PacLine 200 300 - PacTech - Packaging Technologies GmbH · 2014. 3. 10. · Bayan Lepas Industrial...
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Electroless Ni/Au & Ni/Pd/Au Bumping is the Solution for Low Cost High Volume Wafer Bumping The Electroless Bumping Process is suitable for all State of the Art Flip Chip Processes: • Soldering • ACF • NCP • ICA • UPH: 600,000 wafer per year (8”) • Maximum Flexibility: 6”, 8”, 12” • No Tooling • In-line Bath Control and Replenishment • Total Quality Software QualPac 2.0 • SECS GEM Interface • Turnkey Process Solution • Already installed at leading OEM production sites • Compliant with Semi S2 and FM 4910 PacLine 200/300 Electroless Bumping Line for AI and Cu Pad PacLine 300 A50 PacTech USA Inc. 328 Martin Avenue, Santa Clara, CA 95050, USA PacTech Asia Sdn. Bhd. Plot 14, Medan Bayan Lepas, Technoplex, Phase 4 Bayan Lepas Industrial Zone, 11900 Bayan Lepas, Penang, Malaysia PacTech - Packaging Technologies GmbH Am Schlangenhorst 15-17, 14641 Nauen, Germany Contact us at [email protected] Ultra-Fine-Pitch Bumping 40 μm Ni/Au on Copper Pad QualPac - Process Control PacLine 200/300 Electroless Bumping Line for AI and Cu Pad www.pactech.de
Transcript of PacLine 200 300 - PacTech - Packaging Technologies GmbH · 2014. 3. 10. · Bayan Lepas Industrial...
PacTech USA Inc.328 Martin Avenue, Santa Clara, CA 95050, USA
PacTech Asia Sdn. Bhd.Plot 14, Medan Bayan Lepas, Technoplex, Phase 4Bayan Lepas Industrial Zone, 11900 Bayan Lepas,Penang, Malaysia
PacTech - Packaging Technologies GmbHAm Schlangenhorst 15-17, 14641 Nauen, Germany
Contact us at [email protected]
Electroless Ni/Au & Ni/Pd/AuBumping is the Solution forLow Cost High Volume WaferBumping
The Electroless Bumping Process issuitable for all State of the Art Flip ChipProcesses:
• Soldering
• ACF
• NCP
• ICA
• UPH: 600,000 wafer per year (8”)
• Maximum Flexibility: 6”, 8”, 12”
• No Tooling
• In-line Bath Control and Replenishment
• Total Quality Software QualPac 2.0
• SECS GEM Interface
• Turnkey Process Solution
• Already installed at leading OEM production sites
• Compliant with Semi S2 and FM 4910
PacLine 200/300Electroless Bumping Line for AI and Cu Pad
PacLine 300 A50
PacTech USA Inc.328 Martin Avenue, Santa Clara, CA 95050, USA
PacTech Asia Sdn. Bhd.Plot 14, Medan Bayan Lepas, Technoplex, Phase 4Bayan Lepas Industrial Zone, 11900 Bayan Lepas,Penang, Malaysia
PacTech - Packaging Technologies GmbHAm Schlangenhorst 15-17, 14641 Nauen, Germany
Contact us at [email protected]
Ultra-Fine-Pitch Bumping 40 µmNi/Au on Copper Pad
QualPac - Process Control
PacLine 200/300Electroless Bumping Line for AI and Cu Pad
www.pactech.de
