2015 semicon taiwan mb v2

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SEMI Equipment and Materials Market Update Dan Tracy, Sr. Director SEMI Industry Research & Statistics September 3, 2015

Transcript of 2015 semicon taiwan mb v2

Page 1: 2015 semicon taiwan mb v2

SEMI Equipment and Materials Market Update

Dan Tracy, Sr. Director

SEMI Industry Research & Statistics

September 3, 2015

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Outline

• 2015 Year-to-Date Trends

• Equipment and Materials Forecasts

• Summary

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Year-to-Date Trends

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Interesting Year to Date…

• Growing uncertainty in the global economic condition

– Weak 1Q for US economy; Europe (Greek crisis); Japan 2Q GDP contraction; China stock market…global stock markets

• Semiconductor revenue forecasts lowered

– Generally, from mid-single digit to low-single digit

– PC market down, tablet market growth slowing, currency effects…

• Some companies reduced capex for 2015

• Declining DRAM pricing

Yet…

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Unit Trends-Strong Year-over-Year growth for 1H

Source: SEMI and WSTS

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Silicon Area Shipment Index

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Worldwide Wafer Area Shipment Index(Three-month Moving Average)

Source: SEMI Silicon Manufacturers Group August 2015

Silicon shipments are up 7% year to date through July

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SEMI North America Book-to-Bill-Steady booking and billings trends thru July

Source: SEMI August 2015

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Global Semiconductor Equipment Spending

Source: SEMI/SEAJ

2015 Worldwide Semiconductor Equipment Billings(U.S. Dollars in Millions)

Region2015 Year-to-

Date (July) 2014 Year-to-

Date (July)Y/Y % Change

Europe $1,318 $1,337 -1%

Japan $3,118 $2,286 36%

North America $3,474 $4,915 -29%

Korea $5,414 $4,065 33%

Taiwan $5,340 $5,841 -9%

China $2,613 $3,039 -14%

ROW $1,138 $1,120 2%

Total $22,415 $22,603 -1%

Year-date-bookings are flat

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Impact of Exchange Rates on the Market

Source: SEMI and SEAJ

2013 2014Y/Y %

Change

SEAJ Billings (¥ B) 972 1,332 37%

SEAJ Billings (US $M) 9,993 12,012 26%

Conversion Rates: 2013=~98¥/US$, 2014=~106¥/US$

From SEAJ Book-to-Bill Report:

2013 2014

Wafer Shipments (MSI) 9,067 10,098

% Year-over-Year Change 11%

Wafer Revenues ($ M) 7,538 7,626

% Year-over-Year Change 1%

Source: SEMI Silicon Manufacturers Group

2013 2014

Leadframe Shipments (M) 339,133 370,617

% Year-over-Year Change 9%

Leadframe ($ M) 3,342 3,461

% Year-over-Year Change 4%

Source: SEMI/NEDIA

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Impact Exchange Rates on the Market

Source: SEMI and SEAJ

~$900M higher ∆ through June assuming avg. 2014 exchange rate

2014=~106¥/US$2015=~120¥/US$

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Equipment and Materials Forecasts

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66%

14%

-7%5%

-9%

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-21%

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Capital Equipment Annual Growth

Capital Equipment Cycles

Source: SEMI/SEAJ. SEMI 2015 Mid-Year Forecast, August update

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Regional Semiconductor Equipment Markets

China12% Europe

6%

Japan11%

Korea18%

North America

22%

ROW6%

Taiwan25%

2014 = $37.50 billion

Region 2014$US B

2015F$US B

%Change

China $4.37 $4.56 4%

Europe 2.38 2.50 5%

Japan 4.18 5.29 27%

Korea 6.84 8.13 19%

North America 8.16 6.26 -23%

SEA/ROW 2.15 2.14 -1%

Taiwan 9.41 9.56 2%

Total $37.50 $38.44 3%

Source: SEMI/SEAJ August 2015 update

Totals may not add due to rounding

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Fab Equipment Spending-Driven by Memory and Foundry

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Foundries-Ramping 200mm capacity in 2015 and 2016

2010 2011 2012 2013 2014E 2015F 2016F

Foundry only- 200mm 2.12 2.19 2.27 2.29 2.28 2.37 2.43

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d C

apac

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s w

pm

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Installed 200mm Foundry Capacity

Source: SEMI World Fab Forecast

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Worldwide Wafer Fab Materials Forecast

