Post on 26-Apr-2018
Micro-Transfer-Printing: Deterministic Assembly of Microscale Components Using Elastomer StampsC. A. Bower, M. Meitl, S. Bonafede, D. Kneeburg; X-Celeprint Ltd.
cbower@x-celeprint.com www.x-celeprint.com
Outline
• Introduction to Micro-Transfer-Printing
• Strategies for Printable Micro Devices
• Application Examples
• Summary
C. Bower, cbower@x-celeprint.com
Elastomer Stamp Transfer-Printing
devices are transferred
onto the stamp
devices are printed onto
non-native target substrate
Nature Mater. 5 33-38 (2006)
elastomer stamp (PDMS)
native substrate with
“printable” devices
devices are attached to stamp
by Van der Waals forces
C. Bower, cbower@x-celeprint.com
Kinetically Controlled Adhesion
slow lift-off fast lift-off> 10 cm s-1
“The adhesion between the solid objects and the stamp is rate-sensitive owing to the viscoelastic behavior of the elastomer”
Nature Mater. 5 33-38 (2006)
C. Bower, cbower@x-celeprint.com
Competing Adhesion
slow lift-off fast lift-off> 10 cm s-1
Slow Fast
Pick-up
Printing
Nature Mater. 5 33-38 (2006)
Stre
ngt
h o
f A
dh
esio
nStamp Velocity
“The adhesion between the solid objects and the stamp is rate-sensitive owing to the viscoelastic behavior of the elastomer”
Langmuir, Vol. 23, No. 25, 2007
C. Bower, cbower@x-celeprint.com
Micro-Transfer-Printing (µTP) Technology
Native “Source” Wafer
Elastomer Print Head (Stamp)
Non-Native “Target” Substrate
Populated Stamp
Attributes:• manipulate objects that are too small, numerous,
fragile, or otherwise difficult to handle by other means• massively parallel high-throughput assembly• hardware (motion & optics) scales to large format
target substrates • enables re-use of native growth substrate• decouples growth (high temp, lattice constraints) and
usage (glass, plastic) of high-performance materials• tolerant to wafer size mismatch • uses device “source” wafer efficiently • placement accuracy* +/- 1.5 µm (3-sigma)• process yields* > 99%
* application dependent
C. Bower, cbower@x-celeprint.com
Efficient Materials Usage
Non-native “Target” Substrate
1st transfer 2nd transfer
• produce devices at high density on native growth substrate• assemble microscale devices only where necessary on the target substrate
Densely packed device elements
Sparse assembled device elements
Source Wafer
Printing
“Area Multiplication”µTP allows you to spread devices from a source wafer over a much larger target area. As an example, a single 100mm InPwafer might be used to fully populate a 300mm Silicon wafer.
C. Bower, cbower@x-celeprint.com
Transfer-Stamp Technology
i. Prepare master, e.g. by photolithography
ii. Cast prepolymer (PDMS)
iii. Cure stamp; separate from master
• Transfer stamps are fabricated by casting the elastomer (PDMS) against a microfabricated master wafer.
SEM micrograph stamp surface
C. Bower, cbower@x-celeprint.com
Stage (x, y)
Print Head (z, θ, Tx, Ty)
Optics (x, y, z)
• A scalable process that utilizes precision motion and optics
Micro-Transfer-Printing Hardware
C. Bower, cbower@x-celeprint.com
Stre
ngt
h o
f A
dh
esio
n
Stamp Velocity
Strategies for “printable” devices
Most materials of interest are challenging to “pick-up” in their as-grown form.
Si <111>
• The device/substrate interface is engineered to make “pickable” devices• Primary strategy is to employ MEMs-like sacrificial release processes that
are tailored for µTP
Device / Substrate Interface
C. Bower, cbower@x-celeprint.com
The Silicon-on-Insulator (SOI) System
i. Silicon-on-insulator (SOI) wafer
ii. Photolithography and etch top silicon to expose buried oxide (blue)
iii. Etch buried oxide to undercut the structures
iv. Retrieve structures
Printable single-crystal silicon can be achieved using SOI wafers, where the buried oxide layer serves as the sacrificial layer.
