11022 Transcutaneous Signal Transmission for LVAD

October 8 , 2010Yevgeniy Popovskiy, Vince Antonicelli, Craig

LaMendola , Chrystal Andreozzi

Project Background Project Scope and Objective Project Schedule Customer Requirements Engineering specifications Work Breakdown System Concept Generation, Scoring and Selection

Case Insulation/ wire Electrical System

Risks Assessment Project Budget Next Steps Questions and discussion

System Level Design Review Agenda

The primary objective of this project is to design a transmission system to safely and affectively transfer power and control signal from the external power supply and control to the Left Ventricular Assist Device(LVAD).

Project Background

MSD I Objectives

Concept Generation and Selection

Detailed Design Ready for

Construction Deliverables

Finalizes design Order parts Finalize Test

specification

Project Objectives

MSD II Objectives

Assumable system Troubleshoot design Testing equipment

Deliverables Working System Test data to support

design

Senior Design I Schedule

System

Signal Transmission

Vince Antonicelli

Design Electrical Hardware

Debug

Yevgeniy Popovskiy

Program Chip

Debug

Case, Packaging,

Material

Craig LaMendola

Case

Material

Dimensions and Design

Wire Port Seal

Material

Products

Chrystal Andreozzi

Insulation

Heat sink

Material

Wire

Flexibility

Material

Work Breakdown

The device must be reliable (Must produce a continuous power and control signs)

The number of wires needs to be reduced The cable diameter needs to be reduced The cable needs to be more flexible Meet FDA standards or be able to be

modified to meet FDA standards

Customer Needs

THE SYSTEM NEEDS TO WORK!!!!

Reliable Operation 6 hours Cable Size ~3mm Improve Cable Flexibility 200% Internal/ External Volume 450 cm3

Eternal Weight 0.9 kg Cost below $3500

Engineering Specification

System Overview

Outer ProtectionProtective outer layers

Wire port sealingMaterial/product Benefits Possible Risks

Sealcon Cord GripsWith/without strain relief

RemovableAdjustable

Proven to workBulky size

Heat shrink bootPermanent InstallationLong lead time

On failed 10022

Adhesive heat shrink Proven to work Less robust

Material/product Benefits Possible Risks

Locktite 5248 Biocompatible On failed 10022

Master Bond JacketBiocompatible

Encapsulates componentsMore Robust

1st Line of

Defense

Sealing MethodsTypes of O-rings

O-ring grooves

Material/product Benefits Possible Risks

Parker O-ring no break or seam Case designed for available O-ring

PAI X-ring double seal unreliable when bent

O-ring cord Custom sizing Break or Seam On failed 10022

Install method Benefits Possible Risks

Square groove O-ring unsecured

Dove tail groove Secure install

2nd Line of

Defense

Protective CaseCase Structural material

Material/product Benefits Possible Risks

Titanium BiocompatibleElectrical shielding

Stainless Steel BiocompatibleElectrical shielding

May corrode

Aluminum Electrical shieldingLeast robust metal

May corrode

ABS plastic printing Made at RIT On failed 10022Not water tight

Product Cost ($) Reliability

Availability

Bio-compatible

Key Risk associated with selection process

Selected Design

Outer Layer

of Protect

ion

Locktite 5248 In Lab 3 5 5 Failed last team

Master Bond Jacket$650-$800

4 3 5 ?

Wire Port

sealing

Sealcon cord grip $4/$14 each

5 3 1 Bulky size

Heat shrink boot $10 each 4 1 1 Permanent installation

Adhesive heat shrink$15/ In Lab

4 3/5 1 Durability

O-ringsParker O-ring $13 5 3 1

Design case for O-ring sizes

PAI X-ring$0 Sample

3 2 1 Unreliable when bent

O-ring cord $2 3 3 1 Has seam

O-Ring Groove

Square groove Included 4 3 - Less secure installation

Dove tail groove (AL/SS/Ti)

+65/100/150

5 1 -Expense/ production time

Structural

Material

Titanium $470 5 1 5Expense/ production time

Stainless Steel $420 5 2 5Expense/ production time

Aluminum $300 4 3 1 Least robust metal

ABS plastic printing $200 2 4 1 No shielding/ Porous

Case Concept Selection

Insulation.

