Rockwell Collins:WEEE, RoHS and Pbfree

Soldering Processes!

David HillmanAdvanced Process Engineering

May 2006

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WEEE, RoHS & Pbfree Soldering

Agenda:

• Background

• Industry Current Status

• Rockwell Collins Status

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WEEE, RoHS & Pbfree Soldering

Background:

• Waste Electrical and Electronic Equipment (WEEE)

- Prevention of waste

- Reuse, recycling and other forms of recovery

- Implementation August, 2005!

• Restriction of Certain Hazardous Substances (RoHS)- Contribute to environmentally sound recovery and disposal

- Lead, mercury, cadmium, hexavalent chromium,

PBB and PBDEs (brominated flame retardants)

• The Drafts Are Now Directive Requirements

- Implementation July 1, 2006

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WEEE, RoHS & Pbfree Soldering

Background:

• Computer/Communications Segment: 1980’s to 1990’sComputer/Communications Segment: 1980’s to 1990’s

• 49%49% Market Share Market Share 64.7%64.7% Market Share Market Share

• 425425 Million Cell Phones Produced In 2000Million Cell Phones Produced In 2000

““Lead Additives In Gasoline Are Bad”Lead Additives In Gasoline Are Bad”

““Lead Additives In Paint Products Are Bad”Lead Additives In Paint Products Are Bad”

““Can Lead Be Eliminated From Electronics?Can Lead Be Eliminated From Electronics?”

Consumers Have Been Socially Biased That Lead Is Bad!

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WEEE, RoHS & Pbfree Soldering

Industry Status:

Current

Direction

Of

Class 3

OEMs !!!

• Class 2 - Industrial Electronics - Will Make 2006 Deadline

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WEEE, RoHS & Pbfree Soldering

• Rockwell Collins Filed A Request for Exemption on September 21, 2004 with EU TAC – Review Completion Deadline of December 2004

• Request for Further Exemption from the Requirements of Article 4(1) of Directive 2002/95 for Applications of Cadmium, Lead, and Hexavalent Chromium in the Aviation Sector

submitted on behalf of Rockwell Collins, Inc.by Hunton & Williams

Avenue Louise 326 box 6B-1050 BrusselsTel. 02/643 58 00Fax 02/643 58 22

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WEEE, RoHS & Pbfree Soldering

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WEEE, RoHS & Pbfree Soldering

Rockwell Collins Status

• Five Areas Of Focus

– Area #1: Printed Wiring Board Finishes

– Area #2: Component Lead Finishes

– Area #3: Equipment/Manufacturability

– Area #4: Reliability

– Area #5: Legacy Product Issues

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WEEE, RoHS & Pbfree Soldering

Rockwell Collins Status

Area #1: Printed Wiring Board Finishes:• Effort Complete: New Finishes Implemented

• Immersion Silver, Immersion Tin, ENIG (Immersion Gold)

• Rockwell Collins PWB Design Guidelines Revised• Finish Advantages/Disadvantages Comparisons• Decision Tree Charts• Technology/Functionality Charts

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WEEE, RoHS & Pbfree Soldering

Rockwell Collins Status• Area #2: Component Lead Finishes:

* Surface Finish Position Statement Sent to Supply Base

* Lead-Free Component Protocols Implemented

Tin Whiskers Pbfree BGA

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WEEE, RoHS & Pbfree Soldering

Area #3: Equipment/Manufacturability:

* 7 DOE Assembly Process Trials Completed

• Collins is working on characterization of current RC soldering processes, obtaining capable vs. retrofit vs. replace comparisons, and understanding overall impact on current soldering practices

• Rockwell Collins has selected:

• SAC305 for a Pbfree Alloy

Tin (Sn) Silver (Ag) 3% Copper (Cu) 0.5%

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WEEE, RoHS & Pbfree Soldering

Area #3: Equipment/Manufacturability:

***34ºC Increase Over Current Solder Processes !!!

Solder Alloy Melting Temperature (C)42Sn - 58Bi 13868Sn - 32Cd 17663Sn - 37Pb 183

77.2Sn - 2.8 Ag - 20 In 18796.1Sn - 2.6Ag - 0.8Cu - 0.5Sb 210

Sn - 3-4Ag - 0.5-0.9Cu 21795.5Sn - 3.5Ag 221

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WEEE, RoHS & Pbfree Soldering

Rockwell Collins Status:

Area #3: Equipment/Manufacturability:

P3 = 3.3% P1 = 1.1%P2 = 2.2%

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Area #4: Reliability:

JCAA/JGPP No Lead Solder Program:

Test Vehicle & Solder Alloys:•Sn3.9Ag0.6Cu (SAC) for reflow and wave soldering

•Sn3.4Ag1.0Cu3.3Bi (SACB) for reflow soldering

•Sn0.7Cu0.05Ni (SNIC) for wave soldering

•Sn37Pb (SnPb) for reflow and wave soldering

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WEEE, RoHS & Pbfree Soldering

Rockwell Collins Status

Area #5: Legacy Product Issues:

* Effort In Progress: AOE Internal Test on Laminate and Structures

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2003 2004 2005 2006 2007 2008 2009 2010

Calender Year

Implement Lead-Free

Process Line

Product Pathfi nder Trials

Process Compatibility and

Reliability Investigations

Material Investigations

Rockwell Collins Lead-Free Time Line

Material Investigations - Solder Alloy Selection

- Flux Selection

- JCAA/JGPP Test Program (Testing Lead-Free Finishes on Components and Lead-Free Solders)

Process Capability and Reliability Investigations

- Wave Solder Trials

- Reflow Process Trials

- Equipment Analysis

- CALCE Test Program

Product Pathfinder Trials

- Commercial Avionics Product

- Military Avionics

- Additional Product Selections

Implement Lead-Free Process

- Selected Facility Implementation including materials, process and product documentation activities

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Product Pathfinder Trials: Navy Mantech FA-18AB HUD Pbfree Project

WEEE, RoHS & Pbfree Soldering

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WEEE, RoHS & Pbfree Soldering

WEEE,

RoHS,

& Pbfree

Will Impact You!