MIPI Beyond Mobile

Industrial Computer-on-Module Case

Study

Nikola Nenadić, pygmyTITAN

“Industrial Mobile” Market •! Non-consumer applications of mobile technology •! Potential to disrupt a number of industries •!Medical, robotics, instrumentation, retail, logistics &

transportation, emerging markets (VR/AR, IoT, drones) •! People are already doing it…

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Market Forecasts by 2020

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Benefits of Mobile Technology •  Driven by smartphone form factor •  Low power, small form factor •  Latest ARM processor architectures •  Superior video processing with hardware acceleration •  Integrated signal processing capability •  Integrated radio (cellular, Wi-Fi, BT) •  Advanced power management

•  Pervasive technology (over 2 billion devices) •  Rich mobile software application ecosystem

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The Most Popular Invention in History

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Mobile Application Space is Huge

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ARM Landscape is Changing • Mobile ARM market consolidation is in progress •  A number of suppliers left the mobile market recently

(TI, Nvidia, Broadcom, Marvell, Intel)

• Only pure play mobile suppliers stay in the game (Qualcomm, Samsung, MediaTek, HiSilicon)

•  Disproportion: $400B1 mobile vs. $25B2 embedded •  Budgets for innovation in mobile are much bigger •  Reduced supply of high-end ARM platforms for

embedded ! Growing pressure to employ consumer mobile

SoCs in embedded applications

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1)Globalrevenuefromsmartphonesalesin2016,GfK;2)EmbeddedBoardsandIntegratedcomputersystemsmarketsizein2018,VDCResearch,2016

Key Obstacle for Industrial Mobile

•  Pure play mobile suppliers are focused on a small number of high volume customers

•  Embedded systems market is highly fragmented, with thousands of different clients and applications

• Mobile components are short-lived, driven by consumer market dynamics

!  Mobile technology stays inaccessible for embedded developers

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Lesson from the Past – Industrial PC

•  In the early 90’s technology landscape was similar •  There were 18 manufacturers of x86 processors •  IBM PC’s commercial success accelerated

development and consolidated the market •  Latest innovations were becoming cheap •  Pressure to use commercial PC technology

in industrial applications was rising •  1992 – PC/104 Consortium •  2005 – COM Express (PICMG) •  $3.5B1 market today

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1)IMSResearch,2011

Consumer vs. Industrial Applications

Consumer Products:

•  Fast time to market

•  Large volumes •  No customization •  Price pressure •  Short product lifetime

Industrial Devices:

•  Slower adoption rate, regulatory approvals

•  Low and medium volumes •  Tailored solutions •  Relaxed price margins •  Expected longevity

(> 5 years) •  Multi-vendor sourcing

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Mobile Computer-on-Module •  Smartphone electronics packed in a component • Open architecture •  Standardized form factor and pinout ! Solves longevity issue, enables multi-vendor sourcing

• Modular approach – reduced complexity & risk •  Building products on mainstream mobile technology ! Compatibility & continuous access to the latest innovations

•  Standardization of interfaces inside smartphones makes mobile COM possible ! Key role of MIPI Alliance

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Mobile Form Factor

•  Smartphone main boards takes approx. the same area •  High level of integration, small thickness

•  Power consumption: up to 3 W

•  Mobile COMs can be made small and thin, enabling smartphone-like industrial mobile devices

•  Heat dissipation, EMC/EMI, RF shielding

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How We Did It

•  PCB area: 21.6 cm2

•  Total thickness: 5 mm •  Integrated heat spreader, EMC/EMI and RF shielding

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Mobile COM Module Pinout •!Mobile by its nature: based on MIPI interfaces •! No power hungry/legacy industrial PC interfaces

(Ethernet, PCIe, SATA)

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Widely used mobile interfaces: •! MIPI Display Serial Interface

(DSI + LCD control) •! MIPI Camera Serial Interface (CSI + CCI) •! Universal File Storage (UFS + card signals) •! HSIC

Smartphone external interfaces: •! USB 2.0 / USB 3.0 •! HDMI

Integrated radio: •! Cellular •! Wi-Fi •! Bluetooth, NFC

Legacy mobile interfaces: •! SD Card, SDIO

Audio, sensors and control: •! Audio (MIPI SLIMbus/MIPI SoundWire/I2S) •! MIPI I3C, VGI

High-Performance: •! MIPI UniPort-M or M-PCIe?

Embedded Interfaces: •! UART, SPI, I2C, GPIO

Auxiliary Interfaces: •! SIM card, JTAG, boot selection,

power management, system management

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Mobile COM System Block Diagram

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Mobile vs. PC COMs

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Feature IndustrialMobile IndustrialPC

CPUarchitecture: dominantlyARM dominantlyx86

Boardsize: 12.5–25cm2 45–90cm2

Powerconsump?on: <3W 6-55W

Integratedradio: " #

Ba]erypowermanag.: " #

So^ware: Android/Linux Windows/Linux

Totalsystemprice: low high

Mechanical and Thermal Considerations •  Connector solution ! Low mating height ! High density ! 250-400 signal pins

• Mobile use cases ! Constrained space inside device ! Power dissipation ! Mechanical robustness ! Low weight

• Maintenance and servicing ! Easy module replacement ! Easy device upgrade

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Mobile COM Ecosystem Challenges

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•  Industrial Mobile ecosystem do not exist today •  The idea is to take components and know-how

directly from consumer mobile •  Ease technology transfer by implementing mobile

standards without any changes •  SoCs, ICs, displays, cameras, sensors,

mechanical components suppliers – should have no extra effort

•  Unified Industrial Mobile software architecture is needed to ensure compatibility and enable re-usage of commercial mobile applications

The Winner is Clear

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Software and Security •  Android is the winner of platform wars •  Embedded Android variant is needed

for Industrial Mobile to succeed •  Part of AOSP or middleware extension? •  Plug and play functionality, dynamic driver loading

• Mobile and IoT applications – security is key concern! •  Security Architecture should be

integral part of COM platform specification •  Hardware root of trust, secure boot, Trusted Zone

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Conclusions & Recommendations • Open architecture COM module standards facilitate

usage of mobile technology in industrial sector • Mobile is enabling technology for a number of

non-consumer applications with high-growth potential • Mobile industry is positioned well to capture significant

part of the industrial market in the future

•  PICMG led the effort for the Industrial PC • MIPI Alliance should lead it for the Industrial Mobile • Mobile computing module standard,

security architecture, and embedded Android

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To learn more, visit our exhibit in Grand Hall during the conference

Thank you for your time!

Any questions?

Nikola Nenadic Founder & CEO, pygmyTITAN

nikola.nenadic@pygmyTITAN.com