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Product Management Wirebonding

Wirebonding Webinar 2017

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Wirebonding

Wirebonding Process

Typical mistakes and their effects

How to avoid those mistakes

Successful applications

Overview

Philipp Conrad

Würth Elektronik GmbH & Co. KG

Product Manager Wirebonding

Product Management Wirebonding V 2017/06 © Würth Elektronik GmbH & Co. KG www.we-online.com/wirebonding Page 2

Wirebonding ProcessAdvantages of „wirebonded“ components?

Miniaturization

Performance/Function

Reliability

• Thermal Management

• Short signal paths (HF)

• Layout Flexibility

• Wirebond Tester (DVS 2811)

• Over 25 years Experience

• WE know HOW

• Package replacement

• Space savings

• High Precision Positioning

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Overview Wirebonding Process

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Bare Die Pickup

Bare Die Placement

Wirebonding

Wafer Waffle or Gel Pak

Glue Dispensing Positioning Placement

Goldwire Aluminiumwire

TOP 5

Typical Challenges

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Typical ChallengeNo. 1 Fingerprints

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Fingerprints

1. ALWAYS wear clean and new Gloves.

2. ALWAYS carry the PCB module at the edges.

3. Train your Staff.

4. Work close with the EMS partner / SMD Department.

How can you fix it, if it happens anyway?

Cleaning the contaminated area with Zestron or other suitable cleaning solutions, if

possible.

Typical MistakesHow to avoid this Fingerprints?

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Typical ChallengesNo. 2 Scratches

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Scratches

1. Take care during manual handling.

2. Clean working areas.

3. Smart production transportation solutions.

4. Avoid dust.

5. Train your Staff.

6. Work close to the EMS partner / SMD Department.

Typical MistakesHow to avoid Scratches?

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Typical ChallengesNo. 3 Dust

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Dust

1. Use smart transport boxes.

2. If possible use clean room conditions.

3. Clean production environment.

4. Separated production processes.

5. Usage of clean and oil-free Air

Typical MistakesHow to avoid Dust?

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Typical MistakesNo. 4 Glueing Issues

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Glue on the Bond pad

1. If possible, the usage of sharp knive to scratch of the glue. After that you

should perform an optical inspection of the related bond pads. Ggf.

2. Maybe change of the bond parameters.

3. Correct setup of the gluing process.

4. Training of the staff.

Typical MistakesHow to avoid gluing issues?

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Typical MistakesNo. 5 Wrong Tools

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Wrong Tools

WirebondingTools for Wirebonding

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Use the right tools!

WirebondingDesign Rules Suggestions

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Cu

Ni

Pd

0,04 – 0,08 µm

0,1– 0,2 μm

4 – 7 μm

Au

ENEPIG

Cu

Ni

Au 0,05 – 0,1 µm

4 – 7 μm

ENIG

WirebondingDesign Rules Suggestions

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Quality ControlWirebond Tester

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Advantages XYZTec Wirebond-Tester

Automated Process

Standardized Test Process (DVS2811)

Continuous Surface Quality Control

Online Test

Die Bonding ProcessAutomated placement

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WirebondingProduct Samples

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3D ToF Camera Application Medical IR Sensor Application

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Product SamplesWirebonding

WirebondingProduct Samples

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Thank you for your attention!

¡Gracias por su

atención!Děkuji vám

za pozornost!

Köszönöm a

figyelmüket! Tak for deres

opmærksomhed!

Merci de

votre attention!

Tack för er

uppmärksamhet!

Product Management Wirebonding V 2017/06 © Würth Elektronik GmbH & Co. KG www.we-online.com/wirebonding Page 23

Dipl.-Ing.(FH), MBA

Philipp Conrad

HOTLINE:

+49 175 2271600

philipp.conrad@we-online.de