Totals may not add due to roundingSource: SEMI August 2015

Actual Forecast

2013US$ M

2014US$ M

2015US$ M

2016US$ M

Silicon Wafers1 $7,932 $7,990 $7,954 $8,278

Photomasks2 3,136 3,220 3,342 3,442

Photoresist 1,220 1,374 1,354 1,413

Photoresist Ancillaries3 1,428 1,711 1,777 1,850

Wet Chemicals4 995 1,059 1,121 1,104

Gases 3,319 3,481 3,577 3,721

Sputter Targets4 598 629 653 696

CMP Slurry & Pads5 1,436 1,569 1,618 1,722

Other/New Materials 2,588 2,945 3,178 3,415

Total $22,652 $23,977 $24,574 $25,641

% Growth 6% 2% 4%

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Wafer Fab Materials Forecast Notes

1. Silicon wafers include merchant sales value only; includes SOI wafers; no reclaim wafers

2. Includes captive market

3. Includes resist removal chemicals, developers, anti-reflective coatings, contrast enhancers, edge bead removers, adhesion promoters, etc.

4. Source is Linx Consulting LLC, Sputter Targets includes precious metals

5. Estimates for IC applications only

6. Includes low k dielectrics, copper plating solutions, dielectric precursors, organometallic precursors, etc.

7. All forecasts in current dollars

8. Source for all data is SEMI, unless otherwise indicated

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Photomask Market

15/05: Photomask CAGR 1%, Semiconductor CAGR of 4% for the same period

Source: SEMI March 2015

$0

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Source: SEMI March 2015

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Regional Fab Materials Markets

Region 2015F$US B

2016F$US B

%Change

China $1.77 $1.89 6%

Europe 2.49 2.57 3%

Japan 4.39 4.50 2%

Korea 4.65 4.95 6%

North America 4.46 4.59 3%

Taiwan 5.47 5.73 5%

SEA/ROW 1.34 1.42 7%

Total $24.57 $25.64 4%

Source: SEMI August 2015

Totals may not add due to rounding

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Worldwide Packaging Materials Forecast

Totals may not add due to roundingSource: SEMI August 2015

Actual Forecast

2013US$ M

2014US$ M

2015US$ M

2016US$ M

Leadframes $3,342 $3,461 $3,350 $3,346

Organic Substrates1 7,408 7,612 8,196 8,586

Ceramic Packages 2,006 2,075 2,157 2,174

Encapsulation Resins 2,451 2,712 2,922 3,187

Bonding Wire2 4,151 3,385 3,176 3,099

Die Attach Materials3 666 704 734 752

Others 374 409 451 500

Total $20,398 $20,358 $20,986 $21,644

% Growth -0.2% 3% 3%

Packaging Materials will be 46% of the 2015 Total Semiconductor Materials Market

Major update coming in November

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Semiconductor Packaging Materials Forecast Notes

1. Source is TechSearch International. Includes PBGA, PPGA, LGA, and CSP laminate substrates and flex BGA and CSP substrates

2. Assume gold value of $1,480/trz for 2013; $1,260/trz for 2014; $1,190/trz for 2015 - 2016

3. Includes die attach film (tape) materials

4. Other includes solder balls and wafer level package dielectrics

5. Source for all data is SEMI, unless otherwise indicated

6. All forecasts in current dollars

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Packaging Material Market Trends

• CSP laminate substrates, CSP leadframes, and WLP are driven by explosive growth in mobile computing and communications

• Flip chip and copper pillar continue to expand the market for underfillmaterials.

• Need more development for WLP dielectrics used in multi-layer structures

• Mold compounds- warpage control/package reliability (MSL1); withstand high flexing for wearable applications

• QFN- cost optimization through design (including strip size) and reduced plating area (also improves MSL); higher lead counts (routable); improved power dissipation

• Transition from gold wire to copper and silver

Source: SEMI and TechSearch International- Global Semiconductor Packaging Materials Outlook

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Regional Packaging Materials Markets

China21%

Europe3%

Japan13%

Korea13%

North America

3%

SEA/ROW26%

Taiwan21%

2015F = $21.0 billion

Region 2015F$US B

2016F$US B

%Change

China $4.34 $4.54 5%

Europe 0.72 0.75 3%

Japan 2.69 2.82 4%

Korea 2.66 2.72 2%

North America 0.66 0.66 0%

Taiwan 4.43 4.56 3%

SEA/ROW 5.50 5.60 2%

Total $20.99 $21.64 3%

Source: SEMI August 2015

Totals may not add due to rounding

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Summary

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Summary

• Uncertainty with the near-term outlook

• Year-to-Date Trends Silicon shipments are up through July Equipment bookings and billings are comparable to 2014 levels

Exchange rates—weaker Yen & Euro—will dampen 2015 revenue growth

• Memory (Flash) and Foundry will lead fab investment this year and next

• Semiconductor Equipment & Materials Outlook Materials market is expected to increase 3% in 2015 and 4% in 2016 Equipment market is expected to increase 3% in 2015 and 5% in 2016

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