Heatsink paste/grease Pasted applied directly to

component

Heatsink Pad Remain sold at room

temperature and then soften at heatsink operating temperature

Electrical Potting Epoxy

Stable material (hard) Resistance to temp. up to 200 oC Very good resistance to chemicals Cracks easily

Insulation Cont.

Wire Types Calmont Wire and Cable Stranded Single-Conductor (P10022) Thoratec Corporation (HeartMate II)

Wire

Insulation and Wire Concept Selection

Cost ($)

Flexibility

Reliability

Availability

Bio-compatible

Risk associated with selection

Selected Design

Insulation

(Heat sinks)

Heat Sink Pad <$20

n/a

2 5 No

Heat Sink Paste/ grease

<$5 n/a

4 5 No

Electrical Potting

$20-$50

n/a

5 5 No May break

Wire Calmont Wire and Cable

? 4 5 1 Yes Time(product is custom made)

Stranded Single-Conductor

<$5 1 3 5 yes Wire does not have max flexibility

System Overview

Transmit digital signal Wired Wireless Through power

Transmit analog signal Multiplex Convert to Digital Multiplex through power

Chip Technology Microcontroller FPGA  

Clock Internal Wired  

Protocol Use Existing Invent One  

Major Electrical Choices

Current Layout Skin

Main

Controller+

A/D

+

Battery

Pump

Motor

Control

Linear Amplifier

BloodPump

SA

MCC

MCO

LADS LAOP

LAOG

MCP

SP

LAP

Senior Design P10021-P10022 Layout

MCP

Main

Controller+

A/D

+

Battery

Skin

SA

MCC MC

O

PADSPAOP

PAP+MCP+SP

SP

Motor

Control

SA

PWM

Gen.

BloodPump

PAP

PADS

MCC

NSD

Chip

+

Elect.

Chip

+

Elect.

Option 1

Main

Controller+

A/D

+

Battery

Pump

Motor

Control

Linear Amplifier

BloodPump

SA

MCC

MCO

LADS LAOP

LAOG

MCP

SP

LAP

SA Micro.

+

Elect.

Micro.

+

Elect.SP

Skin

NSD

SP

Option 1 DetailsS

ign

al

Wir

es

Do

ub

led

AW

G

Dia

me

ter

Am

ps

Re

du

ce t

o

Pw

r W

ire

s

Sig

na

ls W

ire

s

SP 2 36 0.3 0.12 2 0MCO 3 28 1 1 3 3LAOP 4 28 1 1 4 4LAOG 1 1 26 1 4 2 2NSD 0 36 0.3 0 1 0

12 9 3Signal

SATotal

Bandwidth kbs625625

Inside Body: Micro

Total Wires

Option 2

Main

Controller+

A/D

+

Battery

Skin

SA

SP

SA

NSD

Micro.

+

Elect.

Motor

Control

MCC

MCO

MCP

PAOP

LAP

PADS

BloodPump

Micro.

+

Elect.PADS

LAP

Linear

Amp.

Option 2 DetailsS

ign

al

Wir

es

Do

ub

led

AW

G

Dia

me

ter

Am

ps

Re

du

ce t

o

Pw

r W

ire

s

Sig

na

ls W

ire

s

LAP 3 1 26 1 5 4 4MCO 3 28 1 1 3 3NSD 0 36 0.3 0 2 0

9 7 2Signal

SAMCCTotal

Bandwidth kbs

Inside Body: Linear Amplifier + Micro

Total Wires

6257

632

Option 3

Main

Controller+

A/D

+

Battery

Skin

SA

SP

SA

NSD

Micro.

+

Elect.

Motor

Control

MCC

MCO

MCP

PAOP

PAP

PADS

BloodPump

Micro.

+

Elect.PADS

PAP

PWM

Gen.

Option 3 DetailsS

ign

al

Wir

es

Do

ub

led

AW

G

Dia

me

ter

Am

ps

Re

du

ce t

o

Pw

r W

ire

s

Sig

na

ls

Wir

es

PAP 2 2 26 1 5 4 4MCO 3 28 1 1 3 3NSD 0 36 0.3 0 2 0

9 7 2Signal

SAPADSTotal

62579

704

Inside Body: PWM Generator + Micro

Total WiresBandwidth kbs

Option 4

Main

Controller+

A/D

+

Battery

Linear Amplifier

LADS LAOP

LAOG

LAP

Skin

MCP

SA

MCC MC

O

SP

Motor

Control

SA

MCC

NSD

Micro.

