3-D IC Fabrication and Devices

Mai Chery Vue and Dylan ScheunemannWednesday April 23, 2014

Abstract:3-D integrated circuits have unique fabrication designs that makes it inexpensive,

compact, and more efficient than planar circuits. The components are integrated vertically and horizontally using less material.

Outline❏ Fabrication

❏ Types❏ Monolithic❏ Wafer-on-Wafer❏ Die-on-Wafer❏ Die-on-Die

❏ Wafer-on-Wafer Steps❏ Advantages/Disadvantages❏ Applications

Introduction to 3-D IC’s❏ A Single Circuit with two or more layers of

active components.❏Components can be integrated both

vertically and horizontally.

3-D IC Stacked

Problem with stacking is heat dissipation.

Types of Fabrication❏ Monolithic

❏ Built on single wafer.❏ Diced into 3-D IC’s.

❏ Wafer-on-Wafer❏ Built on two or more wafers.❏ Aligned, bonded, and diced into 3-D IC’s.

❏ Die-On-Wafer❏ Components built on two wafers.❏ One wafer diced and aligned on the second wafer.

❏ Die-On-Die❏ Components built on multiple dice.❏ Aligned and bonded into 3-D IC’s.

Types of FabricationChip means Die

Fabrication (Wafer-on-Wafer)❏ Components are built on two or more wafers❏ Alignment of wafers

❏ Machine checks for alignment mark❏ Temporarily brought into contact❏ Inspected for correct alignment

❏ Bonding of wafers❏ Then bonded together using the method best suited for

that wafer❏ Such as Direct, Adhesive, or Thermocompression

bonding

Fabrication (Wafer-on-Wafer)❏ Thinning of wafers

❏ Can be thinned before or after bonding❏ Dicing Before Grinding

❏ Saws the front before thinning from the back

❏ Dicing By Thinning❏ Applies a trench-etching process❏ Reduces Damage

Fabrication (Wafer-on-Wafer)❏Dicing of wafers

❏ Scribe and Break❏ Mechanical Sawing❏ Laser Cutting

Advantages❏ Chip Performance

❏ Higher Bandwidth❏ Reduced Power Consumption

❏ Functionality❏ Circuit Security

❏ Device Packing Density❏ Fits into a small space❏ Shorter Interconnects

❏ Cheaper fabrication costs

Disadvantages❏Heat due to stacking❏ Testing methods❏ Interconnect design❏CAD algorithms and tools

Applications❏Monolithic IC 3D (Company in California)

❏ FPGA, Gate Array❏ DRAM❏ NAND Flash Memory❏ Image Sensors❏ Microdisplays

Summary3-D integrated circuits have layered active components that are vertically and

horizontally integrated. With these designs, there’s about four different fabrication types: monolithic, wafer-on-wafer, die-on-wafer, and die-on-die. These new fabrication designs provide for better chip performance, circuit security, smaller interconnects, and inexpensive circuits.

ReferencesInformation:

1. http://domino.research.ibm.com/tchjr/journalindex.nsf/9fe6a820aae67ad785256547004d8af0/2f263eb510ba6030852571c500032694!OpenDocument

2. http://en.wikipedia.org/wiki/Three-dimensional_integrated_circuit

3. http://homepages.rpi.edu/~luj/Papers/Luj4.pdf

4. http://www.wiley-vch.de/publish/dt/books/newTitles201201/3-527-32646-4/?sID=p2qlnooj68su7htl8qrrc2qjt3

5. http://electroiq.com/blog/2003/03/wafer-thinning-techniques-for-ultra-thin-wafers/

6. https://www.coherent.com/Applications/index.cfm?fuseaction=Forms.page&PageID=273

7. http://www.monolithic3d.com/applications.html

8. Three-Dimensional Integrated Circuit Design by Vasilis F. Pavlidis & Eby G. Friedman

Pictures:1. http://esl.epfl.ch/page-42448-en.html2. http://lsi.epfl.ch/page-13135-en.html3. http://www.intechopen.com/books/metallurgy-

advances-in-materials-and-processes/low-temperature-wafer-level-metal-thermo-compression-bonding-technology-for-3d-integration

4. http://www.tezzaron.com/technology/FaStack.htm

Five Key Concepts❏ A 3-D circuit is a Single Circuit with two or more layers

of active components.❏ 4 Types of Fabrications

❏ Monolithic, Wafer-on-Wafer, Die-on-Wafer, Die-on-Die

❏ Wafer-on-Wafer Fabrication❏ Align, Bond, Thin, Dice

❏ Disadvantage: Heat from stacking❏ Applications: NAND Flash Memory, and Micro Displays