Reference Model for Project CODE
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Reference Model for Project CODE Direct Sort Flow (Wafer Buy) Direct Sorted Wafer Buy PFG Postponement Flow Direct Flow PFG to FG Flow Assembly Flow Test Flow PFG to FG Flow Sort Back Grind Assy Test SLT Tape and Reel FG Bump PFG/FG* Assembly Back Grinded Die Die Sorted Wafer Bumped Wafer Un Bumped Wafer Fab ply Plans generated for: ab- Sort ie inv to FG LT/T&R adhoc runs us on data, priorities, rules and system-generated supply plans * Test out part numbers for Direct Flow only. Required for capacity planning in SLT
description
Reference Model for Project CODE. Test. Sort. Fab. Bump. Tape and Reel. Back Grind. SLT. Assy. Die. Un Bumped Wafer. Bumped Wafer. Sorted Wafer. FG. PFG/FG*. Assembly. Back Grinded Die. Direct Sort Flow (Wafer Buy). Direct Sorted Wafer Buy. Assembly Flow. PFG to FG Flow. - PowerPoint PPT Presentation
Transcript of Reference Model for Project CODE
Reference Model for Project CODE
Direct Sort Flow (Wafer Buy)
Direct Sorted Wafer Buy
PFG Postponement Flow
Direct Flow
PFG to FG Flow
Assembly Flow Test Flow PFG to FG Flow
Sort
Back Grind
Assy Test SLT
Tape and Reel
FG
Bump
PFG/FG*Assembly
Back Grinded Die
DieSorted WaferBumped WaferUn BumpedWafer
Fab
Supply Plans generated for:Fab- SortDie inv to FGSLT/T&R adhoc runs
Focus on data, priorities, rules and system-generated supply plans* Test out part numbers for Direct Flow only. Required for capacity planning in SLT
