024210 SIM ThermalAnalysis WP ENG
-
Upload
ramkumar121 -
Category
Documents
-
view
222 -
download
0
Transcript of 024210 SIM ThermalAnalysis WP ENG
-
8/23/2019 024210 SIM ThermalAnalysis WP ENG
1/17
Ta Aa
w h i t e p a p
ispiatio
s u m m a r y
I this whit pap w d ad th oti th opt o tha
aasis as it ats to podt dsi. W disss th piips
o odtio, otio, ad adiatio si a-i podts as
aps. W wi aso dsi was to po tha aasis,
spia how o a s dsi aidatio sotwa to siat
tha oditios. W wi aso ist th dsid apaiitis i tha
dsi aidatio sotwa ad dostat thoh aps how
o a so dsi has si SoidWoks podts.
-
8/23/2019 024210 SIM ThermalAnalysis WP ENG
2/17
inodcon o l nl
To d podt dopt ost ad ti, taditioa pototpi ad ts
i has a pad i th ast dad a siatio-di dsi
poss. Sh a poss, whih ds th d o psi ad ti-
osi phsia pototps, aows is to sss pdit pod
poa with as-to-odi opt ods (Fi 1).
Dsi iatio toos a osidd iaa i stdi sh st-
ta pos as dftios, doatios, stsss, o ata is.
How, th stta poa o w podts is o o o a h
s ai dsi is. Oth oo pos a tha at
idi ohati, th ak o disioa staiit, ssi tha
stsss, ad oth has atd to hat fow ad th tha haattis o thi podts.
Tha pos a oo i tois podts. Th dsi o
ooi as ad hat siks st aa th d o sa si with ada
hat oa. At th sa ti, tiht opot pakai st sti s
sit ai fow so that pitd iit oads do ot do o ak d
ssi tha stss (Fi 2).
T H e r m A l A n A l y S I S
Figure 1:
TrAdiTionAl versus simulATion-driven producT design processes
Figure 2:
elecTronic pAckAging requires cAreFul AnAlysis oF how heAT
produced by elecTronic componenTs is removed To Th e
environmenT.
-
8/23/2019 024210 SIM ThermalAnalysis WP ENG
3/17T H e r m A l A n A l y S I S
Figure 3:
POTenTIAl OverHeATIng OF An InDuSTrIAl SHreDDer IS An ImPOrTAnT
cOnSIDerATIOn In THe DeSIgn OF ITS TrAnSmISSIOn AnD beArIngS.
Figure 4:
DenTAl ImPlAnTS muST nOT
AFFecT THermAl cOnDITIOnS OF
THe SurrOunDIng TISSue AnD
muST AlSO WITHSTAnD THermAl
STreSSeS.
Figure 5:
ADequATe cOOlIng OF A HIgH
cAPAcITy bATTery On A cOrDleSS
TOOl requIreS unDerSTAnDIng
THe THermAl cOnDITIOnS.
Tha has aso aod i taditioa ahi dsi. Oios a
ps o podts that st aad o tpat, hat dissipatio, ad
tha stsss a is, hdai ids, ti otos o pps
i shot, a ahi that ss to po so kid o s wok.
Phaps ss oios adidats o tha aasis a atiaposs-
i ahis wh haia ts ito hat ati ot o thahid pi t aso th ahi its. This sitatio is ipotat ot o
i pisio ahii ipt, wh tha pasio a at th
disioa staiit o th tti too, t aso i hih pow ahis sh
as shdds, wh opots a s o ssi tpat ad
tha stsss (Fi 3).
As a thid ap, ost dia dis shod aad o tha p
oa. D-di ssts st ass pop tpat o th adistd ssta whi sia dis st ot st th tiss to th
poit o ssi tha shok. Siia, od ipats st ot dispt h
fow isid th od, whi dta ipats st aso withstad s t
haia ad tha oads (Fi 4).
Fia, a tia appias sh as stos, iatos, is, ios, a
o aksi shot, athi that s o tiitshod aad
o tha poa to aoid ohati. This appis ot o to os
podts that o Ac pow, t aso to att-opatd dis sh as
ot-otod tos ad odss pow toos (Fi 5).