anchor
tether fractures
during retrieval
C. Bower, cbower@x-celeprint.com
Examples of Micro-Transfer-Printed Silicon
J. Micromech. Microeng. 22 (2012) 055018 (7pp)
small 2012, 8, No. 6, 901–906
Si Micro Masonry Flexible Si Solar Cells Imbricate Scales
Nature Materials 7, 907-915 (2008).
http://rogers.matse.illinois.edu
C. Bower, cbower@x-celeprint.com
Printable Microscale Integrated Circuits
• The BOX (buried oxide) can be used as the sacrificial layer • First demonstration was done using XFAB’s XT06 SOI-CMOS process
sacrificial layer
C. Bower, cbower@x-celeprint.com
Microscale ICs on Glass
Printed µICs
50µm
• Over 2 million printed µICs• Process yield > 99.9%• Print accuracy +/- 1.5um 3σ
R.S. Cok, J. W. Hamer, C. A. Bower, E. Menard, S. Bonafede, “AMOLED
displays with transfer-printed integrated circuits,” Journal of the Society
of Information Display (JSID) 19, 335 (2011)
C. Bower, cbower@x-celeprint.com
Printable Microscale Compound Semiconductors
Growth Substrate
Epitaxial Devices Layers(InGaAs, InGaP, GaAs, InP, etc…)
Selective Release Layer (Al>0.6GaAs, InGaAs, InAlP, etc…)
1. Epitaxial Growth (MOCVD, MBE, etc…)
2. Patterning of material down to substrate
3. Formation of anchor and removal of release layer
anchor
“ready to print”
Epitaxial compound semiconductors are very practical systems for µTP because lattice-matched sacrificial layers can be introduced under the device layers.
growth substrate can be re-used after printing
C. Bower, cbower@x-celeprint.com
Microscale Multi-Junction III-V Solar Cells
43% efficient solar cell printed to as-fired ceramic. Cell contains InGaP, InGaAs, GaAs.
600um x 600um x 10um
microcells printed onto ceramic
surface mountable microcell
• Microscale solar cells1 for high efficiency high-concentration photovoltaics (HCPV)
• Over one million printed microcells in the field generating power
• Semprius opened its first factory in 20122
1. X. Sheng, C.A. Bower, M. Meitl et al. "Printing-based Assembly
of Quadruple-Junction Four-Terminal Microscale Solar Cells
and Their Use in High-Efficiency Modules," Nature Materials
13, 593-598 (2014).
2. http://semprius.com/wordpress2/wp-
content/uploads/2014/08/SEM-Facility-Opening.pdf
C. Bower, cbower@x-celeprint.com
Microscale III-V Lasers on Silicon
• Applications include:• Next generation hard drives: Heat-assisted magnetic recording (HAMR)• Silicon Photonics & Optical Interconnects• Sensors
J. Justice, C. A. Bower, M. Meitl, M. B. Mooney, M. A. Gubbins, B. Corbett, “Wafer
scale integration of III-V lasers on silicon using transfer printing of epitaxial layers,”
Nature Photonics, Volume 6, Issue 9, pp. 612-616 (2012)
direct print to silicon
Micro-Transfer-Printed
GaAs laser
C. Bower, cbower@x-celeprint.com
Microscale LEDs
InGaN
(111) Si
Tether
Anchor InGaN µLED on plastic
Rogers, J. A., et al. (2011). Unusual strategies for using indium gallium nitride grown on silicon (111) for solid-state lighting, PNAS
• The <111> substrate is used as the release layer for printable GaN-based devices
• GaAs-based red µLEDs printed on plastic
Applications include:
• Solid-state lighting
• Display backlights and displays
• Indicator lights
C. Bower, cbower@x-celeprint.com
Summary
• Micro-Transfer-Printing (µTP) with engineered elastomer stamps provides a cost-effective approach for the deterministic assembly of microscale devices
• µTP enables the integration of high-performance microscale devices onto non-native substrates such as plastics, glass or other semiconductors
• mature high-performance device technologies (Si ICs,GaAs and GaN) are compatible with µTP
• many emerging technologies can benefit from a cost-effective approach to micro-assembly
C. Bower, cbower@x-celeprint.com
Acknowledgements• The X-Celeprint technical team
• Professor John Rogers and his group at the University of Illinois at Urbana-Champaign
• Semprius
• XFAB
• Tyndall National Institute
• Seagate
• RTI International
Thank you! Please don’t hesitate to contact us with your questions!