMShastestednewprototypes:§  2CBC3minimodule§  BabyMaPSA§  2xSSAminimodule


Characterization of Prototypes (1)


§  USCMStestedinbeamthefirst2CBC3minimodulebuiltbyCERN

§  Theminimodulewastestedbeforeirradiation,afterirradiationandbefore/aftermechanicalstress

§  FullefficiencyreachedafterthetotalfluenceexpectedfortheHL-LHC2Stracker.

pTthreshold(R=71.5cm)=1.207±0.05GeV/c

2E14,annealed

0E14

2E14

(2+2.4)xE14=4.4E14

Vbias



§  USCMScontributedtothetestingofthefirstPS-likedeviceunderbeamatCERN§  BabyMaPSAdevicesgold-stud-bondedatKIT

§  Theapparatusincluded§  CERNH6testbeamwithAIDAtelescope§  ElectronicsandDAQfromtheUS§  FirmwarefromUS,CERNandDESY

Institut für Experimentelle Teilchenphysik (ETP), KIT5 14.05.2018

CMS Outer Tracker test beam @ CERN

Test beam in H6B from 16.04 till 25.04Team of firmware developer, chip designer and test beam expertsMain goals of this test beam:

Test MPA DAQ functionalityDevelopment and validation of firmware and DAQ

Davide Ceresa, Jarne De Clercq, Thomas Eichhorn, Yuri Gershtein, Mykyta Haranko, Andreas Nürnberg, Maria Rojas, Daniel Schell

AIDA telescope in H6B

BabyMaPSA

Sameinterfaceboardasusedforprobestation


Bias rail and punch through

By zooming into bias rail region pixel structures become visibleBias railPunch through bias dotsCurvature of pixel p-stop



Inpixel efficiency

Efficiency map reduced to a2 x 2 pixel map (modulo plot)

Higher statistics for betterinpixel resolution

Pixel efficiency: >98%Efficiency below bias rail: 7%


Projection


Bias rail and punch through

By zooming into bias rail region pixel structures become visibleBias railPunch through bias dotsCurvature of pixel p-stop



Angular scan (MaPSA only)

Rotation along long side of the pixelsCluster width increases with larger angles


[Jarne De Clercq]

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§  PreliminaryresultsfromthebabyMaPSAtestbeamcampaignarebeingreviewed

§  Hitefficiency>98%,withsmallexpectedinefficienciesduetobiasrailandbiaspunch-through

§  Angularscan:longerpaththroughthesensorleadstolargerclusters

D.Schell’sthesisD.Schell’sthesis



§  Investigationofa2xSSAmoduleison-going:§  VerificationoftheSSAchipfrontend

§  Testoftheinter-chipcommunication

§  Status:§  Workingwire-bondedversionofthe2xSSAwastested,lateralSSAinter-chipcommunicationwasverified

§  Thebumpbondedversionofthe2xSSAmoduleisexpectedthismonth

§  The2xSSAcanbeconsideredtheprecursortoababymoduleconsistingofababySSAsensorandababyMaPSA

Sensortobeplacedhere

2SSAchipsunderprotectivecover

DATAFROM2xSSAMODULE

(measuredusing2500injections)

Stu

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3-bit current register

§  AlanHonmawasselectedastheQA/QCcoordinatorfortheOTwithinCMS(currentlyemployedbyBrownUniversity)

§  QCprotocolsarebeingdevelopedasthefinalversionofthefrontendASICsandservicehybridsbecomeavailable§  UntilnowCMS(andUSCMS)hasfocusedontheremainingvalidationofprototypesusingad-hoctestsystems(e.g.testingof8CBC3moduleswillbedoneusingCIC1mezzaninecardandGBTx)

§  TheCMSDAQischargedwithreleasingthefinalsystemfortestingproductionservicehybrids,frontendhybrids,modules

§  USCMSisanactivecontributortothedevelopmentoftheQCprotocolformodulesthroughourworkonthemiddle-waredevelopment

§  TestinfrastructureforfrontendhybridsisbeingdevelopedbyCERN.USCMSisinvolvedinthetestingthefrontendhybrids.

§  Aachen/CERNareresponsiblefordevelopingtheQA/QCprotocolforservicehybrids.Thefirst2Sfunctionalservicehybrids(v3)willbedistributedtoUSCMSinthelateSpring,alongwiththeQCprotocol.