-
8/23/2019 024210 SIM ThermalAnalysis WP ENG
4/17T H e r m A l A n A l y S I S
ung dgn vldon fo l nl
A o th ao tha dsi pos ad a o a siatd
with dsi aidatio sotwa. most dsi is a aad aiia w
this appoah o stta aasis, so padi its sop to tha aas
is itt additioa taii. Stta ad tha siatios a
asd o at th sa opts, oow th sa w-dd stps, adsha tip aaois (Fi 6).
Ftho, tha aass a pod o cAD ods th sa wa
stta aass so, o a cAD od has atd, a tha i
tio a optd with itt ta ot.
Tha aass a td to d tpat distitio, tpat
adit, ad hat fowi i th od, as w as th hat had tw
th od ad its iot.
Figure 6:
AnAlOgIeS beTWeen STrucTurAl
AnD THermAl DeSIgn vAlIDATIOn
Figure 8:
mAIn cHArAcTerISTIcS OF THree
HeAT TrAnSFer mecHAnISmS
Tha ts sh as tpats a as to siat, t a it
dit to as, spia isid pats o assis, o i tpats
a hai apid. This ot as that sotwa-asd dsi aidatio
a idd th o thod aaia to is itstd i th dtai
tha oditios o thi podts.
h nf fndnl
Conduction and convection
Th a th haiss sposi o hat tas: odtio, o
tio, ad adiatio. codtio dsis hat fowi isid a od, with th
att ost ot odd as a cAD pat o ass. cotio ad adiati
oth io hat ha tw th soid od ad th iot.
Figure 7:
TyPIcAl reSulTS PrOvIDeD by THermAl DeSIgn vAlIDATIOn
-
8/23/2019 024210 SIM ThermalAnalysis WP ENG
5/17T H e r m A l A n A l y S I S
A ap o hat tas odtio is hat fow aoss a wa. Th
aot o tasd hat is popotioa to th tpat di
tw th hot sid THOT ad th od sid TcOlD o th wa, to th aa
o th wa, ad to th ipoa o th wa thikss l. Th popotioait a
to K, ad tha odtiit, is a w-kow atia popt (Fi 9)
Figure 9:
HeAT IS cOnDucTeD THrOugH THe
WAll FrOm THe HIgHer TO THe
lOWer TemPerATure.
Figure 10:
cOnDucTIOn cOeFFIcIenTS FOr DIFFerenT mATerIAlS
Figure 11:
HeAT DISSIPATeD by cOnvecTIOn
AlWAyS requIreS mOvemenT OF
THe FluID SurrOunDIng THe bODy.
Tha odtiit K ais wid o dit atias; this ato is wha
ditiats tw hat odtos ad isatos (Fi 10).
Th hais o hat ha tw a ta a o a soid od a
th sodi fid sh as ai, sta, wat, o oi is ad otio. Th
aot o hat od otio is popotioa to th tpat di
tw th soid od a TS ad th sodi fid TF, ad to th
aa A o th a hai (dissipati o aii) hat. Th popotioa
ato h is ad th otio oit, aso kow as a oit.
Hat ha tw th sa o a soid od ad its sodi fid
is ot o th fid (Fi 11).
-
8/23/2019 024210 SIM ThermalAnalysis WP ENG
6/17T H e r m A l A n A l y S I S
Th otio oit sto dpds o th di (.., ai, sta,
wat, oi) ad th tp o otio: ata o od. nata otio a
o tak pa i th ps o ait as fid ot is dpd
o th di tw th spi ait o od ad hot fids. Fod
otio is ot dpdt o ait (Fis 12, 13).
Figure 12:
nATurAl cOnvecTIOn IS InDuceD by A DIFFerence In HOT AnD cOlD FluID Den
SITy. In FOrceD cOnvecTIOn, FluID mOvemenT IS FOrceD, FOr exAmPle, by A
cOOlIng FAn.
Figure 13:
HeAT cOnvecTIOn cOeFFIcIenTS FOr DIFFerenT meDIA AnD FOr DIFFerenT TyP
OF cOnvecTIOn.
