Reference Model for Project CODE

Post on 07-Jan-2016

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Reference Model for Project CODE. Test. Sort. Fab. Bump. Tape and Reel. Back Grind. SLT. Assy. Die. Un Bumped Wafer. Bumped Wafer. Sorted Wafer. FG. PFG/FG*. Assembly. Back Grinded Die. Direct Sort Flow (Wafer Buy). Direct Sorted Wafer Buy. Assembly Flow. PFG to FG Flow. - PowerPoint PPT Presentation

Transcript of Reference Model for Project CODE

Reference Model for Project CODE

Direct Sort Flow (Wafer Buy)

Direct Sorted Wafer Buy

PFG Postponement Flow

Direct Flow

PFG to FG Flow

Assembly Flow Test Flow PFG to FG Flow

Sort

Back Grind

Assy Test SLT

Tape and Reel

FG

Bump

PFG/FG*Assembly

Back Grinded Die

DieSorted WaferBumped WaferUn BumpedWafer

Fab

Supply Plans generated for:Fab- SortDie inv to FGSLT/T&R adhoc runs

Focus on data, priorities, rules and system-generated supply plans* Test out part numbers for Direct Flow only. Required for capacity planning in SLT