+

Elect.

Micro.

+

Elect.BloodPump

MCP

Option 4 DetailsS

ign

al

Wir

es

Do

ub

led

AW

G

Dia

me

ter

Am

ps

Re

du

ce t

o

Pw

r W

ire

s

Sig

na

ls

Wir

es

MCO 3 28 1 1 3 3LAOP 4 28 1 4 4 4LAOG 1 1 26 1 4 2 2NSD 0 36 0.3 0 2 0

11 9 2Signal

SAPADSTotal

79

Total WiresBandwidth kbs

625

704

Inside Body: Motor Controler + Micro

Option 5

MCP

Main

Controller+

A/D

+

Battery

Skin

SA

MCC MC

O

LADSLAOP

PAP+MCP+SP

SP

Motor

Control

SA

Linear

Amp.

BloodPump

PAP

LADS

MCC

NSD

Micro.

+

Elect.

Micro.

+

Elect.

LAOG

Option 5 DetailsS

ign

al

Wir

es

Do

ub

led

AW

G

Dia

me

ter

Am

ps

Re

du

ce

to

Pw

r W

ire

s

Sig

na

ls

Wir

es

LAP 3 1 26 1 5 1 1NP 0 2 22 1.2 6 2 2

NSD 0 36 0.3 0 2 05 3 2

SignalSA

MCCLADSTotal

79711

Bandwidth kbs625

7

Inside Body: Linear Amp. + Motor Controler + Micro

Option 6

MCP

Main

Controller+

A/D

+

Battery

Skin

SA

MCC MC

O

PADSPAOP

PAP+MCP+SP

SP

Motor

Control

SA

PWM

Gen.

BloodPump

PAP

PADS

MCC

NSD

Micro.

+

Elect.

Micro.

+

Elect.

Option 6 DetailsS

ign

al

Wir

es

Do

ub

led

AW

G

Dia

me

ter

Am

ps

Re

du

ce t

o

Pw

r W

ire

s

Sig

na

ls

Wir

es

NP 0 2 22 1.2 6 2 2NSD 0 36 0.3 0 2 0

43 38.0519 4 2 2

SignalSA

MCCPADSTotal

Inside Body: PWM Generator + Motor Controller + Micro

779

711

Bandwidth kbs625

Design Evaluation

Wire count pwr / sig

AWG 36 28 26 22 36 28 26 22 36 28 26 22 36 28 26 22 36 28 26 22 36 28 26 22

Count 3 7 2 0 2 3 4 0 2 3 4 0 2 7 2 0 2 0 1 2 2 0 0 2Selection Criteria Weight Rating Score Rating Score Rating Score Rating Score Rating Score Rating Score

Cable is more Flex 9 2 18 3 27 3 27 2 18 6 54 8 72Eliminate as many wires

as poss 8 2 16 3 24 3 24 2 16 6 48 8 64Transmit power to

internal Compnents w/ less wires 9 2 18 5 45 5 45 2 18 7 63 7 63

Must work with current system 9 9 81 5 45 8 72 9 81 5 45 8 72

Heat produced by conponents 5 9 45 6 30 6 $ 30 7 35 3 15 3 15

Reliable 9 9 81 6 54 6 54 8 72 4 36 4 36Labor 9 8 72 5 45 6 54 6 54 2 18 2 18

Labor w/ Dr. Day Help 9 8 72 5 45 7 63 7 63 7 63 9 81Cost 3 8 24 6 18 6 18 6 18 5 15 5 15

Day to day EM Noise resistant 9 0 0 0 0 0 0

Total 355 288 324 312 294 355

Total w/ Dr. Day Help 355 288 333 321 339 418

2/2

Option 4 Option 5 Option 6

9/2 3/2

M/C Micro LIN M/C Micro PWM M/C Micro

Option 1 Option 2 Option 3

9/3 7/27/2

PWM MicroMicro LIN Micro

Notes NotesNotesNotesNotesNotes

Selected Design

Risk Assessment

Yevgeniy Popovskiy Select Chip Component Pricing

Vince Antonicelli Circuit Design Component Pricing

Craig LaMendola Determine Case Dimensions Create Case Drawings Material Selection with customer

Chrystal Andreozzi Identify Wire in the Cable Electrical Reliability Testing

Team Contact manufactures and get pricing Verify that different components will assumable

Next Steps

?