To s how odtio ad otio wok toth, osid a hat-sik
ass (Fi 14). A iohip ats hat thohot its ti o
Hat os withi
Figure 14:
A cerAmIc mIcrOcHIP generATIng HeAT IS embeDDeD In An AlumInum rADIAT
THe rADIATOr IS cOOleD by THe SurrOunDIng AIr.
-
8/23/2019 024210 SIM ThermalAnalysis WP ENG
7/17T H e r m A l A n A l y S I S
Figure 15:
TemPerATure DISTrIbuTIOn AnD HeAT Flux In THe HeAT-SInK ASSembly
th iohip odtio th is tasd to a ai adiato wh
it aso tas odtio. As hat tas o th poai iohip to
th ai adiato, it st oo a tha sista a od
iptios at th poai-ai ita. Fia, hat is dissipatd
otio o th otsid as o th adiato to th sodi ai.
Addi a ooi a o isi th adiato i wat dos ot ha th
hais o hat tas. Hat is sti od o th adiato as
otio. Th o di tw ai ad wat ati as ooats
ad tw ata ad od otios is a dit a o otio
oit.
Th tpat d i th hat-sik ass is show i Fi 15. Th
ot o hat o th adiato a to th ait ai a pitd
potti hat-f tos (Fi 15, iht). Hat f tos oi ot o
th adiato as isai hat od to th sodi fid. no tos
oss th otto a as i th od th otto as o th adiato
ad iohip a isatd.
not that odi th hat fowi i th hat-sik ass is
aoti o a sista to hat fow at th ita tw th ai
iohip ad th ai adiato. I so dsi iatio poas, th
tha sista a st odd piit; i oths, ik SoidWoks
it a td i a sipid wa as a tha sista oit.
-
8/23/2019 024210 SIM ThermalAnalysis WP ENG
8/17T H e r m A l A n A l y S I S
Conduction, convection and radiation
So a this disssio o hat tas i th hat-sik ass osids o
two hat-fow haiss: odtio (sposi o oi hat isid th
soid odis: iohip ad adiato) ad otio (whih dissipats hat
o th ta as o th adiato to th ait ai). Hat tas
adiatio a iod as at th opati tpat o hat-sikadiatio, hat tas is ow. Th t ap hihihts a hat tas
po wh adiatio at iod.
radiatio a o hat tw two odis o dit tpats o it
a adiat hat ito spa. It dos ot dpd o whth o ot th odis
a isd i a fid o a sodd a a (Fi 16).
Figure 16:
HeAT IS excHAngeD by rADIATIOn beTWeen Any TWO bODIeS OF DIFFerenT
TemPerATureS. HeAT cAn AlSO be rADIATeD by A SIngle bODy OuT TO SPAce
Th aot o hat had adiatio tw th as o two soid
odis with tpats T1 ad T2 is popotioa to th di o th
oth pow o asot tpats to th aa A o th as patiipati
i th hat tas, ad to th issiit o th adiati sa. eissiit i
dd as th atio o th issi pow o th sa to th issi pow
o a akod at th sa tpat. matias a assid a issiit
a tw 0 ad 1.0. A akod, tho, has a issiit o 1.0 ad
a pt fto has a issiit o 0. bas hat tas adiatio
popotioa to th oth pow o th asot tpat, it os
siiat at hih tpats.
-
8/23/2019 024210 SIM ThermalAnalysis WP ENG
9/17T H e r m A l A n A l y S I S
cosid a spotiht poidi iiatio i a a a ha. Ass
that th a ha is so a that a hat ftd o th ha-
was ak to th spotiht a iod. Th iht ad fto a
posd to a a, whi th ak sid o th ai hosi is so
d ai (Fi 17).
