PacTech USA Inc.328 Martin Avenue, Santa Clara, CA 95050, USA

PacTech Asia Sdn. Bhd.Plot 14, Medan Bayan Lepas, Technoplex, Phase 4Bayan Lepas Industrial Zone, 11900 Bayan Lepas,Penang, Malaysia

PacTech - Packaging Technologies GmbHAm Schlangenhorst 15-17, 14641 Nauen, Germany

Contact us at sales@pactech.de

Electroless Ni/Au & Ni/Pd/AuBumping is the Solution forLow Cost High Volume WaferBumping

The Electroless Bumping Process issuitable for all State of the Art Flip ChipProcesses:

• Soldering

• ACF

• NCP

• ICA

• UPH: 600,000 wafer per year (8”)

• Maximum Flexibility: 6”, 8”, 12”

• No Tooling

• In-line Bath Control and Replenishment

• Total Quality Software QualPac 2.0

• SECS GEM Interface

• Turnkey Process Solution

• Already installed at leading OEM production sites

• Compliant with Semi S2 and FM 4910

PacLine 200/300Electroless Bumping Line for AI and Cu Pad

PacLine 300 A50

PacTech USA Inc.328 Martin Avenue, Santa Clara, CA 95050, USA

PacTech Asia Sdn. Bhd.Plot 14, Medan Bayan Lepas, Technoplex, Phase 4Bayan Lepas Industrial Zone, 11900 Bayan Lepas,Penang, Malaysia

PacTech - Packaging Technologies GmbHAm Schlangenhorst 15-17, 14641 Nauen, Germany

Contact us at sales@pactech.de

Ultra-Fine-Pitch Bumping 40 µmNi/Au on Copper Pad

QualPac - Process Control

PacLine 200/300Electroless Bumping Line for AI and Cu Pad

www.pactech.de