Overview of QA/QC (1)


§  USCMSstarteddevelopingtheQCprotocolforMaPSA§  Documentsincludes

•  Description•  Parts•  HandlingandPackaging•  Mechanicaltestsandinspection5.Electricaltests•  FermilabDocumentation•  Con-conformityactions

§  WeexpectUSCMSpersonneltoensureknowledgetransfertothevendorthroughactiveparticipationinsettingupthesystematthecompanyandsitevisitsasdeemednecessary

§  VendorswillbeexpectedtohaveaprobestationcompatiblewiththetestsetupdesignedbyUSCMS.USCMSwillprovidethetestsetup

Moredetailsinbackupslide

Overview of QA/QC (2)


§  USCMSisnotresponsibleforthetheOTASICS.§  Shownhereforcompletenessisthestatusoftheinternationalcontributions

§  ServiceHybrids§  2SV3willbedistributedtothemoduleassemblycentersinlateSpring2019(Aachen).

TestboardsforV3areundercommissioning.CERNwilldevelopV4andtheassociatedtestboard.

§  PSPOHV1(andtheassociatedtestsystem)willbedistributedforPSfunctionalmodulescontributioninlate2019.PSPOHV2(andtheassociatedtestsystem)willbedevelopedbyCERN.

§  PSROH(andtheassociatedtestsystem)willbedevelopedbyCERN.§  ConcentratorChipCIC

§  16boardsequippedwithCIC1deliveredfortestingJanuary30th.Testsareongoing.§  CIC2:chaintestongoingtoensurecompatibilitywithFEASICsandBEsystem.

§  2SmodulefrontendchipCBC3.1§  13CBC3.1wafershadbeentested.CBC3.1chipsareperformingwell.

§  PSmodulefrontendchipMPA,SSA§  TheSSAandMPAASICsprovedtoworktogetherandtoproducecorrectstubson8

MPAand8SSA(SRAMfailureisbeinginvestigated)

Status of the OT ASICs


Summary

Significantprogresshasbeenmadeinthedevelopmentofthetestsystemsinthepastyear§  402.2.4.2TestSystems

§  Hybrids§  USCMSisacquiringknowledgeabouttestingoftheFEHandcontributedtotheQCoftheprototypesdelivered(tobedelivered)totheassemblycenters

§  Modules§  USCMSfinalizedthedevelopmentofthemoduleburninsystemanddemonstratedthatitsperformancemeetsthespecifications

§  MaPSA§  USCMSdesignedandproducedthetestsystemsfortheMPA[MaPSA]/SSAandusedittocarryouttheMPAwafertestingatCERNandtestbeamsatCERN

§  TestingCampaigns§  USCMShassuccessfullytestedprototypesofgrowingcomplexity(2CBC3minimodulebeforeandafterirradiationinbeam,babyMaPSAinthelabandinbeam,2xSSAminimoduleinthelab)

§  QA/QCprotocolsarebeingdevelopedasadvancedprototypesbecomeavailable


Additional Material


Availability of components


§  Thecurrentplanistoassemble52SmodulesperproductionlineintheUS

§  Thisplanentails§  208CBC3frontendhybrids(expectedinMay-June2019)

§  OptionstoreadoutoutallCBCsoruseaCIC1mezzanine§  10SEH3.1servicehybrids(expectedinMay2019)

§  WithGBTinsteadoflpGBT

Test Systems: MPA/MaPSA


§  TheProbeCardlowerstocontactwire-bondingpadsontheMPA

§  AprobestationisprogrammedwiththewafermaptofacilitatemovingfromMPAtoMPA

QC for MaPSAs (1)


§ Mechanical/visualtests(afterassemblyandunderfillapplication):§  CheckthebowoftheMaPSA§  Checkwirebonds(freeofcontaminations)§  Checksensorbackside(noscratches)§  CheckthatthereisnoexcessunderfillmaterialthatwouldinterferewithspacesofthePS

module

§  x-rayorultrasonicimagingtoverifypresenceandlocationofbumpsandpenetrationandcontinuityoftheunderfill.

§  electricaltests(afterassemblyandunderfillapplication):§  Poweronsequence§  Powerconsumption§  BiasDAC§  SensorcurrentonasampleMPA§  BiasDACcalibration§  Write/Readtoregisters§  MemoryandStripInputchecks§  Individualpixeltests-noisemeasurementisdiagnosticofbumpconnectivity(Trimmingand

pulseinjection,s-curves)

QC for MaPSAs (2)


§  FromexperiencesatCERN/Rutgers,thetestsareexpectedtotake~4minutesperchip.

§  Westillneedtodefinepass/failand/orgradingcriteria.§ Wewillprovidevendorswithmostelementsoftheteststand:

§  probecard/interfaceboard,FC7withallsmallattachmentboards,powersupplies,necessarycables,thesoftware(eventuallyevenalinuxhostcomputer).

§  Wewillbewillingtohelpsetupthesystematthevendorsites.§  Weexpectthevendorstohaveaprobingstationthatisableto(automatically)movetheMaPSA,

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