Figure 17:
In THe SPOTlIgHT mODel, THe reFlecTOr AnD lIgHT bulb Are exPOSeD TO
A vAcuum AnD THe bAcK SIDe OF THe HOuSIng IS exPOSeD TO AIr
Th hat atd th iht is patia adiatd ot to spa, whi
th st is id th paaoi a (fto) o th hosi. O a
sa potio o hat ts th hosi odtio wh th iht is
attahd to th hosi. Th adiatd hat id th hosi is aai
spit ito two potios: th st is adiatd ot, ad th sod is od isid
th hosi o o th a sid to th ai sid. O it ahs th
a posd to ai, it is dissipatd otio.
As aasis sts idiat, th tpat o th ai hosi is pa
a io as hat is odtd asi i ai d to its hih
odtiit (Fi 18).
not that si adiatio hat-tas os ti o at hih t-
pats, th iht st hot to dissipat a th hat it pods
Figure 18:
TemPerATure DISTrIbuTIOn In A SPOTlIgHT
-
8/23/2019 024210 SIM ThermalAnalysis WP ENG
10/17T H e r m A l A n A l y S I S
Transient thermal analysis
Th aass o oth th hat sik ad th spotiht dat with hat tas
a stad stat, asd o th assptio that oh ti has passd o h
fow to staii. Aasis o a stad-stat hat tas is idpdt o th
ti it took o th hat fow to ah that stad stat, whih i pati a
tak sods, hos, o das.
A aasis o hat fow hai with ti is ad tasit tha aas
as o ap, th aasis o a o pot kpt hot a hati pat. Th
tpat o th hati pat is otod a thostat adi th t
pat o th o. Th thostat ts th pow o i th tpat
o th o dops ow a ii tpat, ad ts it o wh th
tpat ds a ai, pst a. Tpat osiatios o
spid piod o ti a show i Fi 19.
Thermal stresses
Hat fowi thoh a soid od wi as a ha i tpats i this
od. cost th od wi pad o shik. Stsss asd this
pasio o shika a ad tha stsss.
Tha stsss o i a wh hot o is pod ito it. A tha
aasis o sh stsss is idtii th tpat distitio; o
th isid as o th , th tpat is that o th hot o, whi
o th otsid as s-dd otio oits oto hat oss to
th sodi ai. Si ooi is a ati sow poss, a stad-stat
tha aasis is appid to aat th stat tpat distitio
th o . Th tpat distitio is o-io, asi thastsss that a asi aatd i SoidWoks i a stati aa
si th tpat sts o th tha aasis (Fi 20).
Figure 19:
TemPerATure verSuS TIme PlOT FOr A THermOSTAT-cOnTrOlleD POT OF cOFF
Figure 20:
nOnunIFOrm TemPerATure FIelD,
FOunD by STeADy-STATe THermAlAnAlySIS (leFT), InDuceS THermAl
STreSSeS cAlculATeD In A STruc-
TurAl STATIc AnAlySIS (rIgHT).
-
8/23/2019 024210 SIM ThermalAnalysis WP ENG
11/17T H e r m A l A n A l y S I S
Desired capabilities of thermal design validation software
cosidi th tpia pos if itodd h, tha aasis ds
aidatio sotwa sd i a podt-dsi poss st a to od:
Hat fow odtio
Hat fow otio Hat fow adiatio
Th t o a tha sista a
Ti-dpdt tha ts sh as hati o ooi
(tasit tha aass)
Tpat-dpdt atia poptis, hat pow, otio
oits, ad oth oda oditios
Th a aso oth its that a aidatio poa sd as a dsi
too shod satis that a ot o spi to tha aasis t app as
w to stta o toati aass. Si w podts a isa dsid o cAD, th it s o a tp o aidatio sotwa as
dsi too aso pas th oowi its o cAD sotwa:
Th cAD sst shod :
A at-asd, paati, assoiati soid-od
A to at a ot, oth aati spi ad aasis spi
A to o tw dsi ad aasis pstatios o th
od whi kpi otis ikd
Th ao its a o a adad siatio sst whih o-
is as o s with hih optatioa pow, sh as th SoidWokssiatio poa itatd with SoidWoks cAD (a adi 3D paati
at-asd cAD sst).
Stat-o-th-at sotwa itatio aows ss to tha ad stt
aass si th sa aiia SoidWoks ita, ths iiii th
d to a aasis-spi tasks ad s (Fi 21) .
