© 2006 IBM Corporation

The Young Faculty WorkshopJuly 27, 2009

Working with Industry

Shishpal RawatVP, Technical Initiatives, CEDADirector, Business Enabling ProgramsIntel Corporation

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Our Industry Semi IC’s (~$200B) & Electronics

(~$800B) a significant force in world economy ($66T in 2007)

A challenging year

– Semiconductor revenues fall; Expect 2009 to be lower (Gartner DQ)

– EDA revenues show similar trend, and may lag a bit

Challenges abound– Device & Design Complexity continues to

rise creating new challenges e.g.

• Validation

• Mixed Signal Design

– New application areas e.g.• Energy generation & management

• Health Management

0

500

1000

1500

2000

2500

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3500

4000

4500

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$M

2000 2001 2002 2003 2004 2005 2006 2007 2008

Year

EDA Revenue

CAE IC - Physical PCB/MCM Services

Source SIA, EDAC, GartnerDQ2Council For EDA

© 2006 IBM Corporation

New Process nodes introduce additional complexity for designers and CAD tool developers e.g.– Integrate larger number of devices in the same or shorter time span (TTM)– Lower Power (Control heat and/or Battery Life)– Manage Deep sub micron issues– Manage complex design rules and guidelines

Industry thrives on continuous innovation– Set up multiple for collaborative efforts – GRC, Focus Centers– Aggressively supports “directed research”, internationally– Provides infrastructure support – equipment, tools etc.– Brings in faculty, students to work on site

Websites are a rich source of information e.g.• http://www.intel.com/research• http://www.arm.com/community/university• http://www.cadence.com/cadence/cadence_labs/Pages/default.aspx• http://www.synopsys.com/Community/UniversityProgram/Pages/default.aspx

– (reception today http://www.synopsys.com/Community/UniversityProgram/DAC09University/Pages/default.aspx)

• http://www.ibm.research.com

Industry and University Research

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Getting Started

Collaborative opportunities created via direct contact (unsolicited proposals don’t work well)

Build your network; Establish areas of mutual interest

– Ask your advisor, your dept. chair, the dean, their friends for contacts at industry – Specific contacts DO matter

– Be active at conferences; Seek out speakers/panelists

– Invite industry “visitor” to meet with you/your dept

– Consortia events at various schools (open house)

Offer to give a talk to company where a match exists

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Seeing the collaboration through

Update sponsor on progress; make periodic presentations; solicit feedback

Discuss internship opportunities for students with sponsor

– Extensive world wide opportunities available (Risk: Some students may delay/abort graduate school)

Ensure a presentation to the sponsor at the conclusion of collaboration

– Use as a forum to generate new opportunities

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A few words of advice

Think how you want to showcase your result It’s a new class of research (best fit with consortia)

Device and Interconnect modeling using CNT

Next Generation Algorithm/Engine – Benchmark against existing solutions

Detailed implementation/Methodology (best fit with industry)

Use Industry Standard tools and Infrastructure – OpenAccess, VHDL, System Verilog, System C etc.

Use Open source from universities/labs/industry to build tools

Visit industry and test/validate your hypothesis; Student interns are a good mechanism to bridge industry and academia (but beware of visa/export control restrictions)

Work with sponsor on “success” criterion6Council For EDA

Intel Design and CAD Research

Interacting with Intel• Intel has a strong relationship with academia. Intel supports

university research/infrastructure through a variety of venues- Consortium based funding (SRC, Sematech, …)- Direct funding for small grants- Intel Research network of labs- Intel Foundation/Academic Relations- SDKs (Intel® Parallel Studio), Code releases (FORTE), etc.

• Many opportunities to collaborate with Intel- Student internships- Visiting faculty- Research symposiums- Mutually interesting research programs in consortia (GRC, FCRP, ...)

• Getting Started- Identify technologist at Intel with similar interests- Initiate discussion and identify collaboration opportunities- Initial support can come in many different flavors

Letters of support, invitation to speak, providing feedback on a proposal, …

• System level Tools: Early Design Exploration, System Level Synthesis, System Level Verification and Test, System Design Robustness (DFM, DFR), System Power Optimization.

• Logic/PD/TA: Core Design Tools (synthesis, timing, …), Design/Manufacturing interface tools (yield aware including RET), AMS/RF tools, Tools for designing with innovative CMOS nanostructures.

• Test and Testability: Test in the presence of variability, Coverage and test methodology, AMS/RF Test, System Level and SoC test, Test for process learning, Test and Power mitigation, New apps and technologies (3D, adaptive designs, security, etc.)

• Verification: Core technologies (Bit/Word level solvers, RTL and System Level Verification including SoC, uCode and Software, AMS verification.

Areas of Interest in Design/CAD

EDA/Design ContactsNoel Menezes (Cad Labs Director)Jeff Parkhurst (Academic Research Program Manager)Shishpal Rawat (Business Enabling and Planning)

Other Areas

Intel’s Corporate External Research Office directs research in a variety of areas

ERO supports wide latitude for shaping programs to address strategic priorities

Key Contacts

IBM Research

© 2009 IBM Corporation

EXAMPLE

Working with IBM

Courtesy: John Darringer & Jinjun Xiong

IBM Research

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Getting Support for Your Research From IBM? Contact a colleague in IBM Research

– 3000 researchers at 8 locations world wide

– Computer Science, Electrical Engineering, Mathematical Sciences, Physics, Services Science, Systems, …• Systems includes: Advanced Enterprise Middleware, Communications,

Computer Architecture, Design Automation, Distributed and Fault Tolerant, Electrical Interconnect and Packaging, Performance Modeling and Analysis, Verification Technology, VLSI Design

– http://www.research.ibm.com/

Establish a mutual interest

Demonstrate a track record of collaboration

Visit IBM research sites to present your work

Invite IBM researchers to visit you and discuss their research

Be familiar with the most recent IBM results

– Keynotes, plenary talks, panel discussions, and press releases

IBM Research

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IBM Offers Many Forms of Support

IBM Fellowships– Tuition, variable stipend by Geo, IBM mentor, and optional internship with ThinkPad gift– http://www.ibm.com/university/fellowship/phd/index.html

IBM Faculty Awards– Cash awards provided to faculty at universities worldwide, no strings attached– http://www.ibm.com/university/facultyawards/index.html

Innovation Awards

Shared University Research Awards– http://www-304.ibm.com/jct01005c/university/scholars/sur/index.html

Open Collaborative Research Awards (OCR)– Cash only awards processed as donations ( no strings attached )– http://www.ibm.com/university/collaborativeresearch

Industry IP Collaboration

Extreme Blue Internship Program– http://www.ibm.com/extremeblue

Centers for Advanced Studies– https://www-927.ibm.com/ibm/cas/

IBM Research

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Collaborative Research Initiatives

IBM has a strong tradition of research collaboration with academia

IBM's Collaborative Research Initiatives are aimed diminishing barriers of intellectual property

http://www-304.ibm.com/jct01005c/university/

scholars/collaborativeresearch/index.html