Figure 21:
AnAlySIS SucH AS THermAl AnAlySIS OF A cIrcuIT bOArD IS cOnDucTeD uSIn
THe FAmIlIAr SOlIDWOrKS InTerFAce, mInImIzIng THe neeD FOr uSerS TrAInIn
-
8/23/2019 024210 SIM ThermalAnalysis WP ENG
12/17T H e r m A l A n A l y S I S
Dgn pobl cn b olvd soldwok
Th oowi stios pst so aps o dsi pos sod s
th tha ad stta aasis apaiitis o SoidWoks.
Sizing the cooling fins of a heat sink
A iohip adiato st dsid to poid oh ooi to kp thiohip ow 400 K. Th iohip sits o a as pat. bas o th
tha sista a spaati th pat o th st o th ass, t
as pat poids o ii ooi.
ri a tha aasis o th iitia dsi with a ooi- hiht o 2
shows a tpat o 461 K (Fi 22, top). chai th ooi
to 40 hih iass th ooi, t ot oh to t th spiatio
Figure 22:
HeAT SInK WITH THree DeSIgn cOnFIgurATIOnS
th iohip tpat is ow 419 K (Fi 22). A thid itatio with
60 -hih s pos sss, as th iohip tpat is ow 400
K, a apta a (Fi 22).
cotio oits, whih a a ipotat osidatio i this std,
od i ii ttooks o a aatd si wasd a
atos. Atati, a std o fid fow aod th adiato a odt
si SoidWoks Fow Siatio to dti ths as.
Designing a heating element
A hati t osists o a ai pat with a ddd hati
oi. Th -shapd oi dsi show i Fi 23 is pd o its ow osHow, tha aasis pos that it ats a oio tpat
o th otsid o th pat as show i Fi 23.
Figure 23:
A SImPle DeSIgn OF A HeATIng elemenT embeDDeD In An AlumInum PlATe
-
8/23/2019 024210 SIM ThermalAnalysis WP ENG
13/17T H e r m A l A n A l y S I S
A dsid hati pat ats th hati t oi a spia as
show i Fi 24. rpati th tha aass o th odid dsi
dostats that th distitio o tpat is ow aost io
(Fi 24).
Figure 24:
A reDeSIgneD HeATIng PlATe IS SHOWn WITH unIFOrm DISTrIbuTIOn OF
TemPerATureS.
Figure 25:
A SPOTlIgHT IS SuPPOrTeD AS SHOWn In THe TOP PIcTure. THe mIDDle PIcTure
PreSenTS STeADy-STATe TemPerATure DISTrIbuTIOn, AnD THe bOTTOm One
SHOWS In reD WHere STreSSeS exceeD THe yIelD STrengTH.
Finding thermal stresses in a spotlight housing
A spotiht (Fi 17) is iid sppotd ao th i as show
i Fi 25. Th hosi dops tha stsss as it aot
pad whi its tpat iass.
Fidi tha stsss is a oiatio o tha ad stta a
ss, wh tpat sts (Fi 25) a potd to a stati aasis
i od to aat tha stsss. Dsi aidatio is dd to ai
whth th tha stsss d th id stth o th ai ho
i. Th stss pot i Fi 25 shows i d thos aas o th hosi wh
stss dos idd d th id stth. Ths stss sts po that
th hosi as dsid wi id.
not that tha stsss dop ot as th tpat o th hos
is oio t as th stait pts th hosi o padi. Aso, ot that ths stsss dop i th as o a stta
oads.
-
8/23/2019 024210 SIM ThermalAnalysis WP ENG
14/17
Finding thermal stresses in a flexible pipe
Sppos that a oatd pip, whi to do, is std to di
tpats at its two ds. This sts i th tpat d show i
Fi 26. Th stio o itst is whth it wi dop a tha st
s d to ths dis.
usi th tpat sts i a stati aasis, th sotwa aats th
p t o oio tpat i th as o a stta oads
sppots. Fi 26 shows i d wh th stss ds th pip atia
id stth.
Figure 26:
Due TO A nOnunIFOrm TemPerATure FIelD, THe PIPe DevelOPS THermAl
STreSSeS exceeDIng THe yIelD STrengTH OF THe PIPe mATerIAl.
Figure 27:
A cOrrugATeD AlumInum PIPe SubjecTeD TO A TenSIle lOAD (TOP) AS Well A
THermAl STreSSeS, DevelOPS cOmbIneD STrucTurAl AnD THermAl STreSSe
(bOTTOm).
I dsid, a stta oad (Fi 27) a appid to th pip to aat
th oid t o tha ad stta stsss.
T H e r m A l A n A l y S I S
-
8/23/2019 024210 SIM ThermalAnalysis WP ENG
15/17T H e r m A l A n A l y S I S
Overheating protection of an electronic circuit board
Th pd tpat o a toi iit oad show i Fi 28
is 700c ad shod ot d 1200c. To pt it o ohati, a
oto ts o th pow wh th tpat o th iohip ds
1200c. It ts th pow ak o wh th tpat dops ow 700
How, as o tha itia, th tpat o th iohip a s
d 1200c.
Figure 28:
An elecTrOnIc cIrcuIT bOArD IS PrOTecTeD FrOm OverHeATIng by
A cOnTrOller.
Figure 29:
TemPerATure OF THe mIcrO cHIP FlucTuATeS AS POWer IS cycleD On AnD OFF
becAuSe OF THermAl InerTIA,THe vAlue exceeDS THe mAxImum AllOWeD, 1200
Istiati th a o tpat ftatios ios odti ath
a tasit aasis with th hat pow otod a thostat at
This is siia to th o pot ap i Fi 19. Hai dd th a
ia poptis, otio oits, iitia tpat, ad hat pow, th
aasis is o a piod o 300 sods. Ftatios i iohip tp
t a show i Fi 29.
Th sts o th tasit tha aasis a idiat that th oto
pow t-o tpat st owd ow 1200c to opsat o
th tha itia o th sst. Th dsid stti sod asi od
th t two to th itatios.
-
8/23/2019 024210 SIM ThermalAnalysis WP ENG
16/17T H e r m A l A n A l y S I S
Deformation analysis of a composite bearing-housing
A oposit ai-hosi is std to a atd tpat d to
itio i th ais. It is aso std to ai atio oads. Th ha
is to d th doatio o th os wh th ais sit (Fi 3
top), to ak s that th ais wi ot oos th taii pss t. Th
is a oiatio o stad-stat tha ad stati aass. Th ststp is to d th tpat aoss th ai hosi (Fi 30, otto
Figure 30:
beArIng HOuSIng (TOP) IS SubjecTeD TO nOnunIFOrm TemPerATure FIelD Due
TO HeAT generATeD In THe beArIngS (bOTTOm).
Figure 31:
rADIAl DISPlAcemenT cOmPOnenTS OF DeFOrmATIOn OF THe beArIng
HOuSIng eDgeS
basd o ths sts, a stati aasis is pod to aat th do
tio asd th oid t o tha doatios ad stta oFi 31 shows th adia dispat opots o oth os.
-
8/23/2019 024210 SIM ThermalAnalysis WP ENG
17/17
w w w . s o l i d w o r k s . c
daat st sw c.300 ba Ac, mA 01742 usAp: 1 800 693 9000ot t us: +1 978 371 5011ea: f@.
C o n c l o n
yo shod aa athi that s o tiit o tha poa
aoid pottia daos ohati.
Tha aasis dsi aidatio sotwa sd i th podt-dsi po
st a to od hat fow odtio, otio, ad adiatio.
st aso od th t o a tha sista a, ti-dpdt th
ts sh as hati o ooi, tpat-dpdt atia popti
hat pow, otio oits, ad oth oda oditios.
Si w podts a isa dsid i cAD, a aidatio sotwa
sd as a dsi too st a at-asd, paati, assoiati
soid-od that a at a ot ad o tw dsi ad
aasis pstatios o th od whi kpi otis ikd.
SoidWoks Siatio os a th ao its i a adad si
tio sst whih ois as o s with hih optatioa pow.